CN114220344B - Display module and display device - Google Patents
Display module and display device Download PDFInfo
- Publication number
- CN114220344B CN114220344B CN202111420613.7A CN202111420613A CN114220344B CN 114220344 B CN114220344 B CN 114220344B CN 202111420613 A CN202111420613 A CN 202111420613A CN 114220344 B CN114220344 B CN 114220344B
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- circuit board
- display panel
- display
- bracket
- support plate
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- 230000017525 heat dissipation Effects 0.000 claims description 14
- 229910000838 Al alloy Inorganic materials 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 5
- 238000009413 insulation Methods 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims description 4
- 238000012546 transfer Methods 0.000 abstract description 6
- 230000009286 beneficial effect Effects 0.000 abstract description 5
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- 238000010586 diagram Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000002390 adhesive tape Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000000956 alloy Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 238000004806 packaging method and process Methods 0.000 description 1
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Classifications
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
A display module relates to the technical field of display, and comprises a display panel, a support plate arranged on one side of the display panel, which is away from a display side, a bracket arranged on the surface of the support plate, which is away from the display panel, a first circuit board which is in binding connection with the display panel, and a second circuit board which is electrically connected with the first circuit board; the first circuit board and the second circuit board are both positioned on one side of the supporting plate, which is far away from the display panel, and the first circuit board or/and the second circuit board are/is fixed on the bracket. The display module of the embodiment of the disclosure can reduce the heat transfer generated by the circuit board to the display panel, and is beneficial to prolonging the service life of the display panel.
Description
Technical Field
The embodiment of the disclosure relates to the technical field of display, in particular to a display module and a display device.
Background
With the development of intelligent automobiles, organic Light Emitting Diode (OLED) display technology is increasingly applied to the intelligent automobile industry. However, the vehicle-mounted OLED screen has larger heating value and higher running temperature when in use, and the problem of heat dissipation of the vehicle-mounted OLED screen is a pain point in the industry at present. In some technologies, a circuit board of the vehicle-mounted OLED screen is directly fixed on one side of the display panel, which is far away from the display side, through an adhesive layer, so that heat generated by components on the circuit board can be transferred to the display panel, and the local temperature of the display panel can be increased, so that the service life of the display panel is influenced.
Disclosure of Invention
The embodiment of the disclosure provides a display module and a display device, which can reduce the heat generated by a circuit board to be transferred to a display panel, and are beneficial to prolonging the service life of the display panel.
The embodiment of the disclosure provides a display module, which comprises a display panel, a support plate arranged on one side of the display panel, which is away from a display side, a bracket arranged on the surface of the support plate, which is away from the display panel, a first circuit board which is in binding connection with the display panel, and a second circuit board which is electrically connected with the first circuit board; the first circuit board and the second circuit board are both positioned on one side of the supporting plate, which is far away from the display panel, and the first circuit board or/and the second circuit board are/is fixed on the bracket.
The embodiment of the disclosure also provides another display module, which comprises a display panel, a support plate arranged on one side of the display panel, which is away from the display side, a bracket arranged on the surface of the support plate, which is away from the display panel, and a circuit board which is in binding connection with the display panel; the circuit board is positioned on one side of the supporting plate, which is far away from the display panel, and is fixed on the bracket.
The embodiment of the disclosure also provides a display device, which comprises the display module set according to any embodiment.
The display module of this disclosed embodiment sets up the support on the surface that deviates from display panel of backup pad to locate the circuit board of display module assembly and deviate from one side of display panel and fix on the support of backup pad. Like this, keep apart the circuit board with the backup pad through the support, the circuit board is kept away from the backup pad setting, can reduce the heat transfer that the circuit board produced to display panel, is favorable to improving display panel's life-span.
Drawings
The accompanying drawings are included to provide a further understanding of the disclosed embodiments and are incorporated in and constitute a part of this specification, illustrate embodiments of the disclosure and together with the description serve to explain, without limitation, the disclosed embodiments. The shapes and sizes of the components in the drawings do not reflect true proportions, and are intended to illustrate the present disclosure only.
