CN110806658B

CN110806658B - Backlight module and display device

Info

Publication number: CN110806658B
Application number: CN201911134381.1A
Authority: CN
Inventors: 谢天旭
Original assignee: Xiamen Tianma Microelectronics Co Ltd
Current assignee: Xiamen Tianma Microelectronics Co Ltd
Priority date: 2019-11-19
Filing date: 2019-11-19
Publication date: 2022-03-08
Anticipated expiration: 2039-11-19
Also published as: CN110806658A

Abstract

The invention discloses a backlight module and a display device. The backlight module includes: the backlight module comprises a back plate, a flexible circuit board and a light-emitting element; the back plate comprises a bottom and a side wall connected with the edge of the bottom; the side wall is provided with an opening; the bottom and the side wall form an accommodating cavity; the flexible circuit board comprises a first part, a second part and a third part; the third part is positioned in the accommodating cavity, and the first part and the second part extend into the accommodating cavity from the opening to be connected with the third part; the light-emitting element is positioned on one side surface of the third part, which is far away from the bottom; the first part is bent to one side of the bottom part deviating from the accommodating cavity; the second part comprises a first sub-part and a second sub-part which are connected with each other, the first sub-part extends along the direction that the side wall is far away from the bottom and is positioned on one side of the side wall departing from the accommodating cavity, the second sub-part extends along the plane parallel to the third part and is positioned on one side of the side wall departing from the bottom, and the first sub-part covers the opening, so that light emitted by the light-emitting element is prevented from being emitted out of the opening, and the problem of light leakage of the backlight module is solved.

Description

Backlight module and display device

Technical Field

The embodiment of the invention relates to the technical field of display, in particular to a backlight module and a display device.

Background

The liquid crystal display panel is a commonly used flat panel display at present, and the backlight module is an important component of the liquid crystal display panel and is used for providing a light source for the liquid crystal display panel when the liquid crystal display panel works. With the rapid development of display technologies, the market has higher and higher requirements on the performance and the taste of the backlight module, and high brightness, narrow frames, picture quality and the like are required. However, the backlight quality is degraded, especially the problem of light leakage of the backlight module is caused.

Backlight unit includes backplate, flexible line way board and light emitting component among the prior art, and wherein, the backplate includes the bottom and with the lateral wall of bottom edge connection, the lateral wall is provided with the opening, the flexible line way board is close to the bottom and sets up, light emitting component is fixed in the lateral surface that the flexible line way board deviates from the bottom. In the assembling process, the opening needs to avoid the flexible circuit board, and the flexible circuit board is bent to the back face of the back plate after extending out of the opening. Because this opening part can't wrap up with the sticky tape, produces the problem of light leak easily to cause product quality to descend, influence customer experience.

Disclosure of Invention

The invention provides a backlight module and a display device, which are used for solving the problem of light leakage of the backlight module and improving the product quality and the customer experience.

In a first aspect, an embodiment of the present invention provides a backlight module, including:

the backlight module comprises a back plate, a flexible circuit board and a light-emitting element;

the back plate comprises a bottom and a side wall connected with the edge of the bottom; the side wall is provided with an opening; the bottom and the side wall form a containing cavity;

the flexible circuit board comprises a first part, a second part and a third part; the third part is positioned in the accommodating cavity, and the first part and the second part extend into the accommodating cavity from the opening to be connected with the third part;

the light-emitting element is positioned on one side surface of the third part, which is far away from the bottom part;

the first part is bent to one side of the bottom part, which is far away from the accommodating cavity;

the second part comprises a first sub-part and a second sub-part which are connected with each other, the first sub-part extends along the direction that the side wall is far away from the bottom and is positioned at one side of the side wall which is far away from the accommodating cavity, the second sub-part extends along the plane which is parallel to the third part and is positioned at one side of the side wall which is far away from the bottom, and the first sub-part covers the opening.

In a second aspect, an embodiment of the present invention provides a display device, including:

the backlight module provided by the first aspect.

