CN113450642A - Backlight module, manufacturing method thereof, display device and electronic equipment - Google Patents
Backlight module, manufacturing method thereof, display device and electronic equipment Download PDFInfo
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- CN113450642A CN113450642A CN202110846775.0A CN202110846775A CN113450642A CN 113450642 A CN113450642 A CN 113450642A CN 202110846775 A CN202110846775 A CN 202110846775A CN 113450642 A CN113450642 A CN 113450642A
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- backlight module
- insulating film
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- backlight
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
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Abstract
The invention provides a backlight module, comprising: a substrate; an insulating film disposed on one side of the substrate; the composite glue is coated on one side of the insulating film, which is far away from the substrate, and the composite glue is white or matt; the conducting circuit is arranged on one side, far away from the insulating film, of the composite adhesive; and the backlight light source is arranged on the conductive circuit and is electrically connected with the conductive circuit. In addition, the invention also provides a manufacturing method of the backlight module, a display device and electronic equipment. The technical scheme of the invention effectively reduces the influence of the backlight source on the display module.
Description
Technical Field
The invention relates to the technical field of display equipment, in particular to a backlight module, a manufacturing method of the backlight module, a display device and electronic equipment.
Background
The display module is an electronic device which does not emit light actively and does not have the light-emitting characteristic. The display module can display the picture only by depending on the light emitted by the backlight source in the backlight module, and the picture is obtained by modulating the light emitted by the backlight source. Therefore, the brightness of the display frame of the display module is mainly determined by the light emitted by the backlight source. In order to obtain a display image with higher brightness, the backlight source is required to provide stronger light for the display module. However, the stronger light intensity will affect the display effect of the display module.
Disclosure of Invention
The invention provides a backlight module, a manufacturing method thereof, a display device and electronic equipment, which can reduce the influence of a backlight light source on the display module.
In a first aspect, an embodiment of the present invention provides a backlight module, where the backlight module includes:
a substrate;
an insulating film disposed on one side of the substrate;
the composite glue is coated on one side, far away from the substrate, of the insulating film, and is white or matt;
the conducting circuit is arranged on one side, far away from the insulating film, of the composite adhesive; and
and the backlight light source is arranged on the conductive circuit and is electrically connected with the conductive circuit.
Optionally, the color of the side of the conductive circuit far away from the compound glue is the same as that of the compound glue.
Optionally, the compound adhesive is composed of a hot melt adhesive and a toner, and the toner is white or matt.
Optionally, the insulating film is a polyester film or a polyimide film.
Optionally, the backlight source includes a plurality of mini-LEDs, and the mini-LEDs are arranged in a matrix on the conductive circuit.
Optionally, the conductive circuit is treated by plasma to increase adhesion of the conductive circuit.
In a second aspect, an embodiment of the present invention provides a method for manufacturing a backlight module, where the method for manufacturing a backlight module includes:
providing a substrate;
arranging an insulating film on one side of the substrate;
coating composite glue on one side of the insulating film, which is far away from the substrate, wherein the composite glue is white or matt;
arranging a conductive circuit on one side of the composite adhesive far away from the insulating film; and
and arranging a backlight light source to be electrically connected with the conductive circuit.
Optionally, after disposing the conductive trace on the side of the composite adhesive away from the insulating film, the method for manufacturing the backlight module further includes:
and electroplating the surface of the conducting wire to ensure that the color of the surface of the conducting wire far away from the compound glue is the same as the color of the compound glue.
In a third aspect, an embodiment of the present invention provides a display device, where the display device includes the backlight module and a display module disposed in the backlight module.
In a fourth aspect, an embodiment of the present invention provides an electronic apparatus, which includes a housing and the display device as described above disposed in the housing.
According to the backlight module, the manufacturing method of the backlight module, the display device and the electronic equipment, the composite glue is arranged between the insulating film and the conducting circuit, and the composite glue can absorb or reflect certain light rays while fixing the conducting circuit on the insulating film. The composite glue is white or sub-gloss, and the color of the surface, far away from the composite glue, of the conductive circuit is the same as that of the composite glue, so that the whole back plate surface formed by the composite glue and the conductive circuit is white or sub-gloss. When the backlight source emits light, the light is white or sub-light color through the composite glue and the reflection of the conductive circuit, so that the interference of the backlight source on the display picture of the display module can be reduced, and the influence of the backlight module on the display module is reduced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic cross-sectional view of a backlight module according to an embodiment of the invention.
