WO2022143075A1

WO2022143075A1 - Flexible substrate, chip on film and display screen

Info

Publication number: WO2022143075A1
Application number: PCT/CN2021/136738
Authority: WO
Inventors: 李杰威; 李亚鹏; 贾卫波; 唐书桓
Original assignee: 华为技术有限公司
Priority date: 2020-12-29
Filing date: 2021-12-09
Publication date: 2022-07-07
Also published as: CN114695305A

Abstract

The embodiments of the present application provide a flexible substrate, a chip on film (COF) and a display screen, relating to the field of display technology, and provide a chip on film for a display panel with pins arranged in multiple pads. The COF comprises: a first flexible substrate; and a first chip arranged on the first flexible substrate, wherein the first flexible substrate comprises at least two groups of first bonding pads, pins on the first bonding pads are electrically connected to pins of the first chip by means of wires on the first flexible substrate, and pins of fan-out wires of a display panel or a touch control panel are bonded to the pins on the first bonding pads.

Description

Flexible substrates, die-attached film COFs and displays

This application claims the priority of the Chinese patent application with the application number 202011595231.3 and the application name "Flexible Substrate, CoF and Display Screen" submitted to the State Intellectual Property Office on December 29, 2020, the entire contents of which are incorporated by reference in this application.

technical field

The embodiments of the present application relate to the field of display technology, and in particular, to a flexible substrate, a crystal-attached film COF, and a display screen.

Background technique

In flexible display technology, the display screen of electronic equipment has the characteristics of being lighter, thinner and rollable, and its application in the fields of mobile phones, tablets, and wearables has become more and more common. With reference to Figure 1, in the display panel of the flexible display screen, the drive lines (such as scan lines, data lines, etc.) of the display area (active area, AA) are fanned out to the bonding pads through the fan-out lines on the frame. Also called binding end, refers to the pin area of the border). In this way, the connecting end can be bent to the back of the display panel through the pad bending (bending of the pin area of the display panel frame), so as to connect the pins (pins, or terminals) in the connecting end with the die-attached film (chin On film, COF, that is, flexible circuit film with chip, referred to as chip attached film, also called chip on film) for bonding, because the connecting end is bent to the back of the display panel, it does not occupy the area of the display area, Thereby achieving the ultimate ultra-narrow frame and high screen ratio (the ratio of the area of the display area to the display panel). However, with the increase in the number of pixels per inch (PPI) and resolution of the display panel, the number of driving lines and the number of pins of the bonding pad are increasing. The size of the pad affects the size of the border (as shown in Figure 1, taking a circular display screen as an example, the border size 1, the border size 2 of the border of the display area and the display panel, and the width border size 3 of the connection end) especially Further narrowing of the frame size (frame size 2 of the display area and the display panel, and the width of the connection end (frame size 3)) of the lower frame of the circular screen (as shown in Figure 1, the frame where the connection end is located) is severely limited. Therefore, the display panel with multi-terminal output pins came into being. For example, as shown in Figure 2, a plurality of connection terminals (connection terminal 1, connection terminal 2 and connection terminal 3) are set on the display panel, so that the driving circuit of the display area AA can be connected. The fan-out lines are respectively connected to the pins in different connection ends, so that the width of the connection end (frame size 3) can be reduced by evenly disposing the pins in each connection end, thereby further reducing the frame size and increasing the screen ratio. In addition, the reduction of the frame size 3 is also conducive to reducing the maximum outer circle of the display panel and saves the installation space of the entire electronic device. For the above-mentioned multi-terminal output pin display panel, it is necessary to design a new COF film attached to the display panel to bond with the connecting terminal of the display panel, and input signals in the driving circuit or receive the signal output by the driving circuit.

SUMMARY OF THE INVENTION

Embodiments of the present application provide a flexible substrate, a die-attached film COF, and a display screen, and provide a new type of COF to cope with the signal input or output of a drive line of a display panel with multiple pins.

To achieve the above object, the application adopts the following technical solutions:

In a first aspect, a touch panel is provided. The touch panel includes: a touch sensor array; wherein, a drive line of any touch sensor in the touch sensor array is connected to a fan-out line of the touch panel; at least two sets of second connection ends are arranged on the touch panel, and the second The connection end includes terminals of a plurality of fan-out lines of the touch panel. Among them, the current single-ended pin-out touch panel is usually only provided with a set of connection terminals on the frame of the touch panel, and all the driving lines of the touch panel are respectively connected to different terminals in the connection terminals through the fan-out circuit. With the continuous improvement of touch accuracy, the number of traces of the touch panel drive lines and the number of terminals at the connection end are increasing, and the size of the connection end is also getting larger and larger, which affects the frame size of the touch panel. The narrowing of the control panel is severely limited. The touch panel provided by the embodiment of the present application is provided with at least two groups of second connection terminals, so that the driving circuit of the touch panel can be connected to the terminals in different second connection terminals respectively through the fan-out circuit. Setting a terminal in each second connection end can reduce the width of the connection end, thereby further reducing the frame size of the touch panel and increasing the screen ratio, and the reduction of the frame size is also conducive to reducing the maximum outer circle of the touch panel, saving energy The installation space of the whole electronic equipment.

In a second aspect, a first deposited film COF is provided. The first COF includes: a first flexible substrate; a first chip disposed on the first flexible substrate; the first flexible substrate includes at least two sets of first connection ends, wherein the terminals on the first connection ends pass through the first flexible substrate The circuit is electrically connected to the pin of the first chip, and the terminal of the fan-out circuit of the display panel or the touch panel is bonded to the terminal on the first connection end. Wherein, the first COF includes at least two sets of first connection terminals, and when the multi-terminal output pin display panel or touch panel includes at least two sets of first connection terminals corresponding to the positions of the at least two sets of first connection terminals on the first COF one-to-one When two terminals are connected, the first COF is used for inputting a signal to a driving circuit of a display panel or a touch panel with multi-terminal output pins or receiving a signal output by the driving circuit.

In a possible implementation manner, the display area of the display panel includes a pixel array, wherein a drive line of any pixel unit in the pixel array is connected to a fan-out line of the display panel; at least two groups of second The connection end, the second connection end includes terminals of a plurality of fan-out lines of the display panel, wherein the first flexible substrate is arranged on the back of the display panel, and a group of second connection ends are bent to the back of the display panel and correspond to a The first connection end of the group is connected. Optionally, the pixel unit includes a pixel circuit, and the driving line includes a scan line and a data line connected to the pixel circuit. In this example, since the display panel only includes a pixel array, the display panel only has a display function. The first COF is used to connect the display panel, and the first chip may be a display driver integrated circuit (DDIC).

In a possible implementation manner, the pixel unit further includes a touch sensor, and the driving circuit includes an input channel line and an output channel line connected to the touch sensor. In this example, the display panel may have a touch function at the same time, and the touch sensor is integrated into the pixel unit of the display panel, so that the display panel and the on cell TP (touch panel, touch panel, that is, the touch sensor of the touch panel is integrated in the on-cell TP) in the pixel unit of the display panel). When the first COF is used to connect the display panel, the first chip may be a touch and display driver integration IC (TDDI IC) integrating DDIC and TPIC.

In a possible implementation manner, the touch panel includes a touch sensor array, wherein a drive line of any touch sensor in the touch sensor array is connected to a fan-out line of the touch panel; the touch The panel is provided with at least two sets of second connection ends, the second connection ends include terminals of a plurality of fan-out circuits of the touch panel, wherein the first flexible substrate is arranged on the back of the touch panel , and a set of the second connecting ends is bent to the back of the touch panel and correspondingly connected with a set of the first connecting ends. In this example, the first COF is used to connect the touch panel, and the first chip may be a touch panel integrated circuit (TPIC).

In a possible implementation manner, the driving circuit includes an input channel wiring and an output channel wiring connected with the touch sensor. Usually, the touch sensor is arranged at the position where the input channel trace Rx and the output channel trace Tx cross, and a group of touch sensors is connected to one Rx and one Tx.

