CN115551181A - Connection structure of flexible circuit board and base plate - Google Patents

Connection structure of flexible circuit board and base plate Download PDF

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Publication number
CN115551181A
CN115551181A CN202211117890.5A CN202211117890A CN115551181A CN 115551181 A CN115551181 A CN 115551181A CN 202211117890 A CN202211117890 A CN 202211117890A CN 115551181 A CN115551181 A CN 115551181A
Authority
CN
China
Prior art keywords
circuit board
flexible circuit
silver
connecting channel
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202211117890.5A
Other languages
Chinese (zh)
Inventor
江树仁
沈奕
吕岳敏
张高民
郑伟鹏
温碧波
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shantou Goworld Display Plant Ii Co ltd
Shantou Goworld Display Co Ltd
Shantou Goworld Display Technology Co Ltd
Original Assignee
Shantou Goworld Display Plant Ii Co ltd
Shantou Goworld Display Co Ltd
Shantou Goworld Display Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shantou Goworld Display Plant Ii Co ltd, Shantou Goworld Display Co Ltd, Shantou Goworld Display Technology Co Ltd filed Critical Shantou Goworld Display Plant Ii Co ltd
Priority to CN202211117890.5A priority Critical patent/CN115551181A/en
Publication of CN115551181A publication Critical patent/CN115551181A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

The invention relates to a connection structure of a flexible circuit board and a substrate, which comprises the substrate and the flexible circuit board, wherein the upper surface of the substrate is provided with a first circuit, and the upper surface of the flexible circuit board is provided with a second circuit; the flexible circuit board is bonded on the first circuit through an adhesive layer; the flexible circuit board is provided with at least one connecting channel which is communicated with the upper surface and the lower surface of the flexible circuit board; a silver connecting piece formed by solidifying silver colloid is arranged in the connecting channel, the upper part of the silver connecting piece extends out of the upper port of the connecting channel and covers the second circuit, and the lower part of the silver connecting piece extends out of the lower port of the connecting channel and covers the first circuit; the setting method of the silver connecting piece comprises the following steps: firstly, dispensing the silver colloid in each connecting channel in a dispensing mode, enabling the silver colloid to overflow the edge part of the upper port of each connecting channel in a natural seepage or extrusion mode, and then solidifying the silver colloid in a hot baking mode to form the silver connecting piece. The connection structure can improve the conductivity and the connection stability between the flexible circuit board and the substrate, and allows the passage of large current.

