CN112071193A - Backboard, manufacturing method thereof and display device - Google Patents

Backboard, manufacturing method thereof and display device Download PDF

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Publication number
CN112071193A
CN112071193A CN202010927652.5A CN202010927652A CN112071193A CN 112071193 A CN112071193 A CN 112071193A CN 202010927652 A CN202010927652 A CN 202010927652A CN 112071193 A CN112071193 A CN 112071193A
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China
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layer
opening
bending region
back plate
adhesive layer
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CN202010927652.5A
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Chinese (zh)
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黄威
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Priority to CN202010927652.5A priority Critical patent/CN112071193A/en
Publication of CN112071193A publication Critical patent/CN112071193A/en
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    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The invention discloses a back plate, a manufacturing method thereof and a display device, wherein the back plate comprises a bending area and a non-bending area adjacent to the bending area; the back plate further comprises: the supporting layer is provided with a protruding part corresponding to the bending area, and a stress buffering unit is formed in the protruding part; the base material layer is arranged on one side of the supporting layer, which is provided with the protruding portion, a first opening is formed in the position, corresponding to the protruding portion, of the base material layer, and the protruding portion is embedded into the first opening; compared with the prior art, the invention reduces the thickness of the back plate and the display device, improves the bonding strength and reliability of the back plate, and improves the bending performance of the back plate and the display device.

Description

Backboard, manufacturing method thereof and display device
Technical Field
The invention relates to the technical field of display, in particular to a back plate, a manufacturing method of the back plate and a display device with the back plate.
Background
The development trend of intellectualization, portability and flexibility is one of the main development directions of the current display device. New display devices represented by Organic Light-Emitting diodes (OLED) are receiving more and more attention and acceptance due to their outstanding features of being Light, thin, beautiful, energy-saving, and especially flexible.
However, the conventional flexible display device generally includes a back plate, and the back plate includes a supporting layer, a substrate layer, and a glue layer, as shown in fig. 3, for the design of the supporting layer in the prior art, the flexible display device includes a supporting layer 3, and the supporting layer 3 includes a bending region 1 and a non-bending region 2, the supporting layer 3 is formed with a patterned structure 4 corresponding to the bending region 1 to reduce the bending stress, but the supporting layer 3 is thick as a whole, so that the back plate is thick, and the thick flexible display device is not portable, and also has an adverse effect on bending of the flexible display device.
Disclosure of Invention
The embodiment of the invention provides a back plate, a manufacturing method thereof and a display device, and aims to solve the technical problems that in the prior art, the back plate is thick, so that the back plate is not beneficial to bending and carrying and influences the bending of the display device.
In order to solve the above technical problem, an embodiment of the present invention provides a back plate, where the back plate includes a bending region and a non-bending region adjacent to the bending region;
the back plate further comprises:
the supporting layer is provided with a protruding part corresponding to the bending area, and a stress buffering unit is formed in the protruding part; and
the substrate layer, set up in the supporting layer is equipped with one side of bellying, the substrate layer corresponds the position of bellying has first opening, just the bellying embedding in the first opening.
In an embodiment of the present invention, the method for forming the protruding portion includes thinning the supporting layer located in the non-bending region, so that a thickness of the supporting layer corresponding to the bending region is greater than a thickness of the supporting layer corresponding to the non-bending region, so as to form the protruding portion, and the substrate layer is disposed on the supporting layer corresponding to the non-bending region.
In an embodiment of the present invention, the back plate further includes a first adhesive layer disposed between the support layer and the substrate layer, and a position of the first adhesive layer corresponding to the protrusion portion has a second opening penetrating through the first adhesive layer, and the protrusion portion is embedded in the second opening and the first opening.
In an embodiment of the invention, the thickness of the protruding portion is greater than or equal to the sum of the thicknesses of the first adhesion layer and the substrate layer corresponding to the non-bending region.
In an embodiment of the present invention, the back sheet further includes a second adhesive layer disposed on a side of the substrate layer facing away from the support layer, and a side of the second adhesive layer facing away from the substrate layer has a flat surface.
In an embodiment of the invention, the thickness of the protruding portion is smaller than the sum of the thicknesses of the first adhesive layer, the substrate layer and the second adhesive layer corresponding to the non-bending region.
In an embodiment of the invention, a position of the second adhesive layer corresponding to the protrusion portion has a third opening penetrating through a portion of the second adhesive layer, and the protrusion portion is embedded in the second opening, the first opening, and the third opening.
In one embodiment of the present invention, the material of the support layer comprises a stainless steel material, the material of the substrate layer comprises polyimide, and the stress buffering unit comprises a groove and/or an opening.
