CN114550589A - Display module and display device - Google Patents
Display module and display device Download PDFInfo
- Publication number
- CN114550589A CN114550589A CN202210160681.2A CN202210160681A CN114550589A CN 114550589 A CN114550589 A CN 114550589A CN 202210160681 A CN202210160681 A CN 202210160681A CN 114550589 A CN114550589 A CN 114550589A
- Authority
- CN
- China
- Prior art keywords
- display module
- emitting surface
- light
- display
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 102
- 239000002390 adhesive tape Substances 0.000 claims abstract description 96
- 238000005452 bending Methods 0.000 claims abstract description 67
- 239000002184 metal Substances 0.000 claims abstract description 54
- 229910052751 metal Inorganic materials 0.000 claims abstract description 54
- 230000003139 buffering effect Effects 0.000 claims abstract description 46
- 239000010410 layer Substances 0.000 claims description 208
- 239000006260 foam Substances 0.000 claims description 37
- 239000012044 organic layer Substances 0.000 claims description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 25
- 229910052802 copper Inorganic materials 0.000 claims description 16
- 239000010949 copper Substances 0.000 claims description 16
- 230000000694 effects Effects 0.000 abstract description 20
- 238000010586 diagram Methods 0.000 description 25
- 238000000034 method Methods 0.000 description 14
- 230000008569 process Effects 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 11
- 230000009286 beneficial effect Effects 0.000 description 10
- 239000000463 material Substances 0.000 description 10
- 239000011889 copper foil Substances 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 7
- 230000009467 reduction Effects 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 230000008093 supporting effect Effects 0.000 description 6
- 238000013461 design Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000012790 adhesive layer Substances 0.000 description 4
- 230000005611 electricity Effects 0.000 description 4
- 230000002349 favourable effect Effects 0.000 description 4
- 230000003068 static effect Effects 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 235000009537 plain noodles Nutrition 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Abstract
The invention discloses a display module and a display device, belonging to the technical field of display, wherein the display module comprises a display panel, the display panel comprises a binding part, and the binding part is bent towards one side departing from a light-emitting surface of the display module; the orthographic projection of the buffering heat dissipation layer on the light-emitting surface of the display module is positioned in the display area, the orthographic projection of the first back plate on the light-emitting surface of the display module is positioned in the display area, a first adhesive tape is arranged between the first back plate and the buffering heat dissipation layer, one side, facing the first adhesive tape, of the buffering heat dissipation layer comprises a groove, and the first adhesive tape is embedded in the groove; the side, facing the first adhesive tape, of the buffer heat dissipation layer at least comprises a metal layer, and the orthographic projection of the metal layer on the light-emitting surface of the display module at least overlaps with the orthographic projection of the first adhesive tape on the light-emitting surface of the display module. The display device comprises the display module. The invention can realize the narrow frame and anti-static effect of the flexible display module and can also improve the bending reliability and stability of the whole display module.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display module and a display device.
Background
In the existing display technology, an Organic Light-Emitting Diode (OLED) display has many excellent characteristics such as being Light and thin, Emitting Light actively, having a fast response speed, a large viewing angle, a wide color gamut, high brightness, low power consumption, and being capable of manufacturing a flexible screen, and has attracted great interest in the scientific research and industrial fields, and has gradually become a third generation display technology following a Liquid Crystal Display (LCD). OLED refers to a diode that emits light by carrier injection and recombination under electric field driving using an organic semiconductor material and a light emitting material. With the rapid development of the OLED display technology, curved surface and flexible display products are pushed to rapidly enter the market, and the technology update in the related field is also a change day by day. In recent years, flexible display devices that make it possible to display images under curved conditions have been the focus of next-generation display devices manufactured by forming display panels, wirings, and the like on flexible substrates of flexible materials such as plastics.
Along with comprehensive screen cell-phone receives consumer's favor more and more, the market is also higher and higher to the screen ratio requirement of display module assembly, and the frame of flexible display screen also requires more and more narrowly. The realization of the narrow frame scheme of flexible display screen mainly relies on binding the region and buckling to make driver chip buckle to the back of display module assembly, realize fixedly through the sticky tape that comes the fixed form of buckling. But for realizing ultra-narrow frame or ultra-thin module, the bending radius of flexible module is done more and is less, need set up the sticky tape attenuation of fixed bending form, but the sticky tape thickness of fixed bending form thin can lead to its adhesion not enough easily, the problem of peeling off or breaking away from (peeling) appears, influences the reliability of binding regional bending, influences product quality and reliability.
Therefore, the display module and the display device provided with the display module can solve the peeling problem caused by insufficient viscosity of the adhesive tape in the fixed bending form while realizing the narrow frame of the flexible display module, and the technical problem to be solved by the technical personnel in the field is urgently needed.
Disclosure of Invention
In view of this, the present invention provides a display module and a display device to solve the problem in the prior art that the product quality and reliability are not sufficient easily due to the realization of an ultra-narrow bezel.
The invention provides a display module, comprising: the display panel comprises a display area and a bending area positioned on one side of the display area, the display panel comprises a binding part, the binding part is positioned on one side of the bending area far away from the display area, and the binding part is bent towards one side far away from the light-emitting surface of the display module; the binding part is connected with a driving chip, and the driving chip is positioned on one side of the binding part, which is far away from the light-emitting surface of the display module, in the direction vertical to the light-emitting surface of the display module; the buffer heat dissipation layer is positioned in the display area in the orthographic projection of the buffer heat dissipation layer on the light-emitting surface of the display module; the buffer heat dissipation layer is positioned on one side of the display panel of the display area, which is far away from the light-emitting surface of the display module; the orthographic projection of the first back plate on the light-emitting surface of the display module is positioned in the display area; the first back plate is positioned on one side of the binding part facing the light-emitting surface of the display module; a first adhesive tape is arranged between the first back plate and the heat buffering and dissipating layer, one side of the first adhesive tape, facing the heat buffering and dissipating layer, is fixedly attached to the heat buffering and dissipating layer, and one side of the first adhesive tape, facing the first back plate, is fixedly attached to the first back plate; in the direction perpendicular to the light-emitting surface of the display module, one side of the buffering heat dissipation layer facing the first adhesive tape comprises a groove, and the first adhesive tape is embedded in the groove; the side, facing the first adhesive tape, of the buffer heat dissipation layer at least comprises a metal layer, and the orthographic projection of the metal layer on the light-emitting surface of the display module at least overlaps with the orthographic projection of the first adhesive tape on the light-emitting surface of the display module.
Based on the same invention concept, the invention also discloses a display device which comprises the display module.
Compared with the prior art, the display module and the display device provided by the invention at least realize the following beneficial effects:
the display module comprises a display panel, wherein the display panel comprises a binding part, the binding part can be bent towards one side away from the light-emitting surface of the display module, so that the bent binding part is positioned at one side away from the light-emitting surface of the display module, and the narrow frame of the display module can be realized by bending the driving chip to the back of the light-emitting surface of the display module. The first adhesive tape is arranged between the first back plate and the buffering heat dissipation layer of the display module, and the first adhesive tape can enable the display panel of the binding part to be fixed with the buffering heat dissipation layer at the back of the light-emitting surface of the display module after being bent, so that the bending form of the display module is realized. The invention is arranged in the direction vertical to the light-emitting surface of the display module, one side of the buffer heat-dissipation layer facing the first adhesive tape comprises a groove, the first adhesive tape is embedded in the groove, the thickness of the buffer heat-dissipation layer of the first adhesive tape in the orthographic projection range of the light-emitting surface of the display module is reduced, so that one side of the buffer heat-dissipation layer facing the first adhesive tape comprises the groove, the groove is a thinner area of the buffer heat-dissipation layer, the first adhesive tape is embedded in the groove in the thinner area, the fixed attachment of the buffer heat-dissipation layer and the first back plate by the first adhesive tape is realized, the thickness of a film layer between the first back plate and the second back plate of the first adhesive tape in the orthographic projection range of the light-emitting surface of the display module is favorably reduced, the bending radius is further reduced, the first adhesive tape can be ensured to have enough thickness, the insufficient viscosity caused by the over-thin first adhesive tape is avoided, and the problem that the display module is stripped or separated after being bent can be avoided, the bending reliability and the stability of the whole display module are favorably improved. In addition, the orthographic projection of the metal layer on the light-emitting surface of the display module is at least overlapped with the orthographic projection of the first adhesive tape on the light-emitting surface of the display module, namely the buffer heat dissipation layer is positioned in the range of the whole display area, and at least the metal layer in the buffer heat dissipation layer is positioned in the range of the first adhesive tape, so that the shielding effect of the metal layer at the position of the first adhesive tape is favorably ensured, and the influence of the reduction of the buffer heat dissipation layer in the groove on the anti-static function of the display module is avoided.