FIG. 1 is a schematic diagram of a display module according to some techniques;
fig. 2a is a schematic structural diagram of a display module according to some exemplary embodiments;
FIG. 2b is a schematic top view of the support plate, the first circuit board, the second circuit board and the third circuit board in the display module of FIG. 2 a;
fig. 3 is a schematic structural diagram of a display module according to other exemplary embodiments;
fig. 4a is a schematic structural view of a bracket and a second circuit board of a display module according to some exemplary embodiments;
FIG. 4b is a schematic top view of the bracket and the second circuit board of FIG. 4 a;
fig. 5a is a schematic structural view of a bracket and a second circuit board of a display module according to other exemplary embodiments;
FIG. 5b is a schematic top view of the bracket and the second circuit board of FIG. 5 a;
fig. 6a is a schematic structural view of a bracket and a second circuit board of a display module according to still other exemplary embodiments;
FIG. 6b is a schematic top view of the bracket and the second circuit board of FIG. 6 a;
fig. 7a is a schematic structural view of a bracket and a second circuit board of a display module according to still other exemplary embodiments;
FIG. 7b is a schematic top view of the bracket and the second circuit board of FIG. 7 a;
fig. 8a is a schematic structural diagram of a display module according to still other exemplary embodiments;
FIG. 8b is a schematic top view of the support plate and the circuit board in the display module of FIG. 8 a;
fig. 9 is a schematic view of a display device according to some exemplary embodiments applied to an automobile.
The reference numerals are:
01. the chip comprises a flip chip film 02, a driving chip 03, a circuit board 04, a flexible circuit board 05, a first adhesive tape 06, a second adhesive tape 07, a time sequence control circuit board 08 and a back frame;
11. the display panel, 12, the support plate, 13, the support, 14, the polaroid, 15, the touch control structural layer, 16, the cover plate, 21, the heat insulation glue, 30, the circuit board, 31, the first circuit board, 32, the second circuit board, 33, the third circuit board, 34, the flip chip film, 35, the first flexible circuit board, 36, the second flexible circuit board, 41, the screw, 51, the shell, 52, the connecting frame, 61, the fixed table, 62 and the vehicle window;
131. bonding part 132, first fixing part 133, second fixing part 134, third fixing part 135, and slope part.
Detailed Description
It will be understood by those skilled in the art that modifications and equivalents may be made to the disclosed embodiments without departing from the spirit and scope of the disclosed embodiments, which are intended to be encompassed by the scope of the claims of the present disclosure.
As shown in fig. 1, fig. 1 is a schematic structural diagram of a display module of some technologies, where the display module includes a display panel 11, a touch structure layer 15 disposed on a display side of the display panel 11, a support plate 12 disposed on a side of the display panel 11 facing away from the display side, a circuit board 03 bound and connected with the display panel 11 through a flip chip film (COF for short, a driving chip 02 is disposed), a timing control circuit board 07 connected with the circuit board 03, and a flexible circuit board 04 bound and connected with the touch structure layer 15. The first end of the flip chip film 01 is in binding connection with the display panel 11, the second end of the flip chip film 01 is bent to one side of the supporting plate 12, which is far away from the display panel 11, and the circuit board 03 is in binding connection with the second end of the flip chip film 01 and is fixed on the surface of the supporting plate 12, which is far away from the display panel 11, through the first adhesive tape 05. The timing control circuit board 07 is fixed on a back frame 08 of the whole machine including the display module. The flexible circuit board 04 is bent to a side of the support plate 12 facing away from the display panel 11 and is fixed to the flip chip film 01 by a second adhesive tape 06. The circuit board 03 generates a large amount of heat during the operation, and the circuit board 03 is directly fixed on the support plate 12, so that the heat generated by the circuit board 03 is transferred to the support plate 12 and then to the display panel 11, which may cause a local temperature rise of the display panel 11 and affect the life of the display panel (OLED display panel) 11. In order to improve the heat dissipation capability of the display panel, some technical schemes are to add active and passive heat dissipation devices, such as fans or fin structures, on the support plate, and the scheme occupies a large amount of whole machine space while increasing the weight of the module, so that the development trend of high rigidity and light weight is not met.
In some exemplary embodiments, as shown in fig. 2a, fig. 2a is a schematic structural diagram of a display module of some exemplary embodiments, where the display module includes a display panel 11, a support plate 12 disposed on a side of the display panel 11 facing away from the display side, a bracket 13 disposed on a surface of the support plate 12 facing away from the display panel 11, a first circuit board 31 bound and connected with the display panel 11, and a second circuit board 32 electrically connected with the first circuit board 31; the first circuit board 31 and the second circuit board 32 are located on the side of the support plate 12 facing away from the display panel 11, and the first circuit board 31 and/or the second circuit board 32 are/is fixed on the bracket 13.
