CN108282968B - printed circuit board substrate and manufacturing method thereof - Google Patents
printed circuit board substrate and manufacturing method thereof Download PDFInfo
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- CN108282968B CN108282968B CN201810096112.XA CN201810096112A CN108282968B CN 108282968 B CN108282968 B CN 108282968B CN 201810096112 A CN201810096112 A CN 201810096112A CN 108282968 B CN108282968 B CN 108282968B
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- heat conductors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
Abstract
The invention relates to the technical field of communication, and provides substrates of printed circuit boards and a manufacturing method thereof, which aim to solve the problem of low manufacturing precision of a PCB (printed circuit board). The manufacturing method of the substrates of the printed circuit boards comprises the steps of adhering a plurality of heat conductors on a preset carrier, sequentially placing a prepreg and a copper foil on the surface of the heat conductors away from the preset carrier, laminating times, removing the preset carrier, sequentially placing a second prepreg and a second copper foil on the surface of the heat conductors, which is adhered to the preset carrier, and laminating for the second time to obtain the substrates of the printed circuit boards.
Description
Technical Field
The invention relates to the technical field of communication, in particular to a substrate of printed circuit boards and a manufacturing method thereof.
Background
A PCB (Printed Circuit Board) is a support for electronic components and is a carrier for electrical connection of the electronic components. Because electronic components can produce heat in the working process, the PCB needs to have a heat dissipation function, and for integrated circuits with dense circuits and dense holes, higher heat dissipation requirements are provided for the PCB.
In order to solve the problem of PCB heat dissipation, embedding a material with thermal conductivity in the PCB is a main approach adopted at present. In the prior art, when the heat conduction material is embedded, the PCB and the prepreg are usually grooved in advance, and then the heat conduction material is embedded into the grooved position, thereby completing the manufacture of the PCB motherboard. For the embedding mode of the heat conduction material, the size of the slotted area needs to be larger than that of the heat conduction material, and when the heat conduction material is embedded and laminated, the heat conduction material is easy to shift, so that the manufacturing precision of the PCB is influenced.
Therefore, the PCB in the prior art has the problem of low manufacturing precision.
Disclosure of Invention
The embodiment of the invention provides printed circuit board substrates and a manufacturing method thereof, which aim to solve the problem of low manufacturing precision of a PCB.
In order to solve the technical problem, the invention is realized as follows:
, the embodiment of the invention provides a method for manufacturing a substrate of printed circuit boards, comprising the following steps:
sticking a plurality of heat conductors on a preset carrier;
sequentially placing a th prepreg and a th copper foil on the side of the plurality of heat conductors far away from the preset carrier, and performing times of lamination;
and removing the preset carrier, sequentially placing a second prepreg and a second copper foil on the surface where the plurality of heat conductors are attached to the preset carrier, and performing secondary lamination to obtain the substrate of the printed circuit board.
In another aspect, an embodiment of the present invention further provides a substrate of kinds of printed circuit boards, including:
the heat conducting structure comprises a prepreg, a plurality of heat conductors arranged in the prepreg, a copper foil arranged on the th surface of the prepreg, and a second copper foil arranged on the second surface of the prepreg, wherein the second surface is a surface opposite to the th surface;
wherein the prepreg comprises a th prepreg located between the plurality of heat conductors and the th copper foil, a second prepreg located between the plurality of heat conductors and the second copper foil, and a connecting part located between the th prepreg and the second prepreg, and the connecting part is formed by laminating the th prepreg and/or the second prepreg.
In the embodiment of the invention, a plurality of heat conductors are adhered to a preset carrier, prepregs and copper foils are sequentially placed on the surfaces of the heat conductors, which are far away from the preset carrier, and laminated for times, the preset carrier is removed, and a second prepreg and a second copper foil are sequentially placed on the surfaces, which are jointed with the preset carrier, of the heat conductors, and laminated for the second time, so that a substrate of a printed circuit board is obtained.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments of the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive labor.
