CN218603709U

CN218603709U - NFC double-sided circuit board

Info

Publication number: CN218603709U
Application number: CN202222617686.1U
Authority: CN
Inventors: 傅仁森
Original assignee: Jiangmen Xiaoge Innovation Electronic Technology Co ltd
Current assignee: Jiangmen Xiaoge Innovation Electronic Technology Co ltd
Priority date: 2022-09-29
Filing date: 2022-09-29
Publication date: 2023-03-10
Anticipated expiration: 2032-09-29

Abstract

The utility model relates to a circuit board technical field specifically discloses a NFC double-sided circuit board, include positive printing ink layer, positive circuit layer, substrate layer, reverse side circuit layer, reverse side printing ink layer, gum layer that top-down is in proper order and leave the type rete, positive circuit layer respectively with positive printing ink layer and substrate layer connection, reverse side circuit layer is connected with substrate layer and reverse side printing ink layer respectively, the gum layer respectively with reverse side printing ink layer and leave the type rete connection, be provided with the electroplating pad on the positive circuit layer, positive circuit layer respectively with reverse side circuit layer and electroplating pad electric connection. The utility model discloses a be provided with electroplating pad on positive circuit layer, positive circuit layer respectively with reverse side circuit layer and electroplating pad electric connection, the circuit is walked the line and is rationally distributed, it is more convenient to use to the structure is comparatively simple, and the cost of manufacture is lower.

Description

NFC double-sided circuit board

Technical Field

The utility model relates to a circuit board technical field, in particular to NFC double-sided circuit board.

Background

FPC/FPC board, also called flexible circuit board/flexible wiring board; because it is flexible and bendable, it can be widely used in various small electric devices, such as mobile phones, battery modules, etc. It can be seen that the FPC board can be bent, and some deformation occurs in the thickness direction thereof when bent. The adoption of flexible circuit boards to replace the original aluminum-based hard circuit boards has become a new direction for the development of the electronic and electrical element industry and the circuit board industry. The NFC antenna is generally used in the manufacturing process of the existing mobile phone, and the coil of the NFC antenna is generally fixed through a flexible circuit board with a double-sided structure in order to facilitate layout and reduce thickness. However, the circuit routing layout in the existing flexible circuit board with the double-sided structure is unreasonable, the circuit structure is more complex, and the manufacturing cost is high.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model lies in, to the above-mentioned defect of prior art, provide a NFC double-sided circuit board, through be provided with electroplating pad on positive circuit layer, positive circuit layer respectively with reverse side circuit layer and electroplating pad electric connection, the circuit is walked the line and is rationally distributed, it is more convenient to use to the structure is comparatively simple, and the cost of manufacture is lower.

In order to solve the technical problem, the technical scheme of the utility model is that:

the utility model provides a NFC double-sided circuit board, includes positive printing ink layer, positive circuit layer, substrate layer, reverse side circuit layer, reverse side printing ink layer, gum layer that top-down was in proper order and leaves the type rete, positive circuit layer respectively with positive printing ink layer and substrate layer connection, reverse side circuit layer is connected with substrate layer and reverse side printing ink layer respectively, the gum layer respectively with reverse side printing ink layer and leave the type rete and be connected, be provided with on the positive circuit layer and electroplate the pad, positive circuit layer respectively with reverse side circuit layer and electroplate pad electric connection.

Preferably, a foam layer is arranged on the front ink layer, and the thickness of the foam layer is 0.12mm.

Preferably, the thickness on positive printing ink layer and reverse side printing ink layer is 15um, the thickness on positive circuit layer and reverse side circuit layer is 18um, the thickness of substrate layer is 12.5um, the gum layer reaches the thickness of leaving the type rete and is 13um.

Preferably, the front surface circuit layer comprises a first front surface wiring terminal, an inner ring circuit and a second front surface wiring terminal, one end of the inner ring circuit is electrically connected with the first wiring terminal, and the electroplating bonding pads are welded on the first front surface wiring terminal and the second front surface wiring terminal.

