CN112526792A - Display panel, display device and manufacturing method thereof - Google Patents
Display panel, display device and manufacturing method thereof Download PDFInfo
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- CN112526792A CN112526792A CN202011327162.8A CN202011327162A CN112526792A CN 112526792 A CN112526792 A CN 112526792A CN 202011327162 A CN202011327162 A CN 202011327162A CN 112526792 A CN112526792 A CN 112526792A
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Images
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/35—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being liquid crystals
Abstract
The application discloses a display panel, a display device and a manufacturing method thereof, wherein the display panel comprises a first substrate, a second substrate, a flexible circuit board and a front decorative board; the surface of the first substrate facing the second substrate is a first surface, the exposed area of the first substrate is an outer pin binding area, one end of the flexible circuit board is bound and connected with the outer pin binding area, and the flexible circuit board is arranged on the first surface of the first substrate and is bent to face the second surface of the first substrate; the front decorative plate is adhered to cover the outer pin binding area of the first substrate; the width of the front decorative plate is 1-2 times of the width of the outer pin binding area; the length of the front decorative plate is 1-1.5 times of the length of the outer pin binding area, so that the flexible circuit board of the display panel in the outer pin binding area is more stably and attractively connected, and the cost is relatively lower.
Description
Technical Field
The present disclosure relates to the field of display technologies, and in particular, to a display panel, a display device and a manufacturing method thereof.
Background
In a TFT-LCD (Thin film transistor liquid crystal display) device, an Outer Lead Bonding (OLB) Bonding mode is usually adopted. Under the popular trend of narrow-frame and frameless display panels, the frame of the display panel is made narrower, however, the pin binding mode of OLB requires a larger space to accommodate and fix the exposed pins of the outer pin binding area and the bound circuit board, and a fixing piece with a larger volume is required to fix the outer pin binding area and the circuit board, so that the frame width of the whole machine is difficult to reduce, and the attractiveness is affected.
In order to pursue a narrower frame and to have a visual appearance with impact force, a method of changing a binding mode is often adopted, so that the price of narrow-frame and frameless products in the market is always high, and the circuit stability of a new binding mode is often poor, which becomes a problem to be solved.
Disclosure of Invention
The present application is directed to a display panel, a display device and a method for manufacturing the same, and provides a display panel with lower cost and more beautiful appearance.
The application discloses a display panel, which comprises a first substrate, a second substrate, a flexible circuit board and a front decorative board; the first substrate and the second substrate are oppositely arranged, the surface of the first substrate facing the second substrate is a first surface, and the surface of the first substrate far away from the second substrate is a second surface; the length of the first substrate exceeds that of the second substrate, the exposed area of the first substrate is an outer pin binding area, one end of the flexible circuit board is bound and connected with the outer pin binding area, and the other end of the flexible circuit board is bent to the second surface of the first substrate; the display panel further comprises a front decorative plate, and the front decorative plate is adhered to cover the outer pin binding area of the first substrate; the width of the front decorative plate is consistent with that of the outer pin binding area; the length of the front decorative plate is consistent with that of the outer pin binding area.
Optionally, the front decorative plate is adhered to and covered on the outer pin binding area of the first substrate through a curing adhesive; the curing glue is arranged between the front decorative plate and the first substrate; the outer pin binding area comprises a pasting area and an overflow glue blocking area which are adjacently arranged, and the curing glue is arranged in the pasting area of the outer pin binding area; the glue overflow blocking area is arranged outside the pasting area and is adjacent to the edge of the first substrate; the surface of the overflow glue blocking area is provided with an overflow glue blocking structure, and the contact angle between the surface of the overflow glue blocking structure and the curing glue is more than or equal to 90 degrees.
Optionally, the outer pin binding region is rectangular; the flexible circuit board is bound on the long edge of the rectangular outer pin binding area; the two overflow glue blocking areas are respectively arranged at two ends of two short edges of the rectangular outer pin binding area.
