CN210488564U - Fingerprint identification module and electronic equipment - Google Patents

Abstract

The utility model discloses a fingerprint identification module and electronic equipment, this fingerprint identification module include base plate, circuit board, optics fingerprint chip and cover plate, and on circuit board and optics fingerprint chip all located the base plate, seted up the fluting on the circuit board, optics fingerprint chip held in the fluting, optics fingerprint chip electric connection in circuit board, cover plate fix the one side of keeping away from the base plate at the circuit board, and cover plate establishes around optics fingerprint chip, and cover plate is black cover plate. In the fingerprint identification module and the electronic equipment provided by the utility model, because the covering plate is fixedly connected on the circuit board, a plastic support is not required to be formed by injection molding and other modes, so that the covering plate has smaller thickness; in addition, the black shielding plate can absorb stray light around the optical fingerprint chip to prevent diffuse reflection, so that the identification precision is improved; simultaneously, because optics fingerprint chip is located the fluting of circuit board, is less than the top surface of circuit board, can reduce the thickness of fingerprint identification module.

Description

Fingerprint identification module and electronic equipment

Technical Field

The utility model relates to an electronic equipment technical field especially relates to a fingerprint identification module and electronic equipment.

Background

Along with the rapid development of the electronic industry, the technology application of fingerprint identification is very extensive, the figure of the fingerprint identification technology can be seen in an access control and attendance system, and more applications of fingerprint identification are provided in the market: such as notebook computers, cell phones, automobiles, bank payments, etc. In electronic products such as cell-phone, generally with fingerprint identification module and the range upon range of design of display screen, can increase the screen in cell-phone display area like this and account for the ratio, satisfy people demand more and more, fingerprint identification technique is fingerprint identification under the screen by traditional capacitanc fingerprint identification change.

Fingerprint identification adopts the optics fingerprint scheme more under the present screen, is about to the display module back of optics fingerprint module subsides at the complete machine. But because optics fingerprint module thickness is than thicker, the whole thickness space that consequently occupies is great, is unfavorable for electronic equipment's miniaturized development.

As shown in fig. 1, a fingerprint identification module includes a supporting board 101, a circuit board 102, an optical fingerprint chip 103 and a frame-shaped support 104, wherein the double-sided circuit board 102 is disposed on the supporting board 101, the optical fingerprint chip 103 is disposed on the circuit board 102, and the frame-shaped support 104 is an independent structure and is fixed on the circuit board 102 by an adhesive. The frame-shaped support 104 is made of plastic material and has a large thickness, resulting in a large thickness of the fingerprint identification module.

The foregoing description is provided for general background information and is not admitted to be prior art.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a less fingerprint identification module of thickness and electronic equipment.

The utility model provides a fingerprint identification module, including base plate, circuit board, optics fingerprint chip and apron, the circuit board with optics fingerprint chip all locates on the base plate, the fluting has been seted up on the circuit board, optics fingerprint chip hold in the fluting, optics fingerprint chip electric connection in the circuit board, the apron is fixed the circuit board is kept away from one side of base plate, just the apron centers on optics fingerprint chip and establishing, the apron is black apron.

Further, the substrate is a steel plate, and the circuit board is a single-sided board.

Furthermore, the substrate is a single-sided hard board, and the circuit board is a single-sided board.

Further, a second prepreg is arranged between the substrate and the circuit board, and the circuit board is fixed on the substrate through the second prepreg.

Further, the cover plate is a steel plate, and the surface of the steel plate is subjected to black treatment; alternatively, the cover sheet includes a first semi-cured sheet and a black cover film bonded to the first semi-cured sheet by an adhesive.

Further, the circuit board includes pad region and peripheral region, the pad region with the fluting is adjacent, the pad region is equipped with the pad, optics fingerprint chip passes through gold thread electric connection in the pad.