Preferably, the back side circuit layer includes a back side circuit, the other end of the inner ring circuit is electrically connected to one end of the back side circuit, and the other end of the back side circuit is electrically connected to the second front side connection terminal.

Preferably, the edge of substrate layer respectively with the edge of positive printing ink layer, reverse printing ink layer and gum layer aligns from top to bottom, interior ring circuit follows the edge of substrate layer encircles the setting, the outside of interior ring circuit with the distance at the edge of substrate layer is 0.15mm-0.45mm.

Adopt above-mentioned technical scheme, the utility model provides a pair of NFC double-sided circuit board has following beneficial effect: the front circuit layer in this NFC double-sided circuit board is connected with front printing ink layer and substrate layer respectively, reverse side circuit layer is connected with substrate layer and reverse side printing ink layer respectively, the gum layer respectively with reverse side printing ink layer and from the type membrane layer to be connected, be provided with the electroplating pad on the front circuit layer, front circuit layer respectively with reverse side circuit layer and electroplating pad electric connection, through be provided with the electroplating pad on front circuit layer, front circuit layer respectively with reverse side circuit layer and electroplating pad electric connection, thereby make things convenient for the wiring, the circuit is walked the line and is rationally distributed, it is more convenient to use, and the structure is comparatively simple, and the production cost is reduced, and the production cost is lower.

Drawings

Fig. 1 is an exploded view of the present invention;

FIG. 2 is a schematic front sectional view of the present invention;

FIG. 3 is a schematic view of the cross-sectional structure of the utility model;

FIG. 4 is an enlarged schematic view of the structure at A in FIG. 2;

in the figure, 1-a front side ink layer, 2-a front side circuit layer, 3-a base material layer, 4-a back side circuit layer, 5-a back side ink layer, 6-a back glue layer, 7-a release film layer, 8-an electroplating pad, 9-a foam layer, 10-a first front side wiring terminal, 11-an inner ring circuit, 12-a second front side wiring terminal and 13-an electrogilding lead.

Detailed Description

The following description will further explain embodiments of the present invention with reference to the drawings. It should be noted that the description of the embodiments is provided to help understanding of the present invention, but the present invention is not limited thereto. In addition, the technical features related to the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship indicated based on the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

As shown in fig. 1, the utility model discloses an in the decomposition drawing, this NFC double-sided circuit board includes positive printing ink layer 1 that top-down is in proper order, positive circuit layer 2, the substrate layer 3, reverse side circuit layer 4, reverse side printing ink layer 5, gum layer 6 reaches from type rete 7, this positive circuit layer 2 is connected with positive printing ink layer 1 and substrate layer 3 respectively, this reverse side circuit layer 4 is connected with substrate layer 3 and reverse side printing ink layer 5 respectively, this gum layer 6 respectively with reverse side printing ink layer 5 and from type rete 7 be connected, be provided with electroplating pad 8 on this positive circuit layer 2, this positive circuit layer 2 respectively with this reverse side circuit layer 4 and electroplating pad 8 electric connection. It can be understood that the thickness of this positive printing ink layer 1 and reverse printing ink layer 5 is 15um, and the thickness of this positive circuit layer 2 and reverse circuit layer 4 is 18um, and the thickness of this substrate layer 3 is 12.5um, and this gum layer 6 and the thickness of leaving type rete 7 are 13um. The front ink layer 1 and the back ink layer 5 can be made of black matt ink materials, the front circuit layer 2, the back circuit layer 4 and the electroplating pad 8 can be made of copper or nickel materials, the substrate layer 3 can be made of PI (polyimide) substrates, the back adhesive layer 6 can be made of double-sided adhesive, and the release film layer 7 can be made of release films.

