JP2010050335A - Production method for component built-in module and the component built-in module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for producing a component built-in module in a simple and easy way, without taking into consideration the depth of a hole formed in a substrate and the height of a component, and to provide the component built-in module fabricated thereby. <P>SOLUTION: A foundation section 11 is formed on the bottom surface of a first hole 9 of a component built-in layer 4. Inside the first hole 9, a component 13 having external electrodes 12 is disposed on the foundation section 11, and a first connection member 17, having a first interlayer connection conductor 16 is disposed, in the order. After that, a resin layer 6 having a wiring pattern 5 is prepared, and the wiring pattern 5 is connected to the first interlayer connection conductor 16. Then, the first connecting member 17, is pressurized and inserted into the first hole 9, and the resin layer 6 is thermocured. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a component built-in module in which a component is embedded in a resin layer and a component built-in module. More specifically, the present invention relates to a method for connecting an external electrode of a component built in a resin layer and an in-plane conductor formed on the surface of the resin layer.

  2. Description of the Related Art In recent years, various electronic modules with built-in electronic components such as capacitors, chip resistors, chip coils, and ICs with high density and high functionality have been proposed with downsizing and high performance of electronic devices. This type of resin substrate formation method is described, for example, in Patent Document 1 as follows.

  As shown in FIG. 15 (a), the two metal plates 30-1 and 30-2 are pressed and pasted through the laminated resin layer 32 to form a metal core layer composed of the two metal plates. Then, the metal plates 30-1 and 30-2 are simultaneously etched from both sides around the bonded resin layer 32, and the metal plates at positions corresponding to the through holes 40-1 to 40-5 and the counterbore 42 are removed.

  Subsequently, portions of the laminated resin layer 32 exposed from the metal plates 30-1 and 30-2 are removed by laser processing, and the through holes 40-1 to 40-5 and the counterbore 42 are formed. And as shown to Fig.15 (a), the base layer which consists of the insulating member 36 is formed in the back surface of a metal core layer.

  Then, as shown in FIG.15 (b), the insulating adhesive 24-1 is apply | coated to the bottom face of the through-holes 40-2 and 40-3. Further, an adhesive 24-2 having heat dissipation and conductivity is applied to the bottom surface of the counterbore 42. Then, through these adhesives, the tall passive components 20-1 and 20-2 are arranged in the through holes 40-2 and 40-3, and the low-profile active component 22 is arranged in the counterbore 42. Thereby, the difference in height between the passive components 20-1 and 20-2 and the active component 22 is absorbed by the presence or absence of the metal plate 30-2, and as a result, the upper surfaces of the built-in components become the same height.

  Next, as shown in FIG. 15C, the resin layer is pressed from both sides of the metal core layer, and the periphery and the inside of the metal core layer are sealed with an insulating member 36. At this time, the insulating member 36 is filled into the through holes 40-1 to 40-5 and the counterbore 42.

  Then, as shown in FIG. 15D, the insulating member 36 is removed by laser processing to form a connection via contact 53. In addition, an insulating layer filled in the through hole 40-4 is opened to form a through hole for a through hole conductor.

  Thereafter, as shown in FIG. 15E, the connection via 52 is formed in the connection via contact, and the wiring layers 34-1 and 34-2 on the front and back surfaces are formed. At the same time, a through-hole conductor 54 is formed in the through hole 40-4 via an insulating layer.

Accordingly, the wiring pattern 50 formed on the wiring layers 34-1 and 34-2, the passive components 20-1, 20-2, and the active component 22 are connected via the connection via 52. In addition, the wiring patterns 50 formed on the wiring layers 34-1 and 34-2 are connected via the through-hole conductors 54.
JP 2005-31249 A (paragraphs 0017, 0040, 0041, 0060-0068, FIGS. 9-11, etc.)

  According to the method of Patent Document 1, when the heights of the passive components 20-1, 20-2 and the active component 22 incorporated in the through holes 40-2, 40-3 and the counterbore 42 are different, these components are External electrodes of the passive components 20-1 and 20-2 and the active component 22 by adjusting the amount of the adhesives 24-1 and 24-2 fixed to the bottom surfaces of the through holes 40-2 and 40-3 and the counterbore 42. It is necessary to align the height of.

  In addition, when the heights of the parts are not adjusted by adjusting the amounts of the adhesives 24-1 and 24-2 as described above, the depth at which the holes must be opened by the laser is the passive parts 20-1, 20-2. −2 and the height of the active component 22, adjustment of the laser power is required at each point.

  However, as described above, the heights of the upper surfaces of the external electrodes of the passive components 20-1 and 20-2 and the active component 22 are equalized by the amounts of the adhesives 24-1 and 24-2 and the through holes 40-2. Since it is necessary to change the depth of 40-3 and counterbore 42 according to the height of components, it is difficult.