In a possible implementation manner, the first flexible substrate includes a third connection end, wherein the terminals on the third connection end are electrically connected to the pins of the first chip through the lines on the first flexible substrate, and the third connection end is electrically connected to the pins of the first chip. The terminals are bonded with the terminals of the second flexible substrate, and the terminals of the second flexible substrate are electrically connected with the driving circuit board. Wherein, the terminal of the third connection end is bonded with the terminal of the second flexible substrate and the terminal of the third connection end. The second flexible substrate is mainly used to connect the first COF to the driving circuit board, so as to realize the connection between the first chip and the driving circuit board, such as a printed circuit board (printed circuit board, PCB). The terminals of one group of connection ends of the second flexible substrate are bonded with the terminals of the third connection end, and the other group of connection ends of the second flexible substrate are connected to the PCB through connectors. An application processor (AP) (such as a CPU), a power management chip (power IC), etc. are installed on the PCB. In this way, AP provides display data for DDIC and display panel to display actual image information; power IC provides working voltage for DDIC and display panel. The second flexible substrate provides a signal transmission connection path between the PCB and the DDIC. The DDIC is responsible for receiving the signal transmitted by the PCB and delivering the signal to the display panel according to a specific timing control. For example, after the display data output by the AP passes through the DDIC, it is converted into a scan signal and a data voltage Vdata and transmitted to the pixel units coupled to the respective driving lines to drive the pixel units to emit light. Alternatively, the AP provides an initial signal to the touch sensor through the TPIC (for example, the initial signal is transmitted to the touch sensor through Rx), and when a touch event occurs on the touch sensor, the TPIC detects the touch signal generated by the corresponding touch sensor (for example, the touch sensor sends the touch signal through Tx) transmit the touch signal). The second flexible substrate provides a signal transmission connection path between the PCB and the TPIC. The TPIC is responsible for receiving the signal transmitted by the PCB and delivering the signal to the touch sensor of the touch panel according to a specific timing control, and receiving the touch signal generated by the touch sensor.

In a third aspect, a second flexible substrate is provided, the second flexible substrate includes at least two groups of fourth connection ends, a group of fifth connection ends, and a group of sixth connection ends; wherein the terminals on the fourth connection ends The circuit on the second flexible substrate is connected to the terminal on the fifth connection end, and the terminal on the fourth connection end is bonded with the terminal of the fan-out circuit of the touch panel; The terminal is connected to a first COF, wherein the first COF includes a first flexible substrate and a first chip arranged on the first flexible substrate; the first flexible substrate includes at least one set of first connection terminals and a A set of third connecting ends, wherein the terminals on the first connecting ends are electrically connected to the pins of the first chip through the lines on the first flexible substrate, and the terminals of the fan-out lines of the display panel are electrically connected to the pins of the first chip. The terminals on the first connecting end are bonded, the terminals on the third connecting end are electrically connected with the pins of the first chip through the lines on the first flexible substrate, and the terminals on the third connecting end are electrically connected with the pins of the first chip. The terminal is bonded with the terminal of the fifth connection end; the terminal on the sixth connection end is connected with the terminal on the fifth connection end through the circuit on the second flexible substrate, and the terminal on the sixth connection end It is electrically connected to the drive circuit board. In this solution, the display panel only has the function of display, the touch panel is attached to the display panel, the second flexible substrate can connect the first COF with the driving circuit board, and the structure of the first COF can refer to the above-mentioned first aspect The first COF. In addition, the terminal of the fan-out circuit of the drive circuit of the touch sensor in the touch panel is bonded with the terminal on the fourth connection end on the second flexible substrate, and the terminal on the fourth connection end passes through the second flexible substrate. The circuit connected to the terminal of the fifth connection end, the terminal of the third connection end on the first COF is bonded with the terminal of the fifth connection end on the second flexible substrate, so as to fan out the driving circuit of the touch sensor in the touch panel. The line is connected with the first chip. In addition, the first chip is connected to the touch panel and the display panel at the same time, so it can be a TDDI IC. The terminal on the sixth connecting end is connected to the terminal on the fifth connecting end through the circuit on the second flexible substrate, and the terminal on the sixth connecting end is electrically connected with the driving circuit board, thereby realizing the realization of the first chip and the driving circuit board Connection.

In a possible implementation manner, the touch panel is disposed on the back of the display panel, and the display area of the display panel includes a pixel array, wherein a drive line of any pixel unit in the pixel array is connected to a drive line of the display panel A fan-out circuit; the display panel is provided with at least one group of second connection ends, the second connection ends include terminals of a plurality of fan-out lines of the display panel, wherein the first flexible substrate is disposed on the back of the touch panel, and a group of The second connecting ends are bent to the back of the touch panel and are correspondingly connected with a group of first connecting ends.

In a possible implementation manner, the pixel unit includes a pixel circuit, and the driving line of the pixel unit includes a scan line and a data line connected to the pixel circuit.

In a possible implementation manner, the touch panel includes a touch sensor array, wherein a drive line of any touch sensor in the touch sensor array is connected to a fan-out line of the touch panel; There are at least two sets of seventh connection ends, the seventh connection ends include terminals of a plurality of fan-out lines of the touch panel, wherein the second flexible substrate is disposed on the back of the touch panel, and a The set of seventh connecting ends is bent to the back of the touch panel and is correspondingly connected with a set of the fourth connecting ends.

In a possible implementation manner, the driving circuit of the touch sensor includes an input channel wiring and an output channel wiring connected to the touch sensor.

In a fourth aspect, a second flexible substrate is provided, a second chip is disposed on the second flexible substrate; the second flexible substrate includes at least two groups of fourth connection ends and a group of sixth connection ends; wherein, the fourth connection ends are The terminals of the touch panel are electrically connected to the pins of the second chip through the lines on the second flexible substrate, and the terminals on the fourth connection end are bonded with the terminals of the fan-out circuit of the touch panel; the terminals on the sixth connection end The lines on the second flexible substrate are electrically connected to the pins of the second chip, and the terminals on the sixth connection end are electrically connected to the driving circuit board. In this solution, when the touch panel is externally mounted on the display panel, the touch sensor is not provided on the display panel, and the terminal of the fan-out circuit of the drive circuit of the touch sensor in the touch panel is connected to the fourth terminal on the second flexible substrate. The terminals in the connecting end are bonded and connected to the second chip on the second flexible substrate through the lines on the second flexible substrate, for example, the second chip can be TPIC; and the terminals on the sixth connecting end pass through the second flexible substrate The circuit on the top is electrically connected with the pin of the second chip, and the terminal on the sixth connecting end is electrically connected with the driving circuit board, so as to realize the connection between the second chip and the driving circuit board. In this solution, a multi-terminal out-pin touch panel is provided to connect to the driving circuit board through the second flexible substrate, wherein the TPIC is arranged on the second flexible substrate, due to the structure of the touch panel (compared to the display panel) It is relatively simple, the number of outgoing lines of the driving line is relatively small, and the processing logic of the TPIC is relatively simple, so the TPIC can be directly fabricated into an FPC with low process precision requirements (relative to COF).

In a possible implementation manner, the second flexible substrate further includes a set of fifth connection ends; terminals of the fifth connection ends are connected to the first COF, wherein the first COF includes the first flexible substrate, and is disposed on the A first chip on the first flexible substrate; the first flexible substrate includes at least a set of first connection ends and a set of third connection ends, wherein the terminals on the first connection ends pass through the first flexible The circuit on the substrate is electrically connected with the pin of the first chip, the terminal of the fan-out circuit of the display panel is bonded with the terminal on the first connecting end, and the terminal on the third connecting end passes through the The circuit on the first flexible substrate is electrically connected with the pin of the first chip, the terminal on the third connecting end is bonded with the terminal on the fifth connecting end; the terminal on the sixth connecting end passes through the The lines on the second flexible substrate are electrically connected to the pins of the second chip, or the terminals on the sixth connecting end are electrically connected to the terminals of the fifth connecting end through the lines on the second flexible substrate connect. In this solution, it should be noted that the specific structure of the first COF can refer to the relevant description of the second aspect. In this solution, the first COF connected to the display panel and the touch panel share the second flexible substrate and are connected to the driving circuit board .

In a possible implementation manner, the touch panel is disposed on the back of the display panel, and the display area of the display panel includes a pixel array, wherein a drive line of any pixel unit in the pixel array is connected to A fan-out line of the display panel; at least one set of second connection ends is provided on the display panel, and the second connection ends include terminals of a plurality of fan-out lines of the display panel, wherein the first A flexible substrate is disposed on the backside of the touch panel, and a group of the second connection ends is bent to the backside of the touch panel and is correspondingly connected with a group of the first connection ends.

In a possible implementation manner, the pixel unit includes a pixel circuit, and a drive line of the pixel unit includes a scan line and a data line connected to the pixel circuit.