In the display module of the embodiment of the disclosure, the support 13 is disposed on the surface of the support plate 12 facing away from the display panel 11, and the first circuit board 31 and/or the second circuit board 32 are disposed on one side of the support plate 12 facing away from the display panel 11 and fixed on the support 13. In this way, the first circuit board 31 or/and the second circuit board 32 is/are isolated from the support plate 12 by the support 13, and the first circuit board 31 or/and the second circuit board 32 is/are arranged away from the support plate 12, so that the heat generated by the first circuit board 31 or/and the second circuit board 32 can be reduced to be transferred to the display panel 11, which is beneficial to prolonging the service life of the display panel 11, and compared with the scheme that some technologies adopt active heat dissipation devices such as fans, the display module can be light, and the occupied space of the display module is reduced.
In some exemplary embodiments, as shown in fig. 2a, the bracket 13 may be a heat dissipation bracket, and the bracket 13 may be fixed on a surface of the support plate 12 facing away from the display panel 11 by a heat insulation adhesive 21. Illustratively, the bracket 13 may be made of a material with a high thermal conductivity, for example, may include copper, aluminum, etc., such as an aluminum alloy material, which is beneficial to heat dissipation and easy to process. The heat generated by the first circuit board 31 and/or the second circuit board 32 can be dissipated through the bracket 13, so that the heat dissipation capability can be improved, and the heat transfer to the display panel 11 can be reduced. The heat insulating paste 21 may fix the bracket 13 to the support plate 12 on the one hand, and may block heat transferred to the bracket 13 from the first circuit board 31 and/or the second circuit from being transferred to the display panel 11 through the support plate 12 on the other hand.
In some exemplary embodiments, the operating temperature of the second circuit board 32 may be greater than the operating temperature of the first circuit board 31. The second circuit board 32 generates more heat and can be fixed on the bracket 13; the first circuit board 31 generates less heat and may be fixed to the bracket 13 or to a surface of the support plate 12 facing away from the display panel 11. As shown in fig. 2a, the second circuit board 32 is fixed to the bracket 13, and the first circuit board 31 is fixed to the surface of the support plate 12 facing away from the display panel 11. As shown in fig. 3, fig. 3 is a schematic structural view of a display module according to other exemplary embodiments, and the first circuit board 31 and the second circuit board 32 are both fixed on the bracket 13. As shown in fig. 2a and 3, the distance between the first circuit board 31 and the surface of the support plate 12 facing away from the display panel 11 is d1, and may be d1 be equal to or greater than 6mm; the distance between the second circuit board 32 and the surface of the support plate 12 facing away from the display panel 11 is d2, d2> d1. In this way, the distance between the second circuit board 32 with higher working temperature and the surface of the support plate 12 facing away from the display panel 11 is set to be longer, which is favorable for the dissipation of heat of the second circuit board 32 and reduces the transmission to the support plate 12.
In some exemplary embodiments, as shown in fig. 2a and 3, the display module may further include a third circuit board 33 electrically connected to the second circuit board 32, and the third circuit board 33 is located on a side of the support plate 12 facing away from the display panel 11 and is fixed to the bracket 13. The third circuit board 33 may also be electrically connected to the first circuit board 31. In this way, the heat generated by the third circuit board 33 can be dissipated through the bracket 13, reducing the transmission to the display panel 11, and facilitating the improvement of the lifetime of the display panel 11.
In one example of the present embodiment, as shown in fig. 2a and 3, the operating temperature of the third circuit board 33 is greater than the operating temperature of the second circuit board 32, and the operating temperature of the second circuit board 32 is greater than the operating temperature of the first circuit board 31. The distance between the first circuit board 31 and the surface of the support plate 12 facing away from the display panel 11 is d1, and may be set to be d1 to be equal to or greater than 6mm; the distance between the second circuit board 32 and the surface of the support plate 12 facing away from the display panel 11 is d2, and the distance between the third circuit board 33 and the surface of the support plate 12 facing away from the display panel 11 is d3, d3> d2> d1. In this example, the higher the operating temperature, the more distant the circuit board is located from the surface of the support plate 12 facing away from the display panel 11, which facilitates the dissipation of heat from the circuit board and reduces the transfer to the support plate 12.