Of course, it is not necessary for any product in which the present invention is practiced to specifically achieve all of the above-described technical effects simultaneously.
Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is a schematic structural diagram of a display module according to an embodiment of the present invention;
FIG. 2 is a schematic structural view of the display module of FIG. 1 before bending;
fig. 3 is another schematic structural diagram of a display module according to an embodiment of the invention;
fig. 4 is another schematic structural diagram of a display module according to an embodiment of the invention;
fig. 5 is a schematic structural diagram of a display module according to an embodiment of the invention;
fig. 6 is a schematic structural diagram of a display module according to an embodiment of the invention;
fig. 7 is a schematic structural diagram of a display module according to an embodiment of the invention;
FIG. 8 is a schematic view of another structure of a display module according to an embodiment of the invention;
fig. 9 is another schematic structural diagram of a display module according to an embodiment of the invention;
fig. 10 is a schematic structural diagram of a display module according to an embodiment of the invention;
fig. 11 is another schematic structural diagram of a display module according to an embodiment of the invention;
fig. 12 is a schematic structural diagram of a display module according to an embodiment of the invention;
fig. 13 is another schematic structural diagram of a display module according to an embodiment of the invention;
fig. 14 is a schematic plan view of a display device according to an embodiment of the present invention.
Detailed Description
Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.
Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
Referring to fig. 1 and fig. 2 in combination, fig. 1 is a schematic structural diagram of a display module according to an embodiment of the present invention, fig. 2 is a schematic structural diagram of the display module of fig. 1 before being bent, and a display module 000 according to an embodiment of the present invention includes: the display panel 10 includes a display area AA and a bending area WA located at one side of the display area AA, the display panel 10 includes a binding portion 101, the binding portion 101 is located at one side of the bending area WA away from the display area AA, and the binding portion 101 is bent towards one side away from a light-emitting surface E of the display module 000; the binding part 101 is connected with a driving chip 00, and the driving chip 00 is positioned on one side of the binding part 101 departing from the light-emitting surface E of the display module 000 in the direction Z perpendicular to the light-emitting surface E of the display module 000;
the buffer heat dissipation layer 20 is positioned in the display area AA in the orthographic projection of the buffer heat dissipation layer 20 on the light emitting surface E of the display module 000; the buffering heat dissipation layer 20 is located on a side of the display panel 10 of the display area AA departing from the light emitting surface E of the display module 000;
the first back plate 30, the orthographic projection of the first back plate 30 on the light-emitting surface E of the display module 000 is located in the display area AA; the first back plate 30 is located on one side of the binding portion 101 facing the light emitting surface E of the display module 000;
a first adhesive tape 40 is arranged between the first back plate 30 and the heat-dissipating buffer layer 20, one side of the first adhesive tape 40 facing the heat-dissipating buffer layer 20 is fixedly attached to the heat-dissipating buffer layer 20, and one side of the first adhesive tape 40 facing the first back plate 30 is fixedly attached to the first back plate 30;
in a direction Z perpendicular to the light emitting surface E of the display module 000, one side of the buffer heat dissipation layer 20 facing the first tape 40 includes a groove 20A, and the first tape 40 is embedded in the groove 20A;
the side of the buffering heat dissipation layer 20 facing the first tape 40 at least includes a metal layer 201, and an orthogonal projection of the metal layer 201 on the light-emitting surface E of the display module 000 at least overlaps with an orthogonal projection of the first tape 40 on the light-emitting surface E of the display module 000.
Specifically, the display module 000 provided in this embodiment includes a display panel 10, optionally, the display panel 10 may be a flexible display panel, the display panel 10 may be a flexible organic light emitting diode display panel, the display panel 10 includes a display area AA and a bending area WA located at one side of the display area AA, optionally, the bending area WA may be located within a non-display area NA of the display panel 10, and the non-display area NA of the display panel 10 at least partially surrounds the display area AA. The display panel 10 of the present embodiment includes the binding portion 101, and the binding portion 101 is located on a side of the bending area WA away from the display area AA, it can be understood that the display panel 10 of the present embodiment is a flexible display panel, and the binding portion 101 is located on a side of the bending area WA away from the display area AA, it can be understood that, when the display panel 10 is laid out, as shown in fig. 2, in a direction X parallel to a plane of the display panel 10, the binding portion 101 is located on a side of the bending area WA away from the display area AA, and the binding portion 101 is also located in a range of the non-display area NA. The binding portion 101 included in the display panel 10 in this embodiment may be configured to provide a plurality of conductive pads, and the driving chip 00 is bound by the plurality of conductive pads, that is, the binding portion 101 is electrically connected to the driving chip 00, so as to implement transmission of the driving signal. Optionally, the display area AA of the display panel 10 of this embodiment may include a plurality of signal lines (e.g., scan lines or data lines), the driving chip 00 is configured to be electrically connected to the signal lines in the display area AA through the binding portion 101 bound to the display panel 10, so as to provide driving signals for the display panel 10 to realize a display function. The binding portion 101 of this embodiment can be bent toward the side away from the light emitting surface E of the display module 000, so that the bent binding portion 101 is located at the side away from the light emitting surface E of the display module 000, at this time, in the direction Z perpendicular to the light emitting surface E of the display module 000, the driving chip 00 is located at the side of the binding portion 101 away from the light emitting surface E of the display module 000, and then the narrow frame of the display module 000 can be realized by bending the driving chip 00 to the back of the light emitting surface E of the display module 000.
The display module 000 of this embodiment further includes a buffering heat dissipation layer 20, the orthographic projection of the buffering heat dissipation layer 20 on the light emitting surface E of the display module 000 is located on the display area AA, and in the direction Z perpendicular to the light emitting surface E of the display module 000, the buffering heat dissipation layer 20 is located on the side of the display panel 10 within the display area AA range departing from the light emitting surface E of the display module 000, the buffering heat dissipation layer 20 can be used for playing a role in buffering to protect the display panel 10, and can also play a role in dissipating heat for the display panel 10, thereby being beneficial to prolonging the service life of the display module 000. It can be understood that, the specific structure of the buffer heat dissipation layer 20 is not limited in this embodiment, the buffer heat dissipation layer 20 may be formed by combining a plurality of films made of different materials, or the buffer heat dissipation layer 20 may be formed by stacking a plurality of films made of different materials, and only the buffer layer made of an elastic material and the metal layer having a heat dissipation effect in the buffer heat dissipation layer 20 need to be satisfied. Optionally, one side of the buffering heat dissipation layer 20 facing the first tape 40 of this embodiment at least includes the metal layer 201, the metal layer 201 can not only play a role in dissipating heat and ensuring normal use of the display panel 10, but also the metal layer 201 can play a role in conducting and shielding static electricity. Optionally, the metal layer 201 may be a copper foil with excellent conductivity, such as a self-adhesive copper foil, a double-conductive copper foil, a single-conductive copper foil, or the like, and is a metal material that can perform heat dissipation and also can perform electromagnetic shielding and electrostatic discharge, and the material for manufacturing the metal layer 201 in the buffer heat dissipation layer 20 is not limited in this embodiment.
