CN218603717U

CN218603717U - FPC (flexible printed circuit) board of mobile phone

Info

Publication number: CN218603717U
Application number: CN202222617682.3U
Authority: CN
Inventors: 傅仁森
Original assignee: Jiangmen Xiaoge Innovation Electronic Technology Co ltd
Current assignee: Jiangmen Xiaoge Innovation Electronic Technology Co ltd
Priority date: 2022-09-29
Filing date: 2022-09-29
Publication date: 2023-03-10
Anticipated expiration: 2032-09-29

Abstract

The utility model relates to a circuit board technical field specifically discloses a cell-phone FPC circuit board, including the FPC base plate, the front of FPC base plate is provided with first dew copper district, be provided with the wiring district in the FPC base plate, the back of FPC base plate is provided with gum district and a plurality of second dew copper district, all be provided with the gold-plated layer on first dew copper district and the second dew copper district, be provided with the copper foil layer in the wiring district, be provided with gum layer in the gum district, the gold-plated layer with copper foil layer electric connection. The utility model discloses a set up first dew copper district and second respectively at the front of FPC base plate and the back and dew the copper district, make things convenient for the circuit wiring, the circuit is walked the line and is rationally distributed to occupation space is less, and thickness is less, and it is more convenient to assemble, can improve production efficiency.

Description

FPC (flexible printed circuit) board of mobile phone

Technical Field

The utility model relates to a circuit board technical field, in particular to cell-phone FPC circuit board.

Background

FPC/FPC boards, also called flexible circuit boards/flexible wiring boards; because it is flexible and bendable, it can be widely used in various small electric devices, such as mobile phones, battery modules, etc. It is seen that the FPC board can be bent, and is deformed to some extent in its thickness direction when bent. In the manufacturing process of the mobile phone, a double-sided FPC (flexible printed circuit) board is generally used. However, the circuit wiring layout in the existing double-sided FPC board is unreasonable, the thickness is large, the occupied space is large, the assembly is inconvenient, and the production efficiency is reduced.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model lies in, to the above-mentioned defect of prior art, provide a cell-phone FPC circuit board, through setting up first dew copper district and second respectively at the front and the back of FPC base plate and dew the copper district, make things convenient for the circuit wiring, the circuit is walked the line and is rationally distributed to occupation space is less, and thickness is less, and it is more convenient to assemble, can improve production efficiency.

In order to solve the technical problem, the technical scheme of the utility model is that:

the utility model provides a cell-phone FPC circuit board, includes the FPC base plate, the front of FPC base plate is provided with first dew copper district, be provided with the wiring district in the FPC base plate, the back of FPC base plate is provided with back of the body and glues district and a plurality of second dew copper district, all be provided with the gold-plated layer on first dew copper district and the second dew copper district, be provided with the copper foil layer on the wiring district, be provided with the gum layer on the back of the body gluey district, the gold-plated layer with copper foil layer electric connection.

Preferably, the FPC base plate includes weld part, joint portion and extension, weld part and joint portion all with the extension integration is connected, seted up the circular through-hole of a plurality of on the extension, a draw-in groove has been seted up between weld part and the extension.

Preferably, the width of joint portion is 2.9mm, the length of welding part is 5.2mm, the length of FPC base plate is 35.1mm, the width of extension is 4.7mm.

Preferably, the wiring areas include a first wiring area, a second wiring area and a third wiring area, and the second wiring area is connected to the first wiring area and the third wiring area, respectively.

Preferably, the thickness of the copper foil layer is 0.5oz, and the back adhesive layer is provided with a plurality of dividing lines.

Preferably, a release paper layer is arranged on the front surface of the FPC substrate, and the gold-plated layer is welded on the copper foil layer.

Adopt above-mentioned technical scheme, the utility model provides a pair of cell-phone FPC circuit board has following beneficial effect: the front of the FPC base plate in this cell-phone FPC circuit board is provided with first dew copper district, is provided with the wiring district in the FPC base plate, and the back of FPC base plate is provided with back of the body and glues district and a plurality of second dew copper district, all is provided with the gold-plated layer on first dew copper district and the second dew copper district, is provided with the copper foil layer in the wiring district, is provided with the gum layer on the back of the body district, the gold-plated layer with copper foil layer electric connection through setting up first dew copper district and second dew copper district respectively at the front and the back of FPC base plate, makes things convenient for the circuit wiring, and the circuit is walked the line and is rationally distributed to can furthest save circuit layout space, occupation space is less, and thickness is less, and it is more convenient to assemble, can improve production efficiency.