Fig. 2 is a top view of a backlight module according to an embodiment of the invention.
Fig. 3 is a flowchart of a method for manufacturing a backlight module according to an embodiment of the invention.
Fig. 4 is a sub-flowchart of a method for manufacturing a backlight module according to an embodiment of the invention.
Fig. 5 is a schematic cross-sectional view of a display device according to an embodiment of the invention.
Fig. 6 is a schematic diagram of an electronic device according to an embodiment of the present invention.
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The terms "first," "second," "third," "fourth," and the like in the description and in the claims of the present application and in the above-described drawings (if any) are used for distinguishing between similar items and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances, in other words that the embodiments described are to be practiced in sequences other than those illustrated or described herein. Moreover, the terms "comprises," "comprising," and any other variation thereof, may also include other things, such as processes, methods, systems, articles, or apparatus that comprise a list of steps or elements is not necessarily limited to only those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such processes, methods, articles, or apparatus.
It should be noted that the description relating to "first", "second", etc. in the present invention is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
Referring to fig. 1 and fig. 2 in combination, fig. 1 is a schematic cross-sectional view of a backlight module according to an embodiment of the invention, and fig. 2 is a top view of the backlight module according to the embodiment of the invention. The backlight module 100 is used for providing light required by the display module to display a picture. The backlight module 100 includes a substrate 11, an insulating film 12, a compound adhesive 13, a conductive trace 14, and a backlight source 15. In this embodiment, the insulating film 12 is disposed on one side of the substrate 11, the compound adhesive 13 is coated on one side of the insulating film 12 away from the substrate 11, the conductive trace 14 is disposed on one side of the compound adhesive 13 away from the insulating film 12, and the backlight source 15 is disposed on the conductive trace 14 and electrically connected to the conductive trace 14. It is understood that the substrate 11, the insulating film 12, the compound adhesive 13, the conductive line 14, and the backlight source 15 are sequentially stacked.
The insulating film 12 may be fixed to the substrate 11 by, but not limited to, pressing or pasting. The insulating film 12 is made of high temperature resistant plastic material. The insulating film 12 is a Polyimide (PI) film, or the insulating film 12 is a polyester film, such as a Polyethylene Terephthalate (PET) film.
The compound adhesive 13 has adhesive properties and can adhere the conductive traces 14 to the insulating film 12. Wherein, the compound glue 13 is composed of hot melt glue and toner, and the toner is white or matt. It is understood that the color of the composite paste 13 is determined by the toner. The addition amount of the toner is selected according to actual requirements, so that the ideal color of the compound rubber 13 can be obtained. Accordingly, the composite adhesive 13 is white or matt. The color of the side of the conductive circuit 14 far away from the compound glue 13 is the same as that of the compound glue 13. It can be understood that the conductive traces 14 are hollow traces formed by etching the conductive layer, and a portion of the compound adhesive 13 can be exposed from the hollow traces 14. The color of the surface of the conductive circuit 14 away from the composite adhesive 13 is set to be the same as the color of the composite adhesive 13, so that the whole back panel surface 101 formed by the composite adhesive 13 and the conductive circuit 14 is the same white or matte color. The conductive traces 14 include, but are not limited to, metal material such as copper, silver, etc. The color of the side of the conductive circuit 14 away from the compound adhesive 13 is set to be the same as the color of the compound adhesive 13, specifically: and plating a metal layer with the same color as the composite glue 13 on the surface of the conductive circuit 14 away from the composite glue 13 in an electroplating way. It can be understood that if the original color of the metal material used for the conductive circuit 14 is the same as the color of the compound glue 13, the conductive circuit 14 does not need to be plated. In some possible embodiments, the conductive line 14 and the compound glue 13 may also be kept in the same color by applying ink with the same color as the compound glue 13 on the side of the conductive line 14 away from the compound glue 13.
The conductive traces 14 are plasma treated to enhance adhesion of the conductive traces 14. It will be appreciated that the side of the conductive tracks 14 remote from the compound glue 13 is plasma treated. The backlight light source 15 includes a number of mini-LEDs 151. The mini-LEDs 151 are arranged in a matrix on the conductive circuit 14. The mini-LED151 is fixed to the conductive trace 14 by bonding or cob (chip on board) bonding.