Fig. 1 is a flowchart of a method for manufacturing a substrate of a printed circuit board according to an embodiment of the invention;
FIG. 2 is a diagram illustrating a process for manufacturing a substrate of a printed circuit board according to an embodiment of the present invention;
fig. 3 is a second process diagram for manufacturing a substrate of a printed circuit board according to an embodiment of the invention;
fig. 4 is a third process diagram for manufacturing a substrate of a printed circuit board according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of an arrangement of copper blocks on a predetermined carrier according to an embodiment of the present invention;
FIG. 6 is a fourth process diagram for manufacturing a substrate of a printed circuit board according to an embodiment of the present invention;
FIG. 7 is a fifth process diagram for fabricating a substrate of a printed circuit board according to an embodiment of the present invention;
FIG. 8 is a schematic structural diagram of a substrate of a printed circuit board according to an embodiment of the present invention;
fig. 9 is a schematic structural diagram of a printed circuit board according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention.
Referring to fig. 1, fig. 1 is a flowchart of a method for manufacturing a substrate of a printed circuit board according to an embodiment of the present invention, as shown in fig. 1, including the following steps:
step 101, adhering a plurality of heat conductors on a preset carrier.
The preset carrier can be fixed-hardness carrier, such as cured resin, fixed-hardness plastic and the like, so that the heat conductor can not deviate due to deformation of the carrier in the laminating process, the position precision of the heat conductor can be improved, in addition, when the preset carrier is disassembled, the integral disassembly of the preset carrier is convenient, the operation mode is convenient, and the manufacturing efficiency is improved.
Before the heat conductors are adhered, the face of each heat conductor, which is attached to the preset carrier, can be coated with the adhesive, so that the heat conductors are adhered to the preset carrier.
For example, heat conductors can be arranged in grooves when the heat conductors are arranged according to the rule of , for example, when the heat conductors are arranged in a matrix, a plurality of rows or columns of grooves can be arranged, so that each rows or each column of heat conductors can be arranged in the same grooves.
By adopting the manufacturing method of the embodiment of the invention, the heat conductor with smaller size can be embedded, thereby obtaining the PCB. The shape of the heat conductor may be specifically a cuboid, a cylinder, a prism or other shapes.
When the heat conductor is in the shape of a cuboid, the length of the heat conductor is 0.5mm at the minimum, the width of the heat conductor is 0.5mm at the minimum, the height of the heat conductor ranges from 100 μm to 2000 μm, and the distance between any two heat conductors is 150 μm at the minimum.
In this embodiment, the heat conductor may be processed in advance to obtain a heat conductor of a designed size, and thus, a heat conductor with high dimensional accuracy may be obtained, and when the heat conductor is a copper block, a copper foil or a copper plate may be processed to obtain a copper block of a designed size as a heat conductor, specifically, a copper foil or a copper plate having a thickness of may be die-cut or laser-cut to be processed into a copper block of a desired shape and a desired size, and after the copper block is obtained, the surface of the copper block may be roughened.
In practical applications, the specific size of the heat conductor can be determined according to practical design, when the shape of the heat conductor is a rectangular parallelepiped, the length of the heat conductor can be made to be 0.5mm at minimum, the width of the heat conductor can be made to be 0.5mm at minimum, the height of the heat conductor is not limited, and 100 μm to 2000 μm are only the preferred height in the embodiment.
In addition, a smaller interval can be manufactured between the heat conductors, and the heat dissipation effect of the PCB can be further improved .
In the specific implementation of this step, a plurality of heat conductors are adhered to a predetermined carrier coated with an adhesive material, wherein the adhesive material is a resin or an adhesive film, and the heat conductors are copper blocks.
In this embodiment, an adhesive material such as a resin or an adhesive film may be coated on the predetermined carrier. The adhesive material has adhesive property and is easy to dry, and the heat conductor can be attached to the preset carrier through the adhesive material after the surface drying. Thus, no offset occurs after the relative position between the heat conductors is determined.
Because the gluing material has the characteristic that the cohesive force descends after high temperature, like this, can heat the gluing material constant temperature after, recooling to can get rid of the gluing material and the predetermined carrier on heat conductor surface fast.