  Therefore, an object of the present invention is to provide a method for easily manufacturing a component built-in module and the component built-in module without considering the depth of the hole formed in the substrate and the height of the external electrode of the component. .

  In order to achieve the above-described object, a method of manufacturing a component built-in module according to the present invention prepares a substrate having a first hole, and has an external electrode in the first hole having a lower height than the substrate. Step A for placing the component, and a first connecting member formed of an elastic member and having a first interlayer connecting conductor, and in the first hole and on the component, Step B for placing the first connection member, Step C for pressurizing the first connection member so that the upper surface of the first connection member is flush with the upper surface of the substrate, and the first And a step D of forming an in-plane conductor connected to the interlayer connection conductor on the substrate (claim 1).

  Moreover, in the manufacturing method of the component built-in module according to the present invention, instead of the step C and the step D, an uncured resin layer having the in-plane conductor on the lower surface is prepared, And a step E of pressurizing and inserting the connecting member into the first hole (claim 2).

  The component built-in module manufacturing method according to the present invention is characterized in that, in the step A, an adhesive layer is formed in the first hole, and the component is placed on the adhesive layer ( Claim 3).

  In the method for manufacturing a component built-in module according to the present invention, in the step A, a second connection member incorporating a second interlayer connection conductor is placed in the first hole. It is characterized by being placed on the two connecting members (claim 4).

  The component built-in module manufacturing method according to the present invention is characterized in that the second connecting member is formed of an elastic member.

  Moreover, the method for manufacturing a component built-in module according to the present invention is characterized in that a plurality of the components are present (claim 6).

  In the method of manufacturing a component built-in module according to the present invention, the substrate further includes a second hole, and a third interlayer connection conductor is formed in the second hole by an elastic member. The connecting member is placed (claim 7).

  In the method for manufacturing a component built-in module according to the present invention, a plurality of the third connection members are disposed in a stacked manner in the second hole. ).

  In order to achieve the above-described object, a component built-in module according to the present invention includes a substrate having a first hole, and is placed in the first hole and has an external electrode with a lower height than the substrate. A first connecting member formed by an elastic member and placed in the first hole and on the component so that the upper surface is flush with the upper surface of the substrate; The first connection member includes a first interlayer connection conductor connected to the external electrode, and an in-plane conductor formed on the substrate and connected to the first interlayer connection conductor. (Claim 9).

  According to the first aspect of the present invention, a component built-in module is manufactured by placing a component in a first hole of a substrate and placing a first connection member having a first interlayer connection conductor thereon. Therefore, it is not necessary to form a hole by laser irradiation for placing the first interlayer connection conductor. In addition, since the first connecting member is formed of a stretchable elastic member and is pressed so that the upper surface thereof is flush with the upper surface of the substrate, the depth of the first hole depends on the height of the component. There is no need to adjust the height. Further, there is no need to adjust the height of the built-in component by the amount of adhesive applied. Therefore, it is possible to manufacture the module with a built-in component by forming the first hole to a certain depth and placing the component in the first hole.

  Further, since laser irradiation for forming the hole for the interlayer connection conductor is not required, damage to the external electrode of the component due to laser irradiation can be prevented. Therefore, the electrode material of the external electrode is not limited to copper that reflects the laser, and the component placed in the first hole may have external electrodes of various electrode materials.

  Further, since the first connecting member is pressurized, the component and the first connecting member are brought into close contact with each other by the elastic force, and the conduction reliability between the external electrode and the first interlayer connecting conductor can be improved.

  According to the second aspect of the present invention, an uncured resin layer having an in-plane conductor on the lower surface is prepared, and the first connecting member is pressurized and inserted into the first hole by the resin layer. The step of making the upper surface of the connecting member flush with the upper surface of the substrate and the step of forming the in-plane conductor on the substrate can be performed simultaneously. Therefore, the number of steps for forming the component built-in module can be reduced, and the manufacturing cost can be reduced.

  According to the invention of claim 3, since the adhesive layer is formed in the first hole, and the component is placed and fixed on the adhesive layer, the positional displacement of the component can be prevented.

  According to invention of Claim 4, the 2nd connection member which incorporated the 2nd interlayer connection conductor in the 1st hole is stored, components are stored on the 2nd connection member, and on the components Since the first connection member is placed, a component built-in module in which interlayer connection conductors are arranged above and below the component can be manufactured.

  According to the invention of claim 5, since the second connecting member is also formed of a stretchable elastic member, the component and the second connecting member are brought into close contact with each other and the external electrode and the second interlayer connecting conductor are electrically connected. Reliability can also be improved.