According to the above object of the present invention, there is provided a method for manufacturing a back plate, the back plate including a bending region and a non-bending region adjacent to the bending region, the method comprising:
s10, providing a supporting layer, and thinning the position of the supporting layer corresponding to the non-bending area so that the supporting layer forms a bulge corresponding to the bending area, and a stress buffering unit is formed in the bulge; and
s20, preparing a substrate layer on the support layer corresponding to the non-bending area, wherein the substrate layer is provided with a first opening corresponding to the bending area, and the protruding part is embedded into the first opening.
According to the above object of the present invention, a display device is provided, which includes a back plate and a display panel disposed on one side of the back plate, wherein the display panel is disposed on one side of the second adhesive layer opposite to the substrate layer and is attached to the flat surface.
The invention has the beneficial effects that: the bulge parts are arranged at the positions, corresponding to the bending areas, of the supporting layer, so that the thickness of the supporting layer in the non-bending areas is smaller than that of the supporting layer in the bending areas, the first opening is formed in the substrate layer, the bulge parts are embedded into the first opening, the back plate is integrally thinned, and the stress buffering units are arranged in the bulge parts, so that the thickness of the back plate can be thinned while the bending stress of the back plate is reduced, and the light and thin product is realized.
Drawings
The technical solution and other advantages of the present invention will become apparent from the following detailed description of specific embodiments of the present invention, which is to be read in connection with the accompanying drawings.
Fig. 1 is a schematic view of a backplane structure according to an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a supporting layer according to an embodiment of the present invention.
Fig. 3 is a schematic diagram of a conventional supporting layer structure.
Fig. 4 is a flowchart of a method for manufacturing a backplane according to an embodiment of the present invention.
Fig. 5 is a schematic structural diagram of a display device according to an embodiment of the present invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or uses of other materials.
The embodiment of the invention provides a back plate, a manufacturing method thereof and a display device, and aims to solve the technical problems that in the prior art, the back plate is thick, so that the back plate is not beneficial to bending and carrying and influences the bending of the display device.
To solve the above technical problem, an embodiment of the present invention provides a back plate, as shown in fig. 1, the back plate includes a bending region 10 and a non-bending region 20 adjacent to the bending region 10.
The back plate further comprises:
and the support layer 101 is provided with a protrusion 1011 corresponding to the bending region 10, and the protrusion 1011 is provided with a stress buffering unit 1012.
The substrate layer 102 is disposed on one side of the support layer 101 where the protrusion 1011 is disposed, the substrate layer 102 has a first opening corresponding to the protrusion 1011, and the protrusion 1011 is embedded in the first opening.
In the implementation and application process, please refer to fig. 3, which is a schematic view of a conventional supporting layer structure, wherein a patterned structure 4 is formed at a position of the supporting layer 3 corresponding to the bending region 1 to buffer stress, but thicknesses of film layers of the supporting layer 3 corresponding to the bending region 1 and the non-bending region 2 are the same, so that an overall thickness of the supporting layer 3 is relatively large, which is not beneficial to thinning and bending of a product, and is not beneficial to bending of the product, and in the embodiment of the present invention, referring to fig. 1 and fig. 2, in the back panel provided in the embodiment of the present invention, a protruding portion 1011 is disposed at a position of the supporting layer 101 corresponding to the bending region 10, and a first opening is disposed at a position of the substrate layer 102 corresponding to the protruding portion 1011, so that the protruding portion 1011 is embedded into the first opening to play a role of accommodating the protruding portion 1011, and accordingly, the thickness of the support layer 101 in the bending region 10 is greater than the thickness of the support layer 101 in the non-bending region 20, that is, after the support layer 101 and the substrate layer 102 are assembled, the protrusion 1011 is embedded in the first opening, so that the overall thickness of the back plate includes the thickness of the support layer 101 corresponding to the non-bending region 20 and the thickness of the substrate layer 102 corresponding to the non-bending region 20, and therefore, the thickness of the back plate can be effectively reduced, the bending performance of the product is improved, and the product is light and thin.
In an embodiment of the present invention, the method for forming the protruding portion 1011 includes performing a thinning process on the support layer 101 located at the non-bending region 20, so that a thickness of the support layer 101 corresponding to the bending region 10 is greater than a thickness of the support layer 101 corresponding to the non-bending region 20, so as to form the protruding portion 1011, and the substrate layer 102 is disposed on the support layer 101 corresponding to the non-bending region 20, where the thinning process may include performing a polishing process or other feasible means on the position of the support layer 101 located at the non-bending region 20, which is not limited herein.