Optionally, the curing adhesive comprises a hot-melt adhesive; the overflow glue blocking structure is a low surface energy material, and the low surface energy material can be selected from one or more of resin materials taking fluorine polymer, silicon polymer or copolymers of the fluorine polymer and the silicon polymer as matrixes, or modified carbon nanotube materials formed by adding other elements on the basis of carbon nanotubes.
Optionally, the glue overflow blocking structure is directly disposed on a region of the front decorative plate corresponding to the glue overflow blocking region, and/or a region of the first substrate corresponding to the glue overflow blocking region.
Optionally, a polarizer is further disposed on a side surface of the second substrate away from the first substrate, and an outer surface of the front decorative plate and an outer surface of the polarizer are located on the same plane.
Optionally, four sides of the display panel are respectively a first side, a second side, a third side and a fourth side, the outer pin binding area is arranged on the fourth side, the first side, the second side and the third side are not provided with frames, and the front decorative plate is the frame of the fourth side.
Optionally, the front decorative plate is made of a PET material or a metal material, and a polarizer is further disposed on a surface of one side of the second substrate, which is far away from the first substrate.
The application also discloses a display device, includes: the array substrate is provided with a first surface and a second surface; the color film substrate is arranged opposite to the array substrate and arranged on one side of the first surface of the array substrate; the length of the first substrate exceeds that of the second substrate, the exposed area of the first substrate is an outer pin binding area, one end of the flexible circuit board is bound and connected with the outer pin binding area, and the other end of the flexible circuit board is bent to the second surface of the first substrate; the front decorative plate is arranged in an outer pin binding area of the first substrate; the front decorative plate is adhered to and covered on an outer pin binding area of the first substrate through curing glue, wherein the outer pin binding area comprises an adhering area and an overflow glue blocking area which are adjacently arranged, and the curing glue is arranged in the adhering area of the outer pin binding area; the glue overflow blocking area is arranged outside the pasting area and is adjacent to the edge of the first substrate; the surface of the overflow glue blocking area is provided with an overflow glue blocking structure, and the surface of the overflow glue blocking structure is hydrophobic; the outer pin binding area is rectangular; the flexible circuit board is bound on the long edge of the rectangular outer pin binding area; the two overflow glue blocking areas are respectively arranged at two ends of two short edges of the rectangular outer pin binding area; the glue overflow blocking structure is directly arranged on the front decorative plate; the width of the front decorative plate is consistent with that of the outer pin binding area; the length of the front decorative plate is consistent with that of the outer pin binding area, a polaroid is further arranged on one side, away from the first substrate, of the second substrate, and the outer surface of the front decorative plate and the outer surface of the polaroid are located on the same plane; the four sides of the display panel are respectively a first side, a second side, a third side and a fourth side, wherein the outer pin binding area is arranged on the fourth side, the first side, the second side and the third side are not provided with frames, and the front decorative plate is the frame of the fourth side.
The application also discloses a manufacturing method of the display device, which comprises the following steps:
sequentially forming a first substrate and a second substrate, and jointing the first substrate and the second substrate;
binding a flexible circuit board in an outer pin binding area of a first substrate;
coating an overflow blocking structure made of a low surface energy material at a first preset position;
coating curing glue at a second preset position; and
bonding the front decorative plate with the first substrate;
the first preset position comprises the edge of an outer pin binding area of the first substrate or the edge of a front decorative plate; the second preset position is the surface of the outer pin binding area of the first substrate or the surface of the front decorative plate facing the outer pin binding area.