In an example of this embodiment, as shown in fig. 2a and 2b, fig. 2b is a schematic top view of the support plate 12, the first circuit board 31, the second circuit board 32 and the third circuit board 33 in the display module of fig. 2a, where the first circuit board 31, the second circuit board 32 and the third circuit board 33 are all located on a side of the support plate 12 facing away from the display panel 11, and illustratively, a length direction of the first circuit board 31 may extend along a first direction, a length direction of the second circuit board 32 and the third circuit board 33 may extend along a second direction, and the second direction may be perpendicular to the first direction. The second circuit board 32 may be located between the first circuit board 31 and the third circuit board 33.
In one example of the present embodiment, as shown in fig. 2a and fig. 3, the second circuit board 32 and the first circuit board 31 may be connected by one or more first flexible circuit boards 35, and the third circuit board 33 and the second circuit board 32 may be connected by one or more second flexible circuit boards 36. After the first circuit board 31, the second circuit board 32 and the third circuit board 33 are fixed, two ends of the first flexible circuit board 35 may be plugged (for example, a plug-in connector may be used to connect) on the first circuit board 31 and the second circuit board 32, and two ends of the second flexible circuit board 36 may be plugged on the third circuit board 33 and the second circuit board 32 to connect. Further, the first circuit board 31 and the third circuit board 33 may be connected by a third flexible circuit board (or the third flexible circuit board may not be provided).
In an example of this embodiment, as shown in fig. 2a, the display module may further include a touch structure layer 15 disposed on the display side of the display panel 11, and the second circuit board 32 or the third circuit board 33 may be provided with a touch chip electrically connected to the touch structure layer 15. The touch structure layer may be connected with a flexible circuit board in a binding manner, and the flexible circuit board is bent to a side of the support plate, which is away from the display panel, and is connected with the second circuit board or the third circuit board provided with the touch chip. Alternatively, the touch structure layer 15 may adopt a flexible multi-layer surface-type (FMLOC) touch structure, the touch structure layer 15 is disposed on the packaging layer of the display panel 11, and the touch electrode leads of the touch structure layer 15 may be connected to the routing layer of the display panel 11 outside the display area through the transfer holes.
In one example of the present embodiment, as shown in fig. 2a and 3, electronic components that generate more heat during operation may be disposed on the second circuit board 32 and the third circuit board 33, and electronic components that generate less heat during operation may be disposed on the first circuit board 31. For example, components such as a capacitor and a resistor may be disposed on the first circuit board 31, a timing controller (Tcon IC), a memory chip (Flash IC) and the like may be disposed on the second circuit board 32, and a touch chip, a sensor and the like may be disposed on the third circuit board 33.
In some exemplary embodiments, as shown in fig. 2a, the first circuit board 31 may be bonded to the display panel 11 through a flip chip film 34, and a driving chip for providing display signals may be disposed on the flip chip film 34. The first end of the flip chip film 34 is connected with one side of the display panel 11 in a binding manner, and the second end of the flip chip film 34 may be bent to the side of the support plate 12 facing away from the display panel 11 and connected with the first circuit board 31 in a binding manner.
The display panel 11 may be a flexible or rigid OLED display panel 11, and the display module may further include a polarizer 14 and a cover plate 16 disposed on a display side of the display panel 11. The polarizer 14 may be stacked between the display panel 11 and the touch structure layer 15, or the touch structure layer 15 may be stacked between the display panel 11 and the polarizer 14. The supporting layer can be attached to one side, away from the display side, of the display panel 11 through heat-conducting glue, the display module can further comprise a flexible supporting layer arranged between the display panel 11 and the supporting plate 12, and the flexible supporting layer can be made of Polyimide (PI) or polyethylene terephthalate (PET) or the like. The cover plate 16 may be made of flexible high-hardness material such as PI, PET, or ultra-thin glass (UTG).
In some exemplary embodiments, as shown in fig. 2a and fig. 3, the materials of the support plate 12 and the bracket 13 may be aluminum alloys, so as to have a good heat dissipation effect. The bracket 13 may include a bending plate having a thickness a1, and the supporting plate 12 has a thickness a2,0.67×a2.ltoreq.a1.ltoreq.1.2×a2.
In some exemplary embodiments, as shown in fig. 2a and 3, the thickness of the insulating glue 21 may be greater than or equal to 0.05mm to perform a good heat insulating function. The thickness of the heat insulating paste 21 may be, for example, 0.05mm to 0.1mm.
