CN212851172U - Backlight flexible circuit board structure and backlight module - Google Patents
Backlight flexible circuit board structure and backlight module Download PDFInfo
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- CN212851172U CN212851172U CN202021801756.3U CN202021801756U CN212851172U CN 212851172 U CN212851172 U CN 212851172U CN 202021801756 U CN202021801756 U CN 202021801756U CN 212851172 U CN212851172 U CN 212851172U
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Abstract
The utility model is suitable for a display device technical field provides a flexible circuit board structure and backlight unit are shaded, flexible circuit board structure is shaded includes first substrate layer and the second substrate layer of laminating each other to and be located the conducting layer between first substrate layer and the second substrate layer, the coating has the cover glue film between first substrate layer and the conducting layer, the coating has the connection glue film between second substrate layer and the conducting layer, the surface coating that the cover glue film was kept away from to first substrate layer has the white printing ink layer that is used for reflection ray. The utility model provides a flexible circuit board structure is shaded, the heat resistance of current white reflector plate is not high, the utility model discloses directly scribble white printing ink layer on first substrate layer, close reflector plate and flexible circuit board as an organic whole, processing is simple, has solved and has reduced self thickness and the problem that the fire behavior of original reflector plate material is not enough in the use through reducing reflector plate thickness, has improved holistic backlight performance simultaneously.
Description
Technical Field
The utility model belongs to the technical field of display device, more specifically say, relate to a flexible circuit board structure and backlight unit are shaded.
Background
Along with the development of the technology, the display screen structure is also made thinner and thinner, and the display requirement on the display screen structure is higher and higher while the thickness of the backlight module is smaller and smaller.
The backlight module mainly comprises a Flexible Printed Circuit (FPC), an LED lamp and a light guide plate, and when the design thickness of the FPC is unchanged, the thicknesses of the light guide plate and the LED lamp need to be changed, and the brightness of the light guide plate and the LED lamp with lower thicknesses is lower.
The existing backlight module is mainly characterized in that a reflector plate is attached above a flexible circuit board and then attached on a light guide plate, the thickness of the reflector plate is reduced to reduce the thickness of the backlight module, the backlight module is difficult to process, and the fireproof performance of the reflector plate is poor.
SUMMERY OF THE UTILITY MODEL
An object of the embodiment of the utility model is to provide a flexible circuit board structure and backlight unit are shaded to solve current backlight unit and reduce the technical problem that the fire behavior is not good of self thickness processing difficulty and reflector plate through the thickness that reduces the reflector plate.
In order to achieve the above object, the utility model adopts the following technical scheme: there is provided a backlight flexible circuit board structure comprising: including first substrate layer and the second substrate layer of laminating each other to and be located the conducting layer between first substrate layer and the second substrate layer, first substrate layer with the coating has the cover glue film between the conducting layer, the second substrate layer with the coating has the connection glue film between the conducting layer, first substrate layer is kept away from the surface coating of cover glue film has the white printing ink layer that is used for reflection ray.
Optionally, the white ink layer comprises a white ink layer composed of reflective particles, a binder and an auxiliary agent, and is printed on the first substrate layer.
Optionally, the backlight flexible circuit board structure further comprises:
the bonding pad is arranged on the surface, deviating from the covering glue layer, of the first base material layer and is communicated with the conducting layer; and
the golden finger is connected to one side of the first base material layer;
the white ink layer is coated on the position, where the first base material layer avoids the bonding pad and the golden finger.
Optionally, the thickness of the white ink layer is 10-20 μm.
Optionally, the first substrate layer and the second substrate layer are substrate layers made of polyimide respectively.
Optionally, the thickness of the first substrate layer and the second substrate layer is 45-55 μm.
Optionally, the thickness of the connection glue layer is 8-10 μm.
Optionally, the cover glue layer is used for isolating the conductive layer, and the thickness of the cover glue layer is 15-25 μm.
Optionally, the conductive layer is a copper layer, and the thickness of the conductive layer is 10-25 μm.
The utility model also provides a backlight unit, including the aforesaid flexible circuit board structure is shaded.