When the adhesive material is an adhesive film, the adhesive film may be first adhered to a predetermined carrier, and then the plurality of heat conductors may be adhered to the adhesive film. Thus, when the preset carrier is disassembled, the adhesive film and the preset carrier can be conveniently and quickly removed.
In the embodiment, the copper block is used as the heat conductor, and the copper has the characteristic of good heat conductivity, so that the heat dissipation effect of the PCB can be improved, and the production cost can be reduced.
In addition, when the distance between two adjacent heat conductors is larger than the preset distance or the height of the heat conductors is larger than the preset height, before the step of sequentially placing the th prepreg and the th copper foil on the side, far away from the preset carrier, of the heat conductors and carrying out the lamination for times, the method further comprises the step of adding an adhesive material between the two adjacent heat conductors or adding an adhesive material between the heat conductors and the th prepreg.
When the distance between two adjacent heat conductors is large, i.e., larger than a predetermined distance, or the height of the heat conductors is large, i.e., larger than a predetermined height, in the process of heating the prepreg, there may be a case where it is difficult to fill the gap between the heat conductors or the filling is uneven because of less prepreg.
Therefore, the adhesive material can be added between the heat conductors with larger gaps, and particularly can be added at the position between the two heat conductors, so that the adhesive material can flow when being melted at high temperature and uniformly fill the gaps between the heat conductors, and the adhesive material can also be added between the heat conductors and the prepreg to avoid the abnormal glue shortage.
In addition, the number of prepregs may also be determined according to the gap between the heat conductors. When the height of the heat conductors is larger and the distance between the heat conductors is larger, the gaps between the heat conductors are larger, and more prepregs can be placed, so that the condition of glue shortage is avoided; when the height of the heat conductors is small and the distance between the heat conductors is small, the gaps between the heat conductors are small, and relatively few prepregs can be placed. Thus, the strength of the PCB may be increased due to the reinforcement material in the prepreg.
Optionally, before the step of adhering the plurality of heat conductors to the preset carrier, the method further includes roughening the surfaces of the plurality of heat conductors away from the preset carrier times.
Wherein, coarsening treatment can be brown oxidation treatment, blackening treatment or super coarsening treatment, and after coarsening treatment of the surface of the heat conductor, the contact area between the heat conductor and the th prepreg can be increased, so that the reliability of connection between the heat conductor and the th prepreg can be improved, relative displacement cannot be generated between the heat conductor and the th prepreg, and the precision of PCB manufacture can be improved.
Step 102, sequentially placing prepregs and copper foils on the side of the plurality of heat conductors far away from the preset carrier, and performing times of lamination.
The side of the thermal conductor away from the predetermined carrier is understood to be the other side of the thermal conductor opposite to the side attached to the predetermined carrier.
Specifically, a prepreg and a copper foil are sequentially placed on the surface, away from the preset carrier, of the heat conductors and pressed, the prepreg is heated to th preset temperature, the th preset temperature is the melting temperature of the th prepreg, and the prepreg is heated to a second preset temperature from the th preset temperature, and the second preset temperature is the curing temperature of the th prepreg.
In this embodiment, the th preset temperature is a melting temperature of the th prepreg, which means that the th prepreg is flowable at the th preset temperature, and the th prepreg is solidified at the th prepreg at the second preset temperature.
When the th prepreg is heated to the th preset temperature, the 0 th prepreg flows and uniformly fills gaps among the plurality of heat conductors, and when the th prepreg is sufficiently large, the gaps among the plurality of heat conductors can be filled, when the th prepreg is continuously heated to the second preset temperature, the th prepreg is changed from a flowing state to a solid state, and the th prepreg and the plurality of heat conductors are tightly combined to form integers, reinforcing materials in the th prepreg can further enhance the connection between the heat conductors and the th prepreg by the step of .
In addition, when the th prepreg is heated, the th prepreg, the th copper foil and the heat conductor can be pressurized, so that the heat conductor is tightly combined with the th prepreg, and the joint of the th prepreg and the th copper foil can be smoother.