Further, the fingerprint identification module still includes sealed glue, sealed glue will the gold thread parcel to cover on the pad region with the edge of optics fingerprint chip, the cover plate with sealed glue parallel and level.

The utility model also discloses an electronic equipment, including touch-control display panel, center and above-mentioned fingerprint identification module, the fingerprint identification module is located one side of touch-control display panel, just the base plate is located and keeps away from one side of touch-control display panel, fingerprint identification module part hold in the holding hole that the center was seted up.

Further, electronic equipment still includes that black stops the piece, stop the piece and surround the fingerprint identification module the photosensitive area's of optics fingerprint chip outside and establish to at least part is located the top of fingerprint identification module.

Furthermore, the bottom of the middle frame is also provided with a positioning column, and the substrate is provided with a positioning hole matched with the positioning column.

In the fingerprint identification module and the electronic equipment provided by the utility model, because the covering plate is fixedly connected on the circuit board, a plastic support is not required to be formed by injection molding and other modes, so that the covering plate has smaller thickness; in addition, the black shielding plate can absorb stray light around the optical fingerprint chip to prevent diffuse reflection, so that the identification precision is improved; meanwhile, because the optical fingerprint chip is positioned in the open groove of the circuit board and is lower than the top surface of the circuit board, the highest point of the gold thread can be reduced, so that the position of the sealant is lower, and the thickness of the fingerprint identification module is reduced.

Drawings

Fig. 1 is a schematic structural diagram of a fingerprint identification module.

Fig. 2 is a schematic cross-sectional view of the fingerprint identification module according to the first embodiment of the present invention.

Fig. 3 is a schematic top view of a circuit board of the fingerprint identification module shown in fig. 2.

Fig. 4 is a schematic cross-sectional view of a fingerprint identification module according to a second embodiment of the present invention.

Fig. 5 is a schematic cross-sectional view of a fingerprint identification module according to a third embodiment of the present invention.

Fig. 6 is a schematic cross-sectional view of a fingerprint identification module according to a fourth embodiment of the present invention.

Fig. 7 is a schematic structural diagram of an electronic device according to a fifth embodiment of the present invention.

Detailed Description

The following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.

First embodiment

Referring to fig. 2 and 3, the fingerprint identification module according to the first embodiment of the present invention includes a substrate 11, a circuit board 12, an optical fingerprint chip 14, and a cover plate 15. The substrate 11 is a hard plate, the circuit board 12 and the optical fingerprint chip 14 are both disposed on the substrate 11, the circuit board 12 is provided with a slot 122, the optical fingerprint chip 14 is accommodated in the slot 122, and the optical fingerprint chip 14 is electrically connected to the circuit board 12. The cover plate 15 is fixed on the side of the circuit board 12 away from the substrate 11, and the cover plate 15 is disposed around the optical fingerprint chip 14, and the cover plate 15 is a black cover plate.

In the present embodiment, the substrate 11 is a steel plate, for example, a reinforced steel plate. More specifically, the base plate 11 is a stainless steel reinforcing plate. The steel plate is matched with the circuit board, so that the strength of the circuit board can be improved, and the product is convenient to assemble. It is understood that the substrate 11 may be other hard and hard substrates.

In this embodiment, the circuit board 12 is a single-sided board, such as a single-sided non-adhesive substrate. Specifically, the side of the circuit board 12 away from the substrate 11 is covered with an ink layer for circuit isolation, and the ink layer may be black ink.

In this embodiment, the circuit board 12 is fixed on the substrate 11 by the first adhesive 16. Specifically, the first adhesive 16 may be a thermosetting adhesive.

In this embodiment, as shown in fig. 3, the circuit board 12 includes a pad region 124 and a peripheral region 126, the pad region 124 is adjacent to the slot 122, and the pad region 124 is provided with a pad 125. Specifically, in the present embodiment, the circuit board 12 is provided with the pad area 124 only around a partial area of the slot 122, and the peripheral area 126 is provided around the pad area 124 and the slot 122. Like this, only partial region and the 14 electric connection of optics fingerprint chip around circuit board 12 can reduce the width and the length of fingerprint identification module, realizes the miniaturization of fingerprint identification module. The ink layer is disposed in the peripheral region 126.