The utility model provides a flexible circuit board structure and backlight unit are shaded has: compared with the prior art, the utility model discloses flexible circuit board structure is shaded directly coats white printing ink layer on first substrate layer, closes reflector plate and flexible circuit board as an organic whole, and processing is simple, has solved and has reduced self thickness and the problem that the fire behavior of original reflector plate material is not enough in the use through reducing reflector plate thickness, has improved holistic light-back performance simultaneously.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive labor.
FIG. 1 is a schematic top view of a conventional backlight flexible circuit board structure;
fig. 2 is a schematic top view of a backlight flexible circuit board structure according to an embodiment of the present invention;
fig. 3 is a schematic cross-sectional structural diagram of a backlight flexible circuit board structure according to an embodiment of the present invention.
Wherein, in the figures, the respective reference numerals:
1-a reflective layer; 2-FPC; 31-a first substrate layer; 32-a second substrate layer; 33-a conductive layer; 34-covering the adhesive layer; 35-connecting adhesive layer; 36-white ink layer; 4-golden finger; 5-bonding pad.
Detailed Description
In order to make the technical problem, technical solution and advantageous effects to be solved by the present invention more clearly understood, the following description is given in conjunction with the accompanying drawings and embodiments to illustrate the present invention in further detail. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
Referring to fig. 1 to fig. 3, a structure of a backlight flexible circuit board according to an embodiment of the present invention will be described. The flexible circuit board structure in a poor light is including first substrate layer 31 and the second substrate layer 32 of laminating each other to and be located the conducting layer 33 between first substrate layer 31 and the second substrate layer 32, be connected with cover glue film 34 between first substrate layer 31 and the conducting layer 33, the coating has connection glue film 35 between second substrate layer 32 and the conducting layer 33, and the surface coating that cover glue film 34 was kept away from to first substrate layer 31 has white printing ink layer 36 that is used for reflection ray. A covering glue layer 34 is coated between the first substrate layer 31 and the conductive layer 33, and the covering glue layer 34 has an insulating effect. A bonding paste layer 35 is coated between the second substrate layer 32 and the conductive layer 33, so that the conductive layer 33 can be stably bonded to the second substrate layer 32.
Specifically, referring to fig. 1, a conventional white reflective sheet 1 is attached to a flexible circuit board 2, the white reflective sheet 1 is made of polyester resin (PET), and has good mechanical properties, impact strength 3-5 times that of other films, good folding resistance, oil resistance, resin resistance, dilute acid resistance, and resistance to most solvents, but the PET has low heat resistance, and the thermal deformation temperature is only about 85 ℃. Therefore, the fireproof performance of the existing reflector plate 1 is poor, the high-temperature resistance of the first substrate layer 31 is good, and the white ink layer 36 is directly coated on the first substrate layer 31, so that the problem that the fireproof performance of the material of the reflector plate 1 is insufficient in the using process can be solved.
The utility model provides a flexible circuit board structure is shaded, compare with prior art, directly coat white printing ink layer 36 on first substrate layer 31, close reflector plate 1 and flexible circuit board 2 as an organic whole, when reducing holistic thickness, processing is simple, has solved and has reduced self thickness and the not enough problem of fire behavior of original reflector plate 1 material in the use through reducing reflector plate 1 thickness, has improved holistic backlight performance simultaneously.
It should be noted that the white ink layer 36 is mainly composed of a colorant, a binder, an auxiliary agent, and the like, the colorant is mainly reflective particles, includes pigments and dyes, and mainly plays roles of coloring, covering, special functions, and the like, wherein the colorant is mainly fumed silica, and mainly plays a role of diffusing light to change the propagation direction of light.
The binder is a flowing component in the white ink, is a carrier of the colorant, and is mainly used for mixing and bonding the powdery colorant, wherein the binder is mainly methacrylic resin and is mainly used for bonding fumed silica particles so as to be uniformly attached to the first substrate layer 31.
The auxiliary agent is a material used in the manufacturing and printing processes of the ink and added for improving the performance of the ink itself, and includes a diluent, a defoaming agent, a plasticizer, a thickener, a drying agent, and the like. The white ink layer 36 made of the materials is printed on the first base material layer 31, and the reflectivity reaches 80% -85%.
