CN210981597U - Double-induction pressure sensor - Google Patents

Abstract

A double-induction pressure sensor comprises a conductive circuit layer, a first induction layer and a second induction layer, wherein the first induction layer and the second induction layer are respectively arranged on two opposite sides of the conductive circuit layer; the first pin, the second pin and the front circuit are positioned on the same side surface of the substrate and are electrically connected; the substrate is formed with the through-hole, be formed with in the through-hole and lead electrical pillar, third pin, fourth pin and back circuit are located the different sides of substrate and through leading electrical pillar electric connection, the utility model discloses form two response structures respectively at the front with the back, two response structures overlap on the position but do not interfere with each other, and the lead wire of the response structure at the back concentrates on openly through leading electrical pillar, makes things convenient for the unified processing that the lead wire connects out, has also increased the application characteristic of product.

Description

Double-induction pressure sensor

Technical Field

The utility model relates to a sensor technical field especially relates to a two response pressure sensor.

Background

Pressure sensors are typically constructed of a substrate having electrodes and a conductive membrane that are initially spaced apart to form a deformation cavity therebetween. When the pressure sensor is used, the conductive film is pressed to deform and is in contact with the electrode, and along with the increase of the contact area of the conductive film and the electrode, the current between the conductive film and the electrode is increased, so that the output resistance of the sensor is changed, and the relation between the pressure and the output resistance is obtained. With the development of pressure sensors, the applications of the pressure sensors are wider and wider, and the requirements on the pressure sensors are higher and higher. However, the existing pressure sensor has only one sensing function at the same position, and the bending performance is not good, so that the existing pressure sensor cannot adapt to a complex application structure.

Disclosure of Invention

Accordingly, a dual sensing pressure sensor is provided that effectively addresses the above-mentioned problems.

A double-induction pressure sensor comprises a conductive circuit layer, a first induction layer and a second induction layer, wherein the first induction layer and the second induction layer are respectively arranged on two opposite sides of the conductive circuit layer; the first pin, the second pin and the front circuit are positioned on the same side surface of the substrate and are electrically connected; the substrate is provided with a through hole, a conductive column is formed in the through hole, and the third pin, the fourth pin and the back circuit are located on different sides of the substrate and are electrically connected through the conductive column.

Preferably, the center of the substrate is formed with a kerf, the substrate forms an induction area at one side end of the kerf and a lead area at the other side end of the kerf, the front circuit and the back circuit are formed at two opposite side surfaces of the induction area, and the first pin, the second pin, the third pin and the fourth pin are formed at the same side surface of the lead area.

Preferably, the front surface circuit includes a first conductive circuit and a second conductive circuit, the first pin is connected with the first conductive circuit, and the second pin is connected with the second conductive circuit; the back surface circuit comprises a third conductive circuit and a fourth conductive circuit, and the third conductive circuit and the fourth conductive circuit respectively form a connecting end; the number of the through holes is 2, the through holes are formed in the induction area of the base material, a conductive column is formed in each through hole, and each connecting end extends to a through hole and is connected with the conductive column in the through hole; the third pin and the fourth pin extend to a through hole respectively and are connected with the conductive column in the through hole.

Preferably, the base material forms a crack stop hole communicated with the cutting seam at two ends of the cutting seam respectively.

Preferably, a conductive carbon oil layer is further formed on one side surface of the conductive circuit layer, and the conductive carbon oil layer covers the first pin, the second pin, the third pin, the fourth pin and the conductive column.

Preferably, the first sensing layer includes a first sheet and a first sensing film formed on the first sheet, the first sensing film faces the front circuit on the substrate, a first isolation glue is disposed between the first sheet and the substrate, and the first isolation glue is formed with a first through hole corresponding to the first sensing film and a first opening communicating the first through hole with the outside.