According to the technical scheme provided by the embodiment of the invention, the first part, the second part and the third part are arranged on the upper side of the flexible circuit board, the second part comprises the first sub-part and the second sub-part which are connected with each other, the first sub-part extends along the direction of the side wall far away from the bottom and is positioned on the side of the side wall, which is far away from the containing cavity, and the first sub-part covers the opening to prevent light emitted by the light-emitting element from leaking from the opening, so that the problem of light leakage of the backlight module is solved, and the product quality and the customer experience are improved.

Drawings

In order to more clearly illustrate the technical solutions of the exemplary embodiments of the present invention, a brief description is given below of the drawings used in describing the embodiments. It should be clear that the described figures are only views of some of the embodiments of the invention to be described, not all, and that for a person skilled in the art, other figures can be derived from these figures without inventive effort.

Fig. 1 is a schematic partial cross-sectional structure diagram of a backlight module according to an embodiment of the present invention;

fig. 2 is a schematic partial cross-sectional view illustrating a backlight module according to another embodiment of the present invention;

fig. 3 is a schematic three-dimensional structure diagram of a backlight module before bending according to an embodiment of the present invention;

fig. 4 is a schematic three-dimensional structure diagram of a backlight module according to an embodiment of the invention;

FIG. 5 is a schematic partial cross-sectional view illustrating a backlight module according to another embodiment of the present invention;

FIG. 6 is a schematic partial cross-sectional view illustrating a backlight module according to another embodiment of the present invention;

FIG. 7 is a schematic partial cross-sectional view illustrating a backlight module according to another embodiment of the present invention;

FIG. 8 is a schematic partial cross-sectional view illustrating a backlight module according to another embodiment of the present invention;

fig. 9 is a schematic structural diagram of a display device according to an embodiment of the present invention;

fig. 10 is a schematic structural diagram of another display device according to an embodiment of the present invention.

Detailed Description

The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the application and are not limiting of the application. It should be further noted that, for the convenience of description, only some of the structures related to the present application are shown in the drawings, not all of the structures.

Fig. 1 is a schematic partial cross-sectional view of a backlight module according to an embodiment of the invention. Referring to fig. 1, a backlight module 100 according to an embodiment of the present invention includes: a back plate 110, a flexible circuit board 120 and a light emitting element 130.

The back plate 110 includes a bottom 111 and a sidewall 112, the sidewall 112 is connected to an edge of the bottom 111, and the bottom 111 and the sidewall 112 form a receiving cavity 150. Since the flexible circuit board 120 needs to be passed out of the back plate 110 so as to be bent to the bottom 111 side of the back plate 110, the side wall 112 is provided with an opening 113.

The flexible wiring board 120 includes a first portion 121, a second portion 122, and a third portion 123; the third portion 123 is located in the accommodating cavity 150, the first portion 121 and the second portion 122 extend into the accommodating cavity 150 from the opening 113, and both the first portion 121 and the second portion 122 are connected to the third portion 123.

The light emitting element 130 is located on a side surface of the third portion 123 away from the bottom portion 111, the light emitting element 130 is bound on the third portion 123, and the flexible circuit board 120 provides a driving signal for the light emitting element 130 through the third portion 123.

The first portion 121 is bent to a side of the bottom 111 facing away from the accommodating cavity 150. The end of the first portion 121 is generally provided with a gold finger, and the gold finger bent to the side of the bottom 111 away from the accommodating cavity 150 can be electrically connected with the main board of the display panel through the main flexible circuit board.

The second portion 122 includes a first sub-portion 1221 and a second sub-portion 1222 connected to each other, the first sub-portion 1221 extends along the side wall 112 away from the bottom 111, the first sub-portion 1221 is located on a side of the side wall 112 away from the accommodating cavity 150, and the first sub-portion 1221 covers the opening 113; the second sub-portion 1222 extends in a plane parallel to the plane of the third portion 123, and the second sub-portion 1222 is located on a side of the sidewall 112 facing away from the bottom 111.