In a possible implementation manner, the touch panel includes a touch sensor array, wherein a drive line of any touch sensor in the touch sensor array is connected to a fan-out line of the touch panel; the touch The control panel is provided with at least two sets of seventh connection ends, the seventh connection ends include terminals of a plurality of fan-out lines of the touch panel, wherein the second flexible substrate is disposed on the touch panel. the back of the touch panel, and a group of the seventh connection ends is bent to the back of the touch panel and is connected with a group of the fourth connection ends.

In a fifth aspect, a display screen is provided, including a display panel and the first die-attached film COF described in the second aspect.

In a sixth aspect, a display screen is provided, including the touch panel provided in the first aspect and the second flexible substrate provided in the third aspect or the fourth aspect.

In a seventh aspect, a display screen is provided, including a touch panel and the first die-attached film COF provided in the second aspect.

In an eighth aspect, an electronic device is provided, including any display screen and a driving circuit board as provided in the fifth aspect to the seventh aspect, wherein the display screen is connected to the driving circuit board.

The fifth aspect, the sixth aspect, the seventh aspect and the eighth aspect have the same technical effects as those of the first die-attached thin film COF or the second flexible substrate provided in the foregoing embodiments, which will not be repeated here.

Description of drawings

FIG. 1 is a schematic structural diagram of a display panel according to an embodiment of the present application;

FIG. 2 is a schematic structural diagram of a display panel according to another embodiment of the present application;

3 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

4 is a schematic diagram of the appearance structure of a smart watch provided by an embodiment of the application;

5 is a schematic structural diagram of a display screen provided by an embodiment of the present application;

6 is a schematic cross-sectional structure diagram of a display screen according to an embodiment of the present application;

FIG. 7 is a schematic diagram of a connection mode of a connection terminal provided by an embodiment of the present application;

FIG. 8 is a schematic structural diagram of a display panel according to another embodiment of the present application;

FIG. 9 is a schematic structural diagram of a display screen according to another embodiment of the present application;

10 is a schematic structural diagram of a COF provided by an embodiment of the application;

11 is a schematic cross-sectional structure diagram of a display screen according to another embodiment of the present application;

FIG. 12 is a schematic structural diagram of a display panel according to still another embodiment of the present application;

13 is a schematic cross-sectional structure diagram of a display screen according to another embodiment of the present application;

14 is a schematic structural diagram of a display screen according to another embodiment of the application;

FIG. 15 is a schematic structural diagram of a touch panel according to an embodiment of the present application;

16 is a schematic structural diagram of a display screen according to still another embodiment of the present application;

17 is a schematic structural diagram of a display screen according to another embodiment of the present application;

18 is a schematic structural diagram of a display screen according to another embodiment of the present application;

19 is a schematic cross-sectional structure diagram of a display screen according to another embodiment of the present application;

20 is a schematic structural diagram of an FPC provided by an embodiment of the present application;

21 is a schematic structural diagram of a display screen according to still another embodiment of the application;

22 is a schematic cross-sectional structure diagram of a display screen according to another embodiment of the present application;

23 is a schematic structural diagram of an FPC provided by another embodiment of the present application;

24 is a schematic structural diagram of a display screen according to another embodiment of the present application;

FIG. 25 is a schematic structural diagram of a display panel according to another embodiment of the present application;

FIG. 26 is a schematic structural diagram of a display panel according to another embodiment of the present application;

FIG. 27 is a schematic structural diagram of a display panel according to still another embodiment of the present application;

FIG. 28 is a schematic structural diagram of a display panel according to another embodiment of the present application;

FIG. 29 is a schematic structural diagram of a display panel according to another embodiment of the present application;

FIG. 30 is a schematic structural diagram of a display panel according to still another embodiment of the present application;

31 is a schematic structural diagram of a display panel according to another embodiment of the present application;

32 is a schematic structural diagram of a display panel according to another embodiment of the present application;

FIG. 33 is a schematic structural diagram of a display panel according to still another embodiment of the present application.

Detailed ways

The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments.

Hereinafter, the terms "first", "second", etc. are only used for convenience of description, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature defined as "first", "second", etc., may expressly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "at least one" means one or more, and "plurality" means two or more. "And/or", which describes the association relationship of the associated objects, indicates that there can be three kinds of relationships, for example, A and/or B, which can indicate: the existence of A alone, the existence of A and B at the same time, and the existence of B alone, where A, B can be singular or plural. "At least one item(s) below" or similar expressions thereof refer to any combination of these items, including any combination of single item(s) or plural items(s). For example, at least one (a) of a, b, or c can represent: a, b, c, a-b, a-c, b-c, or a-b-c, where a, b, c may be single or multiple .

In addition, in the embodiments of the present application, "upper", "lower", "left" and "right" are not limited to be defined relative to the schematic placement of components in the drawings, and it should be understood that these directional terms may be Relative notions, they are used for relative description and clarification, which may vary accordingly depending on the orientation in which the components are placed in the drawings.

In this application, unless otherwise expressly specified and limited, the term "connection" should be understood in a broad sense. For example, "connection" may be a fixed connection, a detachable connection, or an integrated body; it may be directly connected, or Can be indirectly connected through an intermediary. In addition, the term "electrical connection" may be a direct electrical connection or an indirect electrical connection through an intermediate medium.

The implementation of this embodiment will be described in detail below with reference to the accompanying drawings.

The flexible substrate, chip-attached film COF and display screen provided by the embodiments of the present application can be applied to mobile phones, tablet computers, notebook computers, ultra-mobile personal computers (UMPC), handheld computers, netbooks, personal digital In electronic devices such as personal digital assistants (PDAs), wearable electronic devices, virtual reality devices, etc., the embodiments of the present application do not impose any restrictions on this, especially for smart watches with circular, arc-shaped or other special-shaped display interfaces, Advertising display equipment, vehicle display equipment, etc.

Exemplarily, FIG. 3 shows a schematic structural diagram of the electronic device 100 .

The electronic device 100 may include a processor 110, an external memory interface 120, an internal memory 121, a universal serial bus (USB) interface 130, a charge management module 140, a power management module 141, a battery 142, an antenna 1, an antenna 2 , mobile communication module 150, wireless communication module 160, audio module 170, speaker 170A, receiver 170B, microphone 170C, headphone jack 170D, sensor module 180, camera 193 and display screen 194 and so on.

It can be understood that, the structures illustrated in the embodiments of the present invention do not constitute a specific limitation on the electronic device 100 . In other embodiments of the present application, the electronic device 100 may include more or less components than shown, or combine some components, or separate some components, or arrange different components. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.

The processor 110 may include one or more processing units, for example, the processor 110 may include an application processor (application processor, AP), a modem processor, a graphics processor (graphics processing unit, GPU), an image signal processor (image signal processor, ISP), controller, video codec, digital signal processor (digital signal processor, DSP), baseband processor, and/or neural-network processing unit (neural-network processing unit, NPU), etc. Wherein, different processing units may be independent devices, or may be integrated in one or more processors.

A memory may also be provided in the processor 110 for storing instructions and data. In some embodiments, the memory in processor 110 is cache memory. This memory may hold instructions or data that have just been used or recycled by the processor 110 . If the processor 110 needs to use the instruction or data again, it can be called directly from the memory. Repeated accesses are avoided and the latency of the processor 110 is reduced, thereby increasing the efficiency of the system.

In some embodiments, the processor 110 may include one or more interfaces. The interface may include an integrated circuit (inter-integrated circuit, I2C) interface, an integrated circuit built-in audio (inter-integrated circuit sound, I2S) interface, a pulse code modulation (pulse code modulation, PCM) interface, a universal asynchronous transceiver (universal asynchronous transmitter) receiver/transmitter, UART) interface, mobile industry processor interface (MIPI), general-purpose input/output (GPIO) interface, subscriber identity module (SIM) interface, and / or universal serial bus (universal serial bus, USB) interface, etc.

The charging management module 140 is used to receive charging input from the charger. The charger may be a wireless charger or a wired charger. In some wired charging embodiments, the charging management module 140 may receive charging input from the wired charger through the USB interface 130 . In some wireless charging embodiments, the charging management module 140 may receive wireless charging input through a wireless charging coil of the electronic device 100 . While the charging management module 140 charges the battery 142 , it can also supply power to the electronic device through the power management module 141 .

