CN103327731B - A kind of structure for strengthening electronic circuit surface contact strength - Google Patents
A kind of structure for strengthening electronic circuit surface contact strength Download PDFInfo
- Publication number
- CN103327731B CN103327731B CN201310206179.1A CN201310206179A CN103327731B CN 103327731 B CN103327731 B CN 103327731B CN 201310206179 A CN201310206179 A CN 201310206179A CN 103327731 B CN103327731 B CN 103327731B
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- China
- Prior art keywords
- electronic circuit
- circuit body
- conductive
- sheet metal
- surface contact
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Abstract
The invention discloses a kind of structure for strengthening electronic circuit surface contact strength, for in communication products, the structure includes the reinforcement material of electronic circuit body and uniform fold on the electronic circuit body, electronic circuit body is connected with mainboard so as to pass through the reinforcement material；Wherein, reinforcement material in the reinforcement electronic circuit surface contact strength structure can be respectively sheet metal, conductive double-sided tape, conductive glue etc., and reinforcement material can also be the mode that sheet metal and both conductive double-sided tape or conductive glue combine, make the sheet metal and electronic circuit body to be connected by conductive double-sided tape or conductive glue, so that electronic circuit body is not damaged by when connection with other parts, and greatly promote the contact stabilization of structure.
Description
Technical field
The present invention relates to the communications field, more particularly to a kind of structure for strengthening electronic circuit surface contact strength.
Background technology
It is with developing rapidly for communication technology, very rapid for the renewal of antenna part, from external to built-in, wherein,
Metal elastic piece type antenna, FPC/PCB antennas, printed antenna and LDS（Laser Direct structuring, laser straight are connected into
Type）Preparing for antenna is more and more.The particularly fast development of radio communication in recent years, mobile terminal occupy it is very big predominantly
Position.Especially mobile terminal and becomes as the communication antenna of mobile terminal progressively to miniaturization, intelligent fast-developing
It is of crucial importance.
In current mobile terminal product, particularly in circuit (PPA, Pad made by printing bat printing electrically conductive ink
Print Antenna) making in, the material of the electronic circuit for being used is generally nanometer silver and makes, as the material compares
It is soft so as to which that the electronic circuit of making is easily damaged when being contacted with the contact point on Mobile terminal main board, so as to cause electronics
Contact failure between circuit and mainboard.
However, in the conventional products of prior art, being to solve this contact of circuit (PPA) made by bat printing electrically conductive ink
The problem of failure, using soft conductive material coupling usually in this kind of way of contact, such as with conducting foam by two
Person is fixedly connected, although however, when this connected mode can avoid both from contacting electronic circuit damage, due to conduction
After foam connection, contact resistance is larger each other, and electrical property is unstable, is unfavorable for the transmitting of signal of communication.
Therefore, it is necessary to propose a kind of structure for strengthening electronic circuit surface contact strength, solve in prior art because
Electronic circuit loose contact and a series of impacts for producing.
The content of the invention
In order to overcome the defect of prior art, the present invention is intended to provide a kind of processing technology is simple, electric conductivity is well strengthened
The structure of electronic circuit surface contact strength.
To achieve these goals, the invention provides a kind of structure for strengthening electronic circuit surface contact strength, should add
The structure of forceful electric power sub-line road surfaces contact strength includes electronic circuit body and uniform fold on the electronic circuit body
Reinforcement material, the structure for strengthening electronic circuit surface contact strength and other parts are connected by the reinforcement material
Connect.
It is preferred that be provided between the electronic circuit body and the conductive material being conductively connected thing, make to lead by this
The electronic circuit body and the reinforcement material are connected as one by electronic connections.
It is preferred that the electronic circuit body is Laser Direct Deposition（LDS）Circuit, flexible circuit board or bat printing conductive oil
Circuit made by ink (PPA), the reinforcement material are sheet metal, described to be conductively connected thing for conductive glue or conductive double sided adhesive tape
Band.
It is preferred that the sheet metal be stainless steel substrates, copper sheet or other conductive metal sheets, make the electronic circuit body with
Other materials are not needed between the sheet metal, is directly passed through electronic circuit body and sheet metal is coupled, by electronic circuit sheet
The sheet metal and the electronic circuit body are combined together by the solidification of body, and do not use conductive glue or conductive double sided adhesive tape
Band connection.
It is preferred that the electronic circuit body is Laser Direct Deposition（LDS）Circuit, flexible circuit board or bat printing conductive oil
Circuit made by ink (PPA), the reinforcement material are conductive glue or conductive double-sided tape, are uniformly coated by the conducting resinl
On the electronic circuit body, and one is formed with the electronic circuit body.
It is preferred that the electronic circuit body is circuit made by bat printing electrically conductive ink, the conductive material is sheet metal,
Directly by the solidification of circuit body made by the bat printing electrically conductive ink by the sheet metal and the bat printing electrically conductive ink system
Into circuit be combined together, and do not use conductive tape or conductive glue to connect the sheet metal and the bat printing conductive oil
Circuit made by ink.
