CN113555412A - Display module and display device - Google Patents
Display module and display device Download PDFInfo
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- CN113555412A CN113555412A CN202110926504.6A CN202110926504A CN113555412A CN 113555412 A CN113555412 A CN 113555412A CN 202110926504 A CN202110926504 A CN 202110926504A CN 113555412 A CN113555412 A CN 113555412A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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Abstract
The embodiment of the invention discloses a display module and a display device, wherein a first structure of a chip on film is fixedly connected with a first adhesive layer by adopting a reinforcing structure, and a cover plate is attached by a first adhesive layer polaroid, so that the reinforcing structure is fixedly connected with the cover plate by the first adhesive layer, and the reinforcing structure can enhance the supporting performance of a display panel binding area, thereby realizing the reinforced fixation of the binding area of the display panel, so that the display panel and a film layer below the display panel can not be bent and deformed in the process of bending the chip on film, thereby preventing the problems of bright lines, abnormal displays and the like caused by the breakage of metal wires in the film layer peeling and the display panel, and improving the yield and the product reliability of a COF (chip on film) bending process.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display module and a display device.
Background
With the development of Organic Light-Emitting Diode (OLED) display technology and the pursuit of new designs by consumers, OLED product morphology is gradually changing from rigid to flexible. Currently, flexible OLED display modules are widely used in various electronic products as display components of electronic devices, and the design of narrow bezel and ultra-thin Module (MDL) is more and more favored by terminal manufacturers and consumers. The narrow frame scheme is realized mainly by Chip On Flex (COF for short) and Pad Bending (Pad bonding) technologies.
Disclosure of Invention
The embodiment of the invention provides a display module and a display device, which are used for strengthening and fixing a binding region and preventing the binding region from being stressed and deformed in the bending process.
The embodiment of the invention provides a display module, which comprises:
the display panel is provided with a display area and a binding area positioned on one side of the display area;
the flexible circuit board is fixed on the back surface of the display panel and is far away from the binding area of the display panel;
a chip-on-film, the chip-on-film comprising: the display panel comprises a first structure, a bending structure and a second structure, wherein the first structure is used for being bound and connected with a binding region of the display panel, and the second structure is bent to the back of the display panel through the bending structure and is bound and connected with the flexible circuit board;
the polaroid is positioned on one side of the display panel, which is deviated from the flexible circuit board;
the first adhesive layer is positioned on one side of the polaroid, which is deviated from the display panel;
the cover plate is positioned on one side, away from the display panel, of the first adhesive layer;
the first structure and the first glue layer are fixedly connected through the reinforcing structure.
Optionally, in the display module provided in the embodiment of the present invention, a gap is formed between the polarizer and the first structure of the chip on film, and the material of the reinforcing structure includes a UV curable adhesive;
the reinforcing structure covers at least part of the surface of one side of the first structure far away from the display panel and covers the side edge of the first structure close to the polarizer.
Optionally, in the display module provided in the embodiment of the present invention, the number of the reinforcing structures is at least one, and an outer surface of each reinforcing structure is in an arc shape.
Optionally, in the display module provided in an embodiment of the present invention, a material of the reinforcing structure includes foam rubber, and the reinforcing structure covers a surface of the first structure on a side away from the display panel.
Optionally, in the display module provided in the embodiment of the present invention, the reinforcing structure includes a second adhesive layer, a reinforcing layer, and a third adhesive layer, which are stacked, the second adhesive layer is fixedly connected to the first structure, and the third adhesive layer is fixedly connected to the first adhesive layer.
Optionally, in the display module provided in an embodiment of the present invention, an outline of an orthogonal projection of the reinforcing structure on the display panel is a square or a curved line.
Optionally, in the display module provided in an embodiment of the present invention, a maximum distance between a surface of the reinforcing structure, which is in contact with the first adhesive layer, and the surface of the display panel is a first distance, and the first distance is greater than or equal to a thickness of the polarizer and is less than or equal to a sum of the thickness of the polarizer and a half of the thickness of the first adhesive layer.