Note that, in the case of performing secondary lamination of the second prepreg, the second copper foil, and the heat conductor, lamination can be performed also using the above-described embodiment.
Thus, the bonding between the heat conductor and the prepreg is more compact during the lamination process, and the heat conductor is not deviated when the lamination is performed by adopting the embodiment.
Step 103, removing the preset carrier, sequentially placing a second prepreg and a second copper foil on the surface where the plurality of heat conductors are attached to the preset carrier, and performing secondary lamination to obtain the substrate of the printed circuit board.
The method comprises the steps of removing a preset carrier to expose the surface of a heat conductor, sequentially stripping the preset carrier and an adhesive when the adhesive is coated on the preset carrier to expose the surface of the heat conductor, sequentially placing a second prepreg and a second copper foil on surfaces of the exposed heat conductor, and performing secondary lamination, wherein the specific lamination process can be the same as -time lamination process, and repeated steps are omitted here to avoid repetition.
Therefore, in the manufacturing process, the heat conductor cannot deviate, the manufacturing precision of the substrate is high, and the precision of the PCB can be improved. And the manufacturing process of the embodiment of the invention is convenient for manufacturing the heat conductor with smaller size.
The method comprises the following steps of removing the preset carrier, carrying out secondary roughening treatment on surfaces of the multiple heat conductors, which are attached to the preset carrier, sequentially placing a second prepreg and a second copper foil on surfaces of the multiple heat conductors which are subjected to the secondary roughening treatment, and carrying out secondary lamination to obtain the substrate of the printed circuit board.
In this embodiment, after the predetermined carrier is removed, the surface of the thermal conductor is exposed, and the exposed surface of the thermal conductor is roughened, specifically, browned, blackened or super-roughened, so that the contact area between the thermal conductor and the prepreg can be increased, thereby improving the reliability of the connection between the thermal conductor and the prepreg, which is close-coupled after the prepreg is cured.
For convenience of understanding, the following will illustrate the manufacturing process of the embodiment of the present invention by taking a copper block as an example of the heat conductor and combining the drawings.
, processing the copper material 1 with preset thickness, such as copper foil or copper plate, to obtain the copper block 11 meeting the size requirement, as shown in fig. 2, at this time, the surface of the copper block 11 can be blackened, browned or super-roughened to improve the reliability of the connection between the copper block and the prepreg.
The second step is that: an adhesive 3 is coated on the predetermined carrier 2 to form a structure as shown in fig. 3. The adhesive may be a resin or an adhesive film.
Thirdly, adhering the untreated surface of the processed copper block 11 to the preset carrier 2 coated with the adhesive 3 to form the structure shown in fig. 4 and 5.
And fourthly, sequentially placing a prepreg 41 and a copper foil 51 on the treated surface of the copper block 11, and laminating to form a structure shown in FIG. 6. the prepreg 41 flows at high temperature and flows into a gap between the copper block 11, and when the th prepreg 41 is continuously heated, the prepreg 41 becomes solid, so that the prepreg 41 and the copper block 11 are combined into whole bodies, and the contact area between the prepreg 41 and the processed copper block 11 is increased, so that the bonding force between the prepreg 41 and the copper block 11 is increased.
The fifth step: and removing the preset carrier 2 and the adhesive 3 to form a structure shown in fig. 7. Because the adhesive 3 is reduced in adhesive force after being heated at high temperature, the adhesive 3 attached to the copper block 11 and the carrier 2 can be quickly removed.
Sixthly, after removing the preset carrier 2 and the adhesive 3, exposing the copper block, and sequentially placing a second prepreg 42 and a second copper foil 52 on the surface of the exposed copper block for laminating to obtain the substrate of the printed circuit board shown in fig. 8.
The seventh step: the substrate is subjected to processes such as drilling, electroplating, pattern transfer, solder resist, surface treatment, molding, testing and the like according to the existing process, so that the PCB shown in figure 9 can be obtained, and the manufacture of the heat dissipation PCB with the small copper blocks embedded in the middle layer is completed.
