CN203691744U - LED backlight source circuit board - Google Patents

LED backlight source circuit board Download PDF

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Publication number
CN203691744U
CN203691744U CN201420046134.2U CN201420046134U CN203691744U CN 203691744 U CN203691744 U CN 203691744U CN 201420046134 U CN201420046134 U CN 201420046134U CN 203691744 U CN203691744 U CN 203691744U
Authority
CN
China
Prior art keywords
led
circuit board
layer
backlight source
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN201420046134.2U
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Chinese (zh)
Inventor
陈子安
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Hetong Technology Co ltd
Original Assignee
HETONG ELECTRONICS CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HETONG ELECTRONICS CO Ltd filed Critical HETONG ELECTRONICS CO Ltd
Priority to CN201420046134.2U priority Critical patent/CN203691744U/en
Application granted granted Critical
Publication of CN203691744U publication Critical patent/CN203691744U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

The utility model lies in providing an LED backlight source circuit board, which comprises an aluminum substrate, an insulating layer and a circuit layer, wherein the aluminum substrate is located at the bottom layer and acts as the basis of the overall circuit board, the insulating layer is adhered to the aluminum substrate, the circuit layer (a copper coil) is pressed on the insulating layer, and a printed circuit is formed through etching, thereby being used for realizing assembly and connection of devices. The LED backlight source circuit board is characterized in that the upper surface of the circuit layer is coated by a photosensitive white soldering-resistant ink layer, an LED backlight source is enabled to have the advantages of high reflectivity and reflection uniformity through coating the photosensitive white soldering-resistant ink layer on the circuit layer, and the circuit board is enabled to be high temperature resistant and non-discoloring. The LED backlight source circuit board meets requirements of high temperature resistance, high reflectivity and reflection uniformity for the circuit board of a straight-down LED television or a display because a large amount of LED crystals are installed on the circuit board, and image colors are more uniform, more stable and bright white, thereby being conforming to higher visual enjoyment of consumers.

Description

A kind of LED-backlit source wiring board
Technical field
The utility model relates to wiring board technical field, relates in particular to a kind of LED-backlit source wiring board.
Background technology
Straight-down negative be LED uniform crystal particles be configured in liquid crystal panel rear be used as light emitting source, make backlightly can evenly be communicated to whole screen, picture detail is finer and smoother true to nature.Near the favor that the straight-down negative LED TV that is changed to LED crystal grain of CCFL conventional light source crystal grain " flush system " is subject to more high-order consumers.The large scale liquid crystal TV of a direct-light type LED backlight need to be used thousands of LEDs crystal grain, high temperature resistant and reflective the having relatively high expectations of the wiring board to installation LED.In prior art, direct LED backlight wiring board adopts conventional aluminium base circuit board more, and reflectivity is low and reflective inhomogeneous.
Summary of the invention
For the deficiencies in the prior art, the utility model is to provide a kind of LED-backlit source high reflectance and reflective uniform wiring board.
For achieving the above object, the utility model is achieved by following technical proposals:
A kind of LED-backlit source wiring board comprises, aluminium base, insulating barrier, line layer, aluminium base is positioned at the bottom, be the basis of whole wiring board, insulating barrier is bonded on aluminium base, and line layer (Copper Foil) is pressed together on insulating barrier, form printed circuit through etching, for realizing assembling and the connection of device, it is characterized in that, described line layer upper surface is coated with a sensitization white welding resistance ink layer.
Described a kind of LED-backlit source wiring board, preferably: described insulating barrier is the anodic oxidation insulating layer with microcellular structure.
Described a kind of LED-backlit source wiring board, preferably: described line layer comprises basilar memebrane, conducting film and welding film.
Described a kind of LED-backlit source wiring board, preferably: described line layer is provided with prepackage LED pad.
The beneficial effects of the utility model are: make LED-backlit source have high reflectance and the inhomogeneity advantage of reflection by be coated with sensitization white welding resistance ink layer on line layer, and make the high temperature resistant nondiscolouring of wiring board.Met straight-down negative LED TV or display and installed and in the circuit board wiring board is proposed to high temperature resistant high reflectance and reflect uniform requirement because of a large amount of LED crystal, image quality is more uniform and stable, and brilliant white meets the visual enjoyment of consumer Geng Gao.
Brief description of the drawings
Fig. 1 is the structural representation of a kind of LED-backlit described in the utility model source wiring board.
In figure: 1-aluminium base, 2-insulating barrier, 3-line layer, 4-sensitization white welding resistance ink layer, 5-prepackage LED pad.
Embodiment
Below in conjunction with accompanying drawing, embodiment of the present utility model is described in further detail.
As shown in Figure 1, a kind of LED-backlit source wiring board comprises, aluminium base 1, insulating barrier 2, line layer 3, aluminium base 1 is positioned at the bottom, is the basis of whole wiring board, and insulating barrier 2 is bonded on aluminium base 1, line layer 3(Copper Foil) be pressed together on insulating barrier 2, form printed circuit through etching, for realizing assembling and the connection of device, described line layer 3 upper surfaces are coated with a sensitization white welding resistance ink layer 4.
In the present embodiment, preferably: described insulating barrier 2 is for having the anodic oxidation insulating layer of microcellular structure, seamless combination aluminium base 1 and insulating barrier 2 and play the function of efficiently radiates heat.
In the present embodiment, preferably: described line layer 3 comprises basilar memebrane, conducting film and welding film, basilar memebrane engages line layer and insulating barrier, and conducting film provides electric current, and weld layer is used for installing the electronic components such as welding LED.
In the present embodiment, preferably: described line layer 3 is provided with prepackage LED pad 5, for welding LED crystal is installed.
That in above-described embodiment and specification, describes just illustrates principle of the present utility model and most preferred embodiment; do not departing under the prerequisite of the utility model spirit and scope; the utility model also has various changes and modifications, and these changes and improvements all fall within the scope of claimed the utility model.