The display module 000 of the embodiment further includes a first back plate 30, the orthographic projection of the first back plate 30 on the light emitting surface E of the display module 000 is located in the display area AA, and in the direction Z perpendicular to the light emitting surface E of the display module 000, the first back plate 30 is located on one side of the binding portion 101 facing the light emitting surface E of the display module 000, optionally, the first back plate 30 may be made of a rigid material for supporting the whole display panel 10. In the manufacturing process of the display module 000 of this embodiment, before the display panel 10 of the bending area WA is bent, one side of the display panel 10 away from the light emitting surface E of the display module 000 may include a whole supporting backplate, and in the subsequent manufacturing process, in order to realize the bending of the display panel 10 of the bending area WA, a part of the whole supporting backplate of the partial bending area WA may be removed, so as to reduce the thickness of the module in the bending area WA, thereby facilitating the reduction of the bending stress during the bending process and realizing better bending, therefore, in the display module 000 of this embodiment, a second backplate 50 may be further included between the buffering heat dissipation layer 20 and the display panel 10 of the display area AA, and the second backplate 50 and the first backplate 30 are structures (illustrated by the same filling pattern in the drawing) on the same whole supporting backplate in the supporting process of the display module 000 in the previous period, only after the partial structure of the bending area WA is removed in the subsequent manufacturing process, the first back plate 30 and the second back plate 50 of the present embodiment are formed separately, wherein the second back plate 50 and the first back plate 30 may function together to support the display panel 10.
The first adhesive tape 40 is disposed between the first back plate 30 and the heat-dissipating buffer layer 20, one side of the first adhesive tape 40 facing the heat-dissipating buffer layer 20 is fixedly attached to the heat-dissipating buffer layer 20, one side of the first adhesive tape 40 facing the first back plate 30 is fixedly attached to the first back plate 30, and the first adhesive tape 40 can fix the display panel 10 of the binding portion 101 after being bent to the heat-dissipating buffer layer 20 at the back of the light-emitting surface E of the display module 000, so as to achieve the bending shape of the display module 000. Optionally, the first adhesive tape 40 of this embodiment may be a cross hatch adhesive tape, which has better fitting performance and exhaust effect, and has better flexibility, so that when the fixing effect is achieved, the flexible design affecting the display module 000 can be avoided.
As shown in fig. 1, the bending radius R of the display module 000 in the embodiment can be understood as a shape of an approximate semicircle formed by the display panel 10 in the bending area WA after the display panel 10 of the binding portion 101 is bent to the back of the light-emitting surface E of the display module 000 for fixing, and the radius of the approximate semicircle structure can be understood as the bending radius R of the embodiment. The size of the bending radius R is at least determined by the sum of the thicknesses of the first tape 40, the first back plate 30, the second back plate 50, the first tape 40, and the buffer heat dissipation layer 20 in the orthographic projection range of the light emitting surface E of the display module 000, and the thicknesses of the first back plate 30 and the second back plate 50 need to ensure the supporting effect on the display panel 10, so that the reduction of the bending radius R can be realized by changing the thicknesses of the first tape 40 and the buffer heat dissipation layer 20 in the orthographic projection range of the light emitting surface E of the display module 000, so as to provide a favorable condition for realizing an ultra-narrow frame or an ultra-thin module for the display module 000 in this embodiment. In the related art, the first adhesive tape 40 is thinned to easily cause insufficient adhesion, peeling or separation (peeling) occurs, the reliability of bending of the binding region is affected, the product quality and the reliability are affected, and the buffer heat dissipation layer 20 is hollowed at the position of the first adhesive tape 40, so that the coverage area of the buffer heat dissipation layer 20 on the display panel 10 is easily reduced, the area of a metal layer in the buffer heat dissipation layer 20 is affected, and the whole shielding effect and the anti-static effect on the display panel 10 can be affected.
In this embodiment, the first adhesive tape 40 is disposed in the direction Z perpendicular to the light emitting surface E of the display module 000, the side of the buffering heat dissipation layer 20 facing the first adhesive tape 40 includes a groove 20A, the first adhesive tape 40 is embedded in the groove 20A, that is, the thickness of the buffering heat dissipation layer 20 within the orthographic projection range of the light emitting surface E of the display module 000 of the first adhesive tape 40 is reduced, so that the side of the buffering heat dissipation layer 20 facing the first adhesive tape 40 includes a groove 20A, the groove 20A is a thinner region of the buffering heat dissipation layer 20, and the first adhesive tape 40 is embedded in the groove 20A in the thinner region, so that the first adhesive tape 40 fixedly attaches the buffering heat dissipation layer 20 to the first back plate 30, the thickness of the first adhesive tape 40 between the first back plate 30 and the second back plate 50 within the orthographic projection range of the light emitting surface E of the display module 000 of the display module is favorably reduced, the bending radius R is reduced, and the first adhesive tape 40 has a sufficient thickness, avoid first sticky tape 40 to lead to the fact viscidity not enough excessively thin, and then can avoid the display module assembly 000 after buckling to appear peeling off or breaking away from (peeling) the problem, be favorable to promoting whole display module assembly 000 buckle reliability and steadiness. In addition, in this embodiment, the orthographic projection of the metal layer 201 on the light-emitting surface E of the display module 000 is at least overlapped with the orthographic projection of the first adhesive tape 40 on the light-emitting surface E of the display module 000, that is, the buffer heat dissipation layer 20 is located in the range of the whole display area AA, and at least the metal layer 201 in the buffer heat dissipation layer 20 is located in the range of the first adhesive tape 40, so that the shielding effect of the metal layer 201 at the position of the first adhesive tape 40 is favorably ensured, and the influence of the thinning of the buffer heat dissipation layer 20 in the groove 20A on the antistatic function of the display module 000 is avoided.
Optionally, as shown in fig. 1, an orthographic projection of the metal layer 201 on the light emitting surface E of the display module 000 is overlapped with the display panel 10 in the display area AA, that is, the metal layer 201 of the buffer heat dissipation layer 20 of the embodiment may be located within the range of the whole display area AA, that is, the metal layer 201 is in a whole-surface structure in the buffer heat dissipation layer 20, and no hollow hole is provided at any position, which is beneficial to ensuring the shielding and anti-static effects of the metal layer 201 on the display area AA of the whole display panel 10.
It should be noted that, in this embodiment, the setting of the groove 20A of the buffered heat dissipation layer 20 may be implemented by hollowing out the film layer in the buffered heat dissipation layer 20 except for the metal layer 201, and it can be understood that, in this embodiment, a manner how to hollowing out the film layer in the buffered heat dissipation layer 20 except for the metal layer 201 to form the groove 20A is not limited, and in the specific implementation, the setting may be performed according to a specific film structure of the buffered heat dissipation layer 20, and only it needs to be satisfied that the metal layer 201 may be at least located within a range where the first adhesive tape 40 is located, or the metal layer 201 may be located within a range of the whole display area AA, so as to ensure a whole-surface shielding effect.