Optionally, in the display module provided in the embodiment of the present invention, the display module further includes a supporting heat dissipation structure located between the display panel and the flexible circuit board, where the supporting heat dissipation structure includes a metal material layer, a foam layer, and a fourth adhesive layer that are sequentially stacked, the fourth adhesive layer is fixedly connected to the back surface of the display panel, and the metal material layer is electrically connected to the flexible circuit board; wherein the content of the first and second substances,
the metal material layer is made of stainless steel, and the orthographic projection of the metal material layer on the display panel covers the whole display panel;
or, the metal material layer comprises a stainless steel layer and a copper foil layer which are fixedly connected, the orthographic projection of the copper foil layer on the display panel covers the display area of the display panel, and the orthographic projection of the stainless steel layer on the display panel covers the binding area of the display panel.
Optionally, in the display module provided in the embodiment of the present invention, the flip chip film further includes a third structure located between the second structure and the bending structure;
the display module assembly still includes:
a spacer layer positioned between the third structure and the supporting heat dissipation structure, the spacer layer having a slot;
the driving chip is positioned in the slot, and the height of the driving chip is less than or equal to that of the spacer layer;
and the heat dissipation adhesive layer is positioned on one side of the third structure, which faces away from the display panel, and the orthographic projection of the heat dissipation adhesive layer on the display panel covers the orthographic projection of the driving chip on the display panel.
Correspondingly, the embodiment of the invention also provides a display device which comprises the display module.
The embodiment of the invention has the following beneficial effects:
according to the display module and the display device provided by the embodiment of the invention, the first structure of the chip on film is fixedly connected with the first glue layer by adopting the reinforcing structure, the cover plate is attached by the first glue layer polaroid, so that the reinforcing structure is fixedly connected with the cover plate by the first glue layer, the reinforcing structure can enhance the supporting performance of the display panel binding area, and the binding area of the display panel is strengthened and fixed, therefore, in the process of bending the chip on film, the display panel and the film layer below the display panel cannot be bent and deformed, the problems of bright lines, abnormal displays and the like caused by the breakage of the film layer peeling and the metal wires in the display panel are prevented, and the yield and the product reliability of the COF bending process are improved.
Drawings
Fig. 1 is a schematic structural diagram of a display module provided in the prior art;
FIG. 2 is a schematic structural view illustrating a bending deformation of the display module shown in FIG. 1 during bending;
fig. 3-6 are schematic structural diagrams of a display module according to an embodiment of the invention;
fig. 7-10 are schematic top view structures of a display module according to an embodiment of the invention;
fig. 11 and 12 are enlarged schematic views of a display module according to an embodiment of the invention;
fig. 13 and 14 are schematic structural views of a display module according to an embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, specific embodiments of a display module and a display device according to an embodiment of the present invention are described in detail below with reference to the accompanying drawings. It should be understood that the preferred embodiments described below are only for illustrating and explaining the present invention and are not to be used for limiting the present invention. And the embodiments and features of the embodiments in the present application may be combined with each other without conflict.
The thickness, size and shape of each layer of film in the drawings do not reflect the real proportion of the display module, and the purpose is only to illustrate the content of the invention.
As shown in fig. 1, one side of a Chip On Film (COF) 1 is bonded to a bonding region of a display panel 2, the other side of the COF is bonded to a flexible circuit board (FPC) 3, and a portion of the COF is bent to the back of the display panel 2, and a driving chip 4(IC) is bonded to the COF. The polaroid 5 is attached to the upper portion of the effective functional area of the display panel 2, the polaroid 5 is attached to the cover plate 7 through the optical transparent adhesive (TOCA) 6, the binding area of the COF is not attached to the polaroid 5 or the cover plate 7, and the support heat dissipation structure 8 is arranged between the display panel 2 and the flexible circuit board 3.