Claims (4)

1. a LED-backlit source wiring board comprises, aluminium base (1), insulating barrier (2), line layer (3), aluminium base (1) is positioned at the bottom, it is the basis of whole wiring board, insulating barrier (2) is bonded on aluminium base (1), line layer (3) is pressed together on insulating barrier (2), it is characterized in that, described line layer (3) upper surface is coated with a sensitization white welding resistance ink layer (4).
2. a kind of LED-backlit according to claim 1 source wiring board, is characterized in that: described insulating barrier (2) is for having the anodic oxidation insulating layer of microcellular structure.
3. a kind of LED-backlit according to claim 1 source wiring board, is characterized in that: described line layer (3) comprises basilar memebrane, conducting film and welding film.
4. a kind of LED-backlit according to claim 1 source wiring board, is characterized in that: described line layer (3) is provided with prepackage LED pad.
CN201420046134.2U 2014-01-24 2014-01-24 LED backlight source circuit board Expired - Lifetime CN203691744U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420046134.2U CN203691744U (en) 2014-01-24 2014-01-24 LED backlight source circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420046134.2U CN203691744U (en) 2014-01-24 2014-01-24 LED backlight source circuit board

Publications (1)

Publication Number Publication Date
CN203691744U true CN203691744U (en) 2014-07-02

Family

ID=51013592

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420046134.2U Expired - Lifetime CN203691744U (en) 2014-01-24 2014-01-24 LED backlight source circuit board

Country Status (1)

Country Link
CN (1) CN203691744U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019095287A1 (en) * 2017-11-17 2019-05-23 盐城天顺机械科技有限公司 Fpc provided with heat dissipation structure and used for backlight source
CN113450642A (en) * 2021-07-26 2021-09-28 江西华创触控科技有限公司 Backlight module, manufacturing method thereof, display device and electronic equipment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019095287A1 (en) * 2017-11-17 2019-05-23 盐城天顺机械科技有限公司 Fpc provided with heat dissipation structure and used for backlight source
CN113450642A (en) * 2021-07-26 2021-09-28 江西华创触控科技有限公司 Backlight module, manufacturing method thereof, display device and electronic equipment

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee
CP01 Change in the name or title of a patent holder

Address after: 523115 Guangdong city of Dongguan province Dongguan Jiasheng Dragon Road Industrial Zone Sixth

Patentee after: GUANGDONG HETONG TECHNOLOGY CO.,LTD.

Address before: 523115 Guangdong city of Dongguan province Dongguan Jiasheng Dragon Road Industrial Zone Sixth

Patentee before: HETONG ELECTRONICS Co.,Ltd.

PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of utility model: LED backlight source circuit board

Effective date of registration: 20170919

Granted publication date: 20140702

Pledgee: China Co. truction Bank Corp Dongguan Dongcheng Branch

Pledgor: GUANGDONG HETONG TECHNOLOGY CO.,LTD.

Registration number: 2017440000087

PE01 Entry into force of the registration of the contract for pledge of patent right
CX01 Expiry of patent term

Granted publication date: 20140702

CX01 Expiry of patent term