It can be understood that this embodiment only exemplifies the structure of the display module 000, and in a specific implementation, the display module 000 may further include other structures, as shown in fig. 1, the display module may further include a polarizer 01 located on a side of the display panel 10 away from the second backplane 50, a side of the polarizer 01 away from the display panel 10 may further be attached to the cover plate 03 through the optical adhesive 02 (not filled in the drawing), and the cover plate 03 protects the entire display module 000 on a side of the light emitting surface E of the display module 000, or may further include other structures capable of displaying a function.
It should be noted that, in this embodiment, the depth of the groove 20A in the direction Z perpendicular to the light emitting surface E of the display module 000 is not specifically limited, and only the first tape 40 has enough thickness to ensure its viscosity, and meanwhile, the bending radius R can be minimized through the groove 20A with the depth, so as to provide favorable conditions for realizing an ultra-narrow frame and an ultra-thin module, and during specific implementation, the depth of the groove 20A can be set according to actual requirements.
Optionally, as shown in fig. 3, fig. 3 is another structural schematic diagram of the display module according to the embodiment of the present invention, in the embodiment, a first adhesive layer 04 may be further disposed on an outer side of the display panel 10 in the bending area WA (i.e., a side of fig. 2 away from the first adhesive tape 40), the first adhesive layer 04 may be a UV adhesive (ultraviolet curing adhesive), and the first adhesive layer 04 may protect the display panel 10 in the bending area WA, seal the display panel 10 in the bending area WA, prevent the display panel 10 from cracking during bending, and prevent an external force from hitting the display panel 10 in the bending area to affect a yield. Further optionally, the end of the first adhesive layer 04 may be connected to the optical adhesive 02 and cover the end of the polarizer 01, so as to prevent salt mist and water vapor from entering the display area AA from the end of the polarizer 01 and affecting the display effect.
Optionally, as shown in fig. 4, fig. 4 is another schematic structural diagram of the display module according to the embodiment of the present invention, in this embodiment, the position of the groove 20A of the buffer heat dissipation layer 20 includes a thickness gradient region 20B, and the thickness of the other film layers in the buffer heat dissipation layer 20 except the metal layer 201 is gradually changed, so that the connection transition between the position of the groove 20A and the position outside the groove 20A is smoother, and the metal layer 201 is prevented from generating a cross-section phenomenon at the connection position between the position of the groove 20A and the position outside the groove 20A, which affects the effect of laying the whole surface of the metal layer 201.
It can be understood that the heat dissipation buffer layer 20 of the present embodiment may be a prefabricated structure, and the prefabricated heat dissipation buffer layer 20 including the groove 20A and the entire metal layer 201 may be directly attached to the side of the second backplane 50 away from the light emitting surface E of the display module 000 in the manufacturing process of the display module 000 of the present embodiment, which is beneficial to improving the manufacturing efficiency.
Optionally, with reference to fig. 1, in the embodiment, in the direction Z perpendicular to the light emitting surface E of the display module 000, the thickness D40 of the first tape 40 is greater than or equal to 0.03 mm.
The embodiment explains that in the direction Z perpendicular to the light emitting surface E of the display module 000, the side of the buffer heat dissipation layer 20 facing the first tape 40 includes a groove 20A, the first tape 40 is embedded in the groove 20A, by reducing the thickness of the buffer heat dissipation layer 20 of the first tape 40 in the orthographic projection range of the light-emitting surface E of the display module 000, so that the side of the buffering heat dissipation layer 20 facing the first adhesive tape 40 includes a groove 20A, the thickness of the first adhesive tape 40 between the first back plate 30 and the second back plate 50 in the orthographic projection range of the light-emitting surface E of the display module 000 is reduced, further reducing the bending radius R, ensuring that the first adhesive tape 40 has enough thickness more than or equal to 0.03mm, avoiding the insufficient viscosity caused by the over-thin first adhesive tape 40, and then can avoid the display module assembly 000 after buckling to appear peeling off or breaking away from (peeling) the problem, be favorable to promoting whole display module assembly 000 buckle reliability and steadiness.
In some optional embodiments, please refer to fig. 5, fig. 5 is another structural schematic diagram of the display module according to the embodiment of the present invention, in the present embodiment, the buffer heat dissipation layer 20 further includes an organic layer 202 and a foam layer 203, the metal layer 201, the organic layer 202, and the foam layer 203 are stacked in a direction Z perpendicular to the light emitting surface E of the display module 000, the foam layer 203 is located on one side of the organic layer 202 close to the light emitting surface E of the display module 000, and the metal layer 201 is located on one side of the organic layer 202 away from the light emitting surface E of the display module 000;
in the direction Z perpendicular to the light emitting surface E of the display module 000, the thickness D1 of the heat dissipation buffer layer 20 at the groove 20A is smaller than the thickness D of the heat dissipation buffer layer 20 outside the groove 20A.
This embodiment explains that the buffering heat dissipation layer 20 may include a structure in which a plurality of film layers are stacked, and optionally, the buffering heat dissipation layer 20 may include a metal layer 201 stacked in a direction Z perpendicular to the light emitting surface E of the display module 000, an organic layer 202, and a foam layer 203, such that the foam layer 203 is located on one side of the organic layer 202 close to the light emitting surface E of the display module 000, and the metal layer 201 is located on one side of the organic layer 202 away from the light emitting surface E of the display module 000, where the foam layer 203 not only can play a role in buffering, protect the display panel 10 of the whole display area AA, but also can play a role in shading, and avoid the influence of external light on the display effect of the display panel 10. The optional foam layer 203 of the embodiment can be arranged in the range of the display panel 10 in the display area AA on the whole, so that the light leakage phenomenon is prevented from being generated and the buffering effect is prevented from being influenced due to the hollow design. The material of the organic layer 202 may be, but not limited to, a polyimide material, and the polyimide has the characteristics of good thermal stability, air tightness, chemical corrosion resistance, low dielectric constant, high mechanical strength, and the like, and is a better insulating material, and the tightness of the adhesion between the metal layer 201 and the foam layer 203 can also be ensured, so as to prevent the generation of bubbles between the films of the buffer heat dissipation layer 20 and the influence on the use effect of the buffer heat dissipation layer 20.
In this embodiment, the groove 20A of the buffering heat dissipation layer 20 may be implemented by thinning a certain film layer in the buffering heat dissipation layer 20 or partially hollowing a certain film layer, so that in the direction Z perpendicular to the light emitting surface E of the display module 000, the thickness D1 of the buffering heat dissipation layer 20 at the groove 20A is smaller than the thickness D of the buffering heat dissipation layer 20 outside the groove 20A, and then a surface recessed toward the light emitting surface E of the display module 000 is formed in the area where the first tape 40 is located, so as to form the groove 20A, so that the first tape 40 with a certain thickness may be embedded in the position of the buffering heat dissipation layer 20 with a thinner thickness D1, which is beneficial to simultaneously achieving stability of a bending form and a smaller bending radius, and ensuring reliability of the module while achieving a narrow frame.
Optionally, as shown in fig. 5, in this embodiment, the groove 20A of the buffering heat dissipation layer 20 may be implemented by partially hollowing out the organic layer 202, that is, the organic layer 202 includes a hollow portion 202A, an orthogonal projection of the hollow portion 202A on the light emitting surface E of the display module 000 overlaps an orthogonal projection of the first tape 40 on the light emitting surface E of the display module 000, since the foam layer 203 needs to be entirely disposed on one side of the display panel 10, the thickness reduction at the position of the groove 20A may be implemented by disposing the organic layer 202 on the hollow portion 202A, and the first tape 40 itself has better flexibility, so that even if a part of the organic layer 202 is removed at the position of the groove 20A, the flexible design at the position of the groove 20A of the display module 000 is not affected. Therefore, in this embodiment, the organic layer 202 includes the hollow portion 202A, and the orthographic projection of the hollow portion 202A on the light-emitting surface E of the display module 000 overlaps with the orthographic projection of the first adhesive tape 40 on the light-emitting surface E of the display module 000, so that the thickness of the whole buffering heat dissipation layer 20 at the position of the first adhesive tape 40 can be reduced, and the influence on the overall flexible design of the display module 000 can be avoided.