In this embodiment, the micro lens 142 is disposed on a side of the optical fingerprint chip 14 away from the substrate 11 to converge light, so that more light is sensed by the optical fingerprint chip 14. Specifically, the micro-lens 142 is disposed corresponding to the photosensitive area of the optical fingerprint chip 14.

The optical fingerprint chip 14 is electrically connected to the circuit board 12 through a gold wire 17. Specifically, one end of the gold wire 17 is connected to the optical fingerprint chip 14, and the other end is connected to the pad 125 of the pad area 124 of the circuit board 12.

The fingerprint identification module further comprises a sealant 18, wherein the gold wire 17 is wrapped by the sealant 18 and covers the pad area 124 and the edge of the optical fingerprint chip 14. The sealant 18 can protect the gold wire 17 and prevent the gold wire 17 from being damaged or corroded to be invalid. Specifically, the cover plate 15 is flush with the sealant 18.

In this embodiment, the covering plate 15 is a steel plate, and the surface of the steel plate is treated with black color to form a black covering plate. Specifically, the cover plate 15 may be a stainless steel plate. It is understood that the covering plate 15 may be made of other hard and hard plates.

The cover plate 15 is fixed to the circuit board 12 by a second adhesive 19. Specifically, the second adhesive 19 may be a thermosetting adhesive. The cover plate 15 is fixed on the circuit board 12 through adhesive, and a plastic support is not required to be formed through injection molding and other modes, so that the cover plate 15 has smaller thickness.

In the fingerprint identification module, because the covering plate 15 is fixedly connected to the circuit board 12, a plastic support does not need to be formed in the modes of injection molding and the like, and the covering plate 15 can have smaller thickness; in addition, the black shielding plate 15 can absorb stray light around the optical fingerprint chip 14 to prevent diffuse reflection, so that the identification precision is improved; meanwhile, because the optical fingerprint chip 14 is located in the slot 122 of the circuit board 12 and is lower than the top surface of the circuit board 12, the highest point of the gold thread 17 can be lowered, so that the position of the sealant 18 is lower, and the thickness of the fingerprint identification module is reduced.

Second embodiment

The utility model discloses the fingerprint identification module of second embodiment is basically the same with the structure of the fingerprint identification module of first embodiment, and the difference lies in, in the second embodiment, as shown in FIG. 4, cover 15 includes first semi-solid piece 152 and black cover membrane 154, and black cover membrane 154 passes through the adhesive bonding on first semi-solid piece 152 to form black cover 15. The first semi-cured sheet 152 has an adhesive property that activates curing when heated to adhere the cover sheet 15 to the wiring board 12.

In this embodiment, the black covering film 154 is matte black, because stray light in the fingerprint identification module can be better eliminated.

Other structures of this embodiment are the same as those of the first embodiment, and are not described herein again.

Third embodiment

The utility model discloses the fingerprint identification module of third embodiment is the same basically with the structure of the fingerprint identification module of first embodiment, and the difference lies in, in the third embodiment, as shown in fig. 5, base plate 11 is the single face hardboard. Because the substrate 11 is a single-sided hard board, and after the substrate is combined with the circuit board 12 made of a single-sided board, double-sided wiring can be realized, so that through holes can be formed in the upper and lower parts of the substrate 11 and the circuit board 12 to realize double-sided wiring, the length and width direction sizes of the fingerprint identification module can be reduced, and the fingerprint identification module is more miniaturized.

In addition, the fingerprint identification module does not include the first adhesive 16, and a second prepreg 21 is disposed between the substrate 11 and the circuit board 12, and the circuit board 12 is fixed on the substrate 11 through the second prepreg 21. The second prepreg 21 has viscosity and is activated and cured by heating to fix the wiring board 12 to the substrate 11.