The first sub-portion 1221 can block the opening 113 on the sidewall 112, so that the light emitted from the light emitting element 130 can be prevented from leaking from the opening 113, and the problem of light leakage of the backlight module is solved. The second sub-portion 1222 is bent to a side of the sidewall 112 away from the bottom 111 and extends along a plane parallel to the third portion 123, so that the second portion 122 can be stably disposed on the sidewall 112, for example, when the backlight module is assembled with the display panel, the second sub-portion 1222 can be fixed by a clamping force after the backlight module and the display panel are assembled.

Optionally, with continued reference to fig. 1, the second portion 122 of the flexible printed circuit board 120 is made of a flexible light-shielding material, and for example, the second portion 122 of the flexible printed circuit board 120 is made of a polyimide material. The polyimide material is bendable, so that the first sub-portion 1221 can be more snugly disposed on the side of the sidewall 112 facing away from the receiving cavity 150, and the second sub-portion 1222 can be disposed on the side of the sidewall 112 facing away from the bottom 111.

Meanwhile, the first sub-portion 1221 of the second portion 122 can block the light emitted by the light emitting element 130, so that the second portion 122 of the flexible printed circuit board 120 can be made of a light blocking material, and in summary, the second portion 122 of the flexible printed circuit board 120 is made of a polyimide material, which can meet both the requirement for flexibility and the requirement for light blocking. The material used for manufacturing the second portion 122 of the flexible printed circuit board 120 is not limited to polyimide, and other materials having elasticity and light shielding performance known to those skilled in the art may be used, and is not limited herein.

Optionally, the first portion 121, the second portion 122, and the third portion 123 of the flexible printed circuit board 120 may be made of a polyimide material. In addition to the second portion 122 of the flexible printed circuit board 120 meeting both the requirements of flexibility and light shielding, the first portion 121 of the flexible printed circuit board 120 also meets the requirements of flexibility. The first portion 121 needs to be bent to a side of the bottom 111 away from the accommodating cavity, and the first portion 121 should not be damaged by the bending, so the first portion 121 of the flexible circuit board 120 also needs to be made of a flexible material. The first part 121, the second part 122 and the third part 123 of the flexible circuit board 120 of the embodiment of the invention can be integrally formed, so that the requirements of the flexible circuit board 120 on flexibility and shading are met, the manufacturing process of the backlight module can be simplified, the manufacturing difficulty is reduced, the extra manufacturing cost is not required to be increased, and meanwhile, the assembly of the backlight module can be facilitated. In another embodiment, for example, the first portion 121 and the third portion 123 may be integrally formed, and one end of the second portion 122 may be fixed to a connection portion of the first portion 121 and the third portion 123. The embodiment of the invention does not limit the manufacturing process of the flexible printed circuit 120. The material used for manufacturing the flexible printed circuit board 120 is not limited to polyimide, and other materials with elasticity and light shielding performance known to those skilled in the art may be used, and is not limited herein.

Optionally, with continued reference to fig. 1, a light-shielding tape 141 is further included, and the light-shielding tape 141 is located on a side of the second sub-portion 1222 close to the bottom 111. The second sub-portion 1222 is fixed to a side near the bottom 111 by the light shielding tape 141, preventing the second sub-portion 1222 from falling off the sidewall 112, so that the structure is more stable.

Fig. 2 is a schematic partial cross-sectional view of another backlight module according to an embodiment of the invention. As shown in fig. 2, a region of the first sub-portion 1221 facing the opening 113 includes the light-shielding layer 160.

If the first sub-portion 1221 is made of a non-light-shielding material, the light-shielding layer 160 may be disposed in a region of the first sub-portion 1221 facing the opening 113, and for example, black ink may be applied in a region of the first sub-portion 1211 facing the opening 113 to shield light emitted from the light-emitting device 130.