The power management module 141 is used for connecting the battery 142 , the charging management module 140 and the processor 110 . The power management module 141 receives input from the battery 142 and/or the charge management module 140, and supplies power to the processor 110, the internal memory 121, the display screen 194, the camera 193, and the wireless communication module 160. The power management module 141 can also be used to monitor parameters such as battery capacity, battery cycle times, battery health status (leakage, impedance). In some other embodiments, the power management module 141 may also be provided in the processor 110 . In other embodiments, the power management module 141 and the charging management module 140 may also be provided in the same device.

The wireless communication function of the electronic device 100 may be implemented by the antenna 1, the antenna 2, the mobile communication module 150, the wireless communication module 160, the modulation and demodulation processor, the baseband processor, and the like.

Antenna 1 and Antenna 2 are used to transmit and receive electromagnetic wave signals. Each antenna in electronic device 100 may be used to cover a single or multiple communication frequency bands. Different antennas can also be reused to improve antenna utilization. For example, the antenna 1 can be multiplexed as a diversity antenna of the wireless local area network. In other embodiments, the antenna may be used in conjunction with a tuning switch.

The mobile communication module 150 may provide wireless communication solutions including 2G/3G/4G/5G etc. applied on the electronic device 100 . The mobile communication module 150 may include one or more filters, switches, power amplifiers, low noise amplifiers (LNAs), and the like. The mobile communication module 150 can receive electromagnetic waves from the antenna 1, filter and amplify the received electromagnetic waves, and transmit them to the modulation and demodulation processor for demodulation. The mobile communication module 150 can also amplify the signal modulated by the modulation and demodulation processor, and then turn it into an electromagnetic wave for radiation through the antenna 1 . In some embodiments, at least part of the functional modules of the mobile communication module 150 may be provided in the processor 110 . In some embodiments, at least part of the functional modules of the mobile communication module 150 may be provided in the same device as at least part of the modules of the processor 110 .

The modem processor may include a modulator and a demodulator. Wherein, the modulator is used to modulate the low frequency baseband signal to be sent into a medium and high frequency signal. The demodulator is used to demodulate the received electromagnetic wave signal into a low frequency baseband signal. Then the demodulator transmits the demodulated low-frequency baseband signal to the baseband processor for processing. The low frequency baseband signal is processed by the baseband processor and passed to the application processor. The application processor outputs sound signals through audio devices (not limited to the speaker 170A, the receiver 170B, etc.), or displays images or videos through the display screen 194 . In some embodiments, the modem processor may be a stand-alone device. In other embodiments, the modem processor may be independent of the processor 110, and may be provided in the same device as the mobile communication module 150 or other functional modules.

The wireless communication module 160 can provide applications on the electronic device 100 including wireless local area networks (WLAN) (such as wireless fidelity (Wi-Fi) networks), Bluetooth (BT), global navigation satellites Wireless communication solutions such as global navigation satellite system (GNSS), frequency modulation (FM), near field communication (NFC), and infrared technology (IR). The wireless communication module 160 may be one or more devices integrating one or more communication processing modules. The wireless communication module 160 receives electromagnetic waves via the antenna 2 , frequency modulates and filters the electromagnetic wave signals, and sends the processed signals to the processor 110 . The wireless communication module 160 can also receive the signal to be sent from the processor 110 , perform frequency modulation on it, amplify it, and convert it into electromagnetic waves for radiation through the antenna 2 .

In some embodiments, the antenna 1 of the electronic device 100 is coupled with the mobile communication module 150, and the antenna 2 is coupled with the wireless communication module 160, so that the electronic device 100 can communicate with the network and other devices through wireless communication technology. The wireless communication technology may include global system for mobile communications (GSM), general packet radio service (GPRS), code division multiple access (CDMA), broadband Code Division Multiple Access (WCDMA), Time Division Code Division Multiple Access (TD-SCDMA), Long Term Evolution (LTE), BT, GNSS, WLAN, NFC , FM, and/or IR technology, etc. The GNSS may include global positioning system (global positioning system, GPS), global navigation satellite system (global navigation satellite system, GLONASS), Beidou navigation satellite system (beidou navigation satellite system, BDS), quasi-zenith satellite system (quasi -zenith satellite system, QZSS) and/or satellite based augmentation systems (SBAS).

The electronic device 100 implements a display function through a GPU, a display screen 194, an application processor, and the like. The GPU is a microprocessor for image processing, and is connected to the display screen 194 and the application processor. The GPU is used to perform mathematical and geometric calculations for graphics rendering. Processor 110 may include one or more GPUs that execute program instructions to generate or alter display information.

Display screen 194 is used to display images, videos, and the like. Display screen 194 includes a display panel. The display panel can be a liquid crystal display (LCD), an organic light-emitting diode (OLED), an active-matrix organic light-emitting diode or an active-matrix organic light-emitting diode (active-matrix organic light). emitting diode, AMOLED), flexible light-emitting diode (flex light-emitting diode, FLED), Miniled, MicroLed, Micro-oLed, quantum dot light-emitting diode (quantum dot light emitting diodes, QLED) and so on. In some embodiments, the electronic device 100 may include one or N display screens 194 , where N is a positive integer greater than one. In the embodiment of the present application, the display panel may adopt a flexible panel, and the display panel provided by the embodiment of the present application is not limited to the display panel based on the low temperature polysilicon (low temperature poly-silicon, LTPS, where polysilicon is abbreviated as p-Si) process. , and is also suitable for low temperature polycrystalline oxide (low temperature polycrystalline oxide, LTPO) process display panels, because the LTPO-based pixel unit integrates LTPS and Oxide two thin film transistor (thin film transistor, TFT) devices, of which Oxide TFT is an NMOS structure, LTPS TFT is a PMOS structure, and the gates of the two need to be connected to their respective independent scan line controls, so the LTPO pixel unit will be connected to more scan lines (relative to the LTPS process pixel unit), so narrow Borders have higher requirements.

The electronic device 100 may implement a shooting function through an ISP, a camera 193, a video codec, a GPU, a display screen 194, an application processor, and the like.

The ISP is used to process the data fed back by the camera 193 . For example, when taking a photo, the shutter is opened, the light is transmitted to the camera photosensitive element through the lens, the light signal is converted into an electrical signal, and the camera photosensitive element transmits the electrical signal to the ISP for processing, and converts it into an image visible to the naked eye. ISP can also perform algorithm optimization on image noise, brightness, and skin tone. ISP can also optimize the exposure, color temperature and other parameters of the shooting scene. In some embodiments, the ISP may be provided in the camera 193 .

Camera 193 is used to capture still images or video. The object is projected through the lens to generate an optical image onto the photosensitive element. The photosensitive element may be a charge coupled device (CCD) or a complementary metal-oxide-semiconductor (CMOS) phototransistor. The photosensitive element converts the optical signal into an electrical signal, and then transmits the electrical signal to the ISP to convert it into a digital image signal. The ISP outputs the digital image signal to the DSP for processing. DSP converts digital image signals into standard RGB, YUV and other formats of image signals. In some embodiments, the electronic device 100 may include 1 or N cameras 193 , where N is a positive integer greater than 1.

The external memory interface 120 can be used to connect an external memory card, such as a Micro SD card, to expand the storage capacity of the electronic device 100 . The external memory card communicates with the processor 110 through the external memory interface 120 to realize the data storage function. For example to save files like music, video etc in external memory card.

Internal memory 121 may be used to store one or more computer programs including instructions. The processor 110 may execute the above-mentioned instructions stored in the internal memory 121, thereby causing the electronic device 100 to execute the methods provided in some embodiments of the present application, as well as various functional applications and data processing. The internal memory 121 may include a storage program area and a storage data area. Wherein, the stored program area may store the operating system; the stored program area may also store one or more application programs (such as gallery, contacts, etc.) and the like. The storage data area may store data (such as photos, contacts, etc.) created during the use of the electronic device 101 and the like. In addition, the internal memory 121 may include high-speed random access memory, and may also include non-volatile memory, such as one or more magnetic disk storage devices, flash memory devices, universal flash storage (UFS), and the like. In other embodiments, the processor 110 causes the electronic device 100 to execute the methods provided in the embodiments of the present application by executing the instructions stored in the internal memory 121 and/or the instructions stored in the memory provided in the processor, As well as various functional applications and data processing.

The electronic device 100 may implement audio functions through an audio module 170, a speaker 170A, a receiver 170B, a microphone 170C, an earphone interface 170D, an application processor, and the like. Such as music playback, recording, etc.

The audio module 170 is used for converting digital audio information into analog audio signal output, and also for converting analog audio input into digital audio signal. Audio module 170 may also be used to encode and decode audio signals. In some embodiments, the audio module 170 may be provided in the processor 110 , or some functional modules of the audio module 170 may be provided in the processor 110 .