Further, referring to fig. 1 and fig. 2, the back plate further includes a first adhesive layer 103 disposed between the support layer 101 and the substrate layer 102, and the support layer 101 and the substrate layer 102 are adhered together through the first adhesive layer 103, wherein a second opening penetrating through the first adhesive layer 103 is formed at a position of the first adhesive layer 103 corresponding to the protrusion 1011, and the second opening corresponds to and is communicated with the first opening, so that the protrusion 1011 is embedded into the second opening and the first opening.
In addition, the back plate further includes a second adhesive layer 104 disposed on a side of the substrate layer 102 facing away from the support layer 101, and a side of the second adhesive layer 104 facing away from the substrate layer 101 has a flat surface, wherein a thickness of the protrusion 1011 is smaller than a sum of thicknesses of the first adhesive layer 103, the substrate layer 102, and the second adhesive layer 104 corresponding to the non-bending region 20.
In an embodiment of the present invention, the thickness of the protrusion 1011 is equal to the sum of the thicknesses of the first adhesive layer 103 and the substrate layer 102 corresponding to the non-bending region, that is, the thickness of the protrusion 1011 is equal to the sum of the thicknesses of the second opening and the first opening, and fig. 1 provided by the present invention is a structure in which the thickness of the protrusion 1011 is equal to the sum of the thicknesses of the first adhesive layer 103 and the substrate layer 102 corresponding to the non-bending region, in this case, the first opening and the second opening respectively penetrate through the substrate layer 102 and the first adhesive layer 103, the second adhesive layer 104 covers the surface of the substrate layer 102 facing away from the support layer 101, and the second adhesive layer 104 forms a flat surface on the side facing away from the substrate layer 102.
The support layer 101 is thinned corresponding to the non-bending region 20, so that the thickness of the support layer 101 corresponding to the bending region 10 is greater than the thickness of the support layer 101 corresponding to the non-bending region 20, so as to form the convex portion 1011, meanwhile, the first adhesion layer 103 and the substrate layer 102 can be arranged in a segmented manner, namely, the second opening is formed at a position corresponding to the non-bending region 20, and the first opening is formed at a position corresponding to the protrusion 1011, and after the support layer 101, the first adhesive layer 103 and the base material layer 102 are adhered, so that the convex portion 1011 is fitted into the second opening as well as the first opening, and the second adhesive layer 104 covers the surface of the substrate layer 102 on the side facing away from the support layer 101, and a flat surface is formed on the side of the second adhesive layer 104 opposite to the substrate layer 102.
In another embodiment of the present invention, the thickness of the protruding portion 1011 is greater than the sum of the thicknesses of the first adhesive layer 103 and the substrate layer 102 corresponding to the non-bending region, and the thickness of the protruding portion 1011 is less than the sum of the thicknesses of the first adhesive layer 103, the substrate layer 102 and the second adhesive layer 104 corresponding to the non-bending region 20, specifically, the position of the second adhesive layer 104 corresponding to the protruding portion 1011 has a third opening penetrating through a portion of the second adhesive layer 104, that is, the thickness of the protruding portion 1011 is greater than the sum of the depths of the second opening and the first opening, and the thickness of the protruding portion 1011 is less than the sum of the depths of the second opening, the first opening and the third opening, so that the protruding portion 1011 is embedded in the second opening, the first opening and the third opening, and at this time, the first opening and the second opening penetrate through the substrate layer 102 and the first adhesive layer 103 respectively, the third opening penetrates through a portion of the second adhesion layer 104, and a side of the second adhesion layer 104 facing away from the third opening is a flat surface.
The support layer 101 is thinned corresponding to the non-bending region 20, so that the thickness of the support layer 101 corresponding to the bending region 10 is greater than the thickness of the support layer 101 corresponding to the non-bending region 20, so as to form the convex portion 1011, meanwhile, the first adhesion layer 103 and the substrate layer 102 can be arranged in a segmented manner, namely, the second opening is formed at a position corresponding to the non-bending region 20, and the first opening is formed at a position corresponding to the protrusion 1011, a third opening penetrating a portion of the second adhesive layer 104 is formed at a position of the second adhesive layer 104 corresponding to the protrusion 1011, and after the support layer 101, the first adhesive layer 103, the base material layer 102 and the second adhesive layer 104 are adhered, so that the convex portions 1011 are fitted into the second opening, the first opening, and the third opening.