In some exemplary embodiments, as shown in fig. 3, the bracket 13 may include a fitting portion 131, a first fixing portion 132, a second fixing portion 133, and a third fixing portion 134, the fitting portion 131 being fitted and fixed to a surface of the support plate 12 facing away from the display panel 11, the first circuit board 31 being fixed (may use a screw or a heat insulating adhesive) on the first fixing portion 132, the second circuit board 32 being fixed (may use a screw or a heat insulating adhesive) on the second fixing portion 133, and the third circuit board 33 being fixed (may use a screw or a heat insulating adhesive) on the third fixing portion 134.
In one example of the present embodiment, as shown in fig. 3, the attaching part 131, the second fixing part 133, and the third fixing part 134 may be integrally formed. The second fixing portion 133 and/or the third fixing portion 134 may be bent to a side of the fitting portion 131 away from the support plate 12; alternatively, the second fixing portion 133 and/or the third fixing portion 134 may be connected to the attaching portion 131 through a slope portion 135. For example, the bracket 13 may be formed by bending an aluminum alloy plate material through a plurality of portions. The first fixing portion 132 may be connected to the second fixing portion 133 through a slope portion 135, and the first fixing portion 132, the second fixing portion 133, and the third fixing portion 134 may be disposed gradually away from a surface of the support plate 12 facing away from the display panel 11.
In some exemplary embodiments, as shown in fig. 3, the bracket 13 may include at least one first fixing portion 132, and the first circuit board 31 is fixed on the at least one first fixing portion 132. The bracket 13 may include at least one second fixing portion 133, and the second circuit board 32 is fixed to the at least one second fixing portion 133. The bracket 13 may include at least one third fixing portion 134, and the third circuit board 33 is fixed to the at least one third fixing portion 134.
Illustratively, the manner in which the second circuit board 32 is secured is illustrated. As shown in fig. 4a and 4b, fig. 4a is a schematic structural view of the bracket 13 and the second circuit board 32 of the display module according to some exemplary embodiments, fig. 4b is a schematic structural view of the bracket 13 and the second circuit board 32 of fig. 4a in a top view, one second fixing portion 133 may be provided, the second circuit board 32 may be rectangular, and one end of the second circuit board 32 may be fixed to the second fixing portion 133 by one or more (two are illustrated) screws 41. As shown in fig. 5a and 5b, fig. 5a is a schematic structural view of the bracket 13 and the second circuit board 32 of the display module according to other exemplary embodiments, fig. 5b is a schematic structural view of the bracket 13 and the second circuit board 32 of fig. 5a, two second fixing portions 133 may be provided, the distance between the two second fixing portions 133 and the surface of the support plate 12 facing away from the display panel 11 may be equal, the second circuit board 32 may be rectangular, a first end of the second circuit board 32 may be fixed to one of the second fixing portions 133 by one or more (two are illustrated) screws 41, and a second end of the second circuit board 32 may be fixed to the other second fixing portion 133 by one or more (two are illustrated) screws 41. As shown in fig. 6a and 6b, fig. 6a is a schematic structural view of the bracket 13 and the second circuit board 32 of the display module of still another exemplary embodiment, fig. 6b is a schematic structural view of the bracket 13 and the second circuit board 32 of fig. 6a, the second fixing parts 133 may be provided in three, distances between the three second fixing parts 133 and the surface of the support plate 12 facing away from the display panel 11 may be equal, the second circuit board 32 may be rectangular, both end positions in the length direction of the second circuit board 32, and intermediate positions of the second circuit board 32 near one of the long sides may be fixed on the three second fixing parts 133 by one or more screws 41 (five in total). As shown in fig. 7a and 7b, fig. 7a is a schematic structural view of the bracket 13 and the second circuit board 32 of the display module of still another exemplary embodiment, fig. 7b is a schematic structural view of the bracket 13 and the second circuit board 32 of fig. 7a, four second fixing portions 133 may be provided, distances between the four second fixing portions 133 and a surface of the support plate 12 facing away from the display panel 11 may be equal, the second circuit board 32 may be rectangular, both end positions in a length direction of the second circuit board 32, an intermediate position of the second circuit board 32 near one of the long sides, and an intermediate position of the second circuit board 32 near the other long side may be fixed on the four second fixing portions 133 by one or more screws 41 (six in total).