The method adopts the OLB which is the most conventional and mature binding mode, so that the binding cost of the display panel is not increased, and the flexible circuit board in the outer pin binding area is more stably electrically connected; after one end of the flexible circuit board is bound and connected with the outer pin binding area, the other end of the flexible circuit board and a circuit board (PCB) are bent to the second surface of the first substrate, so that the fixing space required by the outer pin binding area is reduced as much as possible, a front decorative board is directly arranged on the outer pin binding area to shield the outer pin binding area, and the width of the front decorative board is 1-2 times of that of the outer pin binding area; the length of the front decorative plate is 1-1.5 times of the length of the outer pin binding area, and the outer pin binding area is not required to be shielded by an additional frame, so that the display panel is more attractive; and the cost of directly bonding the front decorative plate to the first substrate is relatively lower.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the application, are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort. In the drawings:
fig. 1 is a schematic diagram of a display device according to an embodiment of the present application;
FIG. 2 is a schematic diagram of another display device according to an embodiment of the present application;
FIG. 3 is a schematic diagram of a display panel according to an embodiment of the present application;
FIG. 4 is a schematic diagram of a display panel according to another embodiment of the present application;
FIG. 5 is a diagram illustrating an outer lead bonding area of a display panel according to another embodiment of the present application;
FIG. 6 is a diagram illustrating an outer lead bonding area of a display panel according to another embodiment of the present application;
figure 7 is a schematic diagram of a flash barrier structure and a contact angle of a cured glue according to an embodiment of the present application;
fig. 8 is a schematic view of a display device according to another embodiment of the present application;
fig. 9 is a schematic view of a display device according to another embodiment of the present application;
fig. 10 is a schematic diagram illustrating a method for manufacturing a display device according to an embodiment of the present disclosure.
10, a display device; 100. a display panel; 101. a first side; 102. a second edge; 103. a third side; 104. a fourth side; 105. a display area; 110. a first substrate; 111. an array substrate; 112. a first surface; 113. a second surface; 120. a second substrate; 121. a color film substrate; 130. a polarizer; 140. a flexible circuit board; 150. a drive circuit board; 160. a front decorative panel; 170. curing glue; 180. an outer pin binding region; 182. a pasting area; 183. an overflow blocking region; 190 flash barrier structure.
Detailed Description
It is to be understood that the terminology, the specific structural and functional details disclosed herein are for the purpose of describing particular embodiments only, and are representative, but that the present application may be embodied in many alternate forms and should not be construed as limited to only the embodiments set forth herein.
In the description of the present application, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating relative importance or as implicitly indicating the number of technical features indicated. Thus, unless otherwise specified, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; "plurality" means two or more. The terms "comprises" and "comprising," and any variations thereof, are intended to cover a non-exclusive inclusion, such that one or more other features, integers, steps, operations, elements, components, and/or combinations thereof may be present or added.
Further, terms of orientation or positional relationship indicated by "center", "lateral", "upper", "lower", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, are described based on the orientation or relative positional relationship shown in the drawings, are simply for convenience of description of the present application, and do not indicate that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present application.
Furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly and may include, for example, fixed connections, removable connections, and integral connections; can be mechanically or electrically connected; either directly or indirectly through intervening media, or through both elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
The present application is described in detail below with reference to the figures and alternative embodiments.
As shown in fig. 1, the display panel of the display device mostly adopts an Outer Lead Bonding (OLB) Bonding manner, that is: the surface of the first substrate 110 facing the second substrate 120 is a first surface 112, and the surface of the first substrate 110 away from the second substrate 120 is a second surface 113; the length of the first substrate 110 exceeds the length of the second substrate 120, the exposed area of the first surface 112 of the first substrate 110 is an outer pin binding area 180, the display panel further includes a driving circuit board 150 for inputting a driving signal into the panel, and the driving circuit board 150 is correspondingly connected in a manner that one end of a flexible circuit board 140(Chip On Film, COF, Chip On Film) is bound to the outer pin binding area 180 of the first substrate 110, and the other end is connected with the driving circuit board 150.
As shown in fig. 2, as an embodiment of the present application, there is disclosed a display panel including: a first substrate 110, a second substrate 120, a flexible circuit board 140, and a front decorative plate 160; the second substrate 120 is disposed opposite to the first substrate 110, a surface of the first substrate 110 facing the second substrate 120 is a first surface 112, and a surface of the first substrate 110 away from the second substrate 120 is a second surface 113; the length of the first substrate 110 exceeds the length of the second substrate 120, the exposed area of the first substrate 110 is an outer pin bonding area 180, one end of the flexible circuit board 140 is bonded to the outer pin bonding area 180, and the other end of the flexible circuit board is bent to the second surface 113 of the first substrate 110; wherein, the front decorative plate 160 is adhered to cover the outer pin binding region 180 of the first substrate 110; the width of the front decorative plate 160 is 1-2 times the width of the outer pin binding region 180; the length of the front decorative plate 160 is 1-1.5 times the length of the outer pin binding region 180; the first substrate 110 is an array substrate 111, and the second substrate 120 is a color filter substrate 121.