The inventor of the present application finds that, for a flexible AMOLED panel, the pad bonding area has low strength, the COF bending process has weak bending resistance, and the risk of film separation (Peeling) and bonding area deformation is high, as shown in fig. 2, when the COF is bent, film bending deformation (within a dotted line frame of fig. 2) of a display panel 2 and a supporting heat dissipation structure 8 in the bonding area is easily caused, and further, the film Peeling and metal wiring are broken to cause defects of bright lines, abnormal displays and the like, which seriously affects the yield and product reliability of the COF bending process.
In order to solve the problem that in the COF bending process of the flexible display product, due to insufficient supporting strength of the bonding region, the film layer of the bonding region is bent and deformed, and further, bright lines and abnormal displays are caused, an embodiment of the present invention provides a display module, as shown in fig. 3 to 6, including:
the display device comprises a display panel 10, wherein the display panel 10 is provided with a display area AA and a binding area BB positioned on one side of the display area AA; specifically, the display area AA of the display panel 10 is used for displaying a picture;
a flexible circuit board 20 fixed to the back surface of the display panel 10 and far away from the binding area BB of the display panel 10;
the chip on film 30, the chip on film 30 includes: a first structure 301 for binding and connecting with the binding region BB of the display panel 10, a bent structure 303, and a second structure 302 bent to the back of the display panel 10 by the bent structure 303 and binding and connecting with the flexible circuit board 20; specifically, the bending structure 303 is a curved shape, and the flip-chip film 30 is bent toward the back of the display panel 10, which is favorable for the arrangement of a narrow frame;
a polarizer 40 located on a side of the display panel 10 facing away from the flexible circuit board 20; the polarizer 40 is used for improving the contrast of the display module, and therefore, preferably, the polarizer 40 is disposed in the display area AA;
the first adhesive layer 50 is positioned on one side of the polarizer 40 departing from the display panel 10; specifically, the first glue layer 50 may be an optically clear glue (TOCA);
the cover plate 60 is positioned on one side of the first adhesive layer 50, which is far away from the display panel 10;
the reinforcing structure 70, the first structure 301 and the first adhesive layer 50 are fixedly connected through the reinforcing structure 70.
In the display module provided by the embodiment of the invention, the first structure of the chip on film is fixedly connected with the first adhesive layer by adopting the reinforcing structure, and the cover plate is attached by the polarizer of the first adhesive layer, so that the reinforcing structure is fixedly connected with the cover plate by the first adhesive layer, and the reinforcing structure can enhance the supporting performance of the binding region of the display panel, thereby realizing the reinforced fixation of the binding region of the display panel.
In a specific implementation, in the display module provided in the embodiment of the present invention, as shown in fig. 3 and 4, a gap is formed between the polarizer 40 and the first structure 301 of the flip-chip film 30, and the material of the reinforcing structure 70 may include a UV curable adhesive;
the reinforcing structure 70 covers at least a portion of the surface of the first structure 301 on the side away from the display panel 10, and covers the side of the first structure 301 close to the polarizer 40. Specifically, before the flip chip 30 is bent, the flip chip 30 is in a flat state, the side of the first structure 301 close to the polarizer 40 and the upper side of the first structure 301 are coated with the UV-curable adhesive with high elastic modulus, after the UV-curable adhesive is cured, a gentle convex top surface is formed on the upper side of the first structure 301, the first adhesive layer 50(TOCA) extends to the curing position of the UV-curable adhesive, and the cured UV-curable adhesive (the reinforcing structure 70) is attached to the cover plate 60. The convex UV curable adhesive (the reinforcing structure 70) is bonded to the cover plate 60 through the first adhesive layer 50(TOCA), so as to strengthen and fix the bonding area BB corresponding to the flip chip 30, i.e. strengthen the bonding area BB of the display panel 10, thereby avoiding the defects of bright lines, abnormal displays, and the like caused by stress deformation during the bending of the flip chip 30.
In practical applications, as shown in fig. 3 and 4, the material of the reinforcing structure 70 is not limited to the above-mentioned UV-curable adhesive, but may also be a hot-melt adhesive or other adhesives.