Specifically, in the present embodiment, the thickness of the white ink layer 36 is 10 to 20 μm, and the white ink layer 36 within this thickness has a good reflection performance, and the overall thickness is also reduced. In a specific application, the thickness of the white ink layer 36 is 10 μm, 11 μm, 12 μm, 13 μm, 14 μm, 15 μm, 16 μm, 17 μm, 18 μm, 19 μm or 20 μm, which can be selected according to specific requirements.
In another embodiment of the present invention, referring to fig. 2 and fig. 3, the structure of the backlight flexible circuit board further includes a bonding pad 5 and a gold finger 4. The bonding pad 5 is disposed on a surface of the first substrate layer 31 away from the cover glue layer 34, the bonding pad 5 is electrically connected to the conductive layer 33 for conduction, and the gold finger 4 is connected to one side of the first substrate layer 31. The white ink layer 36 covers the first base material layer 31 at a position avoiding the pad 5 and the gold finger 4, so as not to affect the electrical connection between the pad 5 and the conductive layer 33 and the connection between the gold finger 4 and other components.
In another embodiment of the present invention, referring to fig. 3, the first substrate layer 31 and the second substrate layer 32 are substrate layers made of Polyimide (PI, Polyimide), and the Polyimide film has excellent high and low temperature resistance, electrical insulation, adhesion, radiation resistance, and dielectric resistance, and can be used for a long time at a temperature range of-269 ℃ to 280 ℃, and can reach a high temperature of 400 ℃ in a short time. The glass transition temperatures are respectively 280 ℃, 385 ℃ and above 500 ℃. The tensile strength is 200MPa at 20 ℃ and is more than 100MPa at 200 ℃. The white ink layer 36 is particularly suitable for being used as a base material of a flexible printed circuit board and insulating materials of various high-temperature resistant motors and electrical appliances, so that the white ink layer 36 covered on the first base material layer 31 is also high-temperature resistant.
Further, in this example, the thickness of the first substrate layer 31 is 45 to 55 μm, and the thickness of the second substrate layer 32 is 45 to 55 mm. In a specific application, the thickness of the first substrate layer 31 is 45 μm, 46 μm, 47 μm, 48 μm, 49 μm, 50 μm, 51 μm, 52 μm, 53 μm, 54 μm or 55 μm, which can be selected according to specific requirements, and the thickness of the second substrate layer 32 is 45 μm, 46 μm, 47 μm, 48 μm, 49 μm, 50 μm, 51 μm, 52 μm, 53 μm, 54 μm or 55 μm, which can be selected according to specific requirements.
In another embodiment of the present invention, referring to fig. 3, the thickness of the connection glue layer 35 is 8-10 μm, and in a specific application, the thickness of the connection glue layer 35 is 8 μm, 9 μm or 10 μm, which can be selected according to specific requirements. The bonding adhesive layer 35 is within this range, and can bond the conductive layer 33 and the second substrate layer 32, and is too thin to perform a bonding function, and too thick to affect the overall thickness. Specifically, the connection glue layer 35 is 20 glue, and the 20 glue has the characteristics of excellent resilience, insulation, water resistance, plasticity and the like.
In another embodiment of the present invention, referring to fig. 3, the covering glue layer 34 is used to isolate the conductive layer 33, and the thickness of the covering glue layer 34 is 15-25 μm. In particular applications, the thickness of the coverlay adhesive layer 34 is 15 μm, 16 μm, 17 μm, 18 μm, 19 μm, 20 μm, 21 μm, 22 μm, 23 μm, 24 μm, or 25 μm. The cover adhesive layer 34 can have a good insulating effect in this range, and if the thickness of the cover adhesive layer 34 is small, the insulating effect is not good, and if the thickness of the cover adhesive layer 34 is large, the entire thickness is affected.