The light shielding layer 160 in the above embodiments may be disposed on a side surface of the first sub-portion 1221 facing away from the accommodating cavity 150 (as shown in fig. 2), or may be disposed on a side surface of the first sub-portion 1221 facing the accommodating cavity 150, which is not limited in the present invention. The light-shielding layer 160 may be formed by applying black ink to a region of the first sub-portion 1211 facing the opening 113, or may be formed by using a light-shielding material alone and fixing the formed light-shielding layer to a region of the first sub-portion 1211 facing the opening 113, such as a light-shielding tape. In addition, the shape of the light-shielding layer 160 may be rectangular, semicircular, or other common geometric shapes known to those skilled in the art, and the size of the light-shielding layer 160 is not particularly limited, and only the light-shielding layer 160 needs to completely shield the opening 113.

Fig. 3 is a schematic three-dimensional structure diagram of a backlight module before bending according to an embodiment of the present invention. Fig. 4 is a schematic three-dimensional structure diagram of a backlight module according to an embodiment of the invention. As shown in fig. 3 or fig. 4, a side surface of the first sub-portion 1221 facing the sidewall is provided with a first copper exposing region 171;

the sidewalls include a first sidewall 1121, a second sidewall 1122, a third sidewall 1123, and a fourth sidewall 1124, the first sidewall 1121 and the second sidewall 1122 are located at both sides of the bottom 111 opposite in the first direction (X direction in fig. 3), the third sidewall 1123 and the fourth sidewall 1124 are located at both sides of the bottom 111 opposite in the second direction (Y direction in fig. 3), and the bottom, the first sidewall 1121, the second sidewall 1122, the third sidewall 1123, and the fourth sidewall 1124 form a receiving cavity 150 therebetween; wherein the first direction and the second direction intersect.

The first sidewall 1121 includes an opening 113; in the second direction, the second sub-portion 1222 extends to a junction of adjacent sidewalls, see the junction 181 of the first sidewall 1121 and the third sidewall 1123 and the junction 182 of the first sidewall 1121 and the fourth sidewall 1124 in fig. 3.

A side surface of the second sub-portion 1222 facing away from the bottom 111 is provided with a second copper exposing area 172; the second copper exposing region 172 is located at the junction 181 and the junction 182;

a connecting wire is also provided in the second portion 122, which electrically connects the first and second copper exposing regions 161 and 172.

After the flexible printed circuit 120 shown in fig. 3 is bent, the first copper exposing area 171 is closely attached to the sidewall 112, and the first copper exposing area 171 is electrically connected to the second copper exposing area 172 through the conductive wires in the second portion 122. The corner area, i.e. the second sub-portion 1222, in the display device extends to the junction 181 between the first sidewall 1121 and the third sidewall 1123 and the junction 182 between the first sidewall 1121 and the fourth sidewall 1124, so that static electricity is easily generated, and therefore, as shown in fig. 4, since the second sub-portion 1222 extends to the junction 181 between the first sidewall 1121 and the third sidewall 1123 and the junction 182 between the first sidewall 1121 and the fourth sidewall 1124 are respectively provided with the second copper exposing region 172, the second copper exposing region 172 can conduct the static electricity generated by the junction 181 and the junction 182 to the first copper exposing region 171 through a wire, and the first copper exposing region 171 is directly or indirectly connected with the sidewall of the back plate, so as to release the static electricity of the first copper exposing region 171 to the back plate, thereby preventing the static electricity from breaking through the chip and the circuit, and eliminating the influence of the static electricity.

Optionally, the first copper exposing region 171 is adhered to the first sidewall 1121 by a conductive tape, so that the first copper exposing region 171 is fixed to the first sidewall 1121, when the backlight module shakes or collides, the first sub-portion 1121 pair can still effectively shield the opening 113, and thus the structure is more stable; meanwhile, the conductive tape is more favorable for the static electricity on the first copper exposing region 171 to be discharged to the back plate 110.