Preferably, the second sensing layer includes a second sheet and a second sensing film formed on the second sheet, the second sensing film faces the back circuit on the substrate, a second isolation glue is disposed between the second sheet and the substrate, and the second isolation glue is formed with a second through hole corresponding to the second sensing film and a second opening communicating the second through hole with the outside.

Preferably, the touch screen further comprises a gasket arranged on the first sensing layer and a double-sided adhesive tape arranged between the gasket and the first sensing layer and connecting the gasket and the first sensing layer, wherein the gasket is rubber, silica gel or foam, and the double-sided adhesive tape is an insulating pressure-sensitive double-sided adhesive tape or a heat-sensitive double-sided adhesive tape.

Preferably, the double-sided adhesive tape is attached to one side of the lead area of the substrate, which is opposite to the side where the first pin, the second pin, the third pin and the fourth pin are located, and the double-sided adhesive tape is an insulating pressure-sensitive double-sided adhesive tape or a heat-sensitive double-sided adhesive tape.

Preferably, the sensor further comprises a double-sided adhesive tape attached to the outer side of the second sensing layer, wherein the double-sided adhesive tape is an insulating pressure-sensitive double-sided adhesive tape or a heat-sensitive double-sided adhesive tape.

Compared with the prior art, the utility model discloses two response pressure sensor form two response structures respectively at the front with the back, and two response structures overlap but do not interfere with each other on the position, and the lead wire of the response structure at the back concentrates on openly through leading electrical pillar, makes things convenient for the unified processing that the lead wire connects out, has also increased the application characteristic of product.

Drawings

Fig. 1 is a schematic structural diagram of an embodiment of the dual sensing pressure sensor of the present invention.

Fig. 2 is an exploded view of the dual sensing pressure sensor of fig. 1.

Fig. 3 is a side view of the dual sensing pressure sensor of fig. 1.

Fig. 4 is a schematic diagram illustrating a usage state of the dual sensing pressure sensor shown in fig. 1.

Fig. 5 is a top view of fig. 4.

FIG. 6 is a schematic diagram of the conductive trace layer of the dual sensing pressure sensor of FIG. 2.

Fig. 7 is a schematic backside view of the conductive trace layer.

Fig. 8 is a cross-sectional view taken along line VIII-VIII of fig. 6.

Fig. 9 is an exploded view of the conductive trace layer shown in fig. 6.

Fig. 10 is an exploded view of the first sensing layer of the dual sensing pressure sensor of fig. 2.

Fig. 11 is an exploded view of the second sensing layer of the dual sensing pressure sensor of fig. 2.

Detailed Description

In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. One or more embodiments of the present invention are illustrated in the accompanying drawings to provide a more accurate and thorough understanding of the disclosed embodiments. It should be understood, however, that the present invention may be embodied in many different forms and is not limited to the embodiments described below.

Fig. 1-3 show that the utility model discloses a specific embodiment of two response pressure sensor, shown two response pressure sensor wholly are multilayer thin slice structure, including conducting wire layer 10, set up respectively in the first response layer 20 and the second response layer 30 of the relative both sides of conducting wire layer 10, set up in the first isolation glue 40 between conducting wire layer 10 and first response layer 20 and set up in the second isolation glue 50 between conducting wire layer 10 and second response layer 30.

Referring to fig. 6 to 9, the conductive circuit layer 10 includes a substrate 11, a front circuit 12 and a back circuit 13 respectively formed on two opposite sides of the substrate 11, and a conductive pillar 14 electrically connected to the back circuit 13.

The base material 11 is a sheet-like structure, preferably a thin film flexible material such as PET, PI, FR4 with excellent adhesive force, has good resilience, can be deformed to a certain extent when being pressed, and can be quickly restored to be deformed when not being pressed. As shown in fig. 9, the center of the base material 11 is cut to form a slit 15, and preferably, the slit 15 penetrates the base material 11 in a thickness manner, that is, the base material 11 is broken at the slit 15, so that the bending capability of the base material 11 is enhanced. In this embodiment, the length of the slit 15 is smaller than the width of the base material 11, and two ends of the slit 15 are spaced from the edge of the base material 11. Preferably, two ends of the slit 15 are respectively formed with a crack stop hole 16, and the crack stop hole 16 is communicated with the slit 15, so as to prevent the substrate 11 from forming a tear at the end of the slit 15 when being bent, and affecting the front circuit 12 or the back circuit 13 formed on the substrate 11.