The application adopts the most conventional and mature binding mode of OLB, which not only can not increase the binding cost of the display panel, but also can ensure that the flexible circuit board 140 of the outer pin binding area 180 is electrically connected more stably; the front decorative plate 160 is directly arranged on the outer pin binding area 180 to shield the outer pin binding area 180, and an additional frame is not needed to shield the outer pin binding area 180, so that the display panel is more attractive, and pins cannot be exposed; moreover, the front decorative plate 160 is directly adhered to the first substrate 110 by the curing adhesive 170, so that the cost is relatively low, and the panel does not need to be additionally fixed by a frame; the front trim panel 160 of the present application can be configured to be consistent in size with the outer pin binding zone 180, i.e.: the width of the front decorative plate 160 is 1-2 times of the width of the outer pin binding region 180, and the length of the front decorative plate 160 is 1-1.5 times of the length of the outer pin binding region 180, so that a frame of one side of the display panel on which the flexible circuit board 140 is correspondingly arranged is narrower, and the display panel is more attractive. It should be noted that the width of the front decorative plate is wider than the area of the outer pin binding area, the decorative plate can wrap two corners of the display panel, and has a certain protection effect, but if a display panel without a frame is pursued, the front decorative plate with the same width can be selected.
As shown in fig. 3, the display panel of the present application is a three-sided frameless display panel, four sides of the display panel include a first side 101, a second side 102, a third side 103 and a fourth side 104, wherein the outer pin bonding region 180 is disposed on the fourth side 104, the first side 101, the second side 102 and the third side 103 are not provided with a frame, and the front decorative plate 160 is a frame of the fourth side; the area enclosed by the first, second, and third edges and the front trim panel 160 is shown as a display area 105; the frame formed by the front decorative plate 160 is arranged on only one side of the outer pin binding area 180, the front decorative plate 160 is only bonded with the first substrate 110 through the curing adhesive 170, the first substrate 110 is directly fixed with the rear frame of the display panel, three sides of the display panel can be frameless due to the arrangement, the frame formed by the front decorative plate 160 is arranged on the only side with the frame, visual shock of three sides without the frame is brought, the flexible circuit board 140 is bent to the second surface 113, the driving circuit board 150 is moved to the back of the display panel, the frame on the fourth side is narrower, side fixing is not needed, only surface decoration is carried out, and therefore the frame on the fourth side is more attractive.
In order to further enhance the aesthetic effect, as shown in fig. 2 and 3, the front decorative plate 160 has a size corresponding to the size of the outer lead bonding area 180, and the front decorative plate 160 is adhered to and covers the outer lead bonding area 180 of the first substrate 110 by the curing adhesive 170; the curing glue 170 is disposed between the front decorative plate 160 and the first substrate 110; a polarizer 130 is further disposed on a side of the second substrate 120 away from the first substrate 110, and an outer surface of the front decorative plate 160 and an outer surface of the polarizer 130 are in the same plane; and the front decorative plate 160 is not protruded from the polarizer 130 and is kept on the same plane, so that the front decorative plate 160 can be protected under the outer protective glass when the outer protective glass of the panel is manufactured, scratching is prevented, and sealing and protection of the pin binding of the outer pin binding area 180 are enhanced.