Fig. 5 is a schematic partial cross-sectional view illustrating a backlight module according to another embodiment of the present invention. As shown in fig. 5, a side surface of the second sub-portion 1222 facing away from the bottom 111 is provided with a heat dissipation layer 191. When the display device is in operation, a large amount of heat is generated, and the backlight module is damaged by an excessive temperature, which affects the performance of the backlight module. Therefore, the heat dissipation layer 191 is disposed on the surface of the second sub-portion 1222 away from the bottom 111, so as to dissipate heat generated by the backlight module, thereby facilitating heat dissipation and ensuring normal operation of the backlight module.

Fig. 6 is a schematic partial cross-sectional view illustrating another backlight module according to an embodiment of the invention. As shown in fig. 6, a side of the first sub-portion 1221 facing away from the side wall 112 is provided with a heat dissipation layer 192. In the working state of the backlight module, the light emitting element 130 emits light and generates a large amount of heat, so that the heat dissipation layer 192 is disposed at a position close to the light emitting element 130, i.e., at a position of a side surface of the first sub-portion 1221 away from the sidewall 112, to facilitate heat dissipation of the light emitting element 130.

In the embodiment of the invention, the backlight module may include both the heat dissipation layer 191 shown in fig. 5 and the heat dissipation layer 192 shown in fig. 6. In the above embodiments, the heat dissipation layers 191 and 192 may contact the back plate 110 to guide heat to the back plate 110, and the materials of the heat dissipation layers 191 and 192 may be various, for example, copper, aluminum, graphite, or a mixture of copper, aluminum, silver, and graphite, which is not particularly limited.

Fig. 7 is a schematic partial cross-sectional view illustrating a backlight module according to another embodiment of the present invention. Fig. 8 is a schematic partial cross-sectional view illustrating a backlight module according to another embodiment of the present invention. As shown in fig. 7, a surface of the heat dissipation layer 191 facing away from the second sub-portion 1222 is provided with an insulating layer 211, and as shown in fig. 8, a surface of the heat dissipation layer 192 facing away from the first sub-portion 1221 is provided with an insulating layer 212.

The heat dissipation layer 191 shown in fig. 7 and the heat dissipation layer 192 shown in fig. 8 are made of a heat conductive material, which is generally a conductive material, and in the display device, the display device includes many chips and circuits, and when the display device shakes or collides, the chips and circuits are easily in contact with the heat dissipation layer, which causes problems such as chip failure and circuit short circuit. Therefore, as shown in fig. 7, the insulating layer 211 is disposed on the side of the heat dissipation layer 191 away from the second sub-portion 1222, or as shown in fig. 8, the insulating layer 212 is disposed on the side of the heat dissipation layer 192 away from the first sub-portion 1221, so that the short circuit problem of the chip and the circuit can be avoided.

In the embodiment of the present invention, the insulating layer 211 may be disposed on a side of the heat dissipation layer 191 away from the second sub-portion 1222, and the insulating layer 212 may be disposed on a side surface of the heat dissipation layer 192 away from the first sub-portion 1221.

Optionally, with continued reference to fig. 5, the backlight module further includes a light guide plate 220;

the backlight module 100 is of a side-in type, that is, the light emitting element 130 is located on one side of the light guide plate 220 close to the sidewall 112, and a light emitting surface of the light emitting element 130 faces the light incident surface of the light guide plate 220.

The light emitting element 130 is located within the heat dissipation layer 191 in a direction perpendicular to the plane of the bottom 111. As shown in fig. 5, the projection area of the light emitting device 130 on the plane perpendicular to the bottom 111 is located in the projection area of the heat dissipation layer 191 on the plane perpendicular to the bottom 111, which is beneficial for dissipating heat of the light emitting device 130.