In a specific implementation, as shown in fig. 3 and 4, in the display module provided in the embodiment of the present invention, the number of the reinforcing structures 70 is at least one, and the outer surface of each reinforcing structure 70 is arc-shaped. Specifically, as shown in fig. 3, the number of the reinforcing structures 70 is one; as shown in fig. 4, the number of the reinforcing structures 70 is two, but is not limited thereto. Specifically, as shown in fig. 7-10, fig. 7 and 8 are schematic top views of partial film layers of the display module shown in fig. 3, where the number of the reinforcing structures 70 is one; fig. 9 and 10 are schematic top views of partial films of the display module shown in fig. 4, where the number of the reinforcing structures 70 is two. Optionally, the number of the UV-curing adhesive coating strips (i.e. the number of the reinforcing structures 70) may be determined according to the specific product size and the UV-curing adhesive coating process, which is not limited herein.
In a specific implementation, in the display module provided in the embodiment of the invention, as shown in fig. 5, the material of the reinforcing structure 70 may include, but is not limited to, Foam (Foam) glue, and the reinforcing structure 70 covers a surface of the first structure 301 on a side away from the display panel 10. Specifically, the foam adhesive is attached to the upper portion of the first structure 301, and the foam adhesive has adhesiveness from top to bottom, so that the foam adhesive is attached to the cover plate 60 through the first adhesive layer 50(TOCA), and finally the binding area BB of the display panel 10 is strengthened and fixed, thereby avoiding the defects of bright lines, abnormal display and the like caused by stress deformation during the bending of the flip chip 30.
In a specific implementation, in the display module provided in the embodiment of the invention, as shown in fig. 6, the reinforcing structure 70 may include a second adhesive layer 701, a reinforcing layer 702, and a third adhesive layer 703 that are stacked, where the second adhesive layer 701 is fixedly connected to the first structure 301, and the third adhesive layer 703 is fixedly connected to the first adhesive layer 50. Specifically, the reinforcing layer 702 with the upper and lower adhesive layers attached is attached to the first structure 301 and the first adhesive layer 50(TOCA), that is, the reinforcing layer 702 is attached to the cover plate 60 through the third adhesive layer 703, and the reinforcing layer 702 is attached to the first structure 301 through the second adhesive layer 701, so that the bonding area BB of the display panel 10 is strengthened and fixed, and the defects of bright lines, abnormal displays and the like caused by stress deformation during the bending of the flip chip film 30 are avoided.
Specifically, the second adhesive layer 701 and the third adhesive layer 703 may be a pressure sensitive adhesive (PSA tape), a double-sided adhesive, or the like, and the reinforcement layer 702 may include, but is not limited to, a PET (Polyethylene terephthalate) film, a PI (Polyimide) film, a PC (polycarbonate) film, a PMMA (polymethyl methacrylate) film, or the like.
In practical implementation, in the display module provided in the embodiment of the present invention, as shown in fig. 3 to fig. 6, an outline of an orthogonal projection of the reinforcing structure 70 on the display panel 10 may be a square or a curve. Specifically, as shown in fig. 7 and 9, the outline of the orthographic projection of the reinforcing structure 70 on the display panel 10 is a curved line; as shown in fig. 8 and 10, the outline of the orthogonal projection of the reinforcing structure 70 on the display panel 10 is square. As shown in fig. 7-10, the orthographic coverage area of the reinforcing structure 70 on the display panel 10 needs to exceed the left, upper and lower edges of the first structure 301, and can not exceed the right edge.