As shown in fig. 4, when the curing adhesive 170 is used to bond the front decorative plate 160 and the first substrate 110, since the space of the outer lead bonding area 180 is small, the adhesive overflow condition as shown in the figure often occurs, and the adhesive removing operation is often required to be added to remove the excess curing adhesive 170 overflowing the first side and the third side of the display panel; thereby achieving the effect of beautiful appearance. Considering that the glue removing action tends to have a high damage rate, as shown in fig. 6, the outer lead bonding area 180 includes a bonding area 182 and a glue overflow blocking area 183, which are adjacently disposed, and the curing glue 170 is disposed in the bonding area 182 of the outer lead bonding area 180; the overflow blocking region 183 is disposed outside the pasting region 182 and adjacent to the edge of the first substrate 110; the surface of the excessive glue blocking area 183 is provided with an excessive glue blocking structure, the surface of the excessive glue blocking structure is hydrophobic, specifically, as shown in fig. 8, a contact angle theta between the excessive glue blocking structure and the curing glue is greater than or equal to 90 degrees, the excessive glue blocking area 183 is provided with the edge of the outer pin binding area 180, the excessive glue blocking structure is made of a low surface energy material, so that the curing glue 170 cannot overflow to form the excessive glue problem.
According to the analysis of fig. 4, most of the glue overflow situations mainly occur at the first side 101 and the third side 103 of the display panel, the first side 101 and the third side 103 are two sides adjacent to the fourth side 104, the second side 102 is opposite to the fourth side 104, the fourth side 104 has a longer length, a larger space and fewer glue overflow situations, even if the glue overflow situation occurs, the glue overflow situation does not occur at the whole fourth side, and under the glue overflow situation occurring in a few areas, the fourth side can be balanced with the glue lacking area through the glue lacking area, so that the glue removing step can be reduced, the glue overflow blocking structure is not coated on the fourth side, the glue overflow blocking structure is only arranged at the first side 101 and the third side 103 of the display panel, the use of the glue overflow blocking material can be greatly reduced, the glue overflow situation can be prevented, and the cost can be further reduced; FIG. 5 shows another embodiment, where the outer pin bonding area 180 is rectangular; the flexible circuit board 140 is bound on the long side of the rectangular outer pin binding area 180; the two excessive glue blocking areas 183 are respectively arranged at two ends of two short edges of the rectangular outer pin binding area 180.
Except for the different arrangement of the glue overflow blocking area 183 area in the above two embodiments, the arrangement of the glue overflow blocking structure on the front decorative plate 160 or the first substrate 110 is different, and the glue overflow blocking structure coated on the front decorative plate 160 in the area corresponding to the glue overflow blocking area 183 area does not affect the outer pin binding area 180 of the first substrate 110, and can be directly coated on the front decorative plate 160, and then the curing glue 170 is directly coated on the front decorative plate 160, so that the display panel process does not need to be waited, and then the coating is processed on the display panel, so that the display panel can be directly attached to the front decorative plate 160, the glue removing step can be reduced, the yield can be improved, and the cost can be reduced.
Unlike the previous embodiment, the glue overflow blocking structure is directly disposed on the area of the first substrate 110 corresponding to the glue overflow blocking area 183, the glue overflow blocking area 183 is disposed on the side of the outer lead bonding area 180 away from the second substrate 120, the flexible circuit board 140 is bonded on the bonding area 182 of the outer lead bonding area 180, the side of the outer lead bonding area 180 bonded to the flexible circuit board 140 is the second side, and the glue overflow blocking structure 190 is disposed on the edges of the two sides of the outer lead bonding area 180 adjacent to the second side. The overflow glue blocking structure 190 is disposed in the overflow glue blocking region of the first substrate 110, corresponding to the positions of the first edge and the third edge and on the first substrate 110 near the edge of the display area 105, because the first edge and the third edge are shorter, glue is easily overflowed, and thus the setting of the overflow glue blocking structure can avoid the subsequent glue removing operation. Of course, it is also possible to combine the above two embodiments, and not only the flash blocking structure is provided on the front decoration plate 160, but also the flash blocking structure is provided on the first substrate 110.