Specifically, fig. 2 is a schematic front sectional structural view of the present invention, and it can be known from fig. 1, fig. 2, fig. 3 and fig. 4 that the front ink layer 1 is provided with a foam layer 9, and the thickness of the foam layer 9 is 0.12mm; the front surface circuit layer 2 comprises a first front surface wiring terminal 10, an inner ring circuit 11 and a second front surface wiring terminal 12, one end of the inner ring circuit 11 is electrically connected with the first wiring terminal 10, and the electroplating bonding pad 8 is welded on the first front surface wiring terminal 10 and the second front surface wiring terminal 12; the back side circuit layer 4 includes a back side circuit, the other end of the inner ring circuit 11 is electrically connected to one end of the back side circuit, and the other end of the back side circuit is electrically connected to the second front side connection terminal 12. As can be understood, an electrogold lead 13 is welded on the upper right of the inner-ring line 11; the edge of the substrate layer 3 aligns with the edge of the front ink layer 1, the back ink layer 5 and the back adhesive layer 6 from top to bottom respectively, the inner ring line 11 is arranged around the edge of the substrate layer 3, and the distance between the outer side of the inner ring line 11 and the edge of the substrate layer 3 is 0.15mm-0.45mm.

As can be understood, the utility model has the advantages of reasonable design and unique structure, the electroplating bonding pad 8 is arranged on the front circuit layer 2, and the front circuit layer 2 is respectively electrically connected with the reverse circuit layer 4 and the electroplating bonding pad 8, so that the wiring is convenient, the circuit wiring layout is reasonable, and the use is more convenient; and this NFC double-sided circuit board top-down comprises positive printing ink layer 1, positive circuit layer 2, substrate layer 3, reverse side circuit layer 4, reverse side printing ink layer 5, gum layer 6 and from type rete 7 in proper order, and the structure is comparatively simple, can reduce the cost of manufacture, and the cost of manufacture is lower.

The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. It will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made in the embodiments without departing from the principles and spirit of the invention, and these embodiments are still within the scope of the invention.

Claims

1. The utility model provides a two-sided circuit board of NFC which characterized in that: including positive printing ink layer, positive circuit layer, substrate layer, reverse side circuit layer, reverse side printing ink layer, gum layer in proper order and from the type rete, positive circuit layer is connected with positive printing ink layer and substrate layer respectively, reverse side circuit layer is connected with substrate layer and reverse side printing ink layer respectively, the gum layer is connected with reverse side printing ink layer and from the type rete respectively, be provided with on the positive circuit layer and electroplate the pad, positive circuit layer respectively with reverse side circuit layer and electroplate pad electric connection.

2. The NFC two-sided wiring board of claim 1, wherein: the front ink layer is provided with a foam layer, and the thickness of the foam layer is 0.12mm.

3. The NFC dual-sided wiring board of claim 1, wherein: the thickness on positive printing ink layer and reverse side printing ink layer is 15um, the thickness on positive circuit layer and reverse side circuit layer is 18um, the thickness of substrate layer is 12.5um, the gum layer and the thickness from the type rete are 13um.

4. The NFC two-sided wiring board of claim 1, wherein: the front circuit layer comprises a first front wiring terminal, an inner ring circuit and a second front wiring terminal, one end of the inner ring circuit is electrically connected with the first front wiring terminal, and the electroplating welding disc is welded on the first front wiring terminal and the second front wiring terminal.

5. The NFC dual-sided wiring board of claim 4, wherein: the reverse side circuit layer comprises a reverse side circuit, the other end of the inner ring circuit is electrically connected with one end of the reverse side circuit, and the other end of the reverse side circuit is electrically connected with the second front side wiring terminal.

6. The NFC dual-sided wiring board of claim 4, wherein: the edge of substrate layer respectively with the edge of positive printing ink layer, reverse side printing ink layer and gum layer aligns from top to bottom, interior ring circuit follows the edge of substrate layer encircles the setting, the outside of interior ring circuit with the distance at the edge of substrate layer is 0.15mm-0.45mm.