Drawings

Fig. 1 is a schematic front structural view of the present invention;

fig. 2 is a schematic view of the back structure of the present invention;

fig. 3 is a cross-sectional view of the present invention;

in the figure, 1-FPC substrate, 2-first copper exposing area, 3-wiring area, 4-back glue area, 5-second copper exposing area, 6-gold plating layer, 7-copper foil layer, 8-back glue layer, 9-welding part, 10-clamping part, 11-extending part, 12-round through hole, 13-clamping groove, 14-first wiring area, 15-second wiring area, 16-third wiring area, 17-dividing line and 18-release paper layer.

Detailed Description

The following description will further explain embodiments of the present invention with reference to the drawings. It should be noted that the description of the embodiments is provided to help understanding of the present invention, but the present invention is not limited thereto. In addition, the technical features related to the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship indicated based on the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless explicitly defined otherwise.

As shown in fig. 1, in the structure diagram of the utility model, combine fig. 1 and fig. 2 to know, this cell-phone FPC circuit board includes FPC base plate 1, this FPC base plate 1's front is provided with first dew copper district 2, be provided with wiring district 3 in this FPC base plate 1, this FPC base plate 1's the back is provided with gum district 4 and a plurality of second dew copper district 5, all be provided with gold-plated layer 6 on this first dew copper district 2 and the second dew copper district 5, be provided with copper foil layer 7 on this wiring district 3, be provided with gum layer 8 on this gum district 4, this gold-plated layer 6 and this copper foil layer 7 electric connection. It can be understood that the FPC substrate 1 includes a soldering portion 9, a clipping portion 10 and an extending portion 11, the soldering portion 9 and the clipping portion 10 are integrally connected to the extending portion 11, the extending portion 11 is provided with a plurality of circular through holes 12, and a clipping slot 13 is provided between the soldering portion 9 and the extending portion 11; the width of the clamping portion 10 is 2.9mm, the length of the welding portion 9 is 5.2mm, the length of the FPC substrate 1 is 35.1mm, and the width of the extending portion 11 is 4.7mm.

Specifically, fig. 3 is a cross-sectional view of the present invention, and it can be known from fig. 1, fig. 2 and fig. 3 that the wiring area 3 includes a first wiring area 14, a second wiring area 15 and a third wiring area 16, and the second wiring area 15 is connected to the first wiring area 14 and the third wiring area 16 respectively; the thickness of the copper foil layer 7 is 0.5oz, and a plurality of dividing lines 17 are arranged on the back adhesive layer 8; the front surface of the FPC board 1 is provided with a release paper layer 18, and the gold-plating layer 6 is welded to the copper foil layer 7. As can be understood, the FPC substrate adopts PT base material, and the thickness of the finished product is 0.1mm; color/surface treatment: black ink on two sides and white silk screen printing; and performing gold plating treatment on the copper exposed area, wherein a back glue layer on the back surface adopts 3M9471 back glue.

It can be understood that the utility model relates to a rationally, the structure is unique, through setting up first dew copper district 2 and second respectively at FPC base plate 1's front and back and dew copper district 5, makes things convenient for the circuit wiring, and the circuit is walked the line and is rationally distributed to can furthest save circuit layout space, occupation space is less, and thickness is less, and it is more convenient to assemble, can improve production efficiency.

The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. It will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made in the embodiments without departing from the principles and spirit of the invention, and the scope of the invention is to be accorded the full scope of the claims.

Claims

1. The utility model provides a cell-phone FPC circuit board, includes the FPC base plate, its characterized in that: the front of FPC base plate is provided with first dew copper district, be provided with the wiring district in the FPC base plate, the back of FPC base plate is provided with back of the body and glues district and a plurality of second dew copper district, all be provided with the gold-plated layer on first dew copper district and the second dew copper district, be provided with the copper foil layer in the wiring district, be provided with the gum layer in the back of the body district, the gold-plated layer with copper foil layer electric connection.

2. The FPC board of the mobile phone of claim 1, wherein: the FPC base plate includes weld part, joint portion and extension, weld part and joint portion all with the extension integration is connected, the circular through-hole of a plurality of has been seted up on the extension, a draw-in groove has been seted up between weld part and the extension.

3. The FPC board of the mobile phone of claim 2, wherein: the width of joint portion is 2.9mm, the length of welding part is 5.2mm, the length of FPC base plate is 35.1mm, the width of extension is 4.7mm.

4. The FPC board of the mobile phone of claim 1, wherein: the wiring district includes first wiring district, second wiring district and third wiring district, the second wiring district respectively with first wiring district and third wiring district are connected.

5. The FPC board of the mobile phone of claim 1, wherein: the thickness of the copper foil layer is 0.5oz, and the back adhesive layer is provided with a plurality of dividing lines.

6. The FPC board of the mobile phone of claim 1, wherein: the front surface of the FPC substrate is provided with a release paper layer, and the gold-plated layer is welded on the copper foil layer.