Considering that the front decorative plate 160 and the first substrate 110 are adhered and fixed only by the curing adhesive 170, the curing adhesive 170 selected in the present application is a hot melt adhesive, and the specific material may be: the pur (polyurethane reactive) adhesive is fully called moisture curing reactive polyurethane hot melt adhesive in Chinese. The main component is isocyanate terminated polyurethane prepolymer. The PUR has adjustable adhesiveness and toughness (elasticity), and has excellent adhesive strength, temperature resistance, chemical resistance and aging resistance. The porous materials such as wood, leather, fabric, paper, ceramics and the like and the surface cleaning materials such as plastics, metal, glass, rubber and the like have excellent adhesive force. Specifically, correspondingly, the low surface energy material includes: (1) the resin material having a fluoropolymer, a silicon polymer, or a copolymer of both as a matrix is, for example: polytetrafluoroethylene (PTFE), a copolymerized resin of a fluoroolefin and vinyl ether (FEVE), a teflon polymer, a fluorinated acrylic modified resin, and the like; (2) the modified carbon nanotube material is formed by adding other elements to the carbon nanotube, and the additive may be a compound such as Perfluorodecyltriethoxysilane (PFDTS). Any one or a mixture of more of the above.
It should be noted that: the surface of the overflow barrier structure is hydrophobic, specifically as shown in fig. 8, a contact angle theta between the overflow barrier structure and the curing adhesive is greater than or equal to 90 degrees, and the low-surface-energy material with the contact angle of greater than or equal to 90 degrees with the curing adhesive can be attached to the surface of the glass in the modes of electroplating, 3D printing, coating, deposition coating and the like
The material of the front decorative plate 160 of the present application may be a PET (Polyethylene tereph-thalate) material or a metal material (e.g., martensitic stainless steel 430 may be selected). The color of the front decorative plate 160 is equivalent to the blackness of the black display area, so that the display area and the outer pin binding area 180 cannot be easily distinguished when the user looks at the black display area at a glance, and the front decorative plate is more attractive in a screen-touching state, has more texture than a thick black frame and is more easily accepted.
As shown in fig. 1 to 8, as a specific embodiment of the present application, there is also disclosed a display device including: the display panel comprises an array substrate 111, a color film substrate 121, a flexible circuit board 140, a front decorative board 160 and a curing adhesive 170, wherein the array substrate 111 is provided with a first surface 112 and a second surface 113; the color filter substrate 121 is arranged opposite to the array substrate 111 and is arranged on one side of the first surface 112 of the array substrate 111; the length of the first substrate 110 exceeds the length of the second substrate 120, the exposed area of the first substrate 110 is an outer pin bonding area 180, one end of the flexible circuit board 140 is bonded to the outer pin bonding area 180, and the other end of the flexible circuit board is bent to the second surface 113 of the first substrate 110; the front decorative plate 160 is disposed in the outer lead bonding region 180 of the first substrate 110; the front decorative plate 160 is adhered to and covered on the outer lead bonding area 180 of the first substrate 110 through a curing adhesive 170; the outer lead bonding area 180 comprises a pasting area 182 and an overflow glue blocking area 183 which are adjacently arranged, and the curing glue 170 is arranged in the pasting area 182 of the outer lead bonding area 180; the overflow blocking region 183 is disposed outside the pasting region 182 and adjacent to the edge of the first substrate 110; the surface of the overflow glue blocking area 183 is provided with an overflow glue blocking structure 190, and the contact angle between the surface of the overflow glue blocking structure and the curing glue is more than or equal to 90 degrees; the outer pin binding area 180 is rectangular; the flexible circuit board 140 is bound on the long side of the rectangular outer pin binding area 180; the two excessive glue blocking areas 183 are respectively arranged at two ends of two short edges of the rectangular outer pin binding area 180; the overflow blocking structure is directly disposed on the front decorative plate 160; the width of the front decorative plate 160 is consistent with the width of the outer pin binding region 180; the length of the front decorative plate 160 is the same as that of the outer pin binding region 180, a polarizer 130 is further disposed on one side of the second substrate 120 away from the first substrate 110, and the outer surface of the front decorative plate 160 and the outer surface of the polarizer 130 are in the same plane; four sides of the display panel are respectively a first side, a second side, a third side and a fourth side, wherein the outer pin binding region 180 is arranged on the fourth side, no frame is arranged on the first side, the second side and the third side, and the front decorative plate 160 is a frame of the fourth side; the front decorative plate 160 may be a Film (Film) material, and the thickness of the front decorative plate 160 may be the same as the thickness of the polarizer 130, so that the outer surface of the front decorative plate 160 and the outer surface of the polarizer 130 are in the same plane.