In some optional embodiments, please refer to fig. 6 and 7 in combination, where fig. 6 is a schematic structural diagram of a display module according to an embodiment of the present invention, and fig. 7 is a schematic structural diagram of a display module according to an embodiment of the present invention, in the embodiment, in a direction Z perpendicular to a light emitting surface E of the display module 000, a thickness D01 of the foam layer 203 at the groove 20A is smaller than a thickness D0 of the foam layer 203 outside the groove 20A.
The embodiment explains that in order to reduce the thickness of the heat dissipation buffer layer 20 at the position of the first tape 40, the thickness D01 of the foam layer 203 at the groove 20A may be smaller than the thickness D0 of the foam layer 203 outside the groove 20A by being arranged in the direction Z perpendicular to the light emitting surface E of the display module 000, at this time, optionally, as shown in fig. 6, the thickness of the organic layer 202 at the groove 20A may be the same as the thickness of the organic layer 202 outside the groove 20A, that is, the organic layer 202 may not be subjected to reduction processing at the position of the first tape 40, and only by reducing the foam layer 203 at the position of the first tape 40, the thickness reduction of the whole heat dissipation buffer layer 20 at the position of the first tape 40 is realized, so that the first tape 40 may meet the required thickness, which is beneficial to simultaneously realize the stability of the bending form and the smaller bending radius, and ensure the reliability of the module while realizing the narrow frame. In a direction Z perpendicular to the light emitting surface E of the display module 000, a thickness D01 of the foam layer 203 at the groove 20A is smaller than a thickness D0 of the foam layer 203 outside the groove 20A, at this time, optionally, the organic layer 202 may also include a hollow portion 202A, so that an orthographic projection of the hollow portion 202A on the light emitting surface E of the display module 000 overlaps with an orthographic projection of the first tape 40 on the light emitting surface E of the display module 000, that is, the position of the first tape 40 may not only hollow the organic layer 202 to form the hollow portion 202A, but also further thin the foam layer 203 to a certain extent, so that in the direction Z perpendicular to the light emitting surface E of the display module 000, a thickness D01 of the foam layer 203 at the groove 20A is smaller than a thickness D0 of the foam layer 203 outside the groove 20A, and further, the thin thickness D0 of the foam layer 203 and the hollow portion of the organic layer 202 may be matched together, which is better beneficial to ensure the thickness of the first tape 40 and realize a smaller bending radius at the same time, thereby realizing a narrow bezel.
It can be understood that, in order to ensure that the entire foam layer 203 is disposed within the range of the display panel 10 in the display area AA, the foam layer 203 at the position of the first tape 40 is only thinned, instead of being designed to be perforated similarly to the organic layer 202, so that in the direction Z perpendicular to the light emitting surface E of the display module 000, the thickness D01 of the foam layer 203 at the position of the groove 20A is smaller than the thickness D0 of the foam layer 203 outside the groove 20A, and only the first tape 40 needs to have enough thickness and realize a smaller bending radius, thereby realizing a narrow frame.
Further alternatively, referring to fig. 7, in the direction Z perpendicular to the light emitting surface E of the display module 000, the thickness D0 of the foam layer 203 at the groove 20A is greater than or equal to 0.08 mm.
This embodiment explains that after the foam layer 203 at the position of the first tape 40 is thinned, it is required to ensure that the thickness D0 of the foam layer 203 at the groove 20A is greater than or equal to 0.08mm in the direction Z perpendicular to the light emitting surface E of the display module 000, so as to prevent the insufficient buffering capacity caused by the too small thickness D0 of the foam layer 203 at the groove 20A from affecting the service performance of the foam layer, reduce the difficulty of the foam foaming process, and prevent the difficulty of manufacturing the foam layer 203 with a small thickness from affecting the process efficiency and the product yield.
Optionally, in the process of manufacturing the display module 000 of this embodiment, after the second backplate 50 and the heat-dissipation buffer layer 20 can be pre-attached and assembled, that is, after the heat-dissipation buffer layer 20 with the groove 20A is fixed to the second backplate 50, they are jointly disposed on the side of the display panel 10 away from the light-emitting surface E of the display module 000, so that in the process of manufacturing the display module 000, one-time attaching process is reduced, the attaching process is optimized, and the process efficiency is improved.
In some alternative embodiments, please refer to fig. 8, fig. 8 is another structural schematic diagram of the display module provided in the embodiment of the present invention, in which one side of the first back plate 30 facing the first tape 40 includes a plurality of bumps 301.
The embodiment explains that a plurality of bumps 301 may be disposed on the fixed side of the first back plate 30 and the first adhesive tape 40, that is, the side surface of the first back plate 30 facing the first adhesive tape 40, the plurality of bumps 301 may be formed by performing a frosting treatment on the side surface of the first back plate 30 facing the first adhesive tape 40, and further, the total area of the side surface of the first back plate 30 facing the first adhesive tape 40 may be increased to increase the bonding strength between the first back plate 30 and the first adhesive tape 40. The organic layer 202 of the buffer heat dissipation layer 20 is hollowed in the area of the first adhesive tape 40, so that the narrow frame is realized, the first adhesive tape 40 is guaranteed to have enough thickness, the first adhesive tape 40 is guaranteed to be sticky, the surface of one side, facing the first adhesive tape 40, of the first back plate 30 is further subjected to frosting treatment, the bonding strength between the first back plate 30 and the first adhesive tape 40 is increased, and the reliability of the whole module is enhanced.
It should be understood that, this embodiment is merely an example that the plurality of bumps 301 included on the side of the first back plate 30 facing the first adhesive tape 40 can be implemented by performing a sanding process on the side of the first back plate 30 facing the first adhesive tape 40, and when the embodiment is implemented, the process includes, but is not limited to, this process, and other structures capable of manufacturing the plurality of bumps 301 may also be included, which is not limited in this embodiment.
It should be noted that fig. 8 of the present embodiment only shows that the shape of the bump 301 may be a cone, and in specific implementation, the shape of the bump 301 includes but is not limited to this shape, and may also be other shapes, and it is only necessary to satisfy that the adhesive strength between the surface of the first backplane 30 and the first tape 40 can be increased by arranging a plurality of bumps 301, which is not described in detail in this embodiment.
Optionally, because the second back plate 50 and the first back plate 30 belong to the same layer and are made of the same material in the previous stage of the display module 000, a plurality of bumps (not shown in the drawing) may also be disposed on the surface of the second back plate 50 on the side away from the light-emitting surface E of the display module 000, so as to increase the bonding strength between the second back plate 50 and the heat-dissipating buffer layer 20, and further ensure the stability of the module.
In some optional embodiments, please refer to fig. 9, fig. 9 is another schematic structural diagram of the display module provided in the embodiment of the present invention, and fig. 10 is another schematic structural diagram of the display module provided in the embodiment of the present invention, in this embodiment, the first back plate 30 includes a first region 30A and a second region 30B, and the second region 30B is located on a side of the first region 30A away from the bending region WA of the display panel 10 along a direction X parallel to the light emitting surface E of the display module 000;
the arrangement density of the plurality of bumps 301 in the first region 30A is greater than the arrangement density of the plurality of bumps 301 in the second region 30B.
