CN111191635A - Fingerprint identification module and fingerprint identification display device - Google Patents
Fingerprint identification module and fingerprint identification display device Download PDFInfo
- Publication number
- CN111191635A CN111191635A CN202010095282.3A CN202010095282A CN111191635A CN 111191635 A CN111191635 A CN 111191635A CN 202010095282 A CN202010095282 A CN 202010095282A CN 111191635 A CN111191635 A CN 111191635A
- Authority
- CN
- China
- Prior art keywords
- fingerprint identification
- circuit board
- layer
- identification module
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1324—Sensors therefor by using geometrical optics, e.g. using prisms
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/1341—Sensing with light passing through the finger
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- General Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention provides a fingerprint identification module and a fingerprint identification display device, wherein the fingerprint identification module comprises a circuit board, a fingerprint identification chip and a connecting plate, the fingerprint identification chip is arranged on the circuit board and electrically connected to the circuit board, the connecting plate is arranged at the bottom of the circuit board and electrically connected to the circuit board, and the circuit board is a hard substrate. In the fingerprint identification module and the fingerprint identification display device provided by the invention, the hard substrate is directly adopted by the fingerprint identification module as the circuit board for arranging the fingerprint identification chip, and a reinforcing plate is not required to be arranged, so that the thickness of the whole fingerprint identification module is smaller, meanwhile, the position of a reference surface attached by the fingerprint identification chip is lower, the relative position of the fingerprint identification chip is lower, the arc height of a binding gold wire is also relatively lower, the height of a sealing layer is also lower, and the thickness of the fingerprint identification module can also be reduced; the circuit board and the connecting board can be separated to ensure that the circuit board has small deformation and keeps flat.
Description
Technical Field
The invention relates to the technical field of fingerprint identification, in particular to a fingerprint identification module and a fingerprint identification display device.
Background
Along with the rapid development of the electronic industry, the technology application of fingerprint identification is very extensive, the figure of the fingerprint identification technology can be seen in an access control and attendance system, and more applications of fingerprint identification are provided in the market: such as notebook computers, cell phones, automobiles, bank payments, etc. In fingerprint identification display devices such as cell-phones, with fingerprint identification module and display screen range upon range of design usually, be about to cell-phone spare parts such as fingerprint identification module locate the display screen below, can increase the screen of cell-phone display area like this and account for the ratio, satisfy people's more and more demand.
However, the fingerprint identification module is disposed below the display screen, which inevitably increases the thickness of the mobile phone, and is not favorable for the light and thin requirements of the current electronic devices.
As shown in fig. 1, a fingerprint identification module includes a flexible circuit board 11, a reinforcing plate 12, an optical fingerprint identification chip 13, a support 14, and a sealing layer 15. The optical fingerprint identification chip 13 is disposed on the flexible circuit board 11 and electrically connected to the flexible circuit board 11 through a gold wire 16. The reinforcing plate 12 is provided at the bottom of the flexible wiring board 11 to reinforce the strength of the flexible wiring board 11. The bracket 14 is arranged on the flexible circuit board 11, the optical fingerprint identification chip 13 is arranged in the bracket 14, and the sealing layer 15 is formed in the bracket 14 and wraps the gold wire 16 and the optical fingerprint identification chip 13. The flexible wiring board 11 includes an extension portion 112 extending to the outside of the bracket 14, and the extension portion 112 is provided with an electronic device 18 such as a driver chip and a connector 19. In this fingerprint identification module, locate 11 intensity of the flexible line way board of optical fingerprint identification chip 13 bottom not enough, must set up stiffening plate 12, the thickness that has led to the fingerprint identification module is great, and the reference surface position of optical fingerprint identification chip 13 laminating is higher moreover, make the relative position of optical fingerprint identification chip 13 higher, bind the arc height of gold thread 16 also higher relatively, make the height of sealing layer 15 also higher, the thickness that also will cause the fingerprint identification module is great.
Disclosure of Invention
The invention aims to provide a fingerprint identification module and a fingerprint identification display device which are thin and save space.
The invention provides a fingerprint identification module, which comprises a circuit board, a fingerprint identification chip and a connecting plate, wherein the fingerprint identification chip is arranged on the circuit board and is electrically connected with the circuit board, the connecting plate is arranged at the bottom of the circuit board and is electrically connected with the circuit board, and the circuit board is a hard substrate.