To further illustrate the coating design of the reinforcement structure 70, as shown in fig. 11 and 12, fig. 11 is a partially enlarged schematic view of fig. 3, and fig. 12 is a partially enlarged schematic view of fig. 5, in the prior art, the thickness N of the flip-chip film 30 is about 70um, the thickness K of the polarizer 40 is about 106um or 147um, and the thickness H of the first adhesive layer 50 is about 150um, so that even if the first adhesive layer 50 overlaps the flip-chip film 30, the first adhesive layer 50 is not directly attached to the flip-chip film 30, in this scheme, the UV-curing glue is coated on the side edge and the upper side of the first structure 301 of the flip-chip film 30 close to the polarizer 40 (in the schemes of fig. 3 and 4), and the maximum distance L from the contact surface of the UV-curing glue protruding to the first adhesive layer 50 to the surface of the display panel 10 needs to be greater than or equal to the thickness K of the polarizer 40, i.e., L is greater than or equal to K in fig. 11. In addition, structural interference between the UV curing adhesive with the upper cover plate 60 in the process of attaching the cover plate 60 and the upper cover plate 60 and cutting off the first adhesive layer 50 due to the fact that the UV curing adhesive is too deep embedded into the first adhesive layer 50 are avoided, the maximum distance L between the surface of the UV curing adhesive in contact with the first adhesive layer 50 and the surface of the display panel 10 is smaller than or equal to the sum of the thickness K of the polarizer 40 and half of the thickness H of the first adhesive layer 50, namely, L is smaller than or equal to K + H/2. Similarly, for the solutions shown in fig. 5 and 6, the sum L of the thickness of the reinforcing structure 70 and the thickness of the first structure 301 needs to be greater than or equal to the thickness K of the polarizer 40, i.e., L is greater than or equal to K in fig. 12, and the sum L of the thickness of the reinforcing structure 70 and the thickness of the first structure 301 needs to be less than or equal to the sum of the thickness K of the polarizer 40 and half of the thickness H of the first adhesive layer 50, i.e., L is less than or equal to K + H/2. Therefore, in the display module provided in the embodiment of the present invention, as shown in fig. 3-6, 11 and 12, the maximum distance from the surface of the reinforcing structure 70 contacting the first adhesive layer 50 to the surface of the display panel 10 is a first distance L, and the first distance L is greater than or equal to the thickness K of the polarizer 40 and less than or equal to the sum of the thickness K of the polarizer 40 and the half of the thickness H of the first adhesive layer 50, i.e., K is less than or equal to L and less than or equal to K + H/2.
In specific implementation, as shown in fig. 3 to fig. 6, the display module according to the embodiment of the present invention further includes a supporting heat dissipation structure 80(Super Clean Foam, SCF) located between the display panel 10 and the flexible circuit board 20(FPC) to achieve buffering, shading, and heat dissipation effects on the display panel, and meanwhile, the flexible circuit board 20 is fixed to the display panel 10 after the flip-chip film 30 is bent; as shown in fig. 13 and 14, the supporting and heat dissipating structure 80 includes a metal material layer 801, a Foam layer 802(Foam), and a fourth glue layer 803 (such as an embossed glue, EMBO) stacked in sequence, the fourth glue layer 803 is fixedly connected to the back surface of the display panel 10, and the metal material layer 801 is electrically connected to the flexible circuit board 20; wherein the content of the first and second substances,
in the prior art, a copper foil is generally used as a material of the metal material layer 801, the copper foil has good heat dissipation performance but insufficient hardness, as shown in fig. 13, the material of the metal material layer 801 may be stainless steel (SUS), and an orthographic projection of the metal material layer 801 on the display panel 10 covers the whole display panel 10, in the embodiment of the present invention, the copper foil layer in the prior art is completely changed into a stainless steel (SUS) material, and the SUS may be used as a rigid support layer, so as to improve the bending strength of a COF binding region, further prevent the binding region BB of the display panel 10 from being forced to bend and deform in the bending process of the flip chip film 30, and the thickness of the SUS layer is 80um to 200um, and the specific thickness is not limited;
alternatively, as shown in fig. 14, the metal material layer 801 includes a stainless steel layer 801 ' and a copper foil layer 801 that are fixedly connected, an orthogonal projection of the copper foil layer 801 "on the display panel 10 covers the display area of the display panel 10, and an orthogonal projection of the stainless steel layer 801 ' on the display panel 10 covers the bonding area BB of the display panel 10, that is, in the embodiment of the present invention, a portion of the metal material layer 801 in the prior art is a stainless steel (SUS) material, and a portion of the metal material layer is a copper foil material, the copper foil layer 801" can ensure the heat dissipation performance of the metal material layer 801, and the stainless steel layer 801 ' can be used as a rigid support layer of the bonding area BB portion, so as to improve the bending strength of the COF bonding area and prevent the bonding area BB of the display panel 10 from being forced to bend and deform during the bending process of the flip chip film 30.