Speaker 170A, also referred to as a "speaker", is used to convert audio electrical signals into sound signals. The electronic device 100 can listen to music through the speaker 170A, or listen to a hands-free call.

The receiver 170B, also referred to as "earpiece", is used to convert audio electrical signals into sound signals. When the electronic device 100 answers a call or a voice message, the voice can be answered by placing the receiver 170B close to the human ear.

The microphone 170C, also called "microphone" or "microphone", is used to convert sound signals into electrical signals. When making a call or sending a voice message, the user can make a sound by approaching the microphone 170C through a human mouth, and input the sound signal into the microphone 170C. The electronic device 100 may be provided with one or more microphones 170C. In other embodiments, the electronic device 100 may be provided with two microphones 170C, which can implement a noise reduction function in addition to collecting sound signals. In other embodiments, the electronic device 100 may further be provided with three, four or more microphones 170C to collect sound signals, reduce noise, identify sound sources, and implement directional recording functions.

The earphone jack 170D is used to connect wired earphones. The earphone interface 170D may be the USB interface 130, or may be a 3.5mm open mobile terminal platform (OMTP) standard interface, a cellular telecommunications industry association of the USA (CTIA) standard interface.

The sensor module 180 may include a pressure sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a distance sensor, a proximity light sensor, a fingerprint sensor, a temperature sensor, a touch sensor, an ambient light sensor, a bone conduction sensor, and the like.

In the embodiments of the present application, the touch sensor is also referred to as a "touch device". The touch sensor can be arranged on the display screen 194, and the touch sensor and the display screen 194 form a touch screen, also called a "touch screen". A touch sensor is used to detect touch operations on or near it. The touch sensor can pass the detected touch operation to the application processor to determine the type of touch event. Visual output associated with touch operations can be provided through the display. In other embodiments, the touch panel provided with a touch sensor array formed by a plurality of touch sensors may also be provided on the surface of the display panel in the form of an overhang. In other embodiments, the touch sensor may also be located at a different location than the display screen 194 . The form of the touch sensor is not limited in the embodiments of the present application, for example, it may be a device such as a capacitor or a piezoresistor.

In addition, the above-mentioned electronic device may also include one or more components such as a button, a motor, an indicator, and a subscriber identification module (SIM) card interface, which is not limited in this embodiment of the present application.

Referring to FIG. 4 , taking the display screen of a circular smart watch as an example, the display screen 194 is usually arranged between the outer frame 41 of the watch and the bottom cover (not shown in FIG. 4 ). As shown in FIG. 5 and FIG. 6 , the display screen includes a display panel 51, and the display panel 51 includes a display area (active area, AA) and a non-display area (frame) around the display area AA. The display area AA includes a pixel array composed of a plurality of pixel units distributed in an array. In addition, the display area AA includes driving lines arranged vertically and horizontally, and the driving lines include the scan lines SCAN and the data lines DATA, wherein the pixel units are arranged at the intersections of the scan lines SCAN and the data lines DATA, and one pixel unit is connected to one data line DATA and at least one scan line SCAN. The display screen also includes a COF 52 and a flexible printed circuit (flexible printed circuit, FPC, or flexible circuit board) 53 .

Wherein, a drive line of any pixel unit in the pixel array is connected to a fan-out line of the display panel 51; the display panel 51 is provided with a connection end 511, and the connection end 511 includes the terminals of a plurality of fan-out lines of the display panel 51 ( pin, or pin), wherein the COF 52 and the FPC 53 are disposed on the back of the display panel 51 , and the connection end 511 of the display panel 51 is bent to the back of the display panel 51 and is correspondingly connected to the connection end 521 of the COF 52 . Among them, as shown in FIG. 7 , the connection mode of the connection end 511 of the display panel 51 and the connection end 521 of the COF 52 is shown, wherein the FOF (film on film, film to film) process can be used to connect the terminal of the connection end 511 to the connection end 521 of the COF 52 . The terminals of the terminal 521 are bonded one by one, for example, the terminal 5111 and the terminal 5211 are bonded together, and the connecting terminal 511 and the other terminals in the connecting The connection end 511 is bonded to the anisotropic conductive film of the connection end 521 of the COF 52 . Unless otherwise specified, the connection ends and the connection manners of the connection ends mentioned in the following solutions all refer to the bonding connection in which the terminals of the two interconnected connection ends are bonded to each other.

In addition, a display driving circuit 522 is disposed on the COF 52, and the display driving circuit 522 may be a display driver integrated circuit (DDIC). In this case, the terminals in the connecting end 521 of the COF 52 are electrically connected to the pins of the DDIC through the lines on the COF 52 . The connecting end 523 of the COF52 is bonded to the connecting end 531 of the FPC53, the terminal of the connecting end 523 of the COF52 is electrically connected to the pins of the DDIC, and the other group of connecting ends 532 of the FPC53 is connected to the printed circuit board (printed circuit board, PCB) is connected, and the terminal of the connection end 531 of the FPC53 is connected with the terminals of the other group of connection ends 532 through the lines on the FPC53. An application processor (AP) (such as a CPU), a power management chip (power IC), etc. are mounted on a printed circuit board (PCB) (or a drive circuit board, a drive system board). The printed circuit board, the COF 52 and the FPC 52 are all disposed between the outer frame 41 of the watch on the back of the display panel and the bottom cover.

In this way, the AP provides display data for the DDIC and the display panel 51 to display actual image information; the power IC provides the DDIC and the display panel 51 with operating voltage. FPC53 provides a signal transmission connection path between PCB and DDIC. The DDIC is responsible for receiving the signals transmitted by the PCB and delivering the signals to the display panel 51 according to a specific timing control. For example, after the display data output by the AP passes through the DDIC, it is converted into a scan signal and a data voltage Vdata and transmitted to the pixel units coupled to the respective driving lines to drive the pixel units to emit light.

The above-mentioned FIG. 5 mainly introduces the working principle of a display panel 51 with a single terminal outputting a pin (ie, a display panel with only one set of connection terminals 511 ). Such a display panel 51 has the problems raised in the background art. Further narrowing of the frame size of the lower frame is severely limited. In another embodiment of the present application, as shown in FIG. 8 , a display panel 81 with multi-terminal output pins is provided, and the display area AA of the display panel 81 includes a pixel array, wherein one row of any pixel unit in the pixel array is provided. The driving circuit is connected to a fan-out circuit of the display panel 81; the display panel 81 is provided with at least two groups of connection terminals. In FIG. 8, three groups of connection terminals are taken as an example, and the connection terminal 811, the connection terminal 812 and the connection terminal 813 are shown in detail. ; The connection terminals ( 811 , 812 and 813 ) include terminals of a plurality of fan-out lines of the display panel 81 . In combination with the above description, when the display panel 81 does not have a touch function, the pixel unit includes a pixel circuit, and the driving circuit includes a scan line SCAN and a data line DATA connected to the pixel circuit.

In order to provide the display panel 81 with signals such as display data and operating voltage, an embodiment of the present application provides a COF 91. Referring to FIG. 9 , FIG. 10 and FIG. 11 ( FIG. 11 is a schematic structural diagram of FIG. ), the COF91 includes: a flexible substrate FPC916; a chip 914 disposed on the flexible substrate FPC916; the flexible substrate FPC916 includes at least two groups of connection terminals, of which three groups of connection terminals (911 , 912, 913); the terminals on the connection ends (911, 912, 913) are electrically connected to the pins of the chip 914 through the circuit on the flexible substrate FPC916, and the terminal of the fan-out circuit of the display panel 81 is connected to the connection end of the COF91 ( 911, 912, 913) on the terminal bonding.

As mentioned above, the connection terminals ( 811 , 812 and 813 ) of the display panel 81 are respectively connected to the connection terminals ( 911 , 912 , 913 ) of the COF 91 one-to-one. The flexible substrate 916 of the COF91 further includes a connection terminal 915, wherein the terminal on the connection terminal 915 is electrically connected to the pins of the chip 914 through the circuit on the flexible substrate 916, and the terminal of the connection terminal 915 is bonded with the terminal of the flexible substrate FPC92. The terminals of the flexible substrate FPC92 are electrically connected to the driving circuit board. The connection method between the driving circuit board and the COF91 may refer to the connection method between the PCB and the COF52 in the above-mentioned FIG. 5 and will not be repeated here. In the examples shown in the above-mentioned FIGS. 8 , 9 , 10 and 11 , since the display panel 81 only has a display function, the chip 914 can be used to realize the related functions of driving the display panel. For example, the chip 914 adopts a DDIC .

