CN112867248A - PCB assembly and preparation method thereof - Google Patents

PCB assembly and preparation method thereof Download PDF

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Publication number
CN112867248A
CN112867248A CN201911193328.9A CN201911193328A CN112867248A CN 112867248 A CN112867248 A CN 112867248A CN 201911193328 A CN201911193328 A CN 201911193328A CN 112867248 A CN112867248 A CN 112867248A
Authority
CN
China
Prior art keywords
pcb
metal
connecting layer
metal base
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201911193328.9A
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Chinese (zh)
Inventor
林继生
谢占昊
陈绪东
余晋磊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shennan Circuit Co Ltd
Original Assignee
Shennan Circuit Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shennan Circuit Co Ltd filed Critical Shennan Circuit Co Ltd
Priority to CN201911193328.9A priority Critical patent/CN112867248A/en
Publication of CN112867248A publication Critical patent/CN112867248A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination

Abstract

The invention discloses a PCB assembly and a preparation method thereof, wherein the method comprises the steps of printing a metal connecting layer at a preset position on a PCB; and pressing the surface of the PCB printed with the metal connecting layer with the metal base so as to fixedly connect the PCB with the metal base. According to the invention, the metal connecting layer is arranged at the preset position of the PCB in a printing mode, so that the metal base is connected with the PCB through the metal connecting layer, the original manual laminating mode is replaced, the connecting layer can be prevented from being leaked, the laminating efficiency is higher, the manufacturing yield is higher, the laminating precision of the metal base and the PCB is higher, the integral structure formed by the metal base and the PCB is more stable, and the subsequent device processing is facilitated.