As shown in fig. 9, when a metal material is selected, the metal material is easy to process, and the front decorative plate 160 may be processed to bend the front decorative plate 160 near the edge of the array substrate 111 and bend the front decorative plate in the direction of the first substrate 110, so that the problem of the curing adhesive 170 overflowing may be avoided to some extent.
As shown in fig. 10, as another embodiment of the present application, a method for manufacturing a display device is disclosed, which includes the steps of:
s1: sequentially forming a first substrate and a second substrate, and jointing the first substrate and the second substrate;
s2: binding a flexible circuit board in an outer pin binding area of a first substrate;
s3: coating an overflow blocking structure made of a low surface energy material at a first preset position;
s4: coating curing glue at a second preset position; and
s5: and bonding the front decorative plate and the first substrate.
The first preset position comprises the edge of an outer pin binding area of the first substrate, and the second preset position comprises the outer pin binding area of the first substrate; the glue coating action is directly carried out on the first substrate, coating is started on one side, close to the display area, of the outer pin binding area, the outer pin binding area moves along the direction of the first edge and is coated on one side, far away from the display area, of the outer pin binding area, in the coating process, under the condition that the coating amount of the curing glue is too much, the curing glue only overflows to one side, far away from the display area, of the outer pin binding area, components inside the display area cannot be influenced, natural curing is needed for 10-24 hours after the front decorative plate and the first substrate are bonded, and the bonding force of the front decorative plate and the panel is stable.
In another embodiment, the first predetermined position is an edge of the front decoration plate, and the second predetermined position is a surface of the front decoration plate facing the outer lead bonding area, and the coating method is not directly coated on the first substrate, so that a machine table is not required for fixing the first substrate, and more positioning devices are not required, and the machine table can be saved for other processes.
It should be noted that, the limitations of each step in the present disclosure are not considered to limit the order of the steps without affecting the implementation of the specific embodiments, and the steps written in the foregoing may be executed first, or executed later, or even executed simultaneously, and as long as the present disclosure can be implemented, all the steps should be considered as belonging to the protection scope of the present application.
The technical solution of the present application can be widely applied to various display panels, such as TN (Twisted Nematic) display panel, IPS (In-Plane Switching) display panel, VA (Vertical Alignment) display panel, MVA (Multi-Domain Vertical Alignment) display panel, and of course, other types of display panels, such as OLED (Organic Light-Emitting Diode) display panel, and the above solution can be applied thereto.
The foregoing is a more detailed description of the present application in connection with specific alternative embodiments, and the specific implementations of the present application are not to be considered limited to these descriptions. For those skilled in the art to which the present application pertains, several simple deductions or substitutions may be made without departing from the concept of the present application, and all should be considered as belonging to the protection scope of the present application.
Claims (10)
1. A display panel, comprising:
a first substrate;
a second substrate disposed opposite to the first substrate; and
a flexible circuit board;
the surface of the first substrate facing the second substrate is a first surface, and the surface of the first substrate far away from the second substrate is a second surface;
the length of the first substrate exceeds that of the second substrate, the exposed area of the first substrate is an outer pin binding area, one end of the flexible circuit board is bound and connected with the outer pin binding area, and the other end of the flexible circuit board is bent to the second surface of the first substrate;
the display panel further comprises a front decorative plate, and the front decorative plate is adhered to cover the outer pin binding area of the first substrate;
the width of the front decorative plate is 1-2 times of the width of the outer pin binding area; the length of the front decorative plate is 1-1.5 times of the length of the outer pin binding area.
2. A display panel as claimed in claim 1,
the front decorative plate is adhered to and covers the outer pin binding area of the first substrate through curing glue; the curing glue is arranged between the front decorative plate and the first substrate;
the outer pin binding area comprises a pasting area and an overflow glue blocking area which are adjacently arranged, and the curing glue is arranged in the pasting area of the outer pin binding area;
the glue overflow blocking area is arranged outside the pasting area and is adjacent to the edge of the first substrate;
the surface of the overflow glue blocking area is provided with an overflow glue blocking structure, and the contact angle between the surface of the overflow glue blocking structure and the curing glue is more than or equal to 90 degrees.