Description

Connection structure of flexible circuit board and base plate
Technical Field
The invention relates to a connection structure of a circuit board, in particular to a connection structure of a flexible circuit board and a substrate.
Background
Devices such as liquid crystal displays and touch screens require certain circuits to connect first circuits arranged on glass substrates or plastic substrates. At present, the first circuit is generally connected to the outside through the flexible circuit board (i.e. FPC), and the second circuit of the flexible circuit board and the first circuit on the glass substrate or the plastic substrate are generally directly combined with each other through a layer of anisotropic conductive adhesive (i.e. ACF), however, since the current between the first circuit and the second circuit is conducted through the limited metal balls on the anisotropic conductive adhesive, and the contact area of the metal balls is very small, when a large current is conducted, the condition of ACF connection failure due to local heating is easily caused, and the conductivity and the connection stability of the flexible circuit board are affected.
Disclosure of Invention
The invention aims to provide a connection structure of a flexible circuit board and a substrate, which can improve the conductivity and the connection stability between the flexible circuit board and the substrate and allow the large current to pass through. The technical scheme is as follows:
the utility model provides a connection structure of flexible circuit board and base plate, includes base plate and flexible circuit board, is equipped with first circuit on the upper surface of base plate, is equipped with second circuit on the upper surface of flexible circuit board, its characterized in that: the flexible circuit board is bonded on the first circuit through an adhesive layer; the flexible circuit board is provided with at least one connecting channel penetrating through the upper surface and the lower surface of the flexible circuit board, the first circuit is positioned at the lower side of the lower port of each connecting channel, and the second circuit extends to the edge part of the upper port of each connecting channel; a silver connecting piece formed by solidifying silver colloid is arranged in each connecting channel, the upper part of the silver connecting piece extends out of the upper port of the connecting channel and covers the second circuit, and the lower part of the silver connecting piece extends out of the lower port of the connecting channel and covers the first circuit; the setting method of the silver connecting piece comprises the following steps: firstly, dispensing the silver colloid in each connecting channel in a dispensing mode, enabling the silver colloid to overflow the edge part of the upper port of each connecting channel in a natural seepage or extrusion mode, and solidifying the silver colloid in a hot baking mode to form the silver connecting piece.
In general, a glass substrate or a plastic substrate is used as the substrate.
In the connection structure, the lower part and the upper part of the silver connecting piece formed by solidifying the silver colloid respectively cover the first circuit and the second circuit to form surface contact instead of point contact, so that large current is allowed to pass between the first circuit and the second circuit, and the silver colloid can be coated thicker, thereby allowing the large current to pass through the cross section and improving the conductivity between the flexible circuit board and the substrate; and when setting up the silver colloid, earlier through some glue mode with the silver colloid point in each interface channel to through natural flow seepage or extrusion mode make the silver colloid spill over on the border position of interface channel upper port, make the silver colloid solidification form silver connecting piece through the mode of drying by fire again, the operation is got up simply, conveniently, and makes silver connecting piece can form stable electricity with first circuit, second circuit and be connected.
In a preferable scheme, the silver adhesive covers the inner wall of the connecting channel, and the thickness of the silver connecting piece is at least 1mm.
In a further preferred scheme, the connection channel is filled with the silver colloid.
In a preferred embodiment, the number of the connecting channels is multiple and the connecting channels are arranged in parallel. The conductivity between the second circuit and the first circuit is further increased by distributing the respective connection channels and the silver paste in the channels thereof all over the flexible circuit board.
In a preferred embodiment, the connecting channel is an opening or a through hole.
In a further preferred embodiment, the connecting channel is circular in shape. Therefore, the deformation of the flexible circuit board can be minimized, and the connection stability of the flexible circuit board can be ensured.
In a preferred scheme, the adhesive layer is a pressure-sensitive adhesive, a high-temperature curing adhesive or a UV curing adhesive. The thickness of the glue layer is generally 0.1-0.3 mm.
In order to prevent the flexible circuit board from being too thick to affect the bridging, the thickness of the flexible circuit board is preferably 0.2mm to 0.4mm.
In a further preferred embodiment, at the corresponding position of the connecting channel, the inner edge of the adhesive layer is located outside the inner edge of the connecting channel, and an air guide gap is formed between the flexible circuit board and the first circuit at the periphery of the connecting channel. Through setting up the air guide gap, make in silver colloid can permeate the interface channel better and cross the thick liquid opening, avoid forming the bubble in the interface channel and the influence switches on, and when seepage flow or extrusion silver colloid, because the effect in air guide gap, make gapped between silver colloid and the glue film, both do not have the contact, the great influence that generates heat and cause the adhesive force of glue film that the event leads to when switching on the heavy current is less, can not influence the fixed of flexible circuit board, thereby improve the connection steadiness between flexible circuit board and the base plate.
In a preferred scheme, a third circuit is arranged on the lower surface of the flexible circuit board and extends to the edge of the lower port of each connecting channel; the lower part of the silver connecting piece extends out of the lower port of the connecting channel and covers the first circuit and the third circuit; the flexible circuit board is provided with at least one conductive hole, and a conductive layer for conducting the third circuit and the second circuit is arranged in the conductive hole. Usually, the conductive layer is made of copper. Therefore, double-sided connection of the flexible circuit board can be formed, and the conductivity and the reliability are better.
In a preferred scheme, the dispensing process of the silver adhesive comprises the following steps: (1) Pressing the dispensing head onto the edge part of the upper port of the connecting channel, and extruding the silver colloid into the connecting channel to enable the lower part of the silver colloid to form surface contact with the second circuit; (2) And lifting the dispensing head upwards, extruding the silver adhesive to the edge part of the upper port of the connecting channel, and coating the silver adhesive on the edge part of the upper port of the connecting channel.