It should be noted that the supporting heat dissipation structure 80 shown in fig. 13 and 14 in the embodiment of the present invention is a specific structure of the embodiment shown in fig. 3, and of course, the specific structure of the supporting heat dissipation structure 80 shown in fig. 4 to 6 may be the same as that of fig. 13 or fig. 14.
In a specific implementation, in the display module provided in the embodiment of the present invention, as shown in fig. 3-6, 13 and 14, the flip-chip film 30 further includes a third structure 304 located between the second structure 302 and the bent structure 303;
the display module assembly still includes:
a spacer layer 90(cushion) located between the third structure 304 and the supporting heat dissipation structure 80, the spacer layer 90 having a slot 901; specifically, the spacer layer 90 is used for fixing the driving chip 100, and the material of the spacer layer 90 may be PET or foam;
the driving chip 100 is positioned in the slot 901, and the height of the driving chip 100 is less than or equal to that of the spacer layer 90;
the heat dissipation adhesive layer 110(IC Cover Tape) is located on a side of the third structure 304 opposite to the display panel 10, and an orthographic projection of the heat dissipation adhesive layer 110 on the display panel 10 covers an orthographic projection of the driving chip 100 on the display panel 10; specifically, the heat dissipation adhesive layer 110 is used for dissipating heat of the driving chip 100 and electromagnetically shielding the driving chip 100.
In a specific implementation, as shown in fig. 3-6, 13 and 14, the display module according to the embodiment of the invention further includes a fifth adhesive layer 120, such as a UV curable adhesive, located between the bonding area BB side of the display panel 10 and the bending structure 303 of the flip-chip film 30, where the fifth adhesive layer 120 can bond the display panel 10 and the flip-chip film 30, and can prevent moisture from diffusing between the display panel 10 and the flip-chip film 30.
It is understood that the display panel in the embodiment of the present invention includes components such as a substrate, a thin film transistor array, and an OLED light emitting layer. The substrate is a flexible substrate such as polyimide; the thin film transistor array includes, but is not limited to, at least one of a low temperature polysilicon thin film transistor and an oxide thin film transistor.
In specific implementation, the process flow of the display module provided by the embodiment of the invention mainly comprises the following steps: polaroid and display panel's laminating, binding of district is bound with display panel to the Cover brilliant film, binding of flexible circuit board and Cover brilliant film, the preparation of reinforcement structure, Shape cut, apron and protection film laminating, support heat radiation structure and the laminating of the display panel back and flexible circuit board, separate bed course (IC cushion) laminating, the laminating of carrier film, first glue film (TOCA) and polaroid laminating, the apron is laminated with first glue film, Cover brilliant film buckles, heat radiation glue film (IC Cover Tape) and Cover brilliant film laminating, Test detects.
It should be noted that, in large-sized products such as mobile phones, since the bonding area and the width of the display panel are both large, when the COF is bent, the bonding area of the display panel can sufficiently support the bending stress applied when the COF is bent. However, when the existing technical scheme is applied to a small-sized flexible wearable product, due to the fact that the size of the binding region is small, film layers such as a display panel and a metal material layer corresponding to the binding region are prone to bending deformation when the COF is bent, and therefore the embodiment of the invention is particularly suitable for the small-sized flexible wearable product.
In addition, the embodiment of the invention adopts the COF bending technical scheme, so that the typesetting rate of the back plate can be improved, the productivity is improved, and the cost is reduced.