In the above embodiment, the compound adhesive is disposed between the insulating film and the conductive circuit, and the compound adhesive can absorb or reflect a certain light while fixing the conductive circuit to the insulating film. The composite glue is white or sub-gloss, and the color of the surface, far away from the composite glue, of the conductive circuit is the same as that of the composite glue, so that the whole back plate surface formed by the composite glue and the conductive circuit is white or sub-gloss. When the backlight source emits light, the light is white or sub-light color through the composite glue and the reflection of the conductive circuit, so that the interference of the backlight source on the display picture of the display module can be reduced, and the influence of the backlight module on the display module is reduced. The matte surface is a non-bright surface relative to the flat surface. The surface of the matt composite glue or the conducting circuit is smooth and is polished to a low degree, and diffuse reflection can be generated. In addition, the conductive circuit is subjected to plasma treatment to enhance the adhesive force, so that the backlight source can be more firmly fixed on the conductive circuit.
Please refer to fig. 3, which is a flowchart illustrating a method for manufacturing a backlight module according to an embodiment of the present invention. The method for manufacturing the backlight module specifically comprises the following steps.
Step S102, providing a substrate.
Step S104, an insulating film is arranged on one side of the substrate. The insulating film 12 may be fixed to the substrate 11 by, but not limited to, pressing or pasting. The insulating film 12 is made of high temperature resistant plastic material. The insulating film 12 is a Polyimide (PI) film, or the insulating film 12 is a polyester film, such as a Polyethylene Terephthalate (PET) film.
Step S106, coating composite glue on the side of the insulating film far away from the substrate. Wherein, the compound glue 13 is composed of hot melt glue and toner, and the toner is white or matt. It is understood that the color of the composite paste 13 is determined by the toner. The addition amount of the toner is selected according to actual requirements, so that the ideal color of the compound rubber 13 can be obtained. Accordingly, the composite adhesive 13 is white or matt.
Step S108, a conductive circuit is arranged on one side of the composite glue, which is far away from the insulating film. The compound adhesive 13 has adhesive properties and can adhere the conductive traces 14 to the insulating film 12. It can be understood that the conductive traces 14 are hollow traces formed by etching the conductive layer disposed on the side of the compound adhesive 13 away from the insulating film 12, and a portion of the compound adhesive 13 can be exposed from the hollow traces 14.
Step S110, a backlight source is set to the conductive circuit, and the backlight source is electrically connected to the conductive circuit. The backlight source 15 includes a plurality of mini-LEDs 151, and the plurality of mini-LEDs 151 are arranged in a matrix on the conductive traces 14. The mini-LED151 is fixed to the conductive trace 14 by bonding or cob (chips On board) bonding. In some possible embodiments, the side of the conductive trace 14 away from the compound 13 may be plasma-treated to enhance the adhesion of the conductive trace 14, so that the backlight source 15 can be more firmly fixed to the conductive trace 14.
In the above embodiment, the compound adhesive is disposed between the insulating film and the conductive circuit, and the compound adhesive can absorb or reflect a certain light while fixing the conductive circuit to the insulating film. The composite glue is white or sub-gloss, and when the backlight source emits light, the light is white or sub-gloss through reflection of the composite glue, so that interference of the backlight source on a display picture of the display module can be reduced, and the influence of the backlight module on the display module is reduced.
Please refer to fig. 4, which is a sub-flowchart of a method for manufacturing a backlight module according to an embodiment of the present invention. After step S108 is executed, the method for manufacturing a backlight module further includes the following steps.
Step S109, performing electroplating treatment on the surface of the conductive circuit, so that the color of the surface of the conductive circuit away from the compound glue is the same as the color of the compound glue. In this embodiment, a metal layer having the same color as the composite adhesive 13 is plated on a surface of the conductive trace 14 away from the composite adhesive 13 by electroplating, so that the color of the surface of the conductive trace 14 away from the composite adhesive 13 is the same as the color of the composite adhesive 13, and the whole back panel surface 101 formed by the composite adhesive 13 and the conductive trace 14 is the same white or matte color. The conductive traces 14 include, but are not limited to, metal material such as copper, silver, etc. It can be understood that if the original color of the metal material used for the conductive circuit 14 is the same as the color of the compound glue 13, the conductive circuit 14 does not need to be plated.
In some possible embodiments, the conductive line 14 and the compound glue 13 may be kept in the same color by applying ink with the same color as the compound glue 13 on the side of the conductive line 14 away from the compound glue 13.