Compared with the prior art, the invention has the following advantages:
according to the connection structure, the connection channel is arranged on the flexible circuit board, the silver connecting piece formed by solidifying the silver adhesive is arranged in the connection channel, the lower part and the upper part of the silver connecting piece respectively cover the first circuit and the second circuit to form surface contact instead of point contact, so that large current is allowed to pass between the first circuit and the second circuit, and the silver adhesive can be coated to be thicker, so that the large current is allowed to pass through the cross section, and the conductivity and the connection stability between the flexible circuit board and the substrate are improved; and when setting up the silver colloid, earlier through some glue mode with the silver colloid point in each interface channel to through natural flow oozes or the extrusion mode make the silver colloid spill over on the border position of interface channel upper port, make the silver colloid solidification through the mode of heat drying, the operation is got up simply, conveniently, and make the silver colloid can form stable electricity with first circuit, second circuit and be connected.
Drawings
Fig. 1 is a schematic structural diagram of a first preferred embodiment of the present invention.
Fig. 2 isbase:Sub>A sectional viewbase:Sub>A-base:Sub>A of fig. 1.
Fig. 3 is a partial sectional view of a second preferred embodiment of the present invention.
Fig. 4 is a process diagram illustrating a method for disposing a silver connector according to a second preferred embodiment of the present invention.
Detailed Description
Example one
As shown in fig. 1 and fig. 2, the connection structure of the flexible circuit board and the substrate includes a substrate 1 and a flexible circuit board 2, a first circuit 11 is disposed on the upper surface of the substrate 1, a second circuit 21 is disposed on the upper surface of the flexible circuit board 2, and the flexible circuit board 2 is bonded on the first circuit 11 through an adhesive layer 3; the flexible circuit board 2 is provided with at least one connecting channel 22 penetrating through the upper surface and the lower surface of the flexible circuit board 2, the first circuit 11 is positioned at the lower side of the lower port of each connecting channel 22, and the second circuit 21 extends to the edge part of the upper port of each connecting channel 22; each connecting channel 22 is provided with a silver connecting piece 23 formed by solidifying silver adhesive 231, the upper part of the silver connecting piece 23 extends out of the upper port of the connecting channel 22 and covers the second circuit 21, and the lower part of the silver connecting piece 23 extends out of the lower port of the connecting channel 22 and covers the first circuit 11.
In the present embodiment, a glass substrate or a plastic substrate is used as the substrate 1.
In this embodiment, the silver paste 231 fills the connecting channel 22 and covers the inner wall of the connecting channel 22, and the thickness of the silver connecting member 23 is at least 1mm.
In the present embodiment, the number of the connecting passages 22 is plural and arranged in parallel. The conductivity between its second circuit 21 and the first circuit 11 is further increased by distributing the respective connection channels 22 and the silver paste 231 within the channels thereof throughout the flexible circuit board 2.
In the present embodiment, the connecting passage 22 is a circular opening or through hole. This minimizes the deformation of the flexible circuit board 2, which is advantageous for ensuring the stability of the connection of the flexible circuit board 2.
In this embodiment, the adhesive layer 3 is a pressure-sensitive adhesive, a high temperature curing adhesive or a UV curing adhesive, and the thickness of the adhesive layer 3 is 0.1 to 0.3mm.
In order to prevent the flexible circuit board 2 from being too thick to affect the crossover, in the present embodiment, the thickness of the flexible circuit board 2 is 0.2mm to 0.4mm.
In the present embodiment, at the corresponding position of the connecting channel 22, the inner edge of the glue layer 3 is outside the inner edge of the connecting channel 22, and an air guide slit 24 is formed between the flexible circuit board 2 and the first circuit 11 at the periphery of the connecting channel 22. Through setting up air guide gap 24, make in silver colloid 231 can permeate connecting channel 22 better, avoid forming the bubble in connecting channel 22 and the influence switches on, and when seepage flow or extrusion silver colloid 231, because air guide gap 24's effect, make gapped between silver colloid 231 and the glue film 3, both do not have the contact, the great influence that generates heat and cause the adhesive force of glue film 3 that the event leads to when switching on the heavy current is less, can not influence the fixed of flexible circuit board 2, thereby improve the connection steadiness between flexible circuit board 2 and the base plate 1.
Example two
Referring to fig. 3, in the case where the other parts are the same as those of the first embodiment, the difference is: in the present embodiment, the lower surface of the flexible circuit board 2 is provided with a third circuit 25, and the third circuit 25 extends to the lower port edge of each connecting channel 22; the lower part of the silver connecting piece 23 extends out of the lower port of the connecting channel 22 and covers the first circuit 11 and the third circuit 25; at least one conductive hole 26 is formed in the flexible circuit board 2, and a copper conductive layer 261 for connecting the third circuit 25 and the second circuit 21 is formed in the conductive hole 26. This makes it possible to form a double-sided electrical connection of the flexible circuit board 2, and the electrical conductivity and reliability are improved.
Referring to fig. 4, the silver connection member 23 is provided by: (1) Pressing the dispensing head 40 onto the edge of the upper port of the connecting channel 22, and extruding the silver paste 231 into the connecting channel 22 to make the lower part of the silver paste 231 form surface contact with the second circuit 21; (2) Lifting the dispensing head 40 upwards, and extruding the silver adhesive 231 to the edge part of the port on the connecting channel 22 to coat the silver adhesive on the edge part of the port on the connecting channel 22; (3) The silver paste 231 is cured by means of a bake to form the silver connection member 23.
In addition, it should be noted that the names of the parts and the like of the embodiments described in the present specification may be different, and the equivalent or simple change of the structure, the characteristics and the principle described in the present patent idea is included in the protection scope of the present patent. Various modifications, additions and substitutions for the specific embodiments described may be made by those skilled in the art without departing from the scope of the invention as defined in the accompanying claims.