Substrate 11 forms induction zone (the direction shown in fig. 9 is the right side end), opposite side end at one side end formation lead wire district (the direction shown in fig. 9 is the left side end) of lance 15 induction zone forms induction circuit, positive circuit 12 and back circuit 13 promptly, is used for with the utility model discloses two response pressure sensor receive pressure turn into resistance, the lead wire district includes a plurality of pins, including first pin 125, second pin 126, third pin 135 and fourth pin 136 for be connected with external circuit, output resistance during the use, the utility model discloses two response pressure sensor can be as the smooth state that fig. 1 is shown, also can bend certain angle in order to adapt to some special application environment, as shown in fig. 4, fig. 5, the utility model discloses when two response pressure sensor need bend, follow lance 15 position department bends, and its angle of bending can be bigger, and induction zone can bend about 90 degrees relatively the lead wire district, makes the utility model discloses two response pressure sensor be L shape.

The front surface circuit 12 and the back surface circuit 13 are formed on two opposite sides of the substrate 11 by printing, etching, electroplating, spraying, and the like, and are preferably conductive silver paste circuits. As shown in fig. 6 and 9, the front surface circuit 12 includes a first conductive trace 121 and a second conductive trace 122 disposed opposite to each other, and the first conductive trace 121 and the second conductive trace 122 are both in a comb shape and meshed with each other without contacting each other. As shown in fig. 7 and 9, the back circuit 13 includes a third conductive trace 131 and a fourth conductive trace 132 disposed opposite to each other, and the third conductive trace 131 and the fourth conductive trace 132 are both in a comb shape and meshed with each other without contact.

The first conductive trace 121 extends toward the lead pad to form a first lead 123, and the second conductive trace 122 extends toward the lead pad to form a second lead 124. The first lead 123 and the second lead 124 respectively extend to the edge of the lead area along two side edges of the substrate 11, the end of the first lead 123 forms the first lead 125, and the end of the second lead 124 forms the second lead 126. A third lead 133 and a fourth lead 134 are further formed on the front surface of the substrate 11 through printing, coating and other processes, the third lead 133 and the fourth lead 134 are arranged at intervals and are located between the first lead 124 and the second lead 124, the third lead 135 is formed at the end of the third lead 133, and the fourth lead 136 is formed at the end of the fourth lead 134. The first pins 125, the third pins 135, the fourth pins 136 and the second pins 126 are arranged in a row, and the third pins 135 and the fourth pins 136 are located between the first pins 125 and the second pins 126 and are spaced apart from each other uniformly.

The substrate 11 is formed with a through hole 17 penetrating in the thickness direction, and the through hole 17 is located in the sensing region of the substrate 11. The conductive post 14 is optionally conductive silver paste, and is formed on the wall surface of the substrate 11 surrounding the through hole 17 through printing, coating, and other processes. In this embodiment, two conductive pillars 14 are disposed at a certain distance, and correspondingly, two through holes 17 are provided. The other ends of the third lead 133 and the fourth lead 134 extend to one of the through holes 17 and are connected to the conductive pillars 14 in the through holes 17. The third conductive trace 131 and the fourth conductive trace 132 of the back surface trace 13 respectively extend to connect ends 137 and 138, and the two connect ends 137 and 138 respectively extend to the two through holes 17 and are respectively connected to the conductive pillars 14 in the two through holes 17. Thus, the third conductive trace 131 of the back trace 13 is connected to and electrically connected to the third lead 133, and the fourth conductive trace 132 is connected to and electrically connected to the fourth lead 134.