In order to ensure the normal operation of the backlight module and provide a high-quality backlight source for the liquid crystal display panel, as shown in fig. 1, the backlight module 100 includes, in addition to the above-mentioned back plate 110, flexible circuit board 120, light emitting elements 130 and light shielding baffles 140: the reflecting sheet 230, the light guide plate 220, the diffusion sheet 240, the lower light intensifying sheet 251 and the upper light intensifying sheet 252 are positioned inside the back plate, a black gasket 261 is arranged on one side of the bottom 111 facing the accommodating cavity 150, and the gasket 261 is placed between the bottom 111 and the reflecting sheet 230 and is used for enabling one end of the reflecting sheet 230 adjacent to the light emitting element 130 to be raised. The light guide plate 220 is fixed to the side of the third portion 123 of the flexible printed circuit board 120 away from the bottom 111 by the light shielding tape 142, wherein the third portion 123 of the flexible printed circuit board 120 is also fixed to the side of the bottom 111 facing the accommodating cavity 150 by the light shielding tape 142. The diffusion sheet 240 is provided with a black spacer 262 on a side thereof away from the bottom 111 for shielding light and supporting the light shielding tape 141. The reflective sheet 230 and the diffusion sheet 240 are located at opposite sides of the light guide plate 220, and the reflective sheet 230 is used for reflecting light emitted from the bottom of the light guide plate 220, thereby preventing light loss. The diffusion sheet 240 serves to diffuse light emitted from the light guide plate 220 such that the brightness of the light is more uniform. The lower light enhancement sheet 251 is located on the surface of the diffusion sheet 240 on the side away from the light guide plate 220, the upper light enhancement sheet 252 is located on the surface of the lower light enhancement sheet 251 on the side away from the light guide plate 220, and the lower light enhancement sheet 251 and the upper light enhancement sheet 252 are used for refracting, reflecting, condensing and the like the light emitted from the light guide plate 220, controlling the light emitted from the diffusion sheet 240, and playing a role in improving the brightness. The light guide plate 220 is provided with optical dots on a side surface thereof facing the bottom of the back plate, and light emitted from the light emitting element 130 is transmitted inside the light guide plate 220 and emitted outward by the dots of the light guide plate 220, thereby providing a backlight for the display device. It should be noted that fig. 9 exemplarily shows that the light emitting element is of a side-in type, that is, the light emitting element is located on one side of the side wall of the light guide plate, and the light emitting surface of the light emitting element faces the light incident surface of the light guide plate. In other embodiments, the light emitting element may be a direct type light emitting element, and the light incident mode of the light emitting element is not limited in the embodiments of the present invention.

Based on the same inventive concept, the embodiment of the invention further provides a display device, which comprises any one of the backlight modules provided in the embodiments of the application.

Fig. 9 is a schematic structural diagram of a display device according to an embodiment of the present invention. As shown in fig. 10, the display device 300 includes any one of the backlight module 100 and the display panel 310 in the above embodiments, and the display panel 310 is located at a light emitting surface side of the backlight module 100, so that the backlight source provided by the backlight module 100 can be incident into the display panel 310 to provide backlight for the display panel 310.

As shown in fig. 9, the display panel 310 may include: an array substrate 311 and an opposite substrate 312 disposed opposite to each other, and a liquid crystal 313 disposed between the array substrate 311 and the opposite substrate 312.

The display device 300 according to the embodiment of the present invention also has the advantages of the backlight module 100 according to the above embodiments, and the description thereof is omitted here. In a specific implementation, the display device 300 may be a mobile phone, a tablet computer, a notebook computer, or any product or component with a display function, such as a television, a display area, a digital photo frame, a navigator, an intelligent wearable display device, and the like, which is not limited in this embodiment of the present invention.

Optionally, fig. 10 is a schematic structural diagram of another display device according to an embodiment of the present invention. As shown in fig. 10, the display device 300 further includes a driving chip 320; the driver chip 320 is bound on the display panel 310; a side surface of the second sub-portion 1222 facing away from the bottom 111 is provided with a heat dissipation layer 330; the driving chip 320 is disposed in the heat dissipation layer 330 in a direction perpendicular to the plane of the bottom 111 of the backlight module.