Claims (10)

1. The utility model provides a connection structure of flexible circuit board and base plate, includes base plate and flexible circuit board, is equipped with first circuit on the upper surface of base plate, is equipped with second circuit on the upper surface of flexible circuit board, its characterized in that: the flexible circuit board is bonded on the first circuit through a glue layer; the flexible circuit board is provided with at least one connecting channel penetrating through the upper surface and the lower surface of the flexible circuit board, the first circuit is positioned at the lower side of the lower port of each connecting channel, and the second circuit extends to the edge part of the upper port of each connecting channel; a silver connecting piece formed by solidifying silver colloid is arranged in each connecting channel, the upper part of the silver connecting piece extends out of the upper port of the connecting channel and covers the second circuit, and the lower part of the silver connecting piece extends out of the lower port of the connecting channel and covers the first circuit; the setting method of the silver connecting piece comprises the following steps: firstly, dispensing the silver colloid in each connecting channel in a dispensing mode, enabling the silver colloid to overflow the edge part of the upper port of each connecting channel in a natural seepage or extrusion mode, and solidifying the silver colloid in a hot baking mode to form the silver connecting piece.
2. A connecting structure of a flexible circuit board and a substrate as claimed in claim 1, wherein: the silver colloid covers on the inner wall of the connecting channel, and the thickness of the silver connecting piece is at least 1mm.
3. A connection structure of a flexible circuit board and a substrate as claimed in claim 2, wherein: the silver colloid is filled in the connecting channel.
4. A connecting structure of a flexible circuit board and a substrate as claimed in claim 1, wherein: the number of the connecting channels is multiple and the connecting channels are arranged in parallel.
5. The structure of claim 4, wherein: the connecting channel is circular in shape.
6. A connection structure of a flexible circuit board and a substrate as claimed in claim 1, wherein: and at the corresponding position of the connecting channel, the inner edge of the adhesive layer is positioned outside the inner edge of the connecting channel, and an air guide gap is formed between the flexible circuit board and the first circuit, which are arranged on the periphery of the connecting channel.
7. A connection structure of a flexible circuit board and a substrate as claimed in claim 1, wherein: the lower surface of the flexible circuit board is provided with a third circuit, and the third circuit extends to the edge part of the lower port of each connecting channel; the lower part of the silver connecting piece extends out of the lower port of the connecting channel and covers the first circuit and the third circuit; the flexible circuit board is provided with at least one conductive hole, and a conductive layer for conducting the third circuit and the second circuit is arranged in the conductive hole.
8. A connection structure of a flexible circuit board and a substrate as claimed in any one of claims 1 to 7, wherein: the substrate is a glass substrate or a plastic substrate; the thickness of the flexible circuit board is 0.2 mm-0.4 mm.
9. A connection structure of a flexible circuit board and a substrate as claimed in any one of claims 1 to 7, wherein: the adhesive layer is a pressure-sensitive adhesive, a high-temperature curing adhesive or a UV curing adhesive; the thickness of the adhesive layer is 0.1-0.3 mm.
10. A connection structure of a flexible circuit board and a substrate as claimed in any one of claims 1 to 7, wherein: the dispensing process of the silver adhesive comprises the following steps: (1) Pressing the dispensing head onto the edge part of the upper port of the connecting channel, and extruding the silver colloid into the connecting channel to enable the lower part of the silver colloid to form surface contact with the second circuit; (2) And lifting the dispensing head upwards, extruding the silver adhesive to the edge part of the upper port of the connecting channel, and coating the silver adhesive on the edge part of the upper port of the connecting channel.
CN202211117890.5A 2022-09-14 2022-09-14 Connection structure of flexible circuit board and base plate Pending CN115551181A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202211117890.5A CN115551181A (en) 2022-09-14 2022-09-14 Connection structure of flexible circuit board and base plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211117890.5A CN115551181A (en) 2022-09-14 2022-09-14 Connection structure of flexible circuit board and base plate

Publications (1)

Publication Number Publication Date
CN115551181A true CN115551181A (en) 2022-12-30

Family

ID=84728291

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202211117890.5A Pending CN115551181A (en) 2022-09-14 2022-09-14 Connection structure of flexible circuit board and base plate

Country Status (1)

Country Link
CN (1) CN115551181A (en)

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Inventor after: Jiang Shuren

Inventor after: Shen Yi

Inventor after: Lv Yuemin

Inventor after: Zhang Gaomin

Inventor after: Zheng Weipeng

Inventor after: Chang Bibo

Inventor before: Jiang Shuren

Inventor before: Shen Yi

Inventor before: Lv Yuemin

Inventor before: Zhang Gaomin

Inventor before: Zheng Weipeng

Inventor before: Wen Bibo