In one embodiment, the connecting board is a flexible circuit board, and one end of the connecting board is connected to the edge of the circuit board.
In one embodiment, a first connecting disc is arranged on the circuit board, a second connecting disc is arranged on the connecting plate, and the first connecting disc and the second connecting disc are electrically conducted through pressing.
In one of them embodiment, the fingerprint identification chip passes through wire electric connection in the circuit board, the fingerprint identification module still includes the sealing layer, the sealing layer parcel the wire with the edge of fingerprint identification chip, the sealing layer includes the opening so that the identification area of fingerprint identification chip is followed the opening part exposes, the sealing layer still covers on the circuit board.
In one embodiment, the sealing layer extends from the edge of the fingerprint identification chip to the outer edge of the circuit board to serve as a support.
In one embodiment, the sealing layer is used for attaching the display screen.
In one embodiment, the fingerprint identification module further comprises an electronic device and a connector, and the electronic device and the connector are both arranged on the connecting plate.
The invention also provides a fingerprint identification display device, which comprises a display screen and the fingerprint identification module, wherein the display screen is arranged on one side of the circuit board far away from the fingerprint identification module and far away from the fingerprint identification module.
In one embodiment, the display screen comprises a display layer, a touch layer, a protective layer and a cover plate, wherein the touch layer, the display layer and the cover plate are sequentially stacked, the protective layer is arranged on one side, away from the display layer, of the touch layer, the display layer comprises a plurality of pixel units and a plurality of pixel gaps, and the pixel gaps are arranged between every two adjacent pixel units.
In one embodiment, an adhesion layer is further disposed between the display screen and the fingerprint identification module, and the adhesion layer is a light shielding layer.
In the fingerprint identification module and the fingerprint identification display device provided by the invention, the hard substrate is directly adopted by the fingerprint identification module as the circuit board for arranging the fingerprint identification chip, and a reinforcing plate is not required to be arranged, so that the thickness of the whole fingerprint identification module is smaller, meanwhile, the position of a reference surface attached by the fingerprint identification chip is lower, the relative position of the fingerprint identification chip is lower, the arc height of a binding gold wire is also relatively lower, the height of a sealing layer is also lower, and the thickness of the fingerprint identification module can also be reduced; the circuit board and the connecting board can be separated to ensure that the circuit board has small deformation and keeps flat.
Drawings
Fig. 1 is a schematic cross-sectional view of a fingerprint recognition module.
Fig. 2 is a schematic cross-sectional view of a fingerprint identification module according to an embodiment of the invention.
Fig. 3 is a schematic top view of the fingerprint recognition module shown in fig. 2.
Fig. 4 is a partial schematic bottom view of the fingerprint recognition module shown in fig. 2.
Fig. 5 is a schematic structural diagram illustrating a fingerprint identification display device according to an embodiment of the invention.
Detailed Description
The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
Referring to fig. 2 to 4, the fingerprint identification module according to an embodiment of the present invention includes a circuit board 31, a fingerprint identification chip 33, and a connection board 35. The fingerprint identification chip 33 is disposed on the circuit board 31, and the fingerprint identification chip 33 is electrically connected to the circuit board 31. The connection board 35 is disposed at the bottom of the circuit board 33, and the connection board 35 is electrically connected to the circuit board 33. The wiring board 31 is a hard substrate.
In this embodiment, the fingerprint identification chip 33 may be attached to the circuit board 31 by glue. In particular, the fingerprint recognition chip 33 may be an optical fingerprint recognition chip. Fingerprint identification chip 33 is used for gathering light, and detect the fingerprint pattern when the display screen is touched according to the intensity of gathering light, specifically, when the finger is pressed down the display screen surface, the light that display panel sent upwards launches to the finger, incident light hits the epidermis layer after-reflection of finger to fingerprint identification chip 33, because the existence of the line on the finger, the light of different positions reflection is strong and weak different, can reflect the fingerprint pattern on the finger according to the light of different strong and weak, realize the fingerprint identification function. It is understood that the fingerprint identification chip 33 can also be a capacitive fingerprint identification chip or an infrared fingerprint identification chip, which is not limited herein.
In this embodiment, the connection board 35 may be a flexible circuit board. The wiring board 31 is connected to an external circuit through a connection board 35. Specifically, one end of the connection plate 35 is connected to an edge of the wiring board 31.