Compared with prior art, beneficial effects of the present invention are as follows：
1st, the reinforcement electronic circuit surface by one is integrated as using electronic circuit body and reinforcement material of the invention
The structure of contact strength, makes electronic circuit be attached with miscellaneous part, can not only avoid because of electric wire made by nanometer silver
Road is easily damaged when being connected with shell foot on mainboard or bullet pin, and lifts the structure of the reinforcement electronic circuit surface contact strength
Stability.
2nd, the processing technology of the of the invention structure for strengthening electronic circuit surface contact strength is simple, greatly reduces making
Unnecessary step in technological process, reduces the conductive resistance of contact surface, while improve contact in use
Performance.
Description of the drawings
Fig. 1 is the structural representation of the first reinforcement electronic circuit surface contact strength of the present invention；
Fig. 2 is the structural representation that the present invention strengthens electronic circuit surface contact strength for second；
Fig. 3 is the structural representation of the third reinforcement electronic circuit surface contact strength of the present invention.
Symbol list：
1- sheet metals, 2- conductive glues or conductive double-sided tape, 3- electronic circuit bodies.
Specific embodiment：
Referring to the accompanying drawing for illustrating the embodiment of the present invention, the present invention hereafter will be described in greater detail.However, the present invention can be with
Multi-form, specification etc. are realized, and be should not be construed as and limited by the embodiment for herein proposing.Conversely, proposing these enforcements
Example is, in order to reach fully and complete disclosure, and to make more relevant those skilled in the art understand models of the invention completely
Enclose.In these accompanying drawings, it is clearly visible, relative size may have been zoomed in or out.
Embodiment 1
As shown in figure 1, the first of present invention offer strengthens the structure of electronic circuit surface contact strength, for a communication
In product, the structure includes electronic circuit body 3, conductive glue or conductive double-sided tape 2 and sheet metal 1, the wherein electronics
Circuit body 3 is a kind of printed electronic circuit, including Laser Direct Deposition（LDS）Circuit, flexible circuit board or bat printing conductive oil
Circuit made by ink (PPA)；Conductive glue or conductive double-sided tape 2 are the good reinforcement material of electric conductivity；The sheet metal 1 is
The preferable conductive material of toughness, including the sheet metal that stainless steel substrates, copper sheet or other electric conductivity are good；The electronic circuit body
3 with sheet metal 1 pass through conductive glue or conductive double-sided tape 2 make to be attached between the two it is fixed form one, so as to by electricity
Sub-line road body 3 is connected with bullet pin or shell foot on mainboard, it is to avoid the damage of electronic circuit body 3.
Wherein, the reinforcement electronics with electronic circuit body 3, conductive glue or 1 three layers of conductive double-sided tape 2 and sheet metal
The concrete steps of the manufacture method of the structure of circuit surface contact strength include：
1）One electronic circuit body 3 is provided；
2）By 1 uniform fold of a sheet metal on the surface of electronic circuit body 3, and pass through conductive glue or conductive double sided adhesive tape
Fixation is attached with 2 contact surfaces by sheet metal 1 with both electronic circuit bodies 3, so that electronic circuit body 3, leading
Electric glue or conductive double-sided tape 2 and sheet metal 1 form one, form the structure of the reinforcement electronic circuit surface contact strength.
Embodiment 2
As shown in Fig. 2 the structure of the second reinforcement electronic circuit surface contact strength provided for the present invention, reinforcement knot
Structure includes electronic circuit body 3 and conductive glue or conductive double-sided tape 2, and wherein the electronic circuit body 3 is printed electronic line
Road, including Laser Direct Deposition（LDS）Circuit, flexible circuit board or circuit (PPA) made by bat printing electrically conductive ink, conductive glue
Or conductive double-sided tape 2 is the good conductive material of electric conductivity；By by 2 uniform fold of conductive glue or conductive double-sided tape
On the surface of electronic circuit body 3, make both solidify to form one, so as to by the shell foot on electronic circuit body 3 and mainboard or
Play pin to be attached, and avoid the damage of electronic circuit body 3.
Wherein, the reinforcement electronic circuit surface with 2 two-layer of electronic circuit body 3 and conductive glue or conductive double-sided tape
The concrete steps of the manufacture method of the structure of contact strength include：
1）One electronic circuit body 3 is provided；
2）Conductive glue or conductive double-sided tape 2 are coated uniformly on into the surface of electronic circuit body 3, by conductive glue
Or conductive double-sided tape 2 and 3 curing molding of electronic circuit body, connect as one, form the reinforcement electronic circuit surface and contact
The structure of intensity.
Embodiment 3
As shown in figure 3, the present invention proposes the structure that the third strengthens electronic circuit surface contact strength, for a communication
In product, the reinforcement structure includes electronic circuit body 3 and sheet metal 1, wherein, the electronic circuit body 3 is printed electronic line
Road, or circuit (PPA) made by bat printing electrically conductive ink, sheet metal 1 be the preferable conductive material of toughness, be stainless steel substrates,
The good sheet metal of copper sheet or other electric conductivities；Due to the electronic circuit body 3 that nanometer silver makes it is softer, and in its electronics
Before circuit body 3 is uncured, by sheet metal uniform fold on electronic circuit body 3, both are made to combine composition through solidification
Integrally, connect so as to realize electronic circuit body 3 other components and parts, it is to avoid the damage of electronic circuit body 3.
Wherein, the knot for strengthening electronic circuit surface contact strength with both electronic circuit body 3 and sheet metal 1 composition
The concrete steps of the manufacture method of structure include：
1）One electronic circuit body 3 is provided；
2）By 1 uniform fold of sheet metal on the electronic circuit body 3 of unfashioned printing, through baking, solidification, electricity is made
One is combined to form when sub-line road body 3 solidifies with sheet metal 1, the structure of the reinforcement electronic circuit surface contact strength is formed.
The shell foot and bullet pin strengthened by three of the above on the structure of electronic circuit surface contact strength and mainboard is mutually interconnected
When connecing, the damage of the electronic circuit made because of nanometer silver, improving product quality and application reliability are avoided that.
Additionally, we are also acknowledged that the present invention is not limited thereto, it is according to the present invention about with electronic circuit phase
The sheet metal and conducting resinl for mutually combining is not limited thereto, and the present embodiment is only to provide a preferred materials, can be with other
Conductive metallic material or conducting resinl realize and the cladding of printed electronic circuit and be fixedly connected so as to can realize with mainboard
Shell foot and play pin connection after satisfactory electrical conductivity, it is to avoid there is the problem of loose contact；And electric wire proposed by the present invention
The nanometer silver that the making material on road is not proposed with this embodiment is limited, circuit made by bat printing conduction proposed by the present invention
（PPA）For a preferred embodiment, making materials can also be printed by other so as to conductive metal sheet and conducting resinl
Water or conductive double sided adhesive tape are mutually permanently connected, so as to avoid the damage of electronic circuit.
Obviously, those skilled in the art can carry out various changes and deform the essence without deviating from the present invention to the present invention
God and scope.So, if these modifications of the present invention and deformation belong to the scope of the claims in the present invention and its equivalent technologies
Interior, then the present invention is also intended to change comprising these.
Claims (1)
1. a kind of structure for strengthening electronic circuit surface contact strength, it is characterised in that the reinforcement electronic circuit surface contact
The structure of intensity includes electronic circuit body and the reinforcement material being covered on the electronic circuit body, wherein：
The electronic circuit body is printed electronic circuit or circuit made by bat printing electrically conductive ink, and the reinforcement material is metal
The sheet metal and the electronic circuit body are directly combined together by piece by the solidification of the electronic circuit body；
The sheet metal is stainless steel substrates, copper sheet or other conductive metal sheets.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310206179.1A CN103327731B (en) | 2013-05-29 | 2013-05-29 | A kind of structure for strengthening electronic circuit surface contact strength |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310206179.1A CN103327731B (en) | 2013-05-29 | 2013-05-29 | A kind of structure for strengthening electronic circuit surface contact strength |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103327731A CN103327731A (en) | 2013-09-25 |
| CN103327731B true CN103327731B (en) | 2017-03-29 |
Family
ID=49196171
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310206179.1A Expired - Fee Related CN103327731B (en) | 2013-05-29 | 2013-05-29 | A kind of structure for strengthening electronic circuit surface contact strength |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103327731B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104902685A (en) * | 2015-05-05 | 2015-09-09 | 深圳市嘉瑞俊新材料科技有限公司 | Method for manufacturing reinforced flexible substrate by using liquid screen printing conductive adhesive |
| CN106910996B (en) * | 2017-02-17 | 2023-10-27 | 深圳市欢太科技有限公司 | Antenna device, mobile terminal and manufacturing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1929719A (en) * | 2005-08-24 | 2007-03-14 | 株式会社藤仓 | Printed circuit board and manufacturing method thereof |
| CN2938703Y (en) * | 2006-08-31 | 2007-08-22 | 比亚迪股份有限公司 | Flexible printed circuit board |
| CN203340402U (en) * | 2013-05-29 | 2013-12-11 | 上海安费诺永亿通讯电子有限公司 | Structure for strengthening surface contract strength of electronic circuit |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100546432C (en) * | 2005-10-25 | 2009-09-30 | 比亚迪股份有限公司 | A kind of manufacture method of flexibility printed circuit board |
-
2013
- 2013-05-29 CN CN201310206179.1A patent/CN103327731B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1929719A (en) * | 2005-08-24 | 2007-03-14 | 株式会社藤仓 | Printed circuit board and manufacturing method thereof |
| CN2938703Y (en) * | 2006-08-31 | 2007-08-22 | 比亚迪股份有限公司 | Flexible printed circuit board |
| CN203340402U (en) * | 2013-05-29 | 2013-12-11 | 上海安费诺永亿通讯电子有限公司 | Structure for strengthening surface contract strength of electronic circuit |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103327731A (en) | 2013-09-25 |
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Granted publication date: 20170329 |