  According to the sixth aspect of the present invention, the same effect as in the first to fifth aspects can be obtained by placing a plurality of parts in the first hole.

  According to invention of Claim 7, a board | substrate further has a 2nd hole, The 3rd connection member formed by the elastic member is stored in the 2nd hole, The 3rd interlayer connection conductor Thus, conduction between the upper surface and the lower surface of the substrate is achieved. Therefore, there is no need to newly form a via hole for conducting electrical connection between the upper surface and the lower surface of the substrate by laser processing, and it is not necessary to fill the hole with a conductive paste or to perform plating.

  According to the eighth aspect of the present invention, the number of third connection members stacked in the second hole can be increased or decreased according to the height of the substrate.

  According to the invention of claim 9, it is possible to provide a novel component built-in module that can be manufactured by the invention of claim 1.

(First embodiment)
A first embodiment corresponding to claims 1, 2, 3, and 9 will be described with reference to FIGS. 1 is a cross-sectional view of the component built-in module, FIGS. 2 to 4 are explanatory diagrams showing the manufacturing process of the component built-in module, and FIG. 5 is a schematic configuration diagram showing a specific example of the first connecting member in the component built-in module. is there.

1. Configuration of Component Built-in Module As shown in FIG. 1, the component built-in module 1 according to the present embodiment includes a wiring layer 3, a component built-in layer 4 that forms the “board” of the present invention together with the wiring layer 3, and a wiring pattern 5. And a resin layer 6 having the same.

  The wiring layer 3 has a predetermined circuit pattern, and a component built-in layer 4 made of resin is disposed on the wiring layer 3. A first hole 9 is formed in the component built-in layer 4, and a base portion 11 as an adhesive layer made of a thermosetting resin is formed at the bottom of the first hole 9. A component 13 having external electrodes 12 on both sides is disposed on the base portion 11, and the component 13 is placed in the first hole 9. As an example, the height of the component built-in layer 4 is about 500 μm, the height of the base portion 11 is about 100 μm, and the height of the component 13 is about 300 μm.

  In the first hole 9, a first connection member 17 having first interlayer connection conductors 16 on both sides is disposed on the component 13. The first interlayer connection conductor 16 has a lower end joined to an upper end of the external electrode 12 of the component 13 and is electrically connected to the external electrode 12.

  The first connecting member 17 is formed of silicon resin, which is an elastic member having elasticity, and has a first interlayer connecting conductor 16 made of solder inside. The first connecting member 17 is not limited to a silicon resin, and may be a fluororesin such as Teflon (registered trademark) or other materials as long as it is a flexible material having a heat resistant temperature of about 300 ° C. . Further, the first interlayer connection conductor is not limited to solder, and may be a conductive paste or other conductive material.

  A resin layer 6 is disposed on the component built-in layer 4, and a wiring pattern 5 connected to the first interlayer connection conductor 16 is formed on the lower surface of the resin layer 6. The external electrode 12 of the component 13 and the wiring pattern 5 are electrically connected through the first interlayer connection conductor 16.

  The component built-in layer 4 and the resin layer 6 are formed of a thermosetting resin such as an epoxy resin in consideration of the ease of the curing process. Moreover, you may form with the photocurable resin hardened | cured with an ultraviolet-ray other than this. However, it is preferable to select one having a low shrinkage ratio due to curing.

  The wiring layer 3 may be a resin substrate, a ceramic substrate, a transfer plate made of SUS or the like, or another component-embedded substrate as long as it has a wiring pattern on the upper surface.

2. Manufacturing Method Next, a manufacturing method of the component built-in module 1 will be described below with reference to FIGS.

  First, as shown in FIG. 2A, a component built-in layer 4 having a first hole 9 is prepared. The component built-in layer 4 is formed of, for example, a thermosetting resin such as an epoxy resin, and the first hole 9 is formed at a desired position by irradiation with a carbon dioxide laser from the upper surface. As shown in FIG. 2A, the wiring layer 3 is formed on the lower surface of the component built-in layer 4 described above.

  The size of the opening of the first hole 9 may be any size as long as it is larger than the size of the built-in component. Further, as described above, the formation of the wiring layer 3 is not limited to after the first hole 9 is formed in the component built-in layer 4, but before the first hole 9 is formed, on the lower surface of the component built-in layer 4. It may be formed. Further, the first hole 9 may be formed in the component-containing layer 4 in an uncured state or may be formed in the component-containing layer 4 in a cured state.

  Next, as shown in FIG. 2B, an uncured thermosetting resin is placed at the bottom of the first hole 9 to form the base portion 11. Then, as shown in FIG. 3C, the component 13 is placed on the base portion 11 described above in the first hole 9.

  And as shown to Fig.3 (a), the 1st connection member 17 is placed on the above-mentioned component 13 in the inside of the 1st hole 9. As shown in FIG.