In other exemplary embodiments, the present disclosure provides a display module, as shown in fig. 8a and 8b, fig. 8a is a schematic structural view of the display module of still other exemplary embodiments, and fig. 8b is a schematic structural view of a support plate and a circuit board in the display module of fig. 8a, where the display module includes a display panel 11, a support plate 12 disposed on a side of the display panel 11 facing away from the display side, a bracket 13 disposed on a surface of the support plate 12 facing away from the display panel 11, and a circuit board 30 connected to the display panel 11 in a binding manner; the circuit board 30 is located on the side of the support plate 12 facing away from the display panel 11 and is fixed to the bracket 13.
In the display module of the embodiment of the disclosure, the support 13 is disposed on the surface of the support plate 12 facing away from the display panel 11, and the circuit board 30 bound and connected with the display panel 11 is disposed on one side of the support plate 12 facing away from the display panel 11 and fixed on the support 13. In this way, the circuit board 30 is isolated from the support plate 12 by the bracket 13, and the circuit board 30 is far away from the support plate 12, so that heat generated by the circuit board 30 can be reduced from being transferred to the display panel 11, and the service life of the display panel 11 can be prolonged.
As shown in fig. 8a, the bracket 13 may be a heat dissipation bracket, and the bracket 13 may be fixed on a surface of the support plate 12 facing away from the display panel 11 by a heat insulation adhesive 21. Illustratively, the bracket 13 may be made of a material with a high thermal conductivity, for example, may include copper, aluminum, etc., such as an aluminum alloy material, which is beneficial to heat dissipation and easy to process. The heat generated by the circuit board 30 can be dissipated through the bracket 13, so that the heat dissipation capability can be improved, and the heat transfer to the display panel 11 can be reduced. In order to improve the heat dissipation capability of the bracket 13, the bracket 13 may be further provided with a structure such as a heat dissipation fin. The heat insulating paste 21 may fix the bracket 13 to the support plate 12 on the one hand, and may block heat transferred from the circuit board 30 to the bracket 13 from being transferred to the display panel 11 through the support plate 12 on the other hand.
Illustratively, as shown in fig. 8a, the materials of the support plate 12 and the bracket 13 may each include copper or/and aluminum, for example, the materials of the support plate 12 and the bracket 13 may each be an aluminum alloy.
The embodiment of the disclosure also provides a display device, including the display module set according to any of the embodiments. The display device may be: any product or component with display function such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like.
As shown in fig. 9, fig. 9 is a schematic structural diagram of a display device applied to an automobile according to some exemplary embodiments, and the display device further includes a housing 51 surrounding a peripheral edge of the display module and a side of the display module facing away from a display side, and a motherboard disposed in the housing 51, where the motherboard may be electrically connected with the third circuit board. For example, the display device may be a large-sized vehicle-mounted OLED display device, the outer surface of the housing 51 may be provided with a connection frame 52, the display device may be fixed on a fixing table 61 near a front window 62 in the vehicle through the connection frame 52, and the display device may be configured in a "floating screen" shape. The connection frame 52 may be rotatably provided to be able to adjust a display angle of the display device.
In the drawings, the size of constituent elements, thicknesses of layers, or regions may be exaggerated for clarity. Accordingly, embodiments of the present disclosure are not necessarily limited to this dimension, and the shape and size of each component in the drawings do not reflect the true scale. Furthermore, the figures schematically illustrate some examples, and embodiments of the present disclosure are not limited to the shapes or values illustrated in the figures.
In the description herein, "parallel" refers to a state in which two straight lines form an angle of-10 ° or more and 10 ° or less, and thus includes a state in which the angle is-5 ° or more and 5 ° or less. The term "perpendicular" refers to a state in which the angle formed by two straight lines is 80 ° or more and 100 ° or less, and thus includes a state in which the angle is 85 ° or more and 95 ° or less.
In the description herein, the positional or positional relationship indicated by the terms "upper", "lower", "left", "right", "top", "inner", "outer", "axial", "four corners", and the like are based on the positional or positional relationship shown in the drawings, and are merely for convenience in describing the embodiments of the present disclosure, and are not indicative or implying that the structure referred to has a specific orientation, is configured and operated in a specific orientation, and thus is not to be construed as limiting the present disclosure.