Based on the same inventive concept, the embodiment of the invention further provides a display device, which comprises any one of the display modules provided by the embodiment of the invention. The display device may be: any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like. The implementation of the display device can be seen in the above embodiments of the display module, and repeated descriptions are omitted.
According to the display module and the display device provided by the embodiment of the invention, the first structure of the chip on film is fixedly connected with the first glue layer by adopting the reinforcing structure, the cover plate is attached by the first glue layer polaroid, so that the reinforcing structure is fixedly connected with the cover plate by the first glue layer, the reinforcing structure can enhance the supporting performance of the display panel binding area, and the binding area of the display panel is strengthened and fixed, therefore, in the process of bending the chip on film, the display panel and the film layer below the display panel cannot be bent and deformed, the problems of bright lines, abnormal displays and the like caused by the breakage of the film layer peeling and the metal wires in the display panel are prevented, and the yield and the product reliability of the COF bending process are improved.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. A display module, comprising:
the display panel is provided with a display area and a binding area positioned on one side of the display area;
the flexible circuit board is fixed on the back surface of the display panel and is far away from the binding area of the display panel;
a chip-on-film, the chip-on-film comprising: the display panel comprises a first structure, a bending structure and a second structure, wherein the first structure is used for being bound and connected with a binding region of the display panel, and the second structure is bent to the back of the display panel through the bending structure and is bound and connected with the flexible circuit board;
the polaroid is positioned on one side of the display panel, which is deviated from the flexible circuit board;
the first adhesive layer is positioned on one side of the polaroid, which is deviated from the display panel;
the cover plate is positioned on one side, away from the display panel, of the first adhesive layer;
the first structure and the first glue layer are fixedly connected through the reinforcing structure.
2. The display module of claim 1, wherein a gap is formed between the polarizer and the first structure of the flip-chip film, and the material of the reinforcing structure comprises a UV curable adhesive;
the reinforcing structure covers at least part of the surface of one side of the first structure far away from the display panel and covers the side edge of the first structure close to the polarizer.
3. The display module assembly as claimed in claim 2, wherein the number of the reinforcing structures is at least one, and the outer surface of the reinforcing structure is arc-shaped.
4. The display module according to claim 1, wherein the material of the reinforcing structure comprises foam rubber, and the reinforcing structure covers a surface of the first structure on a side away from the display panel.
5. The display module assembly according to claim 1, wherein the reinforcing structure comprises a second adhesive layer, a reinforcing layer and a third adhesive layer, the second adhesive layer, the reinforcing layer and the third adhesive layer are stacked, the second adhesive layer is fixedly connected with the first structure, and the third adhesive layer is fixedly connected with the first adhesive layer.
6. The display module according to any one of claims 1 to 5, wherein an outline of an orthographic projection of the reinforcing structure on the display panel is square or curved.
7. The display module according to any one of claims 1 to 5, wherein a maximum distance from a surface of the reinforcing structure contacting the first adhesive layer to the surface of the display panel is a first distance, and the first distance is greater than or equal to the thickness of the polarizer and less than or equal to a sum of the thickness of the polarizer and half of the thickness of the first adhesive layer.
8. The display module assembly according to any one of claims 1 to 5, further comprising a supporting heat dissipation structure located between the display panel and the flexible circuit board, wherein the supporting heat dissipation structure comprises a metal material layer, a foam layer and a fourth adhesive layer, which are sequentially stacked, the fourth adhesive layer is fixedly connected with the back surface of the display panel, and the metal material layer is electrically connected with the flexible circuit board; wherein the content of the first and second substances,
the metal material layer is made of stainless steel, and the orthographic projection of the metal material layer on the display panel covers the whole display panel;
or, the metal material layer comprises a stainless steel layer and a copper foil layer which are fixedly connected, the orthographic projection of the copper foil layer on the display panel covers the display area of the display panel, and the orthographic projection of the stainless steel layer on the display panel covers the binding area of the display panel.