It should be noted that, in the embodiment of the present invention, the material of the support layer 101 includes a stainless steel material, which can improve the stiffness of the backplane, the material of the substrate layer 102 includes polyimide, the material of the first adhesion layer 103 includes OCA optical cement, the material of the second adhesion layer 104 includes PSA pressure sensitive adhesive, and the stress buffering unit 1012 includes grooves and/or openings formed in the support layer 101 in the bending region 10, so as to reduce the bending stress applied to the support layer 101.
In summary, in the embodiment of the invention, the position of the support layer corresponding to the non-bending region is thinned, so that the support layer forms the protrusion corresponding to the bending region, and the second opening and the first opening are respectively formed at least at the positions of the first adhesion layer and the substrate layer corresponding to the protrusion, so that the protrusion is embedded into the second opening and the first opening, and the protrusion is accommodated, so that the overall thickness of the back plate is thinned, the product is thinned, the back plate is more favorable for being bent, and the protrusion, the second opening and the first opening form an inter-embedded structure, so that the bonding strength between the film layers in the back plate is improved, and the reliability of the back plate is improved.
In addition, an embodiment of the present invention further provides a method for manufacturing the back plate in the above embodiments, please refer to fig. 1 and 4, in which the back plate includes a bending region 10 and a non-bending region 20 adjacent to the bending region 10, and the method includes:
s10, providing a support layer 101, and thinning the position of the support layer 101 corresponding to the non-bending region 20, so that the support layer 101 forms a protrusion 1011 corresponding to the bending region 10, and the protrusion 1011 forms a stress buffering unit 1012.
The material of the support layer 101 includes a stainless steel material, and the thinning process performed on the position of the support layer 101 corresponding to the non-bending region 20 includes polishing the position of the support layer 101 corresponding to the non-bending region 20, so that the thickness of the support layer 101 corresponding to the bending region 10 is greater than the thickness of the support layer 101 corresponding to the non-bending region 20, so that the support layer 101 corresponding to the bending region 10 forms the protrusion 1011, and meanwhile, the protrusion 1011 is formed with the stress buffering unit 1012, and the stress buffering unit 1012 includes a groove and/or an opening, which can play a role in buffering the bending stress.
S20, preparing a substrate layer 102 on the support layer 101 corresponding to the non-bending region 20, wherein the substrate layer 102 has a first opening corresponding to the bending region 10, and the protrusion 1011 is embedded in the first opening.
Specifically, a first adhesive layer 103 is prepared on the side of the support layer 101 where the protruding portion 1011 is disposed, and the first adhesive layer 103 is disposed in a segmented manner, that is, the first adhesive layer 103 is correspondingly disposed in the non-bending region 20, and a second opening penetrating through the first adhesive layer 103 is formed corresponding to the bending region 10, and the protruding portion 1011 is correspondingly embedded in the second opening, and the material of the first adhesive layer 103 includes OCA optical cement.
Preparing a substrate layer 102 on the first adhesive layer 103, and attaching to the support layer 101 through the first adhesive layer 103, where the substrate layer 102 is also arranged in a sectional manner, that is, the substrate layer 102 is correspondingly arranged in the non-bending region 20 and forms a first opening penetrating through the substrate layer 102 corresponding to the bending region 10, and the first opening is communicated with the second opening, so that the protrusion 1011 is correspondingly embedded into the second opening and the first opening, and the substrate layer 102 is made of polyimide.
In one embodiment of the present invention, a second adhesive layer 104 is prepared on the substrate layer 102, the second adhesive layer 104 covers a surface of the substrate layer 102 facing away from the support layer 101, and a flat surface is formed on a side of the second adhesive layer 104 facing away from the substrate layer 102.
In another embodiment of the present invention, the second adhesive layer 104 is prepared on the substrate layer 102, and the second adhesive layer 104 has a third opening at a position corresponding to the protrusion 1011, and the third opening penetrates through a portion of the second adhesive layer 104, and the third opening is communicated with the first opening and the second opening, so that the protrusion 1011 is embedded into the second opening, the first opening and the third opening, and a side of the second adhesive layer 104 facing away from the substrate layer 102 has a flat surface.
The material of the second adhesive layer 104 includes a PSA pressure sensitive adhesive.
In addition, an embodiment of the present invention further provides a display device, please refer to fig. 5, where the display device includes the back plate in the above embodiment, and a display panel 105 disposed on one side of the back plate, and the display panel 105 is disposed on a side of the second adhesive layer 104 opposite to the substrate layer 102 and attached to the flat surface.
Furthermore, the display device further includes a polarizer 106 disposed on a side of the display panel 105 facing away from the substrate layer 102, and a cover plate 107 disposed on a side of the polarizer 106 facing away from the display panel 105.