Specifically, the circuit board 31 is provided with a first connection pad, the connection board 35 is provided with a second connection pad, and the first connection pad and the second connection pad are electrically connected through vertical pressing. More specifically, the first connection pad and the second connection pad can be conducted through pressing of the pressing glue. The circuit board 31 and the connecting plate 35 are connected in a pressing mode, so that warping deformation of the circuit board 31 or the connecting plate 35 caused by high temperature adhesion can be avoided.
In this embodiment, the fingerprint identification chip 33 can be electrically connected to the circuit board 31 through a wire 37. The wires 37 may be formed by bonding gold wires. Specifically, the fingerprint identification chip 33 is provided with a first bonding pad 332, the circuit board 31 is provided with a second bonding pad 312, and two ends of the wire 37 are respectively soldered to the first bonding pad 332 and the second bonding pad 312. The fingerprint recognition chip 33 includes a recognition area 334 disposed on a side facing away from the wiring board 31.
The side of the fingerprint identification chip 33 away from the circuit board 31 is further provided with a micro-focusing lens group 336 for converging light.
In this embodiment, the fingerprint identification module further includes a sealing layer 39, the sealing layer 39 wraps the edges of the wire 37 and the fingerprint identification chip 33, the sealing layer 39 includes an opening 392 such that the identification area 334 of the fingerprint identification chip 33 is exposed from the opening 392, and the sealing layer 39 further covers the circuit board 31. The sealing layer 39 extends from the edge of the fingerprint recognition chip 33 to the outer edge of the circuit board 31 and serves as a support. Specifically, the sealing layer 39 may be made of an EMC (Epoxy Molding Compound) material. Still regard as the support of fingerprint identification module simultaneously through sealing layer 39 for the thickness of sealing layer 39 can set up as required, reduces the thickness of whole fingerprint identification module; in addition, the bracket and the sealant have no material fault and section difference, the joint surface with the display screen is flat, and the mechanical reliability is better; simultaneously, it is more simple to also make whole fingerprint identification module structure.
In this embodiment, the fingerprint identification module further includes an electronic device 41 such as a driving chip and a connector 43, and the electronic device 41 and the connector 43 are both disposed on the connecting plate 35. The wiring board 31 can be electrically connected to an external circuit through the connector 43. Generally, the electronic device 41 and the connector 43 are attached to the connection board 35 by a Surface Mount Technology (SMT) process, and a high temperature is required to separate the circuit board 31 and the connection board 35 into two parts, so that the fingerprint identification chip 33 can be packaged first, and then the connection board 35 and the circuit board 31 are connected, so that the fingerprint identification chip 33 does not need to be manufactured at a high temperature before being packaged, and the electronic device and the connector are small in deformation and easy to level.
In the fingerprint identification module, the hard substrate is directly used as the circuit board for arranging the fingerprint identification chip, and a reinforcing plate is not required to be arranged, so that the thickness of the whole fingerprint identification module is smaller, meanwhile, the position of a reference surface attached to the fingerprint identification chip is lower, the relative position of the fingerprint identification chip is lower, the arc height of a binding gold wire is also relatively lower, the height of the sealing layer 39 is also lower, and the thickness of the fingerprint identification module can also be reduced; the circuit board and the connecting board can be separated to ensure that the circuit board has small deformation and keeps flat.
The present invention further provides a fingerprint identification display device, as shown in fig. 5, the fingerprint identification display device of an embodiment includes a display screen 50 and the fingerprint identification module, the display screen 50 is disposed on one side of the fingerprint identification module, which is far away from the circuit board 31 of the fingerprint identification module. The display screen 50 includes a display layer 52, a touch layer 54, a protective layer 56 and a cover plate 58, wherein the touch layer 54, the display layer 52 and the cover plate 58 are sequentially stacked, and the protective layer 56 is disposed on a side of the touch layer 54 away from the display layer 52.
In this embodiment, the display layer 52 may be an OLED (light emitting diode) display panel or an LCD (liquid crystal display panel). Specifically, the display layer 52 includes a plurality of pixel units 522 and a plurality of pixel gaps 524, and the pixel gaps 524 are disposed between adjacent pixel units 522. In the fingerprint identification process, when a finger presses the display screen 50, the OLED emits light upwards, the light hits the epidermal layer of the finger to generate reflected light, and the reflected light passes through the cover plate 58 and the pixel gap 524 to generate emergent light to reach the optical fingerprint module.