This embodiment explains that, when the bending area WA of the display panel 10 is bent to bend the binding portion 101 of the display panel 10 to the back of the light emitting surface E of the display module 000, the side of the first back plate 30 facing the first adhesive tape 40 may be frosted to make the side of the first back plate 30 facing the first adhesive tape 40 include a plurality of bumps 301, so as to increase the bonding strength between the first back plate 30 and the first adhesive tape 40, and further optionally, as shown in fig. 10, in the direction X parallel to the light emitting surface E of the display module 000, along the direction away from the bending area WA, the arrangement density of the plurality of bumps 301 on the first back plate 30 may be set to be gradually increased, specifically, the first back plate 30 includes a first area 30A and a second area 30B, along the direction X parallel to the light emitting surface E of the display module 000, the second area 30B is located on a side of the first area 30A away from the bending area WA of the display panel 10, and since the first area 30A is closer to the bending area WA than the second area 30B, after the first tape 40 bends and fixes the first back sheet 30 and the buffer heat dissipation layer 20 at the position of the binding portion 101, the existence of bending inertia and bending stress more easily enables peeling between the first back sheet 30 and the first tape 40 at the position of the first area 30A to affect the fixing effect, so that the arrangement density of the plurality of bumps 301 in the first area 30A is set to be greater than the arrangement density of the plurality of bumps 301 in the second area 30B (it can be understood that the arrangement density refers to the number of bumps 301 included in the first back sheet 30 per unit area, and the greater the number of bumps 301 included in the same area of the first area 30A and the second area 30B is, the arrangement density of the bumps 301 in the area is set to be greater), thereby being beneficial to reducing the possibility of peeling between the first back sheet 30 and the first tape 40 of the first area 30A, and further the stability of the whole module can be enhanced.
Optionally, as shown in fig. 9 and 10, the volumes and the shapes of the bumps 301 in the first area 30A and the second area 30B of the first back plate 30 may be the same, and the arrangement density of the bumps 301 in the first area 30A is greater than the arrangement density of the bumps 301 in the second area 30B by setting the distance between two adjacent bumps 301 in the first area 30A to be smaller than the distance between two adjacent bumps 301 in the second area 30B.
It should be noted that, in this embodiment, the area of the entire first back plate 30 occupied by the first region 30A is not limited, and in implementation, the area of the first region 30A may be specifically set according to a test analysis of an area that is easy to peel off on a side close to the bending region WA, and an area of the first back plate 30 other than the first region 30A is the second region 30B.
Optionally, as shown in fig. 11, fig. 11 is another schematic structural diagram of the display module provided in the embodiment of the present invention, in this embodiment, a distance between two adjacent bumps 301 in the first region 30A of the first back plate 30 may be the same as a distance between two adjacent bumps 301 in the second region 30B, shapes of the bumps 301 in the first region 30A and the second region 30B may also be the same, and sizes of the bumps 301 in the first region 30A and the second region 30B are set to be different, and a volume of the bump 301 in the first region 30A is smaller than a volume of the bump 301 in the second region 30B, that is, the bumps 301 include a plurality of first bumps 3011 and a plurality of second bumps 3012, the first bump 3011 is located in the first region 30A, and the second bump 3012 is located in the second region 30B; the orthographic projection area of at least part of the first bumps 3011 on the light emitting surface E of the display module 000 is smaller than the orthographic projection area of at least part of the second bumps 3012 on the light emitting surface E of the display module 000, so that the arrangement density of the bumps 301 in the first area 30A is greater than that of the bumps 301 in the second area 30B, the possibility of peeling the first back plate 30 of the first area 30A from the first tape 40 is reduced, and the stability of the whole module can be further enhanced.
It is to be understood that this embodiment is merely an illustration of a design structure that can achieve a greater arrangement density of the plurality of bumps 301 in the first region 30A than the arrangement density of the plurality of bumps 301 in the second region 30B, and specific implementations include, but are not limited to, the above-mentioned manner, and other manners that can achieve different arrangement densities may also be implemented, and this embodiment is not limited to.
In some optional embodiments, please refer to fig. 12, where fig. 12 is another schematic structural diagram of the display module provided in the embodiment of the present invention, in this embodiment, the binding portion 101 of the display panel 10 in the display module 000 further includes a flexible circuit board 05, and in a direction Z perpendicular to the light emitting surface E of the display module 000, the flexible circuit board 05 is located on a side of the binding portion 101 away from the light emitting surface E of the display module 000;
one side of the flexible circuit board 05, which deviates from the light emitting surface E of the display module 000, comprises a plurality of bonding pads 051, one side of the flexible circuit board 05, which faces the light emitting surface E of the display module 000, comprises a copper leakage area 05A, and the flexible circuit board 05 of the copper leakage area 05A is electrically connected with the metal layer 201.
This embodiment explains that the driver Chip 00 for providing the display panel 10 with the driving signal can be electrically connected to the binding portion 101 and the driver Chip 00 through a COG (Chip on Glass, where the Chip is disposed on the substrate) technology (as shown in fig. 1), optionally, the driver Chip 00 bound by the binding portion 101 can be electrically connected and bound through the flexible circuit board 05, that is, a COF (Chip on Film, where the Chip is disposed on a Film of the flexible circuit board) technology, specifically, in a direction Z perpendicular to the light emitting surface E of the display module 000, the flexible circuit board 05 is located on a side of the binding portion 101 departing from the light emitting surface E of the display module 000, a side of the flexible circuit board 05 departing from the light emitting surface E of the display module 000 includes a plurality of pads 051, and the driver Chip 000 can be bound on the flexible circuit board 05 through the plurality of pads 051. The flexible circuit board 05 is generally a copper clad laminate, that is, the flexible circuit board 05 itself is mainly composed of a substrate, copper foil and an adhesive, the surface of the substrate is the copper foil, the layer where the copper foil is located is used for arranging various electric connection circuits of the flexible circuit board 50, and the copper foil is fixedly adhered on the substrate by the adhesive, so that the copper clad laminate type flexible circuit board 05 is formed.
This embodiment sets up that flexible line way board 05 goes out the plain noodles one side of E including leaking copper district 05A towards display module 000, the partial region of the plain noodles one side of E can be got rid of to flexible line way board 05 orientation display module 000 promptly, make the copper foil expose, form and leak copper district 05A, can be connected with metal level 201 electricity through leaking copper district 05A's flexible line way board 05, optionally, can make leaking copper district 05A's flexible line way board and the metal level 201 direct contact of buffering heat dissipation layer 20 through changing first sticky tape 40 thickness, realize that the electricity between them is connected and switch on, and then can be through the metal level 201 that the whole face set up when quick with static electricity release, can also directly lead out static electric charge through leaking copper district 05A, with the better antistatic effect who realizes display module 000.
Optionally, referring to fig. 13, fig. 13 is another schematic structural diagram of the display module provided in the embodiment of the present invention, in the embodiment, the electrical connection between the flexible circuit board 05 of the copper leakage area 05A and the metal layer 201 of the heat dissipation buffer layer 20 may be further implemented by dispensing silver paste 06 between the side of the flexible circuit board 05 of the copper leakage area 05A facing the metal layer 201 and the side of the metal layer 201 of the heat dissipation buffer layer 20 facing the flexible circuit board 05 to make up the gap therebetween, so as to achieve the electrical connection therebetween, and directly lead out the electrostatic charges through the copper leakage area 05A, thereby achieving the anti-electrostatic effect of the display module 000, and further avoiding the problem that the electrical connection effect is easily affected by peeling due to the large bending degree of the flexible circuit board 05, in specific implementation, the electrical connection manner between the flexible circuit board 05 of the copper leakage area 05A and the metal layer 201 of the heat dissipation buffer layer 20 may be set according to actual requirements, the present embodiment is not limited.