The utility model discloses lamellar materials such as the fine PET of the preferred pliability of two response pressure sensor's substrate 11, PI, FR4 make conducting wire layer 10 can be fine emergence deformation and reconversion under the pressure effect. The front surface of the substrate 11 forms a front surface circuit 12, the first conductive circuit 121 and the second conductive circuit 122 are separately disposed, and the resistance between the first pin 125 and the second pin 126 is infinite; the back surface of the substrate 11 forms the back surface circuit 13, the third conductive trace 131 and the fourth conductive trace 132 are separately disposed, and the resistance between the third pin 135 and the fourth pin 136 is infinite. In this embodiment, the back circuit 13 at the back of the substrate 11 is communicated with the third pin 135 and the fourth pin 136 at the front of the substrate 11 through the conductive column 14, so the utility model discloses all pins 125, 126, 135, 136 that the double-induction pressure sensor is connected with the external circuit are all located the same side of the substrate 11, make things convenient for the wiring in the follow-up application. Preferably, a conductive carbon oil layer 18 is further formed on the front surface of the substrate 11 by printing, spraying, and the like, and the conductive carbon oil layer 18 covers the first, second, third, and fourth pins 125, 126, 135, 136 and the two conductive posts 14 to protect them.

As shown in fig. 10, the first sensing layer 20 is stacked on the front surface of the sensing region of the substrate 11, and includes a first sheet 22 and a first sensing film 24 formed on the first sheet 22. The first sheet 22 is preferably a thin film flexible material with excellent adhesion, such as PET, PI, FR4, and the first sensing film 24 is preferably a carbon oil resistance film, and is formed on the first sheet 22 by printing, coating, or the like. The first sheet 22 has an outline conforming to an outline of the sensing region of the base material 11, and the first sensing film 24 is formed in the center of the first sheet 22. In this embodiment, the first sensing film 24 is circular and disposed facing the front surface circuit 12 of the substrate 11. The first isolation adhesive 40 is disposed between the first sheet 22 of the first sensing layer 20 and the substrate 11 of the conductive trace layer 10, and is preferably an insulating double-sided adhesive, and functions to adhere the first sheet 22 to the substrate 11 and isolate the first sensing film 24 from the front trace 12.

A first through hole 42 is formed in the center of the first isolation adhesive 40, and the position and size of the first through hole 42 correspond to the first sensing film 24. When the front circuit board is assembled, the first through hole 42 faces the first sensing film 24, so that the first isolation glue 40 separates the front circuit board 12 from the first sensing film 24, and the first through hole 42 forms a deformation space between the front circuit board 12 and the first sensing film 24. Preferably, the first isolation adhesive 40 is formed with a first opening 44, and the first opening 44 communicates the first through hole 42 with the outside, so that the pressure in the deformation space is always consistent with the outside, and thus the deformation of the first sensing layer 20 is more accurate when the force is applied, and the recovery after the force is removed is also faster.

As shown in fig. 11, the second sensing layer 30 is stacked on the back surface of the sensing region of the substrate 11, and includes a second sheet 32 and a second sensing film 34 formed on the second sheet 32. The second sheet 32 is preferably a thin film flexible material such as PET, PI, FR4 with good adhesion, and the second sensing film 34 is preferably a carbon oil resistance film, and is formed on the second sheet 32 by printing, coating, or the like. The second sheet 32 has an outline conforming to an outline of the sensing region of the substrate 11, and the second sensing film 34 is formed in the center of the second sheet 32. In this embodiment, the second sensing film 34 is circular and disposed facing the back circuit 13 of the substrate 11. The second isolation adhesive 50 is disposed between the second sheet 32 of the second sensing layer 30 and the substrate 11 of the conductive trace layer 10, and is preferably an insulating double-sided adhesive, and functions to adhere the second sheet 32 to the substrate 11 and isolate the second sensing film 44 from the back trace 13.