3. The display panel of claim 2, wherein the outer lead bonding area is rectangular; the flexible circuit board is bound on the long edge of the rectangular outer pin binding area; the two overflow glue blocking areas are respectively arranged at two ends of two short edges of the rectangular outer pin binding area.
4. The display panel of claim 2, wherein the curing glue comprises a hot melt adhesive;
the overflow glue blocking structure is a low surface energy material, and the low surface energy material comprises one or more of resin materials taking fluorine polymer, silicon polymer or copolymers of the fluorine polymer and the silicon polymer as matrixes, or modified carbon nanotube materials formed by adding other elements on the basis of carbon nanotubes.
5. The display panel according to claim 3, wherein the flash barrier structure is directly disposed on a region of the front decorative plate corresponding to the flash barrier region and/or a region of the first substrate corresponding to the flash barrier region.
6. The display panel according to claim 1, wherein four sides of the display panel are a first side, a second side, a third side and a fourth side, respectively, in sequence, wherein the outer lead bonding area is disposed on the fourth side, the first side, the second side and the third side are not provided with a frame, and the front decorative plate is a frame of the fourth side.
7. The display panel according to claim 1, wherein a surface of the second substrate on a side away from the first substrate is further provided with a polarizer, and an outer surface of the front decorative plate and an outer surface of the polarizer are in the same plane.
8. The display panel of claim 1, wherein the front decorative plate is made of a PET material or a metal material, and a surface of the second substrate, which is away from the first substrate, is further provided with a polarizer.
9. A display device, comprising:
an array substrate having a first surface and a second surface;
the color film substrate is arranged opposite to the color film substrate and arranged on one side of the first surface of the array substrate;
the length of the first substrate exceeds that of the second substrate, the exposed area of the first substrate is an outer pin binding area, one end of the flexible circuit board is bound and connected with the outer pin binding area, and the other end of the flexible circuit board is bent to the second surface of the first substrate;
the front decorative plate is arranged in the outer pin binding area of the first substrate;
the front decorative plate is adhered to and covers the outer pin binding area of the first substrate through the curing glue;
the outer pin binding area comprises a pasting area and an overflow glue blocking area which are adjacently arranged, and the curing glue is arranged in the pasting area of the outer pin binding area; the glue overflow blocking area is arranged outside the pasting area and is adjacent to the edge of the first substrate; the surface of the glue overflow blocking area is provided with a glue overflow blocking structure, and the contact angle between the surface of the glue overflow blocking structure and the curing glue is more than or equal to 90 degrees;
the outer pin binding area is rectangular; the flexible circuit board is bound on the long edge of the rectangular outer pin binding area; the two overflow glue blocking areas are respectively arranged at two ends of two short edges of the rectangular outer pin binding area;
the glue overflow blocking structure is directly arranged on the front decorative plate;
the width of the front decorative plate is consistent with that of the outer pin binding area; the length of the front decorative plate is consistent with that of the outer pin binding area, a polaroid is further arranged on one side, away from the first substrate, of the second substrate, and the outer surface of the front decorative plate and the outer surface of the polaroid are located on the same plane;
the four sides of the display panel are respectively a first side, a second side, a third side and a fourth side, wherein the outer pin binding area is arranged on the fourth side, the first side, the second side and the third side are not provided with frames, and the front decorative plate is the frame of the fourth side.
10. A manufacturing method of a display device is characterized by comprising the following steps:
sequentially forming a first substrate and a second substrate, and jointing the first substrate and the second substrate;
binding a flexible circuit board in an outer pin binding area of a first substrate;
coating an overflow blocking structure made of a low surface energy material at a first preset position;
coating curing glue at a second preset position; and
bonding the front decorative plate with the first substrate;
the first preset position is the edge of the corresponding outer pin binding area of the first substrate or the edge of the front decorative plate; the second preset position is a surface of the first substrate, which corresponds to the outer pin binding area or faces the outer pin binding area, of the front decorative plate.
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Application publication date: 20210319 |