By adopting the manufacturing method of the embodiment of the invention, the processing feasibility of the small-size ultra-thick copper heat dissipation PCB can be solved, and the manufacturing precision of the PCB can be improved.
Referring to fig. 8, fig. 8 is a schematic structural diagram of a substrate of a printed circuit board according to an embodiment of the present invention, as shown in fig. 8, the substrate of the printed circuit board includes a prepreg 4, a plurality of heat conductors 11 disposed inside the prepreg 4, a th copper foil 51 disposed on an th surface of the prepreg 4, and a second copper foil 52 disposed on a second surface of the prepreg 4, where the second surface is a surface opposite to the th surface;
the prepreg 4 includes a prepreg 41 between the plurality of thermal conductors 11 and the -th copper foil 51, a second prepreg 42 between the plurality of thermal conductors 11 and the second copper foil 52, and a connection portion between the -th prepreg 41 and the second prepreg 42, the connection portion being formed by laminating the -th prepreg 41 and/or the second prepreg 42.
The connection portion may be a prepreg located in a gap between the plurality of heat conductors, the th prepreg may flow into the gap between the plurality of heat conductors when the th prepreg is laminated, the second prepreg may also flow into the gap between the plurality of heat conductors when the second prepreg is laminated, and the prepreg located in the gap between the plurality of heat conductors forms the connection portion.
In specific implementation, a copper foil and a prepreg are firstly placed on the surface of a plurality of heat conductors and are laminated, then a second copper foil and a second prepreg are placed on the other surface of the plurality of heat conductors and are laminated to obtain a substrate of the printed circuit board, and the prepregs are heated and flow in the laminating process to wrap the plurality of heat conductors, so that the plurality of heat conductors are embedded in the prepregs, the heat conductors cannot be deviated, and the heat conductors and the prepregs can be tightly connected to form bodies, so that the manufacturing accuracy of the printed circuit board can be improved.
Optionally, each of the heat conductors 11 is shaped as a rectangular parallelepiped, a length of each of the heat conductors 11 is at least 0.5mm, a width of each of the heat conductors 11 is at least 0.5mm, and a height of each of the heat conductors 11 is in a range from 100 μm to 2000 μm.
The plurality of heat conductors 11 are arranged according to the arrangement sequence determined by and are embedded in the prepreg 4, and the copper foil 51 and the second copper foil 52 are respectively arranged on two opposite surfaces of the prepreg.
Optionally, the distance between any two of the thermal conductors 11 is at least 150 μm.
In this embodiment, the user can design the spacing between the heat conductors as the case may be. The distance that can make between the heat conductor is less, can satisfy actual demand, can improve the radiating effect.
Optionally, the heat conductor 11 is a copper block.
When the heat conductor is a copper block, the copper foil or the copper plate can be processed to obtain the copper block with the designed size as the heat conductor. In the embodiment, the copper block is used as the heat conductor, and the copper has the characteristic of good heat conductivity, so that the heat dissipation effect of the PCB can be improved, and the production cost can be reduced.
While the present invention has been described with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, which are illustrative and not restrictive, and it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (10)
1, A manufacturing method of a base plate of a printed circuit board, which is characterized by comprising the following steps:
sticking a plurality of heat conductors on a preset carrier;
sequentially placing a th prepreg and a th copper foil on the side of the plurality of heat conductors far away from the preset carrier, and performing times of lamination;
and removing the preset carrier, sequentially placing a second prepreg and a second copper foil on the surface where the plurality of heat conductors are attached to the preset carrier, and performing secondary lamination to obtain the substrate of the printed circuit board.
2. The method of claim 1, wherein the step of sequentially placing prepreg and copper foil on the side of the plurality of thermal conductors away from the pre-set carrier and performing times of lamination comprises:
sequentially placing a th prepreg and a th copper foil on the side of the plurality of heat conductors far away from the preset carrier, and pressing;
heating the th prepreg to a preset temperature, wherein the preset temperature is the melting temperature of the th prepreg;
heating the th prepreg to a second preset temperature from the preset temperature, wherein the second preset temperature is the curing temperature of the th prepreg.