In another example, the display panel may have a touch function at the same time. For example, a touch sensor may be integrated into a pixel unit of the display panel. In this way, the pixel unit also includes a touch sensor, such as the display panel 81-a shown in FIG. 12 . , the driving circuit includes the input channel wiring Rx and the output channel wiring Tx connected with the touch sensor. As shown in FIG. 13 , the display panel and the on cell TP (touch panel, touch panel, that is, the touch sensor of the touch panel is integrated in the pixel unit of the display panel) can be realized. In this example, one or all of the connection terminals ( 811 , 812 and 813 ) of the display panel 81 - a include the terminals of the fan-out line connected to Rx or Tx; some or all of the connection terminals ( 911 , 912 ) of the COF 91 , 913) contains terminals bonded to the terminals of the fan-out lines of Rx or Tx. When the display panel shown in FIG. 12 is used, the chip 914 needs to have the related functions of realizing the display driving and touch control of the display panel at the same time. At this time, the chip 914 can use the touch and display driver integrated chip (touch and display driver integrated chip) that integrates DDIC and TPIC. display driver integration IC, TDDI IC).

In another example, the touch panel can be attached to the back of the display panel. In order to cooperate with the display panel, the effective touch area of the touch panel is usually overlapped with the display area AA of the display panel. A touch sensor array composed of two touch sensors, as shown in FIG. 14 , the touch panel 21 of the display screen further includes a driving circuit arranged in a vertical and horizontal manner, and the driving circuit includes an input channel wiring Rx and an output channel wiring Tx connected to the touch sensors , wherein the touch sensor is arranged at the intersection of Rx and Tx, and one touch sensor is connected to one Rx and one Tx. The display screen also includes COF22 and flexible substrate FPC23.

As shown in FIG. 14 , a drive line of any touch sensor in the touch sensor array is connected to a fan-out line of the touch panel 21 ; the touch panel 21 is provided with a connection end 211 , and the connection end 211 includes the The terminals of a plurality of fan-out lines, the COF 22 and the flexible substrate FPC 23 are disposed on the back of the touch panel 21 , and the connecting ends 211 are bent to the back of the touch panel 21 and are correspondingly connected to the connecting ends 221 of the COF 22 . For the connection method between the connection end 211 of the touch panel 21 and the connection end 221 of the COF 22 , reference may be made to the connection method of the connection end 511 of the display panel 51 and the connection end 521 of the COF 52 in FIG. 7 , which will not be repeated here.

In addition, a touch driving circuit 222 is disposed on the COF 22 , and the touch driving circuit 222 may be a touch panel integrated circuit (TPIC). In this case, the terminals in the connecting end 221 of the COF 22 are electrically connected to the pins of the TPIC through the lines on the COF 22 . The connection end 223 of the COF22 is bonded to the connection end 231 of the FPC23, the terminal of the connection end 223 of the COF22 is electrically connected to the pins of the TPIC, and the other group of connection ends 232 of the FPC23 is connected to the printed circuit board (printed circuit board, PCB), the terminals of the connection end 231 of the FPC23 are connected to the terminals of the other group of connection ends 232 through the lines on the FPC23. An application processor AP (eg, CPU) and the like are mounted on the PCB (or drive circuit board, drive system board). The PCB, the COF 22 and the FPC 22 are all disposed between the outer frame 41 of the watch on the back of the touch panel 21 and the bottom cover.

In this way, the AP provides an initial signal to the touch sensor of the touch panel 21 through the TPIC (for example, transmits the initial signal to the touch sensor through Rx), and when a touch event occurs on the touch sensor, the TPIC detects the touch generated by the corresponding touch sensor. Signal (for example, the touch sensor transmits the touch signal through Tx). FPC23 provides a signal transmission connection path between PCB and TPIC. The TPIC is responsible for receiving the signals transmitted by the PCB and controlling the transmission of the signals to the touch sensor of the touch panel 21 according to a specific timing sequence, and receiving the touch signals generated by the touch sensor.

The above-mentioned FIG. 14 mainly introduces the working principle of a touch panel with a single pin output (that is, a touch panel with only one set of connection ends 211 ), wherein such a touch panel exists on the lower frame of the screen (where the connection end 211 is located). position), the border size is further narrowed and the problem is severely limited. In another embodiment of the present application, as shown in FIG. 15 , a touch panel 31 with multiple pins is provided, and the touch panel 31 includes a touch sensor array, wherein one of any touch sensor in the touch sensor array is The drive circuit is connected to a fan-out circuit of the touch panel 31; the touch panel 31 is provided with at least two groups of connection terminals, and FIG. ( 311 , 312 ) include terminals of a plurality of fan-out lines of the touch panel 31 . In combination with the above description, when the driving circuit of the touch panel 31 includes the input channel wiring Rx and the output channel wiring Tx connected to the touch sensor. A plurality of connection terminals ( 311 , 312 ) are provided on the touch panel 31 , so that the drive lines of the touch panel can be respectively connected to the terminals in different connection terminals through the fan-out circuit, so that the Setting the terminal can reduce the width of the connection end, thereby further reducing the size of the frame and increasing the screen ratio, and the reduction in the size of the frame is also conducive to reducing the maximum outer circle of the touch panel and saving the installation space of the entire electronic device.

In order to provide the initial signal to the touch panel 31 and receive the touch signal of the touch panel 31, an embodiment of the present application provides a COF 32. Referring to FIG. 16, the COF 32 includes: a flexible substrate FPC324; The flexible substrate FPC324 includes at least two groups of connection terminals, wherein two groups of connection terminals (321, 322) are shown in FIG. 16; The pins of 323 are electrically connected, and the terminals of the fan-out circuit of the touch panel 31 are bonded to the terminals on the connection ends ( 321 , 322 ).

Specifically, the connecting ends ( 311 , 312 ) of the touch panel 31 are respectively connected one-to-one with the connecting ends ( 321 , 322 ) of the COF 32 . The flexible substrate FPC324 of the COF32 further includes another connection end 325, wherein the terminals on the other connection end 325 are electrically connected to the pins of the chip 323 through the lines on the flexible substrate FPC324, and the terminals of the other connection end 325 are connected to the flexible The terminals of the substrate FPC 33 are bonded, and the terminals of the flexible substrate 33 are electrically connected to the driving circuit board. The connection method between the driving circuit board and the COF32 may refer to the connection method between the driving circuit board and the COF22 in the above-mentioned FIG. 14 and will not be repeated here.

Referring to FIG. 17 , a display screen is provided, which includes a display panel 81 and a touch panel (not shown in FIG. 17 ) that is externally mounted on the back of the display panel. In this solution, the The solution including the display panel 81 , the COF 91 and the PCB 92 provided in FIG. 9 and the solution including the touch panel 31 , the COF 32 and the FPC 33 provided in FIG. 16 are integrated together, and the touch panel (not shown in FIG. 17 ) is externally mounted on the display The backside of the panel 81, and the COF91, the PCB92, the COF32 and the FPC33 are arranged on the backside of the touch panel.

In addition, in another implementation, referring to FIG. 18, FIG. 19 (wherein FIG. 19 is a schematic structural diagram of FIG. 18 at the BB' section), and FIG. 20, a display screen is provided, the display screen includes The display panel 81 and the touch panel 31 attached to the back of the display panel 81 , in this solution, the connection ends ( 311 , 312 ) of the touch panel 31 can be directly bound to the FPC 92 .