In some optional embodiments, please refer to fig. 14, where fig. 14 is a schematic plane structure diagram of a display device according to an embodiment of the present invention, and the display device 111 according to this embodiment includes the display module 000 according to the above embodiment of the present invention. The embodiment of fig. 14 only uses a mobile phone as an example to describe the display device 111, and it should be understood that the display device 111 provided in the embodiment of the present invention may be other display devices 111 having a display function, such as a computer, a television, and a vehicle-mounted display device, and the present invention is not limited thereto. The display device 111 provided in the embodiment of the present invention has the beneficial effects of the display module 000 provided in the embodiment of the present invention, and specific reference may be made to the specific description of the display module 000 in the foregoing embodiments, and details of this embodiment are not repeated herein.
According to the embodiment, the display module and the display device provided by the invention at least realize the following beneficial effects:
the display module comprises a display panel, wherein the display panel comprises a binding part, the binding part can be bent towards one side away from the light-emitting surface of the display module, so that the bent binding part is positioned at one side away from the light-emitting surface of the display module, and the narrow frame of the display module can be realized by bending the driving chip to the back of the light-emitting surface of the display module. The first adhesive tape is arranged between the first back plate and the buffering heat dissipation layer of the display module, and the first adhesive tape can enable the display panel of the binding part to be fixed with the buffering heat dissipation layer at the back of the light-emitting surface of the display module after being bent, so that the bending form of the display module is realized. The invention is arranged in the direction vertical to the light-emitting surface of the display module, one side of the buffering heat-radiating layer facing the first adhesive tape comprises a groove, the first adhesive tape is embedded in the groove, the thickness of the buffering heat-radiating layer of the first adhesive tape in the orthographic projection range of the light-emitting surface of the display module is reduced, so that one side of the buffering heat-radiating layer facing the first adhesive tape comprises the groove, the groove is a thinner area of the buffering heat-radiating layer, the first adhesive tape is embedded in the groove in the thinner area, the fixed attachment of the buffering heat-radiating layer and the first back plate by the first adhesive tape is realized, the thickness of a film layer between the first back plate and the second back plate in the orthographic projection range of the light-emitting surface of the display module by the first adhesive tape is favorably reduced, the bending radius is reduced, the first adhesive tape can be ensured to have enough thickness, the insufficient viscosity caused by the over-thin first adhesive tape is avoided, and the problem that the display module after being bent is stripped or separated is avoided, the bending reliability and the stability of the whole display module are favorably improved. In addition, the orthographic projection of the metal layer on the light-emitting surface of the display module is at least overlapped with the orthographic projection of the first adhesive tape on the light-emitting surface of the display module, namely the buffer heat dissipation layer is positioned in the range of the whole display area, and at least the metal layer in the buffer heat dissipation layer is positioned in the range of the first adhesive tape, so that the shielding effect of the metal layer at the position of the first adhesive tape is favorably ensured, and the influence of the reduction of the buffer heat dissipation layer in the groove on the anti-static function of the display module is avoided.
Although some specific embodiments of the present invention have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustrative purposes only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.
Claims (13)
1. A display module, comprising:
the display panel comprises a display area and a bending area positioned on one side of the display area, the display panel comprises a binding part, the binding part is positioned on one side of the bending area far away from the display area, and the binding part bends towards one side far away from the light-emitting surface of the display module; the binding part is connected with a driving chip, and the driving chip is positioned on one side of the binding part, which is far away from the light-emitting surface of the display module, in the direction vertical to the light-emitting surface of the display module;
the orthographic projection of the buffering heat dissipation layer on the light-emitting surface of the display module is positioned in the display area; the buffer heat dissipation layer is positioned on one side, away from the light-emitting surface of the display module, of the display panel of the display area;
the orthographic projection of the first back plate on the light-emitting surface of the display module is positioned in the display area; the first back plate is positioned on one side of the binding part facing the light-emitting surface of the display module;
a first adhesive tape is arranged between the first back plate and the buffer heat dissipation layer, one side of the first adhesive tape, facing the buffer heat dissipation layer, is fixedly attached to the buffer heat dissipation layer, and one side of the first adhesive tape, facing the first back plate, is fixedly attached to the first back plate;
in the direction perpendicular to the light emitting surface of the display module, one side of the buffering heat dissipation layer facing the first adhesive tape comprises a groove, and the first adhesive tape is embedded in the groove;
one side, facing the first adhesive tape, of the buffer heat dissipation layer at least comprises a metal layer, and the orthographic projection of the metal layer on the light-emitting surface of the display module at least overlaps with the orthographic projection of the first adhesive tape on the light-emitting surface of the display module.
2. The display module according to claim 1, wherein an orthographic projection of the metal layer on a light emitting surface of the display module overlaps with the display panel of the display area.
3. The display module according to claim 1, wherein the buffer heat dissipation layer further comprises an organic layer and a foam layer, the metal layer, the organic layer and the foam layer are stacked, the foam layer is located on one side of the organic layer close to the light-emitting surface of the display module, and the metal layer is located on one side of the organic layer away from the light-emitting surface of the display module;
in the direction perpendicular to the light emitting surface of the display module, the thickness of the buffer heat dissipation layer at the groove is smaller than that of the buffer heat dissipation layer outside the groove.
4. The display module of claim 3,
the organic layer comprises a hollow-out part, and the orthographic projection of the hollow-out part on the light-emitting surface of the display module is overlapped with the orthographic projection of the first adhesive tape on the light-emitting surface of the display module.
5. A display module according to any one of claims 3 or 4, wherein the thickness of the foam layer at the groove is smaller than the thickness of the foam layer outside the groove in a direction perpendicular to the light exit surface of the display module.
6. The display module according to claim 5, wherein the thickness of the foam layer at the groove is greater than or equal to 0.08mm in a direction perpendicular to a light emitting surface of the display module.
7. The display module of claim 1, wherein a side of the first backplane facing the first tape comprises a plurality of bumps.
8. The display module assembly according to claim 7, wherein the first back plate comprises a first region and a second region, and the second region is located on a side of the first region away from the bending region of the display panel along a direction parallel to a light emitting surface of the display module assembly;
the arrangement density of the plurality of bumps in the first area is greater than that of the plurality of bumps in the second area.
9. The display module of claim 8, wherein the plurality of bumps comprises a plurality of first bumps and a plurality of second bumps, the first bumps being located in the first region, the second bumps being located in the second region;
the orthographic projection area of at least part of the first bumps on the light-emitting surface of the display module is smaller than the orthographic projection area of at least part of the second bumps on the light-emitting surface of the display module.
10. The display module of claim 1,
the binding part further comprises a flexible circuit board, and the flexible circuit board is positioned on one side of the binding part, which is far away from the light-emitting surface of the display module, in the direction perpendicular to the light-emitting surface of the display module;
one side of the flexible circuit board, which deviates from the light-emitting surface of the display module, comprises a plurality of bonding pads, one side of the flexible circuit board, which faces the light-emitting surface of the display module, comprises a copper leakage area, and the flexible circuit board in the copper leakage area is electrically connected with the metal layer.
11. The display module of claim 10, wherein the flexible circuit board of the copper leakage region is in direct contact with the metal layer.
12. The display module of claim 1, wherein the thickness of the first adhesive tape is greater than or equal to 0.03mm in a direction perpendicular to a light emitting surface of the display module.