Other structures of this embodiment are the same as those of the first embodiment, and are not described herein again.

Fourth embodiment

The utility model discloses the fingerprint identification module of fourth embodiment is basically the same with the fingerprint identification module of third embodiment's structure, and the difference lies in, in the fourth embodiment, as shown in FIG. 6, cover 15 includes first semi-solid piece 152 and black cover membrane 154, and black cover membrane 154 passes through the adhesive bonding on first semi-solid piece 152 to form black cover 15. The first semi-cured sheet 152 has an adhesive property that activates curing when heated to adhere the cover sheet 15 to the wiring board 12.

In this embodiment, the black covering film 154 is matte black, because stray light in the fingerprint identification module can be better eliminated.

Other structures of this embodiment are the same as those of the third embodiment, and are not described herein again.

Fifth embodiment

A fifth embodiment of the present invention provides an electronic device, which includes the fingerprint recognition module of any one of the above embodiments.

In this embodiment, as shown in fig. 7, the electronic device includes the touch display panel 30, the middle frame 50 and any one of the fingerprint identification modules, the fingerprint identification module is disposed on one side of the touch display panel 30, the substrate 11 is disposed on one side away from the touch display panel 30, and the fingerprint identification module is partially accommodated in the accommodating hole formed in the middle frame 50. The touch display panel 30 includes a display layer 31, a touch layer 33, a cover plate 35, and a protection layer 37, wherein the cover plate 35 and the touch layer 33 are respectively disposed on two opposite sides of the display layer 31, and the cover plate 35 is disposed on a side of the display layer 31 away from the fingerprint identification module. The protective layer 37 is located between the touch layer 33 and the fingerprint identification module, and the protective layer 37 opens up an opening corresponding to the photosensitive area of the optical fingerprint chip 14 of the fingerprint identification module to allow light to pass through. Specifically, the display layer 31 includes a plurality of pixel units arranged at intervals and gaps 312 between adjacent pixel units, the gaps 312 allowing light to pass therethrough.

In the embodiment, the Display layer 31 of the touch Display panel 30 is an OLED (Organic Light-emitting diode) Display, and certainly, the Display layer 31 may also be other types of Display screens such as an LCD (Liquid Crystal Display).

In this embodiment, the electronic device further includes a black blocking member 70, the blocking member 70 is disposed around the outer side of the photosensitive area of the optical fingerprint chip 14 of the fingerprint identification module, and is at least partially located above the fingerprint identification module, that is, the blocking member 70 is at least partially located between the fingerprint identification module and the touch display panel 30. Through setting up and stopping piece 70, firstly, can play the effect of buffering when apron 35 is pressed, and secondly, multiplicable light path formation of image distance guarantees the formation of image effect, and thirdly, can the separation come from the formation of image light beyond the light path above touch-control display panel 30, guarantees the accuracy of formation of image. Specifically, the barrier 70 may be a black bubble ring.

In this embodiment, the bottom of the middle frame 50 is further provided with a positioning column 502, the substrate 11 is provided with a positioning hole matched with the positioning column 502, and the fingerprint identification module can be conveniently positioned during assembly through matching of the positioning column 502 and the positioning hole.

When the finger presses the display screen surface, the light that touch-control display panel 30 sent upwards launches the finger, and incident light hits the epidermal layer of finger and reflects fingerprint identification chip 14 on, because the existence of the line on the finger, the light intensity of different position reflection is different, can reflect the fingerprint pattern on the finger according to the light of different intensities, realizes the fingerprint identification function. It is understood that the fingerprint identification chip 14 can also be a capacitive fingerprint identification chip or an infrared fingerprint identification chip, which is not limited herein.