Description

PCB assembly and preparation method thereof
Technical Field
The invention relates to the technical field of circuit boards, in particular to a PCB assembly and a preparation method thereof.
Background
With the rapid development of the Printed Circuit Board (PCB) industry, the application range thereof is wider and wider. Small electronic watches, calculators, large computers, communication electronics, and the like, as long as there are electronic components such as integrated circuits, the electrical interconnection between the components needs to be realized by using a PCB board.
The inventor of this application discovers in long-term research and development, and preparation metal substrate is the important process in the PCB board processing production process, generally makes metal substrate through the mode with PCB board and metal matrix through the conductive adhesive membrane laminating at present, and the laminating process is through the artifical protection film of tearing conductive adhesive membrane both sides face, and metal matrix and PCB board laminating are torn to the rethread conductive adhesive membrane, and laminating efficiency is lower and the laminating precision of metal matrix and PCB board is lower.
Disclosure of Invention
The invention provides a PCB assembly and a preparation method thereof, which aim to solve the technical problems of low bonding efficiency and low bonding precision of a metal base and a PCB in the prior art.
In order to solve the above technical problems, one technical solution adopted by the present invention is to provide a method for manufacturing a PCB assembly, including:
printing a metal connecting layer at a preset position on the PCB;
and pressing the surface of the PCB printed with the metal connecting layer with a metal base so as to fixedly connect the PCB with the metal base.
In a specific embodiment, the method for printing the metal connection layer at the predetermined position on the PCB is a screen printing method.
In a specific embodiment, the method for printing the metal connection layer at the predetermined position on the PCB specifically includes:
making the pattern of the metal connecting layer into a photo-drawing pattern on a photo-drawing negative;
transferring the optical drawing graph to a screen printing plate;
and printing on the PCB by utilizing the screen printing plate to form the metal connecting layer.
In one embodiment, the number of the screens is 18T to 36T.
In a specific embodiment, after the metal connection layer is printed at the predetermined position on the PCB, the method further includes:
and curing the metal connecting layer for the first time so that the metal connecting layer does not flow in the PCB transferring process.
In a specific embodiment, the pressing of the metal substrate and the surface of the PCB printed with the metal connection layer specifically includes:
and enabling the metal connecting layer to melt and flow again in the process of pressing the side of the PCB printed with the metal connecting layer and the metal base so as to fill the gap between the PCB and the metal base.
In a specific embodiment, after the laminating the surface of the PCB board printed with the metal connection layer and the metal base, the method further includes:
and solidifying the metal connecting layer for the second time so that the PCB is fixedly connected with the metal matrix.
In one embodiment, the metal connection layer is a copper connection layer or a silver connection layer.
In order to solve the technical problem, another technical solution adopted by the present invention is to provide a PCB assembly, which includes a PCB and a metal base, wherein the PCB and the metal base are connected by a metal connection layer, and the metal connection layer is formed on the PCB by printing.
In a specific embodiment, the number of the PCB boards is two, the metal base is provided with a partition board, and the two PCB boards are respectively arranged on two sides of the partition board.
According to the invention, the metal connecting layer is arranged at the preset position of the PCB in a printing mode, so that the metal base is connected with the PCB through the metal connecting layer, the original manual laminating mode is replaced, the connecting layer can be prevented from being leaked, the laminating efficiency is higher, the manufacturing yield is higher, the laminating precision of the metal base and the PCB is higher, the integral structure formed by the metal base and the PCB is more stable, and the subsequent device processing is facilitated.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without inventive efforts, wherein:
FIG. 1 is a schematic flow chart diagram illustrating one embodiment of a method for making a PCB assembly of the present invention;
FIG. 2 is a schematic flow chart diagram illustrating another embodiment of a method for fabricating a PCB assembly in accordance with the present invention;
FIG. 3 is a schematic structural diagram of one embodiment of a PCB assembly of the present invention;
FIG. 4 is an exploded view of one embodiment of the PCB assembly of the present invention;
FIG. 5 is a schematic structural diagram of another embodiment of a PCB assembly of the present invention;
fig. 6 is an exploded view of another embodiment of the PCB assembly of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
The terms "first" and "second" in this application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless explicitly specifically limited otherwise. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus. While the term "and/or" is merely one type of association that describes an associated object, it means that there may be three types of relationships, e.g., a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.
Referring to fig. 1, an embodiment of a method for manufacturing a PCB assembly of the present invention includes:
and S110, printing a metal connecting layer at a preset position on the PCB.
In this embodiment, the predetermined position of the printed metal connection layer on the PCB is close to one side of the PCB. In other embodiments, the predetermined position on the PCB where the metal connection layer is printed may also be located in the middle of the PCB, which is not limited herein.
In this embodiment, the predetermined position may be determined by marking on the PCB, or the PCB may be directly positioned to determine the predetermined position, which is not limited herein.
And S120, laminating the surface of the PCB printed with the metal connecting layer with the metal base so as to fixedly connect the PCB with the metal base.
According to the invention, the metal connecting layer is arranged at the preset position of the PCB in a printing mode, so that the metal base is connected with the PCB through the metal connecting layer, the original manual laminating mode is replaced, the connecting layer can be prevented from being leaked, the laminating efficiency is higher, the manufacturing yield is higher, the laminating precision of the metal base and the PCB is higher, the integral structure formed by the metal base and the PCB is more stable, and the subsequent device processing is facilitated.
Referring to fig. 2 to 4, another embodiment of the method for manufacturing a PCB assembly of the present invention includes:
the metal connection layer 200 is printed at a predetermined position on the PCB board 100.
In this embodiment, the method of printing the metal connection layer at the predetermined position on the PCB 100 is a screen printing method, which includes the following specific steps:
s210, manufacturing the pattern of the metal connecting layer 200 into a photo-drawing pattern on a photo-drawing negative film.
And S220, transferring the optical drawing graph to a screen printing plate.
In this embodiment, the number of the screens may be 18T to 36T, for example, 18T, 25T or 36T.
And S230, printing the metal connecting layer 200 on the PCB 100 by utilizing the screen printing plate.
In the present embodiment, the metal connection layer 200 is a copper connection layer or a silver connection layer.
Form metal connecting layer 200 through the screen printing mode, can realize PCB board 100 and metal matrix 300's automatic laminating, laminating efficiency and laminating precision can both obtain great promotion.
In this embodiment, after the metal connection layer 200 is printed at a predetermined position on the PCB 100, the method further includes:
s240, curing the metal connection layer 200 for the first time, so that the metal connection layer 200 does not flow during the transfer process of the PCB 100.
In this embodiment, the metal connection layer 200 may be cured for the first time by baking. In other embodiments, the metal layer 200 may be first cured by other methods, such as natural air drying, without limitation.
By solidifying the metal connection layer 200 for the first time, the metal connection layer 200 can be in a semi-solidified or completely solidified state, so that the bonding precision of the PCB 100 and the metal matrix 300 is prevented from being influenced by the flowing of the metal connection layer 200 in the transfer process of the PCB 100.
In this embodiment, the pressing of the metal connection layer 200 printed on the PCB 100 and the metal base 300 specifically includes:
and S250, re-melting and flowing the metal connecting layer 200 in the process of laminating the side of the PCB 100 printed with the metal connecting layer 200 and the metal base 300 to fill the gap between the PCB 100 and the metal base 300.
In the present embodiment, the metal connection layer 200 may be melted and flowed again by the pressure generated during the lamination process of the PCB 100 and the metal base 300, so as to fill the gap between the PCB 100 and the metal base 300, and make the connection between the PCB 100 and the metal base 300 more tight.
In other embodiments, the metal matrix 300 may also be heated, so that the metal connection layer 200 is melted by the temperature of the metal matrix 300 during the lamination process of the PCB 100 and the metal matrix 300, thereby filling the gap between the PCB 100 and the metal matrix 300, which is not limited herein.
In this embodiment, after the pressing of the side of the PCB 100 printed with the metal connection layer 200 and the metal base 300, the method further includes:
and S260, solidifying the metal connecting layer 200 for the second time, so that the PCB 100 is fixedly connected with the metal matrix 300.
In this embodiment, the metal connection layer 200 may be cured for the second time by baking. In other embodiments, the metal layer 200 may be cured for the second time by other methods, such as natural air drying, which is not limited herein. By solidifying the metal connection layer 200 for the second time, the metal connection layer 200 can be in a completely solidified state, thereby closely connecting the PCB board and the metal base 300 together.
Referring to fig. 3 and 4, an embodiment of the PCB assembly of the present invention includes a PCB 100 and a metal base 300, the PCB 100 and the metal base 300 are connected by a metal connection layer 200, wherein the metal connection layer 200 is formed on the PCB 100 by printing.
Specifically, the preparation method of the PCB assembly refers to the above embodiment of the preparation method of the PCB assembly, and is not described herein again.
According to the invention, the metal connecting layer is arranged at the preset position of the PCB in a printing mode, so that the metal base is connected with the PCB through the metal connecting layer, the original manual laminating mode is replaced, the connecting layer can be prevented from being leaked, the laminating efficiency is higher, the manufacturing yield is higher, the laminating precision of the metal base and the PCB is higher, the integral structure formed by the metal base and the PCB is more stable, and the subsequent device processing is facilitated.
Referring to fig. 5 and 6, another embodiment of the PCB assembly of the present invention includes a PCB 400 and a metal base 500, the PCB 400 and the metal base 500 are connected by a metal connection layer 600, wherein the metal connection layer 600 is formed on the PCB 400 by a printing method.
In this embodiment, the number of the PCB boards 400 is two, the metal base 500 is provided with a partition 510, and the two PCB boards 400 are respectively disposed on two sides of the partition 510.
In other embodiments, the PCB and the metal base may have other matching structures, which is not limited herein.
According to the invention, the metal connecting layer is arranged at the preset position of the PCB in a printing mode, so that the metal base is connected with the PCB through the metal connecting layer, the original manual laminating mode is replaced, the connecting layer can be prevented from being leaked, the laminating efficiency is higher, the manufacturing yield is higher, the laminating precision of the metal base and the PCB is higher, the integral structure formed by the metal base and the PCB is more stable, and the subsequent device processing is facilitated.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims (10)