As shown in FIG. 18, a flexible substrate FPC92 is provided, including at least two groups of connection ends (923, 924) connected to the connection ends (311, 312) of the touch panel 31, a group of connection ends 921 connected to the COF 91, and A group of connection terminals (connection terminals 922 shown in FIG. 20 ) are connected to the driving circuit board. As shown in FIG. 20 , the terminals on the connecting ends ( 923 , 924 ) of the flexible substrate FPC92 are connected to the terminals on the connecting end 921 through the lines on the flexible substrate FPC92 . As shown in FIG. 18, the terminals on the connection ends (923, 924) are bonded to the terminals of the fan-out circuit of the touch panel 31 shown in FIG. 15; the connection end 921 of the flexible substrate FPC92 is connected with the connection end 915 of the COF91 ( The connection manner of the connection end 921 and the connection end 915 may refer to the connection manner of the connection end 523 and the connection end 531 in FIG. 5 above, which will not be repeated here). In this solution, it should be noted that the specific structure of the COF 91 can refer to the description of the related embodiment in FIG. 9 , and the difference between this solution and FIG. 9 is that the touch sensor in the touch panel 31 in the example in FIG. The terminals of the fan-out circuit of the driving circuit are directly bonded with the terminals in the connecting ends (911, 912, 913) of the COF91, so as to realize the connection between the touch sensor and the chip 914 (TDDI). The terminals of the fan-out circuit of the drive circuit of the touch sensor are bonded with the terminals in the connection terminals (923, 924) on the flexible substrate FPC92, and are connected to the terminals of the connection terminal 915 of the COF91 through the circuit on the flexible substrate FPC92, and then through The connection terminal 915 of the COF91 is connected to the chip 914 (TDDI) to realize the connection between the touch sensor and the chip 914 (TDDI).

In another implementation, referring to FIG. 21 , a display screen is provided, which includes a display panel 81 and a touch panel 31 attached to the back of the display panel 81 . In this solution, you can directly The connection end of the touch panel 31 is bound to the flexible substrate FPC92.

As shown in FIG. 21, FIG. 22 (FIG. 22 is a schematic structural diagram of the cross section of FIG. 21 at CC'), and FIG. 23, an FPC 92 is provided, and a chip 925 is provided on the FPC 92; the FPC 92 includes at least two groups and touch The connection terminals (923, 924) to which the connection terminals (311, 312) of the panel 31 are connected, a set of connection terminals 921 to be connected to the COF 91, and a set of connection terminals to be connected to the driving circuit board (the connection terminals 922 shown in FIG. 23 ). ). The terminals on the connection ends (923, 924) are electrically connected to the pins of the chip 925 through the lines on the FPC 92. As shown in FIG. 21, the terminals on the connection ends (923, 924) are electrically connected to the contacts shown in FIG. The terminals of the fan-out circuit of the control panel 31 are bonded; the connection end 921 of the flexible substrate FPC92 is connected to the connection end 915 of the COF 91 (wherein the connection method of the connection end 921 and the connection end 915 can refer to the connection end 523 and the connection end in FIG. 5 above. 531 connection, which will not be repeated here). The terminals on the connecting end 922 are electrically connected to the pins of the chip 925 through the lines on the FPC92, or the terminals on the connecting end 922 pass through the lines on the FPC92 (wherein this part of the lines passes directly from the bottom of the chip 925 shown in FIG. 23 ). However, it is not electrically connected to the chip 925) and is electrically connected to the terminal of the connection end 921; the terminal of the connection end 922 is electrically connected to the driving circuit board. In this solution, it should be noted that the specific structure of the COF 91 can refer to the description of the related embodiment in FIG. 9 , and the difference between this solution and FIG. 9 is that the touch sensor in the touch panel 31 in the example in FIG. The terminals of the fan-out circuit of the driving circuit are directly bonded with the terminals in the connecting ends (911, 912, 913) of the COF91, so as to realize the connection between the touch sensor and the chip 914 (TDDI). It is arranged on the display panel. Therefore, there is no touch sensor on the display panel. The chip 914 on the COF91 adopts DDIC. The terminals in (923, 924) are bonded, and are connected to the chip 925 on the FPC92 through the lines on the flexible substrate FPC92, and the chip 925 can be TPIC.

As shown in FIG. 24 , an FPC 41 is provided. The FPC 41 is provided with a chip 413 ; the FPC 41 includes at least two groups of connection ends ( 411 , 312 ) connected to the connection ends ( 311 , 312 ) of the touch panel 31 , and a group of connection ends ( 411 , 412 ) connected to the touch panel 31 . Connection terminal for driver circuit board connection (not shown in Figure 24). The terminals on the connecting ends (411, 412) are electrically connected to the pins of the chip 413 through the lines on the FPC41. As shown in FIG. 24, the terminals on the connecting ends (411, 412) are electrically connected to the contacts shown in FIG. The terminals of the fan-out circuit of the control panel 31 are bonded; the terminals on the connecting end connected to the driving circuit board are electrically connected to the pins of the chip 413 through the circuits on the FPC 41 . In this solution, since the touch panel 31 is externally installed on the display panel, no touch sensor is provided on the display panel, and the terminal of the fan-out circuit of the drive circuit of the touch sensor in the touch panel 31 is connected to the terminal on the flexible substrate FPC41. The terminals in the connection ends ( 411 , 412 ) are bonded and connected to the chip 413 on the FPC 41 through the lines on the flexible substrate FPC 41 , and the chip 413 can be TPIC. As shown in FIG. 24 , the display screen using the FPC 41 and the touch panel 31 may further include the display panel 81 , the COF 91 and the FPC 91 , and the specific structure of the COF 91 can refer to the description of the related embodiment in FIG. 9 , wherein the chip 914 on the COF 91 adopts the DDIC , the connection end 921 of the flexible substrate FPC91 is connected with the connection end 915 of the COF91 (wherein the connection method of the connection end 921 and the connection end 915 can refer to the connection method of the connection end 523 and the connection end 531 in the above-mentioned FIG. 5 , which will not be repeated here) . The difference from the embodiment in FIG. 21 is that the COF 91 and the touch panel 31 can be connected to the driving circuit board through their corresponding FPCs, respectively. In this solution, a way of connecting the touch panel with multi-terminal pins to the driving circuit board directly through the FPC41 is provided, wherein the TPIC is arranged on the FPC41. Since the structure of the touch panel is relatively simple (compared to the display panel), the touch The drive lines of the panel (compared to the display panel) have a relatively small number of outgoing lines, and the processing logic of the TPIC is relatively simple. Therefore, the precision requirements of the TPIC manufacturing process are lower than that of the DDIC (or TDDI IC). FPC with lower process accuracy requirements (relative to COF).

In addition, based on the above-mentioned multi-terminal output pin display panel, since the display panel includes a plurality of connection terminals, the plurality of connection terminals can be designed in any number according to the design requirements according to the principle of minimizing the frame or arranged at any position on the display panel, for example For a circular display panel, in order to improve the symmetry of the display area and the installation space, a plurality of connection ends may be uniformly arranged around the display panel.

At present, when a common flat display panel is installed on the front case of a smart watch, its cross-sectional view is shown in Figure 25, where the curved part (the part in the dotted line in Figure 25) raised on the edge of the front case usually does not display an image. In order to make full use of the space of the arc-shaped raised portion in the dashed-line box to increase the display area, as shown in FIG. 26 , the display panel can usually be extended to the position of the arc-shaped portion. As shown in Figures 26 and 27, the display panel of the circular curved screen has a curved structure capable of displaying images at the frame position of the display screen. If the display panel adopts a regular shape, such as a circle, as shown in Figure 28. During the installation process of assembling the display panel to the electronic device, the frame position needs to be bent to a certain angle towards the back of the display panel to form the arc structure corresponding to FIG. Therefore, the unfolded shape of the display panel is usually designed as shown in FIG. 29 , and there are prominent display blocks around the display panel, wherein the display block has an effective display area, and usually the display blocks are arranged according to the curved screen. The design requires no direct connection; the display block can be a trapezoid, a triangle or a semicircle, etc. (the semicircle is used as an example in Figure 29), so that the display block is bent to the back of the display panel at a certain angle to cover the arc The frame area of the face screen forms a display screen as shown in Figure 31. After the display block is bent, the adjacent display blocks can be connected together or the distance between the adjacent display blocks in the shape expanded relative to the display panel changes. Smaller, so that the screen ratio of the curved screen can be guaranteed, and the edge of the display panel can be prevented from wrinkling. However, as shown in Figure 29, the display panel with single-end output pins usually only contains one set of connecting ends. When the size of the connecting ends is large, when the connecting ends are folded to the back of the display panel for connecting the COF, the connecting ends The adjacent display blocks on both sides are far apart, as shown in FIG. 30 . Then, when the display panel is assembled into a display screen, the display blocks are unevenly distributed on the display screen (as shown in FIG. 31 , a large area of display vacancy appears at the position corresponding to the connection end), which affects the display effect. When using the display panel with multi-terminal output pins provided by the embodiment of the present application, as shown in FIG. 32, taking five connection terminals as an example, since the multi-terminal output pin display panel can reduce the size of the connection terminals, it is possible to connect the The ends are evenly arranged between each display block, as shown in Figure 33. Then, when the display panel is assembled into a display screen, the display blocks are evenly distributed on the display screen, and a good display effect can be obtained.