In the electronic equipment, because the cover plate 15 of the fingerprint identification module is fixedly connected to the circuit board 12, a plastic support does not need to be formed in the modes of injection molding and the like, and the cover plate 15 can have smaller thickness; in addition, the black shielding plate 15 can absorb stray light around the optical fingerprint chip 14 to prevent diffuse reflection, so that the identification precision is improved; meanwhile, because the optical fingerprint chip 14 is located in the slot 122 of the circuit board 12 and is lower than the top surface of the circuit board 12, the highest point of the gold thread 17 can be lowered, so that the position of the sealant 18 is lower, and the thickness of the fingerprint identification module is reduced.

In this document, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms can be understood in a specific case to those of ordinary skill in the art.

In this document, the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", "vertical", "horizontal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for the sake of clarity and convenience of description of the technical solutions, and thus, should not be construed as limiting the present invention.

As used herein, the ordinal adjectives "first", "second", etc., used to describe an element are merely to distinguish between similar elements and do not imply that the elements so described must be in a given sequence, either temporally, spatially, in ranking, or in any other manner.

As used herein, the meaning of "a plurality" or "a plurality" is two or more unless otherwise specified.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

As used herein, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, including not only those elements listed, but also other elements not expressly listed.

The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (10)

1. The utility model provides a fingerprint identification module, its characterized in that, includes base plate (11), circuit board (12), optics fingerprint chip (14) and cover plate (15), circuit board (12) with optics fingerprint chip (14) are all located on base plate (11), fluting (122) have been seted up on circuit board (12), optics fingerprint chip (14) hold in fluting (122), optics fingerprint chip (14) electric connection in circuit board (12), cover plate (15) are fixed circuit board (12) are kept away from one side of base plate (11), just cover plate (15) center on optics fingerprint chip (14) and establish, cover plate (15) are black cover plate.

2. The fingerprint identification module of claim 1, wherein the substrate (11) is a steel plate and the circuit board (12) is a single-sided board.

3. The fingerprint identification module of claim 1, wherein the substrate (11) is a single-sided hard board and the circuit board (12) is a single-sided board.

4. The fingerprint identification module of claim 3, wherein a second prepreg (21) is arranged between the substrate (11) and the circuit board (12), and the circuit board (12) is fixed on the substrate (11) through the second prepreg (21).

5. The fingerprint identification module according to any one of claims 1-3, wherein the cover plate (15) is a steel plate, and the surface of the steel plate is treated with black; alternatively, the cover sheet (15) includes a first semi-cured sheet (152) and a black cover film (154), and the black cover film (154) is bonded to the first semi-cured sheet (152) by an adhesive.

6. The fingerprint identification module of claim 1, wherein the circuit board (12) includes a pad area (124) and a peripheral area (126), the pad area (124) is adjacent to the slot (122), the pad area (124) is provided with the pad (125), and the optical fingerprint chip (14) is electrically connected to the pad (125) by a gold wire (17).

7. The fingerprint recognition module of claim 6 further comprising a sealant (18), wherein the sealant (18) wraps the gold wire (17) and covers the pad region (124) and the edge of the optical fingerprint chip (14), and the cover plate (15) is flush with the sealant (18).

8. An electronic device, comprising a touch display panel (30), a middle frame (50) and the fingerprint identification module set according to any one of claims 1 to 7, wherein the fingerprint identification module set is disposed on one side of the touch display panel (30), the substrate (11) is disposed on one side far away from the touch display panel (30), and the fingerprint identification module set is partially accommodated in an accommodating hole formed in the middle frame (50).

9. The electronic device of claim 8, further comprising a black barrier (70), wherein the barrier (70) is disposed around an outside of a photosensitive area of the optical fingerprint chip (14) of the fingerprint identification module and at least partially over the fingerprint identification module.

10. The electronic device according to claim 8, wherein a positioning post (502) is further disposed at the bottom of the middle frame (50), and a positioning hole matched with the positioning post (502) is disposed on the substrate (11).

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