A second through hole 52 is formed in the center of the second isolation glue 50, and the position and size of the second through hole 52 correspond to those of the second sensing film 34. When the circuit board is assembled, the second through hole 52 faces the second sensing film 34, so that the second isolation glue 50 separates the back circuit 13 from the second sensing film 34, and the second through hole 52 forms a deformation space between the back circuit 13 and the second sensing film 34. Preferably, the second opening 54 is formed in the second isolation adhesive 50, and the second opening 54 communicates the second through hole 52 with the outside, so that the pressure in the deformation space is always consistent with the outside, and thus the deformation of the second sensing layer 30 is more accurate when the force is applied, and the recovery after the force is removed is faster.

The utility model discloses two response pressure sensor openly form positive circuit 12 and the first response layer 20 of collocation constitutes first response structure, form back circuit 13 and the second response layer 30 of collocation constitutes the second response structure at the back simultaneously, form two response functions, increase the product application characteristic. In use, if the front first sensing layer 20 is pressed, the first sensing film 24 is deformed to contact the front trace 12, so that the first conductive trace 121 and the second conductive trace 122 are electrically connected. The larger the pressure on the first sensing layer 20 is, the larger the deformation of the first sensing film 24 is, and the larger the contact area between the first conductive trace 121 and the second conductive trace 122 is, so that the output resistance between the first lead 125 and the second lead 126 is smaller, thereby obtaining the corresponding relationship between the pressure and the resistance. Similarly, if the second sensing layer 30 on the back side is pressed, the second sensing film 34 is deformed to contact the back side circuit 13, so that the third conductive traces 131 and the fourth conductive traces 132 are electrically connected. The larger the second sensing layer 30 is pressed, the larger the deformation of the second sensing film 34, the larger the contact area with the third conductive trace 131 and the fourth conductive trace 132, and thus the smaller the output resistance between the third lead 135 and the fourth lead 136.

Preferably, as shown in fig. 2 and 3, the utility model discloses still be provided with flexible glue gasket 60 on two response pressure sensor's the first response layer 20, flexible glue gasket 60 can be soft sheet such as rubber, silica gel, bubble cotton, perhaps with the range upon range of alternate use of hard sheet, make the utility model discloses can directly effectually transmit the induction zone again when two response pressure sensor receive pressure evenly distributed. The soft glue pad 60 is connected to the first sheet 22 of the first sensing layer 20 through a double-sided adhesive tape 70, and the double-sided adhesive tape 70 is preferably an insulating pressure-sensitive double-sided adhesive tape or a heat-sensitive double-sided adhesive tape.

Preferably, as shown in fig. 2 and 3, double- sided tapes 80 and 82 are respectively attached to the outer side surface of the second sheet 32 of the second sensing layer 30 and the back surface of the lead area of the substrate 11, and the double- sided tapes 80 and 82 are preferably insulating pressure-sensitive double-sided tapes or heat-sensitive double-sided tapes for connecting the dual-sensing pressure sensor with other devices. As shown in fig. 3-4, when the dual sensor pressure sensor of the present invention is bent by 90 degrees, the sensing area is fixed by the double-sided tape 80 on the second sheet 32, and the lead area is fixed by the double-sided tape 82 on the back of the lead area of the substrate 10, so that the sensing area and the lead area are kept in a substantially vertical state for the intelligent pressure-sensitive pen, etc.

The utility model discloses two response pressure sensor form two response structures respectively at the front with the back, and two response structures overlap but do not interfere with each other in the position, and the lead wire of the response structure at the back concentrates on openly through leading electrical pillar 14, makes things convenient for the unified processing that the lead wire connects out, has also increased the application characteristic of product. Additionally, the utility model discloses two response pressure sensor form joint-cutting 15 and form at joint-cutting 15's both ends and stop the crack hole 16 on substrate 11, conveniently carry out 90 degrees and bend and not fragile, make the product be fit for more complicated application environment.