The projection area of the driving chip 320 perpendicular to the plane of the bottom 111 of the backlight module 100 is located in the projection area of the heat dissipation layer 330 perpendicular to the plane of the bottom 111 of the backlight module, which is beneficial to heat dissipation of the driving chip 320. The heat dissipation layer 330 is disposed on a side of the backlight module away from the bottom 111, and the driving chip 320 is bonded on the display panel 310, that is, the heat dissipation layer 330 is disposed between the driving chip 320 and the backlight module. The heat dissipation layer 330 can absorb heat generated by the driving chip 320 and heat generated by the light emitting element 130 at the same time, the heat dissipation layer 330 is directly or indirectly connected to the back plate 110, and the heat dissipation layer 330 directly or indirectly conducts the absorbed heat to the back plate 110 and then radiates the heat through the back plate 110 to reduce the internal temperature of the display device.

Optionally, a surface of the heat dissipation layer 330 facing away from the backlight module is in direct contact with the display panel 310, so that the speed and efficiency of transferring heat generated by the driving chip 320 to the heat dissipation layer 330 are increased.

The foregoing is considered as illustrative of the preferred embodiments of the invention and technical principles employed. The present invention is not limited to the specific embodiments herein, and it will be apparent to those skilled in the art that various changes, rearrangements, and substitutions can be made without departing from the scope of the invention. Therefore, although the present invention has been described in more detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the claims.

Claims

1. A backlight module, comprising: the backlight module comprises a back plate, a flexible circuit board and a light-emitting element;

the second part comprises a first sub-part and a second sub-part which are connected with each other, the first sub-part extends along the direction of a side wall away from the bottom and is positioned on one side of the side wall away from the accommodating cavity, the second sub-part extends along the plane parallel to the third part and is positioned on one side of the side wall away from the bottom, and the first sub-part covers the opening;

the area of the first sub-part opposite to the opening comprises a light shielding layer;

the backlight module is of a side-in type.

2. The backlight module as claimed in claim 1, wherein the second portion is made of flexible light shielding material.

3. The backlight module according to claim 1, further comprising a light-shielding tape;

the shading adhesive tape is positioned on one side of the second sub-portion close to the bottom portion.

4. The backlight module as claimed in claim 1, wherein a side surface of the first sub-portion facing the sidewall is provided with a first copper exposing region;

the side walls comprise a first side wall, a second side wall, a third side wall and a fourth side wall, the first side wall and the second side wall are positioned on two opposite sides of the bottom along a first direction, the third side wall and the fourth side wall are positioned on two opposite sides of the bottom along a second direction, and the accommodating cavity is formed among the bottom, the first side wall, the second side wall, the third side wall and the fourth side wall; wherein the first direction and the second direction intersect;

the first sidewall includes the opening; along the second direction, the second sub-portion extends to a junction of adjacent sidewalls;

a second copper exposure area is arranged on one side surface of the second sub-portion, which is far away from the bottom; the second copper exposure area is positioned at the joint of the adjacent side walls;

and a connecting lead is also arranged in the second part and electrically connects the first copper exposing area and the second copper exposing area.

5. The backlight module of claim 4, wherein the first copper exposed area is bonded to the first sidewall by a conductive tape.

6. The backlight module as claimed in claim 1, wherein a side surface of the second sub-portion facing away from the bottom portion is provided with a heat dissipation layer.

7. The backlight module as claimed in claim 1, wherein a side of the first sub-portion facing away from the sidewall is provided with a heat dissipation layer.

8. The backlight module according to claim 6 or 7, wherein a surface of the heat dissipation layer facing away from the first sub-portion and/or the second sub-portion is provided with an insulating layer.

9. The backlight module according to claim 7, further comprising a light guide plate;

in a direction perpendicular to the plane of the bottom, the light emitting element is located in the heat dissipation layer.

10. A display device comprising a display panel and the backlight module according to any one of claims 1-9;

the backlight module is used for providing backlight for the display panel.

11. The display device according to claim 10, further comprising a driver chip; the driving chip is bound on the display panel; a heat dissipation layer is arranged on the surface of one side, away from the bottom, of the second sub-portion; and in the direction vertical to the plane of the bottom of the backlight module, the driving chip is positioned in the heat dissipation layer.