1. A method of making a PCB assembly, comprising:
printing a metal connecting layer at a preset position on the PCB;
and pressing the surface of the PCB printed with the metal connecting layer with a metal base so as to fixedly connect the PCB with the metal base.
2. The method of claim 1, wherein the metal connection layer is printed on the PCB at the predetermined position by screen printing.
3. The method of claim 2, wherein the method of printing the metal connection layer at the predetermined position on the PCB specifically comprises:
making the pattern of the metal connecting layer into a photo-drawing pattern on a photo-drawing negative;
transferring the optical drawing graph to a screen printing plate;
and printing on the PCB by utilizing the screen printing plate to form the metal connecting layer.
4. The method of claim 3, wherein the number of screens is 18T to 36T.
5. The method of claim 1, further comprising, after printing the metal connection layer at the predetermined location on the PCB board:
and curing the metal connecting layer for the first time so that the metal connecting layer does not flow in the PCB transferring process.
6. The method of claim 5, wherein the pressing the metal substrate against the surface of the PCB printed with the metal connection layer comprises:
and enabling the metal connecting layer to melt and flow again in the process of pressing the side of the PCB printed with the metal connecting layer and the metal base so as to fill the gap between the PCB and the metal base.
7. The method of claim 6, wherein the laminating the side of the PCB printed with the metal connection layer with the metal matrix further comprises:
and solidifying the metal connecting layer for the second time so that the PCB is fixedly connected with the metal matrix.
8. The method of claim 1, wherein the metal connection layer is a copper connection layer or a silver connection layer.
9. The PCB assembly is characterized by comprising a PCB and a metal base, wherein the PCB is connected with the metal base through a metal connecting layer, and the metal connecting layer is formed on the PCB in a printing mode.
10. The PCB assembly of claim 9, wherein the number of the PCB boards is two, a partition board is arranged on the metal base, and the two PCB boards are respectively arranged on two sides of the partition board.
CN201911193328.9A 2019-11-28 2019-11-28 PCB assembly and preparation method thereof Pending CN112867248A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201911193328.9A CN112867248A (en) 2019-11-28 2019-11-28 PCB assembly and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201911193328.9A CN112867248A (en) 2019-11-28 2019-11-28 PCB assembly and preparation method thereof