In the above embodiment, the color of the side of the conductive circuit far from the composite adhesive is the same as that of the composite adhesive, so that the whole back panel formed by the composite adhesive and the conductive circuit is white or sub-gloss. When the backlight source emits light, the light is white or sub-light color through the composite glue and the reflection of the conductive circuit, so that the interference of the backlight source on the display picture of the display module can be reduced, and the influence of the backlight module on the display module is reduced.
Please refer to fig. 5, which is a schematic cross-sectional view of a display device according to an embodiment of the invention. The display device 300 includes a backlight module 100 and a display module 200 disposed on the backlight module 100. The specific structure of the backlight module 100 refers to the above embodiments. The display module 200 is disposed at a side of the backlight module 100 where the backlight source is disposed. Since the display device 300 adopts all technical solutions of all the above embodiments, at least all the beneficial effects brought by the technical solutions of the above embodiments are achieved, and are not described in detail herein.
Please refer to fig. 6, which is a schematic diagram of an electronic apparatus according to an embodiment of the invention. The electronic apparatus 1000 includes a housing 400, and a display device 300 provided in the housing 400. The electronic device 1000 includes, but is not limited to, a cell phone, a tablet computer, a notebook computer, a television, a display, and the like. The electronic device 1000 shown in fig. 6 is a mobile phone. The specific structure of the display device 300 refers to the above-described embodiments. Since the electronic device 1000 adopts all technical solutions of all the embodiments, at least all the beneficial effects brought by the technical solutions of the embodiments are achieved, and are not described in detail herein.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, insofar as these modifications and variations of the invention fall within the scope of the claims of the invention and their equivalents, the invention is intended to include these modifications and variations.
The above-mentioned embodiments are only examples of the present invention, which should not be construed as limiting the scope of the present invention, and therefore, the present invention is not limited by the claims.
Claims (10)
1. A backlight module is characterized in that the backlight module comprises:
a substrate;
an insulating film disposed on one side of the substrate;
the composite glue is coated on one side, far away from the substrate, of the insulating film, and is white or matt;
the conducting circuit is arranged on one side, far away from the insulating film, of the composite adhesive; and
and the backlight light source is arranged on the conductive circuit and is electrically connected with the conductive circuit.
2. The backlight module as claimed in claim 1, wherein the conductive traces are of the same color as the composite paste on a side thereof away from the composite paste.
3. The backlight module as claimed in claim 1, wherein the compound adhesive is composed of a hot melt adhesive and a toner, and the toner is white or matte.
4. The backlight module according to claim 1, wherein the insulating film is a polyester film or a polyimide film.
5. The backlight module as claimed in claim 1, wherein the backlight source comprises a plurality of mini-LEDs arranged in a matrix on the conductive traces.
6. The backlight module as claimed in claim 1, wherein the conductive traces are plasma treated to increase adhesion of the conductive traces.
7. A method for manufacturing a backlight module is characterized by comprising the following steps:
providing a substrate;
arranging an insulating film on one side of the substrate;
coating composite glue on one side of the insulating film, which is far away from the substrate, wherein the composite glue is white or matt;
arranging a conductive circuit on one side of the composite adhesive far away from the insulating film; and
and arranging a backlight light source to be electrically connected with the conductive circuit.
8. The method of claim 7, wherein after disposing a conductive trace on a side of the composite adhesive away from the insulating film, the method further comprises:
and electroplating the surface of the conducting wire to ensure that the color of the surface of the conducting wire far away from the compound glue is the same as the color of the compound glue.
9. A display device, comprising the backlight module as claimed in any one of claims 1 to 6, and a display module disposed on the backlight module.
10. An electronic apparatus, characterized in that the electronic apparatus comprises a housing, and the display device according to claim 9 provided to the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110846775.0A CN113450642A (en) | 2021-07-26 | 2021-07-26 | Backlight module, manufacturing method thereof, display device and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110846775.0A CN113450642A (en) | 2021-07-26 | 2021-07-26 | Backlight module, manufacturing method thereof, display device and electronic equipment |
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| CN113450642A true CN113450642A (en) | 2021-09-28 |
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| CN202110846775.0A Pending CN113450642A (en) | 2021-07-26 | 2021-07-26 | Backlight module, manufacturing method thereof, display device and electronic equipment |
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Application publication date: 20210928 |