In the present embodiment, the touch layer 54 is used to implement a touch function, and it is understood that the touch layer 54 may be omitted, and the display screen 50 is a non-touch screen.
In this embodiment, the protective layer 56 is provided with a light-transmitting opening corresponding to the fingerprint identification chip 33 to allow light to pass through to the fingerprint identification chip 33.
In this embodiment, the cover plate 58 may be a glass plate or a plastic plate, and serves to protect the display screen 50.
In this embodiment, the display screen 50 is attached to the sealing layer 39 of the fingerprint identification module. Specifically, the protective layer 56 of the display screen 50 is attached to the sealing layer 39. An adhesive layer 70 may also be disposed between the display screen 50 and the fingerprint identification module. Specifically, the adhesion layer 70 may be a light shielding layer. The adhesive layer 70 may be made of black light-shielding adhesive foam ring.
When setting up fingerprint identification display device on electronic equipment, can set up fluting 902 on electronic equipment's casing 90, locate the fingerprint identification module in fluting 902 to fix the fingerprint identification module on casing 90.
In the fingerprint identification display device, the hard substrate is directly adopted by the fingerprint identification module as the circuit board for arranging the fingerprint identification chip, and a reinforcing plate is not required to be arranged, so that the thickness of the whole fingerprint identification module is smaller, meanwhile, the position of a reference surface attached by the fingerprint identification chip is lower, so that the relative position of the fingerprint identification chip is lower, the arc height of a binding gold wire is also relatively lower, the height of the sealing layer 39 is also lower, and the thickness of the fingerprint identification module can also be reduced; the circuit board and the connecting board can be separated to ensure that the circuit board has small deformation and keeps flat.
In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity. It will be understood that when an element such as a layer, region or substrate is referred to as being "formed on," "disposed on" or "located on" another element, it can be directly on the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly formed on" or "directly disposed on" another element, there are no intervening elements present.
In this document, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms can be understood in a specific case to those of ordinary skill in the art.
In this document, the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", "vertical", "horizontal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for the purpose of clarity and convenience of description of the technical solutions, and thus, should not be construed as limiting the present invention.
As used herein, the ordinal adjectives "first", "second", etc., used to describe an element are merely to distinguish between similar elements and do not imply that the elements so described must be in a given sequence, either temporally, spatially, in ranking, or in any other manner.
As used herein, the meaning of "a plurality" or "a plurality" is two or more unless otherwise specified.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
As used herein, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, including not only those elements listed, but also other elements not expressly listed.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (10)
1. The utility model provides a fingerprint identification module, its characterized in that, includes circuit board (31), fingerprint identification chip (33) and connecting plate (35), fingerprint identification chip (33) are located on circuit board (31), just fingerprint identification chip (33) electric connection in circuit board (31), connecting plate (35) are located the bottom of circuit board (33), just connecting plate (35) electric connection in circuit board (33), circuit board (31) are the rigid substrate.
2. The fingerprint identification module of claim 1, wherein the connecting board (35) is a flexible circuit board, and one end of the connecting board (35) is connected to an edge of the circuit board (31).
3. The fingerprint recognition module of claim 1, wherein the circuit board (31) is provided with a first connecting pad, the connecting board (35) is provided with a second connecting pad, and the first connecting pad and the second connecting pad are electrically connected through pressing.
4. The fingerprint identification module of claim 1, wherein the fingerprint identification chip (33) is electrically connected to the circuit board (31) through a wire (37), the fingerprint identification module further comprises a sealing layer (39), the sealing layer (39) wraps the wire (37) and the edge of the fingerprint identification chip (33), the sealing layer (39) comprises an opening (392) so that the identification area (334) of the fingerprint identification chip (33) is exposed from the opening (392), and the sealing layer (39) further covers the circuit board (31).
5. The fingerprint recognition module of claim 4, wherein the sealing layer (39) extends from the edge of the fingerprint recognition chip (33) to the outer edge of the circuit board (31) to serve as a support.
6. Fingerprint recognition module according to claim 5, wherein the sealing layer (39) is adapted to be attached to a display screen (50).