13. A display device comprising the display module according to any one of claims 1 to 12.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210160681.2A CN114550589A (en) | 2022-02-22 | 2022-02-22 | Display module and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210160681.2A CN114550589A (en) | 2022-02-22 | 2022-02-22 | Display module and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114550589A true CN114550589A (en) | 2022-05-27 |
Family
ID=81678109
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210160681.2A Pending CN114550589A (en) | 2022-02-22 | 2022-02-22 | Display module and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114550589A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115064073A (en) * | 2022-06-28 | 2022-09-16 | 武汉华星光电半导体显示技术有限公司 | Cover plate, preparation method thereof and display device |
| CN115116336A (en) * | 2022-07-19 | 2022-09-27 | 武汉华星光电半导体显示技术有限公司 | Display panel and manufacturing method thereof |
| CN115116335A (en) * | 2022-07-19 | 2022-09-27 | 武汉华星光电半导体显示技术有限公司 | Display module and display device |
| CN115132089A (en) * | 2022-07-18 | 2022-09-30 | 京东方科技集团股份有限公司 | Display module and display device |
| CN115273672A (en) * | 2022-08-22 | 2022-11-01 | 京东方科技集团股份有限公司 | Display device and display module thereof |
| WO2024000321A1 (en) * | 2022-06-29 | 2024-01-04 | 京东方科技集团股份有限公司 | Display module and display device |
| WO2024041379A1 (en) * | 2022-08-24 | 2024-02-29 | 京东方科技集团股份有限公司 | Display module and display device |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105419671A (en) * | 2016-01-04 | 2016-03-23 | 京东方科技集团股份有限公司 | Adhesive tape, manufacturing method thereof and display device |
| CN206148473U (en) * | 2016-11-10 | 2017-05-03 | 上海天马微电子有限公司 | Flexible display device |
| CN109037282A (en) * | 2018-07-24 | 2018-12-18 | 京东方科技集团股份有限公司 | A kind of array substrate and preparation method thereof, display panel, display device |
| CN110752295A (en) * | 2019-11-29 | 2020-02-04 | 武汉天马微电子有限公司 | Flexible display panel, manufacturing method thereof and display device |
| CN111696439A (en) * | 2019-03-11 | 2020-09-22 | Uti有限公司 | Flexible covering window |
| CN112289185A (en) * | 2020-10-26 | 2021-01-29 | 武汉华星光电半导体显示技术有限公司 | Display module |
| CN113178134A (en) * | 2021-05-25 | 2021-07-27 | 京东方科技集团股份有限公司 | Display module and display device |
| CN213988886U (en) * | 2021-01-27 | 2021-08-17 | 深圳市柔宇科技股份有限公司 | Display panel and display device |
| CN113516909A (en) * | 2020-09-07 | 2021-10-19 | 京东方科技集团股份有限公司 | Display module and display device |
| CN113516924A (en) * | 2021-05-19 | 2021-10-19 | 京东方科技集团股份有限公司 | Display module and electronic equipment |
| CN113555412A (en) * | 2021-08-12 | 2021-10-26 | 京东方科技集团股份有限公司 | Display module and display device |
| CN114038333A (en) * | 2021-12-01 | 2022-02-11 | 京东方科技集团股份有限公司 | Display module and display device |
-
2022
- 2022-02-22 CN CN202210160681.2A patent/CN114550589A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105419671A (en) * | 2016-01-04 | 2016-03-23 | 京东方科技集团股份有限公司 | Adhesive tape, manufacturing method thereof and display device |
| CN206148473U (en) * | 2016-11-10 | 2017-05-03 | 上海天马微电子有限公司 | Flexible display device |
| CN109037282A (en) * | 2018-07-24 | 2018-12-18 | 京东方科技集团股份有限公司 | A kind of array substrate and preparation method thereof, display panel, display device |
| CN111696439A (en) * | 2019-03-11 | 2020-09-22 | Uti有限公司 | Flexible covering window |
| CN110752295A (en) * | 2019-11-29 | 2020-02-04 | 武汉天马微电子有限公司 | Flexible display panel, manufacturing method thereof and display device |
| CN113516909A (en) * | 2020-09-07 | 2021-10-19 | 京东方科技集团股份有限公司 | Display module and display device |
| CN112289185A (en) * | 2020-10-26 | 2021-01-29 | 武汉华星光电半导体显示技术有限公司 | Display module |
| CN213988886U (en) * | 2021-01-27 | 2021-08-17 | 深圳市柔宇科技股份有限公司 | Display panel and display device |
| CN113516924A (en) * | 2021-05-19 | 2021-10-19 | 京东方科技集团股份有限公司 | Display module and electronic equipment |
| CN113178134A (en) * | 2021-05-25 | 2021-07-27 | 京东方科技集团股份有限公司 | Display module and display device |
| CN113555412A (en) * | 2021-08-12 | 2021-10-26 | 京东方科技集团股份有限公司 | Display module and display device |
| CN114038333A (en) * | 2021-12-01 | 2022-02-11 | 京东方科技集团股份有限公司 | Display module and display device |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115064073A (en) * | 2022-06-28 | 2022-09-16 | 武汉华星光电半导体显示技术有限公司 | Cover plate, preparation method thereof and display device |
| WO2024000321A1 (en) * | 2022-06-29 | 2024-01-04 | 京东方科技集团股份有限公司 | Display module and display device |
| CN115132089A (en) * | 2022-07-18 | 2022-09-30 | 京东方科技集团股份有限公司 | Display module and display device |
| CN115132089B (en) * | 2022-07-18 | 2023-12-05 | 京东方科技集团股份有限公司 | Display module and display device |
| CN115116336A (en) * | 2022-07-19 | 2022-09-27 | 武汉华星光电半导体显示技术有限公司 | Display panel and manufacturing method thereof |
| CN115116335A (en) * | 2022-07-19 | 2022-09-27 | 武汉华星光电半导体显示技术有限公司 | Display module and display device |
| CN115116336B (en) * | 2022-07-19 | 2023-10-31 | 武汉华星光电半导体显示技术有限公司 | Display panel and manufacturing method thereof |
| WO2024016431A1 (en) * | 2022-07-19 | 2024-01-25 | 武汉华星光电半导体显示技术有限公司 | Display module and display apparatus |
| CN115273672A (en) * | 2022-08-22 | 2022-11-01 | 京东方科技集团股份有限公司 | Display device and display module thereof |
| WO2024041379A1 (en) * | 2022-08-24 | 2024-02-29 | 京东方科技集团股份有限公司 | Display module and display device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN114550589A (en) | Display module and display device | |
| US11852931B2 (en) | Display unit having a curved display panel | |
| CN111725265B (en) | Display module and display device | |
| US20210055599A1 (en) | Electronic device | |
| US11129281B2 (en) | Flexible circuit film and electronic device comprising the same | |
| US11829028B2 (en) | Backlight source and manufacturing method thereof | |
| JP7183427B2 (en) | Display module and display device | |
| US8619229B2 (en) | Back light assembly and liquid crystal display including the same | |
| CN113555412A (en) | Display module and display device | |
| US20210366881A1 (en) | Array substrate, method of manufacturing the same, and display device | |
| KR20120081859A (en) | Container unit and display device including the same | |
| CN113570966A (en) | Display device and spliced screen | |
| KR101797001B1 (en) | Acf, fabricating method of display panel using the same, fpd module inculding the display panel | |
| US20080123335A1 (en) | Printed circuit board assembly and display having the same | |
| TWI457645B (en) | Touch display device | |
| CN217563982U (en) | Display module and display device | |
| CN114927071B (en) | Display module and display device | |
| CN113066393B (en) | Display device | |
| CN110930884B (en) | Display module and display device | |
| KR20070033507A (en) | Flexible printed circuit film and liquid crystal display comprising the same | |
| WO2024020957A1 (en) | Backlight module and manufacturing method therefor, and display device | |
| JP2018110110A (en) | Light source module and backlight unit and liquid crystal display device including the same | |
| CN115148769A (en) | Display module | |
| CN117769294A (en) | Display module and display device | |
| KR20080043051A (en) | Display panel and display device having the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |