CN104902685A - Method for manufacturing reinforced flexible substrate by using liquid screen printing conductive adhesive - Google Patents
Method for manufacturing reinforced flexible substrate by using liquid screen printing conductive adhesive Download PDFInfo
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- CN104902685A CN104902685A CN201510224136.5A CN201510224136A CN104902685A CN 104902685 A CN104902685 A CN 104902685A CN 201510224136 A CN201510224136 A CN 201510224136A CN 104902685 A CN104902685 A CN 104902685A
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Abstract
The invention is applicable in the field of new electronic materials, and provides a method for manufacturing a reinforced flexible substrate by using liquid screen printing conductive adhesive. The method comprises the following steps: manufacturing a silk screen board for printing the conductive adhesive on the flexible substrate; performing screen printing treatment on the surface of the flexible substrate by using the liquid screen printing conductive adhesive to form a screen printing conductive adhesive layer; plying a reinforcing material to the screen printing conductive adhesive layer to obtain a rough reinforced flexible substrate; and sequentially performing hot pressing treatment and solidification on the rough reinforced flexible substrate to obtain the reinforced flexible substrate. By adopting the method for manufacturing the reinforced flexible substrate by using the liquid screen printing conductive adhesive, the surface of the flexible substrate to be plied with the reinforcing material can be directly treated with the screen printing conductive adhesive, so that the obtained reinforced flexible substrate has good bonding effect and conductivity, the process flow for manufacturing the reinforced flexible substrate is significantly shortened, the production efficiency is improved, and the production cost is lowered.
Description
Technical field
The invention belongs to electronics field of new, particularly relate to and a kind ofly use liquid silk-screen conducting resinl to prepare the method for reinforcing flexible substrate.
Background technology
In the preparation process of the electronic product such as capacitance plate, liquid crystal display screen, capacitance plate, liquid crystal display screen are connected with mainboard by flexible circuit board, and in flexible circuit board, dress pastes the electronic components such as IC.In order to there is not the phenomenon such as rosin joint, dry joint when filling subsides, after the flexible circuit board of the electronic components such as subsides IC to be installed, need reinforcement, meanwhile, in order to protect the electronic devices and components such as IC not to be subject to electrostatic interference, reinforcement materials adopt electric conducting material, are generally steel current conducting plate.
Be communicated with flexible circuit board to allow steel disc, mainly in the market use that the solid conduction glued membrane of Japanese import-conductive adhesive film carries out adhesion process if model is CBF-300, concrete, conductive adhesive film is die-cut into the shape needing pad pasting, again by steel disc through HTHP, steel disc and flexible circuit board are bondd, reaches reinforcement and electric action.But existing solid conduction glued membrane, resistance is comparatively large, can up to 30 ohm, and its electric conductivity Shortcomings, bonding effect is not good yet.In addition; when using conductive adhesive film bonding flexible circuit board; usually need through sawing sheet-boring-die-cut-go the steps such as surface protection film-pad pasting-press mold-dyestripping-subsides steel disc-pressing-solidification; its technological process is complicated; equipment investment is large; manpower consumption is many, cost intensive, and the laminating program of its complexity makes laminating qualification rate low.
Summary of the invention
The object of the present invention is to provide and a kind ofly use liquid silk-screen conducting resinl to prepare the method for reinforcing flexible substrate, be intended to solve and existingly prepare conducting resinl that reinforcing flexible wiring board uses or conductive adhesive film not only electric conductivity, bonding effect are not good, and, cost intensive loaded down with trivial details for the preparation of operation during reinforcing flexible wiring board and the low problem of laminating qualification rate.
The present invention is achieved in that and a kind ofly uses liquid silk-screen conducting resinl to prepare the method for reinforcing flexible substrate, comprises the following steps:
Make the silk-screen half tone being used for silk-screened conductive glue on flexible substrates;
Use liquid silk-screen conducting resinl to carry out silk-screen process on described flexible base, board surface, form silk-screened conductive glue-line;
Supporting material is fitted in and is printed with on described silk-screened conductive glue-line, obtain coarse of reinforcing flexible substrate;
Coarse of described reinforcing flexible substrate is carried out successively hot-pressing processing, solidification process, obtain reinforcing flexible substrate.
The method of reinforcing flexible substrate prepared by the liquid silk-screen conducting resinl of use provided by the invention, directly the flexible base, board surface of lamination reinforcement material is being needed to carry out the liquid conducting resinl process of silk-screen, the reinforcing flexible base plate bonding not only obtained is effective, electric conductivity is good, and can shortened process greatly, enhance productivity, make the operation originally needing complete for 2-3 days, foreshorten to 2-3 hour to complete, production cost is significantly reduced, and the conductive adhesive film that only model need be used to be CBF-300 makes 30% of reinforcing flexible substrate production cost.The method of reinforcing flexible substrate prepared by the liquid silk-screen conducting resinl of use provided by the invention, simple to operate controlled, produces practical, can realize industrialization and produce.
Embodiment
In order to make the technical problem to be solved in the present invention, technical scheme and beneficial effect clearly understand, below in conjunction with embodiment, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
Embodiments provide and a kind ofly use liquid silk-screen conducting resinl to prepare the method for reinforcing flexible substrate, comprise the following steps:
S01. the silk-screen half tone being used for silk-screened conductive glue is on flexible substrates made;
S02. use liquid silk-screen conducting resinl to carry out silk-screen process on described flexible base, board surface, form silk-screened conductive glue-line;
S03. supporting material is fitted in and is printed with on described silk-screened conductive glue-line, obtain coarse of reinforcing flexible substrate;
S04. coarse of described reinforcing flexible substrate is carried out successively hot-pressing processing, solidification process, obtain reinforcing flexible substrate.
Concrete, in embodiment of the present invention above-mentioned steps S01, described flexible base, board is the conventional flexible base, board for the preparation of flexible circuit board, and its specification, shape are all unrestricted, can select according to actual needs.Described silk-screen half tone, can according to treating that the shape of reinforcing flexible substrate is prepared.As preferred embodiment, described silk-screen half tone is 51T silk-screen half tone.If T number is too low, then easily cause in uneven thickness after silk screen printing, space of a whole page visual effect extreme difference; If T number is too high, then thickness is partially thin, is not enough to protect the space of a whole page.
In above-mentioned steps S02, the described liquid silk-screen conducting resinl carrying out silk-screen process can be selected and can be used for the liquid conducting resinl of silk-screen, and preferably, described liquid silk-screen conducting resinl is, in the gross weight of described liquid silk-screen conducting resinl for 100%, comprise the following component of following weight percentage:
This preferred described liquid silk-screen conducting resinl, simultaneously using conductive silver particles, the brilliant pipe of conduction and conductive fiber as conductive compositions.Wherein, the brilliant pipe of described conduction is kind of a tablet, described conductive fiber is thread, described conductive silver particles can be adsorbed on its surface by the brilliant pipe of described conduction, and the interpolation of described conductive fiber, make triplicity together, and keep global shape constant, therefore, described liquid silk-screen conductive adhesive performance is stable, electric conductivity obviously strengthens, and its resistance is less than 1 ohm; In addition, in the preferred described liquid silk-screen conducting resinl of the embodiment of the present invention, adopt described epoxy modified acrylic resin, improve the heat-resisting quantity of described liquid silk-screen conducting resinl, wet stability, pliability and the compatibility to material, its cohesive force is strong.Further, as a preferred embodiment, described conductive silver particles is spherical silver particle, and the particle diameter of described conductive silver particles is 8-12 μm.As another preferred embodiment, the diameter of the brilliant pipe of described conduction is 8-12 μm, and length is 28-32 μm.As another preferred embodiment, the length of described conductive fiber is 20-30 μm.Certainly, at other specific embodiments, the particle diameter of described conductive silver particles, the brilliant diameter of pipe of described conduction and the length of described conductive fiber can be combined, obtain preferred embodiment, this preferred embodiment, effectively can reduce resistance, improves the electric conductivity of reinforcing flexible substrate.
In above-mentioned steps S02, as preferred embodiment, be also included in after using liquid silk-screen conducting resinl to carry out silk-screen process to flexible base, board, the described silk-screened conductive glue-line obtained carried out drying process, obtain silk-screened conductive glue dry film.In order to protect performance and the uniformity of described silk-screened conductive glue-line, described drying process preferably adopts the gentle mode of drying naturally to realize.As concrete preferred embodiment, the thickness of described silk-screened conductive glue dry film is 12-15 μm.If the thickness of described silk-screened conductive glue dry film is too thin, cementability can be caused inadequate; If the thickness of described silk-screened conductive glue dry film is too thick, overflow after causing pressing glue.As further preferred embodiment, after described drying process, also comprise and have the described flexible base, board of conducting resinl to rush external form process to silk-screen.
In above-mentioned steps S03, the method for described supporting material of fitting can be used for reference conventional method and realize.As preferred embodiment, described supporting material is reinforcement steel plate.
In above-mentioned steps S04, in order to obtain the described reinforcing flexible substrate that laminating is effective, adhesion is strong, need to carry out hot-pressing processing and solidification process to coarse of described reinforcing flexible substrate.As preferred embodiments, the method for described hot-pressing processing is, is 170-190 DEG C in temperature, under pressure is the condition of 90-110KG, after first precompressed 8-12s, then presses 110-130s in fact.As specific embodiment, the method for described hot-pressing processing is, is 180 DEG C in temperature, under pressure is the condition of 100KG, after first precompressed 10s, then presses 100s in fact.Under preferred temperature and pressure, adopt the hot-press method that first precompressed is pressed in fact again, after precompressed, the Contact of described liquid silk-screen conducting resinl and described supporting material can be allowed tight, bubble-free.Real pressure is carried out again after precompressed, can the generation of effectively preventing bubble, thus improve the adhesion between described supporting material and described flexible base, board.
As another preferred embodiment, the method for described solidification process is solidify 50-70min under 150-160 DEG C of condition.As specific embodiment, the method for described solidification process is solidify 60min under 150 DEG C of conditions.
The method of reinforcing flexible substrate prepared by the liquid silk-screen conducting resinl of the use that the embodiment of the present invention provides, and directly needing the flexible base, board surface of lamination reinforcement material to carry out the liquid conducting resinl process of silk-screen,
First, the reinforcing flexible base plate bonding that the embodiment of the present invention obtains is effective, electric conductivity is good, particularly use preferred liquid silk-screen conducting resinl, resistance can be down to 1 below Ω, even can be low to moderate 0.1 Ω, the conductive adhesive film that electric conductivity and use model are CBF-300 makes and obtains reinforcing flexible substrate quite, is even better than the electric conductivity of the conductive adhesive film making reinforcing flexible substrate that use model is CBF-300.
Secondly, its cohesive force is good, makes that to obtain reinforcing flexible substrate suitable with using conductive adhesive film that model is CBF-300.
Again, stability is strong, even if still can keep good electric conductivity and adhesive property under the high heat of high temperature and adverse circumstances thereof.
The more important thing is, the method of reinforcing flexible substrate prepared by the liquid silk-screen conducting resinl of the use that the embodiment of the present invention provides, can shortened process greatly, eliminate sawing sheet, specially control, die-cut, go the operations such as surface protection film, pad pasting, press mold, dyestripping, significantly improve production efficiency, make the operation originally needing complete for 2-3 days, foreshorten to 2-3 hour and complete; Production cost is also significantly reduced, and the conductive adhesive film being CBF-300 with use model makes the Measures compare of reinforcing flexible substrate, and its production cost reduces by 70%.In addition, the method is simple to operate controlled, produces practical, can realize industrialization and produce.
Be described below in conjunction with specific embodiment.
Embodiment 1
Use liquid silk-screen conducting resinl to prepare a method for reinforcing flexible substrate, comprise the following steps:
S11. make the silk-screen half tone for using liquid silk-screen conducting resinl to prepare reinforcing flexible substrate, described silk-screen half tone is 51T silk-screen half tone;
S12. use liquid silk-screen conducting resinl to carry out silk-screen process on flexible base, board surface, form silk-screened conductive glue-line;
S13. supporting material is fitted in and is printed with on described silk-screened conductive glue-line, obtain coarse of reinforcing flexible substrate;
S14. coarse of described reinforcing flexible substrate is carried out successively hot-pressing processing, solidification process, obtain reinforcing flexible substrate, wherein, the method for described hot-pressing processing is, is 180 DEG C in temperature, under pressure is the condition of 100KG, after first precompressed 10s, then presses 100s in fact; The method of described solidification process is solidify 60min under 150 DEG C of conditions.
Embodiment 2
Use liquid silk-screen conducting resinl to prepare a method for reinforcing flexible substrate, comprise the following steps:
S21. make the silk-screen half tone for using liquid silk-screen conducting resinl to prepare reinforcing flexible substrate, described silk-screen half tone is 51T silk-screen half tone;
S22. use liquid silk-screen conducting resinl to carry out silk-screen process on flexible base, board surface, form silk-screened conductive glue-line, described silk-screened conductive glue-line is dried naturally, obtains liquid silk-screen conducting resinl dry film, and the thickness of described liquid silk-screen conducting resinl dry film is 12-15 μm;
S23. reinforcement steel disc is fitted in and is printed with on described silk-screened conductive glue-line, obtain coarse of reinforcing flexible substrate;
S24. coarse of described reinforcing flexible substrate is carried out successively hot-pressing processing, solidification process, obtain reinforcing flexible substrate, wherein, the method for described hot-pressing processing is, is 180 DEG C in temperature, under pressure is the condition of 100KG, after first precompressed 10s, then presses 100s in fact; The method of described solidification process is solidify 60min under 150 DEG C of conditions.
Comparative example 1
Use Japan to open up the method preparing reinforcing flexible substrate from the CBF-300 conductive adhesive film reaching the production of electric wire Co., Ltd., comprise the following steps:
Sawing sheet;
Boring;
Die-cut;
Remove surface protection film;
Pad pasting;
Press mold;
Dyestripping;
Paste steel disc;
Pressing: temperature is 180 DEG C, pressure is under the condition of 100KG, after first precompressed 10s, then presses 100s in fact;
Solidification: the method for described solidification process is solidify 60min under 150 DEG C of conditions.
Reinforcing flexible substrate prepared by the embodiment of the present invention 1,2 and comparative example 1 is carried out performance test, and sample treatment is respectively:
Solidification: the sample directly after above-described embodiment 1,2 and comparative example 1 final step solidification process;
Three Reflow Solderings: each 260 DEG C/10 seconds;
Tropical deterioration: 60 DEG C, 95%RH;
Cold cycling is aging :-30 DEG C of * 30min---70 DEG C of * 30min;
Test result is as shown in table 1:
Table 1
As seen from the above table, reinforcing flexible substrate prepared by the embodiment of the present invention, not only resistance is low, conduct electricity very well, electric conductivity after Reflow Soldering, tropical deterioration, cold and hot reflux digestion is obviously better than the reinforcing flexible substrate using CBF-300 conductive adhesive film to prepare, and its cementitiousness, high temperature resistant property can be prepared reinforcing flexible substrate with use CBF-300 conductive adhesive film and match in excellence or beauty, stability is strong.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. use liquid silk-screen conducting resinl to prepare the method for reinforcing flexible substrate, comprise the following steps:
Make the silk-screen half tone being used for silk-screened conductive glue on flexible substrates;
Use liquid silk-screen conducting resinl to carry out silk-screen process on described flexible base, board surface, form silk-screened conductive glue-line;
Supporting material is fitted in and is printed with on described silk-screened conductive glue-line, obtain coarse of reinforcing flexible substrate;
Coarse of described reinforcing flexible substrate is carried out successively hot-pressing processing, solidification process, obtain reinforcing flexible substrate.
2. the method using liquid silk-screen conducting resinl to prepare reinforcing flexible substrate as claimed in claim 1, is characterized in that, in the gross weight of described liquid silk-screen conducting resinl for 100%, comprise the following component of following weight percentage:
3. the method using liquid silk-screen conducting resinl to prepare reinforcing flexible substrate as claimed in claim 2, it is characterized in that, described conductive silver particles is spherical silver particle, and the particle diameter of described conductive silver particles is 8-12 μm.
4. the method using liquid silk-screen conducting resinl to prepare reinforcing flexible substrate as claimed in claim 2, it is characterized in that, the diameter of the brilliant pipe of described conduction is 8-12 μm, and length is 28-32 μm.
5. the method using liquid silk-screen conducting resinl to prepare reinforcing flexible substrate as claimed in claim 2, it is characterized in that, the length of described conductive fiber is 20-30 μm.
6. the method for reinforcing flexible substrate prepared by the liquid silk-screen conducting resinl of the use as described in as arbitrary in claim 1-3, it is characterized in that, the method for described hot-pressing processing is, temperature be 170-190 DEG C, under pressure is the condition of 90-110KG, after first precompressed 8-12s, then press 110-130s in fact.
7. the method for reinforcing flexible substrate prepared by the liquid silk-screen conducting resinl of the use as described in as arbitrary in claim 1-3, it is characterized in that, the method for described solidification process is solidify 50-70min under 150-160 DEG C of condition.
8. the method for reinforcing flexible substrate prepared by the liquid silk-screen conducting resinl of the use as described in as arbitrary in claim 1-3, it is characterized in that, also be included in after using liquid silk-screen conducting resinl to carry out silk-screen process to flexible base, board, the described silk-screened conductive glue-line obtained is carried out drying process, obtain silk-screened conductive glue dry film.
9. the method using liquid silk-screen conducting resinl to prepare reinforcing flexible substrate as claimed in claim 8, it is characterized in that, the thickness of described silk-screened conductive glue dry film is 12-15 μm.
10. the method for reinforcing flexible substrate prepared by the liquid silk-screen conducting resinl of the use as described in as arbitrary in claim 1-3, and it is characterized in that, described supporting material is reinforcement steel plate; And/or
Described silk-screen half tone is 51T silk-screen half tone.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510224136.5A CN104902685A (en) | 2015-05-05 | 2015-05-05 | Method for manufacturing reinforced flexible substrate by using liquid screen printing conductive adhesive |
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| CN201510224136.5A CN104902685A (en) | 2015-05-05 | 2015-05-05 | Method for manufacturing reinforced flexible substrate by using liquid screen printing conductive adhesive |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109548270A (en) * | 2018-11-09 | 2019-03-29 | 广东洲明节能科技有限公司 | Wiring board and preparation method thereof |
| CN112867248A (en) * | 2019-11-28 | 2021-05-28 | 深南电路股份有限公司 | PCB assembly and preparation method thereof |
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| CN103327731A (en) * | 2013-05-29 | 2013-09-25 | 上海安费诺永亿通讯电子有限公司 | Structure for strengthening surface contract strength of electronic circuit |
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| CN101711091A (en) * | 2009-04-16 | 2010-05-19 | 深圳市精诚达电路有限公司 | Technique for applying anisotropic conductive paste to flexible printed circuits |
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| CN109548270A (en) * | 2018-11-09 | 2019-03-29 | 广东洲明节能科技有限公司 | Wiring board and preparation method thereof |
| CN112867248A (en) * | 2019-11-28 | 2021-05-28 | 深南电路股份有限公司 | PCB assembly and preparation method thereof |
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