Publications (1)

Publication Number Publication Date
CN112867248A true CN112867248A (en) 2021-05-28

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CN201911193328.9A Pending CN112867248A (en) 2019-11-28 2019-11-28 PCB assembly and preparation method thereof

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0271582A (en) * 1988-09-06 1990-03-12 Mitsubishi Electric Corp Manufacture of printed wiring board
CN102123562A (en) * 2010-12-30 2011-07-13 东莞生益电子有限公司 Method for manufacturing metal substrate by adopting reflow soldering
CN102186306A (en) * 2011-04-29 2011-09-14 惠州中京电子科技股份有限公司 Metal base circuit board and manufacturing method thereof
CN103096640A (en) * 2011-11-03 2013-05-08 深南电路有限公司 Method for processing metal-based printed circuit board (PCB) and tin printing jig for processing of metal-based PCB
CN104902685A (en) * 2015-05-05 2015-09-09 深圳市嘉瑞俊新材料科技有限公司 Method for manufacturing reinforced flexible substrate by using liquid screen printing conductive adhesive
CN105750764A (en) * 2016-05-13 2016-07-13 北京工业大学 Preparation method of nanoparticle reinforcing solder balls for BGA
CN207783277U (en) * 2018-02-27 2018-08-28 浙江万正电子科技有限公司 Aluminium base heat dissipation high temperature resistance multilayer backboard

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0271582A (en) * 1988-09-06 1990-03-12 Mitsubishi Electric Corp Manufacture of printed wiring board
CN102123562A (en) * 2010-12-30 2011-07-13 东莞生益电子有限公司 Method for manufacturing metal substrate by adopting reflow soldering
CN102186306A (en) * 2011-04-29 2011-09-14 惠州中京电子科技股份有限公司 Metal base circuit board and manufacturing method thereof
CN103096640A (en) * 2011-11-03 2013-05-08 深南电路有限公司 Method for processing metal-based printed circuit board (PCB) and tin printing jig for processing of metal-based PCB
CN104902685A (en) * 2015-05-05 2015-09-09 深圳市嘉瑞俊新材料科技有限公司 Method for manufacturing reinforced flexible substrate by using liquid screen printing conductive adhesive
CN105750764A (en) * 2016-05-13 2016-07-13 北京工业大学 Preparation method of nanoparticle reinforcing solder balls for BGA
CN207783277U (en) * 2018-02-27 2018-08-28 浙江万正电子科技有限公司 Aluminium base heat dissipation high temperature resistance multilayer backboard

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Application publication date: 20210528