The above contents are only specific embodiments of the present application, but the protection scope of the present application is not limited thereto, and any changes or substitutions within the technical scope disclosed in the present application should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

A first crystal-attached film COF, characterized in that it comprises:

a first flexible substrate;

a first chip disposed on the first flexible substrate;

The first flexible substrate includes at least two sets of first connecting ends, wherein the terminals on the first connecting ends are electrically connected with the pins of the first chip through the lines on the first flexible substrate, and the display panel Or the terminal of the fan-out circuit of the touch panel is bonded with the terminal on the first connection end.
The first COF according to claim 1, wherein the display area of the display panel comprises a pixel array, wherein a drive line of any pixel unit in the pixel array is connected to a fan-out of the display panel line;

The display panel is provided with at least two sets of second connection ends, the second connection ends include terminals of a plurality of fan-out lines of the display panel, wherein the first flexible substrate is arranged on the display panel. the back side of the display panel, and a group of the second connection ends is bent to the back side of the display panel and is connected to a group of the first connection ends correspondingly.
The first COF according to claim 2, wherein the pixel unit comprises a pixel circuit, and the driving line comprises a scan line and a data line connected to the pixel circuit.
The first COF according to claim 3, wherein the pixel unit further comprises a touch sensor, and the driving circuit comprises an input channel wiring and an output channel wiring connected to the touch sensor.
The first COF according to claim 1, wherein the touch panel comprises a touch sensor array, wherein a drive line of any touch sensor in the touch sensor array is connected to a drive line of the touch panel fan-out line;

The touch panel is provided with at least two sets of second connection ends, the second connection ends include terminals of a plurality of fan-out lines of the touch panel, wherein the first flexible substrate is disposed on the touch panel. The backside of the touch panel, and a group of the second connection ends is bent to the backside of the touch panel and is correspondingly connected with a group of the first connection ends.
The first COF according to claim 5, wherein the driving circuit comprises an input channel wiring and an output channel wiring connected to the touch sensor.
The first COF according to any one of claims 1-6, wherein the first flexible substrate comprises a third connection end, wherein the terminals on the third connection end pass through the first flexible substrate The circuit of the first chip is electrically connected to the pin of the first chip, the terminal of the third connection end is bonded to the terminal of the second flexible substrate, and the terminal of the second flexible substrate is electrically connected to the driving circuit board.
A second flexible substrate, characterized in that:

The second flexible substrate includes at least two groups of fourth connection ends, a group of fifth connection ends and a group of sixth connection ends;

Wherein, the terminal on the fourth connection end is connected with the terminal on the fifth connection end through the circuit on the second flexible substrate, and the terminal on the fourth connection end is connected with the fan-out circuit of the touch panel terminal bonding;

The terminal of the fifth connection end is connected to the first COF, wherein the first COF includes a first flexible substrate and a first chip arranged on the first flexible substrate; the first flexible substrate includes at least one set of A first connection end and a set of third connection ends, wherein the terminals on the first connection end are electrically connected with the pins of the first chip through the lines on the first flexible substrate, and the fan-out of the display panel The terminals of the circuit are bonded to the terminals on the first connecting end, and the terminals on the third connecting end are electrically connected to the pins of the first chip through the circuits on the first flexible substrate. The terminal on the third connection end is bonded with the terminal of the fifth connection end;

The terminals on the sixth connecting end are connected to the terminals on the fifth connecting end through the lines on the second flexible substrate, and the terminals on the sixth connecting end are electrically connected with the driving circuit board.
The second flexible substrate according to claim 8, wherein the touch panel is disposed on the back of the display panel, and the display area of the display panel comprises a pixel array, wherein any one of the pixel arrays A drive line of the pixel unit is connected to a fan-out line of the display panel; the display panel is provided with at least one group of second connection ends, and the second connection end includes a plurality of fan-out lines of the display panel. terminals, wherein the first flexible substrate is disposed on the back of the touch panel, and a set of the second connection ends is bent to the back of the touch panel and corresponds to a set of the first connection ends connect.
The second flexible substrate according to claim 9, wherein the pixel unit includes a pixel circuit, and the driving line of the pixel unit includes a scan line and a data line connected to the pixel circuit.
The second flexible substrate according to any one of claims 8-10, wherein the touch panel comprises a touch sensor array, wherein a drive line of any touch sensor in the touch sensor array is connected to the touch sensor array. A fan-out circuit of a touch panel; at least two sets of seventh connection ends are provided on the touch panel, and the seventh connection ends include terminals of a plurality of fan-out circuits of the touch panel, wherein the The second flexible substrate is disposed on the backside of the touch panel, and a group of the seventh connection ends is bent to the backside of the touch panel and is correspondingly connected with a group of the fourth connection ends.
The second flexible substrate according to claim 11, wherein the driving circuit of the touch sensor comprises an input channel wiring and an output channel wiring connected to the touch sensor.
A second flexible substrate, characterized in that a second chip is arranged on the second flexible substrate;

The second flexible substrate includes at least two groups of fourth connection ends and a group of sixth connection ends;

The terminals on the fourth connecting end are electrically connected to the pins of the second chip through the lines on the second flexible substrate, and the terminals on the fourth connecting end are connected to the fan-out of the touch panel. Terminal bonding of lines;

The terminals on the sixth connecting end are electrically connected with the pins of the second chip through the lines on the second flexible substrate, and the terminals on the sixth connecting end are electrically connected with the driving circuit board.
The second flexible substrate according to claim 13, wherein the second flexible substrate further comprises a set of fifth connection terminals;

The terminal of the fifth connection end is connected to the first COF, wherein the first COF includes a first flexible substrate and a first chip arranged on the first flexible substrate; the first flexible substrate includes at least one set of A first connection end and a set of third connection ends, wherein the terminals on the first connection end are electrically connected with the pins of the first chip through the lines on the first flexible substrate, and the fan-out of the display panel The terminals of the circuit are bonded to the terminals on the first connecting end, and the terminals on the third connecting end are electrically connected to the pins of the first chip through the circuits on the first flexible substrate. The terminal on the third connection end is bonded with the terminal of the fifth connection end;

The terminals on the sixth connecting end are electrically connected to the pins of the second chip through the lines on the second flexible substrate, or the terminals on the sixth connecting end are connected through the second flexible substrate. The circuit is electrically connected to the terminal of the fifth connection end.
The second flexible substrate according to claim 14, wherein the touch panel is disposed on the back of the display panel, and the display area of the display panel comprises a pixel array, wherein any one of the pixel arrays A drive line of the pixel unit is connected to a fan-out line of the display panel; the display panel is provided with at least one group of second connection ends, and the second connection end includes a plurality of fan-out lines of the display panel. terminals, wherein the first flexible substrate is disposed on the back of the touch panel, and a set of the second connection ends is bent to the back of the touch panel and corresponds to a set of the first connection ends connect.
The second flexible substrate according to claim 15, wherein the pixel unit comprises a pixel circuit, and the driving line of the pixel unit comprises a scan line and a data line connected to the pixel circuit.
The second flexible substrate according to any one of claims 13-16, wherein the touch panel comprises a touch sensor array, wherein a drive line of any touch sensor in the touch sensor array is connected to the touch sensor array. A fan-out circuit of a touch panel; at least two sets of seventh connection ends are provided on the touch panel, and the seventh connection ends include terminals of a plurality of fan-out circuits of the touch panel, wherein the The second flexible substrate is disposed on the backside of the touch panel, and a group of the seventh connection ends is bent to the backside of the touch panel and is correspondingly connected with a group of the fourth connection ends.
The second flexible substrate according to claim 17, wherein the driving circuit of the touch sensor comprises the input channel wiring and the output channel wiring connected to the touch sensor.
A touch panel, comprising: a touch sensor array;

Wherein, a drive line of any touch sensor in the touch sensor array is connected to a fan-out line of the touch panel; at least two sets of second connection terminals are provided on the touch panel, and the second connection The terminals include terminals of a plurality of fan-out lines of the touch panel.
A display screen, characterized in that it comprises a display panel and the first co-crystal film COF according to any one of claims 1-7.
A display screen, characterized by comprising the touch panel according to claim 19 and the second flexible substrate according to any one of claims 8-12 or the touch panel according to any one of claims 13-18 the second flexible substrate.
A display screen, characterized in that it comprises a touch panel and the first die-attached film COF according to any one of claims 1-7.