7. The fingerprint identification module of claim 1, further comprising electronics (41) and a connector (43), the electronics (41) and the connector (43) each being disposed on the connection plate (35).
8. A fingerprint identification display device, characterized in that, includes display screen (50) and the fingerprint identification module of any one of claims 1-7, display screen (50) locate keep away from the fingerprint identification module the side of circuit board (31) of fingerprint identification module.
9. The fingerprint identification display device according to claim 8, wherein the display screen (50) comprises a display layer (52), a touch layer (54), a protection layer (56) and a cover plate (58), the touch layer (54), the display layer (52) and the cover plate (58) are sequentially stacked, the protection layer (56) is disposed on a side of the touch layer (54) far away from the display layer (52), the display layer (52) comprises a plurality of pixel units (522) and a plurality of pixel gaps (524), and the pixel gaps (524) are disposed between adjacent pixel units (522).
10. The fingerprint identification display device of claim 8, wherein a bonding layer (70) is further disposed between the display screen (50) and the fingerprint identification module, and the bonding layer (70) is a light shielding layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010095282.3A CN111191635A (en) | 2020-02-14 | 2020-02-14 | Fingerprint identification module and fingerprint identification display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010095282.3A CN111191635A (en) | 2020-02-14 | 2020-02-14 | Fingerprint identification module and fingerprint identification display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111191635A true CN111191635A (en) | 2020-05-22 |
Family
ID=70708329
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010095282.3A Pending CN111191635A (en) | 2020-02-14 | 2020-02-14 | Fingerprint identification module and fingerprint identification display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111191635A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114002935A (en) * | 2020-07-13 | 2022-02-01 | Oppo广东移动通信有限公司 | Wearable device |
| CN114942666A (en) * | 2021-02-10 | 2022-08-26 | Oppo广东移动通信有限公司 | Wearable device |
-
2020
- 2020-02-14 CN CN202010095282.3A patent/CN111191635A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114002935A (en) * | 2020-07-13 | 2022-02-01 | Oppo广东移动通信有限公司 | Wearable device |
| CN114942666A (en) * | 2021-02-10 | 2022-08-26 | Oppo广东移动通信有限公司 | Wearable device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108563363B (en) | Touch display module, display device and transparent optical adhesive layer structure | |
| US10565425B2 (en) | Under-screen biometric identification apparatus, biometric identification component and terminal device | |
| US10268241B2 (en) | Touch screen panel and mobile terminal including the same | |
| KR102362598B1 (en) | Printed circuit board and display device comprising the same | |
| CN113065472B (en) | Fingerprint identification device and electronic equipment | |
| US11320925B2 (en) | Force sensor and display device including the same | |
| CN110515499B (en) | Touch panel and touch display device | |
| US10175813B2 (en) | Touch panel board with guard portion and flexible wiring board connecting guard portion to ground wire | |
| US20140049892A1 (en) | Touch panel and touch display panel | |
| KR20180033380A (en) | Display device and manufacturing method thereof | |
| CN110837312A (en) | Display device | |
| CN113555412A (en) | Display module and display device | |
| US20150085204A1 (en) | Touch panel | |
| US20210326557A1 (en) | Electronic device having a fingerprint sensing function | |
| CN102955281A (en) | Display device | |
| CN111191635A (en) | Fingerprint identification module and fingerprint identification display device | |
| CN114648917A (en) | Electronic device | |
| US20070139583A1 (en) | Display module | |
| CN114144038A (en) | Display module and display device | |
| CN111836457A (en) | Circuit board, display screen and electronic equipment | |
| CN211787126U (en) | Fingerprint identification module and fingerprint identification display device | |
| US11765830B2 (en) | Flexible printed circuit and display device | |
| CN111240513B (en) | Protection structure for reverse folding part of display | |
| CN110781767A (en) | Fingerprint identification module and electronic equipment | |
| CN210488564U (en) | Fingerprint identification module and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20201207 Address after: 3 / F, factory building No.1, No.3, Taihong Road, high tech Zone, Kunshan City, Suzhou City, Jiangsu Province Applicant after: Kunshanqiu titanium biometric technology Co., Ltd Address before: 215300 No. 3 Rainbow Road, Kunshan hi tech Industrial Development Zone, Jiangsu, Suzhou Applicant before: KUNSHAN Q TECHNOLOGY Co.,Ltd. |
|
| TA01 | Transfer of patent application right |