In the description herein, unless explicitly stated and limited otherwise, the terms "connected," "fixedly connected," "mounted," "assembled" and "mounted" are to be construed broadly, and may be, for example, fixedly connected, or detachably connected, or integrally connected; the terms "mounted," "connected," "fixedly connected," and "coupled" may be directly connected, indirectly connected through intervening media, or in communication between two elements. The meaning of the above terms in the embodiments of the present disclosure may be understood by those of ordinary skill in the art as appropriate.
Claims (6)
1. A display module assembly, its characterized in that: the display device comprises a display panel, a support plate arranged on one side, away from a display side, of the display panel, a bracket arranged on the surface, away from the display panel, of the support plate, a first circuit board and a second circuit board, wherein the surface is away from the display panel, the first circuit board is in binding connection with the display panel, and the second circuit board is electrically connected with the first circuit board; the first circuit board and the second circuit board are positioned on one side of the supporting plate, which is away from the display panel, and the first circuit board or/and the second circuit board are/is fixed on the bracket;
the display module further comprises a third circuit board electrically connected with the second circuit board, and the third circuit board is positioned on one side of the supporting plate, which is away from the display panel, and is fixed on the bracket;
the working temperature of the third circuit board is higher than that of the second circuit board, and the working temperature of the second circuit board is higher than that of the first circuit board;
the distance between the first circuit board and the surface of the support plate, which is away from the display panel, is d1, the distance between the second circuit board and the surface of the support plate, which is away from the display panel, is d2, and the distance between the third circuit board and the surface of the support plate, which is away from the display panel, is d3, d3> d2> d1;
the bracket comprises a fitting part, a first fixing part, a second fixing part and a third fixing part, wherein the fitting part is fitted and fixed with the surface, deviating from the display panel, of the supporting plate, the first circuit board is fixed on the first fixing part, the second circuit board is fixed on the second fixing part, and the third circuit board is fixed on the third fixing part;
the attaching part, the second fixing part and the third fixing part are of an integrated structure;
the second fixing part or/and the third fixing part is/are bent to one side of the attaching part far away from the supporting plate; or, the second fixing part or/and the third fixing part is connected with the attaching part through a slope part.
2. The display module assembly of claim 1, wherein: the support is a heat dissipation support, and the support is fixed on the surface, facing away from the display panel, of the support plate through heat insulation glue.
3. The display module assembly of claim 1, wherein: the display module further comprises a touch control structure layer arranged on the display side of the display panel, and a touch control chip electrically connected with the touch control structure layer is arranged on the second circuit board or the third circuit board.
4. The display module assembly of claim 1, wherein: the supporting plate and the bracket are made of aluminum alloy; the support comprises a bending plate, the thickness of the bending plate is a1, the thickness of the supporting plate is a2, and a1 is more than or equal to 0.67×a2 and less than or equal to 1.2×a2.
5. The display module assembly of claim 2, wherein: the thickness of the heat insulation glue is more than or equal to 0.05mm.
6. A display device, characterized in that: comprising a display module according to any of claims 1 to 5.
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| CN202111420613.7A CN114220344B (en) | 2021-11-26 | 2021-11-26 | Display module and display device |
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| CN202111420613.7A CN114220344B (en) | 2021-11-26 | 2021-11-26 | Display module and display device |
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| CN114220344A CN114220344A (en) | 2022-03-22 |
| CN114220344B true CN114220344B (en) | 2023-12-29 |
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| CN115019650B (en) * | 2022-06-10 | 2023-11-10 | 京东方科技集团股份有限公司 | Support piece of display module, preparation method of support piece, display module and display device |
| CN115083291B (en) * | 2022-07-25 | 2023-12-12 | 京东方科技集团股份有限公司 | Display panel and display device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113112924A (en) * | 2021-04-15 | 2021-07-13 | 京东方科技集团股份有限公司 | Protective structure for flexible display module |
| CN113539091A (en) * | 2021-07-13 | 2021-10-22 | 京东方科技集团股份有限公司 | Display device |
| CN113555412A (en) * | 2021-08-12 | 2021-10-26 | 京东方科技集团股份有限公司 | Display module and display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113112924A (en) * | 2021-04-15 | 2021-07-13 | 京东方科技集团股份有限公司 | Protective structure for flexible display module |
| CN113539091A (en) * | 2021-07-13 | 2021-10-22 | 京东方科技集团股份有限公司 | Display device |
| CN113555412A (en) * | 2021-08-12 | 2021-10-26 | 京东方科技集团股份有限公司 | Display module and display device |
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