9. The display module of claim 8, wherein the flip-chip film further comprises a third structure located between the second structure and the bent structure;
the display module assembly still includes:
a spacer layer positioned between the third structure and the supporting heat dissipation structure, the spacer layer having a slot;
the driving chip is positioned in the slot, and the height of the driving chip is less than or equal to that of the spacer layer;
and the heat dissipation adhesive layer is positioned on one side of the third structure, which faces away from the display panel, and the orthographic projection of the heat dissipation adhesive layer on the display panel covers the orthographic projection of the driving chip on the display panel.
10. A display device, comprising the display module according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110926504.6A CN113555412A (en) | 2021-08-12 | 2021-08-12 | Display module and display device |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114093243A (en) * | 2021-11-11 | 2022-02-25 | 昆山工研院新型平板显示技术中心有限公司 | Display module and preparation method thereof |
| CN114220344A (en) * | 2021-11-26 | 2022-03-22 | 京东方科技集团股份有限公司 | Display module and display device |
| CN114550589A (en) * | 2022-02-22 | 2022-05-27 | 武汉天马微电子有限公司 | Display module and display device |
| CN114628469A (en) * | 2022-02-17 | 2022-06-14 | 武汉华星光电半导体显示技术有限公司 | OLED display panel |
| CN114859599A (en) * | 2022-04-27 | 2022-08-05 | 京东方科技集团股份有限公司 | Display module and display device |
| CN114900948A (en) * | 2022-04-25 | 2022-08-12 | 京东方科技集团股份有限公司 | Flexible circuit board module, reinforcing method thereof and display device |
| CN115311949A (en) * | 2022-08-31 | 2022-11-08 | 昆山国显光电有限公司 | Binding structure, display module and electronic equipment |
| CN115542594A (en) * | 2022-09-20 | 2022-12-30 | 惠科股份有限公司 | Display panel, preparation method of display panel and display device |
| CN114038892B (en) * | 2021-11-24 | 2023-07-04 | 武汉华星光电半导体显示技术有限公司 | Display panel and display device |
| US12025886B2 (en) | 2022-09-20 | 2024-07-02 | HKC Corporation Limited | Display panel, method of manufacturing display panel, and display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114093243A (en) * | 2021-11-11 | 2022-02-25 | 昆山工研院新型平板显示技术中心有限公司 | Display module and preparation method thereof |
| CN114038892B (en) * | 2021-11-24 | 2023-07-04 | 武汉华星光电半导体显示技术有限公司 | Display panel and display device |
| CN114220344A (en) * | 2021-11-26 | 2022-03-22 | 京东方科技集团股份有限公司 | Display module and display device |
| CN114220344B (en) * | 2021-11-26 | 2023-12-29 | 京东方科技集团股份有限公司 | Display module and display device |
| CN114628469A (en) * | 2022-02-17 | 2022-06-14 | 武汉华星光电半导体显示技术有限公司 | OLED display panel |
| CN114550589A (en) * | 2022-02-22 | 2022-05-27 | 武汉天马微电子有限公司 | Display module and display device |
| CN114900948A (en) * | 2022-04-25 | 2022-08-12 | 京东方科技集团股份有限公司 | Flexible circuit board module, reinforcing method thereof and display device |
| CN114859599A (en) * | 2022-04-27 | 2022-08-05 | 京东方科技集团股份有限公司 | Display module and display device |
| CN115311949A (en) * | 2022-08-31 | 2022-11-08 | 昆山国显光电有限公司 | Binding structure, display module and electronic equipment |
| CN115311949B (en) * | 2022-08-31 | 2023-11-28 | 昆山国显光电有限公司 | Binding structure, display module assembly and electronic equipment |
| CN115542594B (en) * | 2022-09-20 | 2023-12-22 | 惠科股份有限公司 | Display panel, preparation method of display panel and display device |
| CN115542594A (en) * | 2022-09-20 | 2022-12-30 | 惠科股份有限公司 | Display panel, preparation method of display panel and display device |
| US12025886B2 (en) | 2022-09-20 | 2024-07-02 | HKC Corporation Limited | Display panel, method of manufacturing display panel, and display device |
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