3. The method of claim 2, wherein the step of affixing a plurality of thermally conductive bodies to a predetermined carrier comprises:
and adhering the plurality of heat conductors to a preset carrier coated with an adhesive material.
4. The method of claim 1, wherein when the spacing between two adjacent thermal conductors is greater than the predetermined spacing or the height of the plurality of thermal conductors is greater than the predetermined height, the method further comprises, before the steps of sequentially placing prepreg and copper foil on the side of the plurality of thermal conductors away from the predetermined carrier and performing times of lamination:
adding an adhesive material between two adjacent heat conductors; or
An adhesive material is added between the plurality of thermal conductors and the th prepreg.
5. The method of claim 1, wherein prior to the step of affixing the plurality of thermal conductors to the predetermined carrier, the method further comprises:
carrying out roughening treatment times on the surfaces of the plurality of heat conductors far away from the preset carrier;
removing the preset carrier, sequentially placing a second prepreg and a second copper foil on the surfaces of the plurality of heat conductors and the preset carrier, and laminating for the second time to obtain the substrate of the printed circuit board, wherein the steps comprise:
removing the preset carrier;
performing secondary roughening treatment on surfaces of the multiple heat conductors and the preset carrier;
and sequentially placing a second prepreg and a second copper foil on the surfaces of the plurality of heat conductors subjected to the secondary roughening treatment, and performing secondary lamination to obtain the substrate of the printed circuit board.
6. The method of claim 3 or 4, wherein the adhesive material is a resin or an adhesive film.
7, A printed circuit board substrate, comprising:
the heat conducting structure comprises a prepreg, a plurality of heat conductors arranged in the prepreg, a copper foil arranged on the th surface of the prepreg, and a second copper foil arranged on the second surface of the prepreg, wherein the second surface is a surface opposite to the th surface;
wherein the prepregs include a prepreg between the plurality of thermal conductors and the copper foil, a second prepreg between the plurality of thermal conductors and the second copper foil, and a connection between the prepreg and the second prepreg, the connection formed by laminating the prepreg and/or the second prepreg;
wherein the connection portion is a prepreg positioned in a gap between the plurality of heat conductors.
8. The substrate for printed circuit board according to claim 7, wherein each of the heat conductors has a shape of a rectangular parallelepiped, a length of each of the heat conductors is 0.5mm at the minimum, a width of each of the heat conductors is 0.5mm at the minimum, and a height of each of the heat conductors is in a range of 100 μm to 2000 μm.
9. A printed circuit board substrate according to claim 7, wherein the spacing between any two of the thermal conductors is at least 150 μm.
10. A printed circuit board substrate of , wherein the heat conductor is a copper block.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810096112.XA CN108282968B (en) | 2018-01-31 | 2018-01-31 | printed circuit board substrate and manufacturing method thereof |
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| CN201810096112.XA CN108282968B (en) | 2018-01-31 | 2018-01-31 | printed circuit board substrate and manufacturing method thereof |
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| CN108282968B true CN108282968B (en) | 2020-01-31 |
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| CN108882538B (en) * | 2018-07-17 | 2020-06-16 | 乐健科技（珠海）有限公司 | Circuit board and preparation method thereof |
| CN111885812A (en) * | 2020-07-14 | 2020-11-03 | 珠海方正科技高密电子有限公司 | Circuit board and circuit board manufacturing method |
| CN112208169B (en) * | 2020-09-30 | 2023-02-03 | 宁波甬强科技有限公司 | Copper-clad plate and manufacturing method thereof |
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| CN107018621A (en) * | 2017-05-19 | 2017-08-04 | 上海美维科技有限公司 | A kind of method that copper billet is buried in printed circuit board |
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| CN101232774A (en) * | 2007-01-24 | 2008-07-30 | 南京汉德森科技股份有限公司 | High heat conductivity ceramic base printed circuit board and method for making the same |
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