In another embodiment of the present invention, referring to fig. 3, the conductive layer 33 is a copper layer, which has good ductility, high thermal conductivity and high electrical conductivity, and is the most commonly used material for cables, electrical and electronic components. The thickness of the conductive layer 33 is 10-25 μm, and in a specific application, the thickness of the conductive layer 33 is 10 μm, 11 μm, 12 μm, 13 μm, 14 μm, 15 μm, 16 μm, 17 μm, 18 μm, 19 μm, 20 μm, 21 μm, 22 μm, 23 μm, 24 μm or 25 μm, which can be selected according to specific requirements, and the conductive layer 33 has a good conductive performance within the thickness, and if too thin, the conductive layer is not easy to conduct, and if too thick, the overall thickness is affected.
The embodiment of the utility model provides a still provide a backlight unit, including foretell flexible circuit board structure in a poor light.
This backlight unit is through adopting foretell flexible circuit board structure in a poor light, covers white printing ink layer 36 on first substrate layer 31, closes reflector plate and FPC as an organic whole, when reducing holistic thickness to solved the problem that the fire behavior of original single reflector plate 1 material is not enough in the use, improved holistic backlight performance simultaneously.
Further, referring to fig. 2 and 3, the thickness of the backlight flexible circuit board structure is 0.08-0.1 mm. The thickness of the whole backlight flexible circuit board structure is within the range, so that the whole backlight effect of the backlight module is good.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. A backlight flexible circuit board structure is characterized in that: including first substrate layer and the second substrate layer of laminating each other to and be located the conducting layer between first substrate layer and the second substrate layer, first substrate layer with the coating has the cover glue film between the conducting layer, the second substrate layer with the coating has the connection glue film between the conducting layer, first substrate layer is kept away from the surface coating of cover glue film has the white printing ink layer that is used for reflection ray.
2. The backlight flexible circuit board structure of claim 1, wherein: the white ink layer comprises a white ink layer consisting of reflective particles, a connecting material and an auxiliary agent, and is printed on the first substrate layer.
3. The backlight flexible circuit board structure of claim 1, wherein: the backlight flexible circuit board structure further includes:
the bonding pad is arranged on the surface, deviating from the covering glue layer, of the first base material layer and is communicated with the conducting layer; and
the golden finger is connected to one side of the first base material layer;
the white ink layer is coated on the position, where the first base material layer avoids the bonding pad and the golden finger.
4. The backlight flexible circuit board structure of any one of claims 1 to 3, wherein: the thickness of the white ink layer is 10-20 μm.
5. The backlight flexible circuit board structure of any one of claims 1 to 3, wherein: the first substrate layer and the second substrate layer are substrate layers made of polyimide respectively.
6. The backlight flexible circuit board structure of claim 5, wherein: the thickness of the first base material layer and the second base material layer is 45-55 mu m.
7. The backlight flexible circuit board structure of any one of claims 1 to 3, wherein: the thickness of the connecting glue layer is 8-10 μm.
8. The backlight flexible circuit board structure of any one of claims 1 to 3, wherein: the covering glue layer is used for isolating the conducting layer, and the thickness of the covering glue layer is 15-25 mu m.
9. The backlight flexible circuit board structure of any one of claims 1 to 3, wherein: the conducting layer is a copper layer, and the thickness of the conducting layer is 10-25 mu m.
10. A backlight module is characterized in that: comprising a backlit flexible circuit board structure as claimed in any one of claims 1 to 9.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021801756.3U CN212851172U (en) | 2020-08-25 | 2020-08-25 | Backlight flexible circuit board structure and backlight module |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202021801756.3U CN212851172U (en) | 2020-08-25 | 2020-08-25 | Backlight flexible circuit board structure and backlight module |
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| CN212851172U true CN212851172U (en) | 2021-03-30 |
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| CN202021801756.3U Active CN212851172U (en) | 2020-08-25 | 2020-08-25 | Backlight flexible circuit board structure and backlight module |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113450642A (en) * | 2021-07-26 | 2021-09-28 | 江西华创触控科技有限公司 | Backlight module, manufacturing method thereof, display device and electronic equipment |
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- 2020-08-25 CN CN202021801756.3U patent/CN212851172U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113450642A (en) * | 2021-07-26 | 2021-09-28 | 江西华创触控科技有限公司 | Backlight module, manufacturing method thereof, display device and electronic equipment |
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