In the display device provided by the embodiment of the invention, the position of the support layer corresponding to the non-bending area is thinned, so that the support layer corresponding to the bending area forms the protruding part, and the second opening and the first opening are respectively formed at least at the positions of the first adhesion layer and the substrate layer corresponding to the protruding part, so that the protruding part is embedded into the second opening and the first opening to play a role of accommodating the protruding part, so that the whole thickness of the back plate is thinned, the back plate is more beneficial to bending, and the protruding part, the second opening and the first opening form an embedded structure, so that the bonding strength between film layers in the back plate is improved, and the reliability of the back plate is improved, in addition, the second opening and the first opening are arranged to accommodate the protruding part, so that one side of the second adhesion layer facing to the display panel is a flat surface, the reliability and the yield of the bonding are improved, and the thickness of the back plate is thinned and the bending performance is improved, the display device provided by the embodiment of the invention is lighter and thinner, and the bending resistance of the display device is improved.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The backplane, the manufacturing method thereof and the display device provided by the embodiment of the invention are described in detail, a specific example is applied in the text to explain the principle and the embodiment of the invention, and the description of the embodiment is only used for helping to understand the technical scheme and the core idea of the invention; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims (10)

1. A back plate, comprising a bending region and a non-bending region adjacent to the bending region;
the back plate further comprises:
the supporting layer is provided with a protruding part corresponding to the bending area, and a stress buffering unit is formed in the protruding part; and
the substrate layer, set up in the supporting layer is equipped with one side of bellying, the substrate layer corresponds the position of bellying has first opening, just the bellying embedding in the first opening.
2. The back plate of claim 1, wherein the method for forming the protruding portion comprises thinning the supporting layer located in the non-bending region such that the thickness of the supporting layer corresponding to the bending region is greater than the thickness of the supporting layer corresponding to the non-bending region to form the protruding portion, and the substrate layer is disposed on the supporting layer corresponding to the non-bending region.
3. The back sheet of claim 1, further comprising a first adhesive layer disposed between the support layer and the substrate layer, wherein the first adhesive layer has a second opening penetrating through the first adhesive layer at a position corresponding to the protrusion, and the protrusion is embedded in the second opening and the first opening.
4. A backsheet according to claim 3, wherein the thickness of the protrusion is greater than or equal to the sum of the thicknesses of the first adhesive layer and the substrate layer corresponding to the non-bent region.
5. The backing sheet of claim 3 further comprising a second adhesive layer disposed on a side of the substrate layer facing away from the support layer, wherein the side of the second adhesive layer facing away from the substrate layer has a flat surface.
6. A back sheet according to claim 5, wherein the thickness of the protrusion is smaller than the sum of the thicknesses of the first adhesive layer, the substrate layer and the second adhesive layer corresponding to the non-bending region.
7. The backing sheet of claim 6 wherein the second adhesive layer has a third opening through a portion of the second adhesive layer at a position corresponding to the protrusion, and the protrusion is inserted into the second opening, the first opening, and the third opening.
8. The backplate of claim 1, wherein the material of the support layer comprises a stainless steel material, the material of the substrate layer comprises polyimide, and the stress buffering elements comprise grooves and/or openings.
9. A method of forming a back plate, the back plate comprising a bending region and a non-bending region adjacent to the bending region, the method comprising:
s10, providing a supporting layer, and thinning the position of the supporting layer corresponding to the non-bending area so that the supporting layer forms a bulge corresponding to the bending area, and a stress buffering unit is formed in the bulge; and
s20, preparing a substrate layer on the support layer corresponding to the non-bending area, wherein the substrate layer is provided with a first opening corresponding to the bending area, and the protruding part is embedded into the first opening.
10. A display device, comprising the back plate of any one of claims 1 to 8, and a display panel disposed on one side of the back plate, wherein the display panel is disposed on a side of the second adhesive layer opposite to the substrate layer and attached to the flat surface.
CN202010927652.5A 2020-09-07 2020-09-07 Backboard, manufacturing method thereof and display device Pending CN112071193A (en)

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Cited By (4)

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CN113066362A (en) * 2021-03-05 2021-07-02 武汉华星光电半导体显示技术有限公司 Supporting plate, manufacturing method thereof and flexible display device
CN113362719A (en) * 2021-06-22 2021-09-07 云谷(固安)科技有限公司 Display module, display device and preparation method of display module
WO2022141352A1 (en) * 2020-12-29 2022-07-07 武汉华星光电半导体显示技术有限公司 Display panel and display device
US12005684B2 (en) 2020-12-29 2024-06-11 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Display panel and display device

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Application publication date: 20201211