It should be noted that the present invention is not limited to the above embodiments, and other changes can be made by those skilled in the art according to the spirit of the present invention, and all the changes made according to the spirit of the present invention should be included in the scope of the present invention.

Claims (10)

1. The utility model provides a two response pressure sensor, includes the conducting wire layer and sets up respectively in the first response layer and the second response layer of the relative both sides on conducting wire layer, its characterized in that: the conductive circuit layer comprises a substrate, a front circuit and a back circuit which are respectively formed on two opposite side surfaces of the substrate, and a first pin, a second pin, a third pin and a fourth pin which are formed on the same side surface of the substrate; the first pin, the second pin and the front circuit are positioned on the same side surface of the substrate and are electrically connected; the substrate is provided with a through hole, a conductive column is formed in the through hole, and the third pin, the fourth pin and the back circuit are located on different sides of the substrate and are electrically connected through the conductive column.

2. The dual sensing pressure sensor of claim 1, wherein the substrate has a slit formed at a center thereof, the substrate has a sensing area formed at one side of the slit and a lead area formed at the other side of the slit, the front and back traces are formed at opposite sides of the sensing area, and the first, second, third and fourth leads are formed at a same side of the lead area.

3. The dual sensing pressure sensor of claim 2, wherein the front side traces include a first conductive trace and a second conductive trace, the first leads being connected to the first conductive trace and the second leads being connected to the second conductive trace; the back surface circuit comprises a third conductive circuit and a fourth conductive circuit, and the third conductive circuit and the fourth conductive circuit respectively form a connecting end; the number of the through holes is 2, the through holes are formed in the induction area of the base material, a conductive column is formed in each through hole, and each connecting end extends to a through hole and is connected with the conductive column in the through hole; the third pin and the fourth pin extend to a through hole respectively and are connected with the conductive column in the through hole.

4. The dual sensor pressure sensor of claim 2, wherein the substrate defines a crack stop hole at each end of the slit in communication with the slit.

5. The dual sensing pressure sensor of claim 1, wherein a conductive carbon oil layer is further formed on a side of the conductive trace layer, and the conductive carbon oil layer covers the first pin, the second pin, the third pin, the fourth pin, and the conductive post.

6. The dual sensing pressure sensor of claim 1, wherein the first sensing layer comprises a first sheet and a first sensing film formed on the first sheet, the first sensing film faces the front trace on the substrate, a first isolation adhesive is disposed between the first sheet and the substrate, and the first isolation adhesive is formed with a first through hole corresponding to the first sensing film and a first opening communicating the first through hole with the outside.

7. The dual sensing pressure sensor of claim 1, wherein the second sensing layer comprises a second sheet and a second sensing film formed on the second sheet, the second sensing film faces the back trace on the substrate, a second isolation adhesive is disposed between the second sheet and the substrate, and the second isolation adhesive is formed with a second through hole corresponding to the second sensing film and a second opening communicating the second through hole with the outside.

8. The dual sensing pressure sensor of claim 1, further comprising a spacer disposed on the first sensing layer, and a double-sided tape disposed between and connecting the spacer and the first sensing layer, wherein the spacer is rubber, silica gel, or foam, and the double-sided tape is an insulating pressure-sensitive double-sided tape or a thermal double-sided tape.

9. The dual sensor pressure sensor of claim 1, further comprising a double-sided tape attached to a side of the substrate where the lead area faces away from the first, second, third, and fourth pins, wherein the double-sided tape is an insulating pressure-sensitive double-sided tape or a heat-sensitive double-sided tape.

10. The dual sensing pressure sensor of claim 1, further comprising a double-sided adhesive tape affixed to an outer side of the second sensing layer, the double-sided adhesive tape being an insulative pressure sensitive double-sided adhesive tape or a heat sensitive double-sided adhesive tape.

Images