  As shown in FIG. 3A, the first connecting member 17 placed on the above-described component 13 in the first hole 9 has the first connection as shown in FIG. The upper surface of the connection member 17 is formed so as to protrude from the upper surface of the component built-in layer 4. As an example, the upper surface of the first connection member 17 is formed at a height that protrudes about 10% of the height of the first connection member 17 with respect to the upper surface of the component built-in layer 4.

  Thereafter, a resin layer 6 having a wiring pattern 5 is prepared. The resin layer 6 is made of uncured resin, and a wiring pattern 5 having a predetermined circuit pattern is formed on the lower surface of the resin layer 6 by pressure bonding. Then, as shown in FIG. 3B, the resin layer 6 is disposed on the first connection member 17 so that a predetermined position of the wiring pattern 5 is connected to the first interlayer connection conductor 16.

  Next, as shown in FIG. 4A, a press machine 21 is disposed on the resin layer 6 via a flat plate 20 made of metal. Then, as shown in FIG. 4B, the resin layer 6 and the first connecting member 17 are pressurized by the press machine 21 so that the upper surface of the first connecting member 17 is flush with the upper surface of the component built-in layer 4. Thus, the first connecting member 17 is inserted into the first hole 9. In addition, the height of the 1st connection member 17 after pressurization is about 100 micrometers as an example.

  The applied pressure at this time can be changed as appropriate depending on the material of the first connecting member 17. As an example, when the first connecting member 17 is a fluororesin system, the first connecting member 17 is pressurized with a pressure of 20 MPa or less. Further, the pressurizing force increases as the height of the upper surface of the first connecting member 17 projecting from the upper surface of the component built-in layer 4 increases. However, the pressurizing force is lower than the breaking pressure of the first connecting member 17. Pressed.

  And as shown in FIG.4 (b), the resin layer 6 is thermoset in the state in which the resin layer 6 and the 1st connection member 17 were pressurized with the press machine 21. As shown in FIG. The heating temperature at this time is 180-200 degreeC as an example. Moreover, the base part 11 formed of the thermosetting resin is simultaneously cured by the above-described heating. Therefore, the resin layer 6 having the wiring pattern 5 is integrated with the component built-in layer 4, and the component 13 is fixed on the base portion 11.

  Thereafter, as shown in FIG. 4C, the press machine 21 and the flat plate 20 made of metal are retracted, and the component built-in module 1 is completed.

  In the above-described method, the first connecting member 17 is pressed by the resin layer 6 having the wiring pattern 5 and inserted into the first hole 9, but the upper surface of the first connecting member 17 has a built-in component. After the first connecting member 17 is pressed by the press machine 21 through the flat plate 20 so as to be flush with the upper surface of the layer 4, the wiring pattern 5 connected to the first interlayer connecting conductor 16 is embedded in the component. It may be formed on the layer 4.

  In this case, when the first connection member 17 is pressurized, the first connection member 17 is held by the elastic force in the first hole 9 in a state where the first connection member 17 is flush with the upper surface of the component built-in layer 4. As described above, the size and shape of the first connecting member 17 are formed in advance. Then, for example, a copper foil may be pressure-bonded to the upper surfaces of the first connection member 17 and the component built-in layer 4 that are formed flush with each other, and the pressure-bonded copper foil may be patterned to form a wiring pattern.

  The wiring pattern 5 is not limited to the copper foil as described above, and a copper alloy or other metal foil may be formed and processed into a pattern. In place of the metal foil, a conductive layer made of copper, a copper alloy, or other conductive metal is formed on the entire upper surface of the first connecting member 17 and the component built-in layer 4 formed on the same plane by electrolytic plating and electroless plating. It can also be formed by forming and processing the conductive layer into a pattern.

  As described above, according to the first embodiment, the component 13 is placed in the first hole 9 of the component built-in layer 4 and the first connection member 17 having the first interlayer connection conductor 16 thereon. Since the component built-in module 1 is manufactured, it is not necessary to form a hole by laser irradiation for storing the first interlayer connection conductor 16. In addition, since the first connecting member 17 is formed of an elastic member having elasticity and the upper surface thereof is pressed so as to be flush with the upper surface of the component built-in layer 4, It is not necessary to adjust the depth of one hole 9. Further, it is not necessary to adjust the height of the built-in component 13 by the application amount of the thermosetting resin forming the base portion 11. Accordingly, the first built-in module 1 can be manufactured by forming the first hole 9 to a certain depth and placing the component 13 in the first hole 9.

  Furthermore, since laser irradiation for forming the hole for the first interlayer connection conductor 16 is not required, damage to the external electrode 12 of the component 13 due to laser irradiation can be prevented. Therefore, the electrode material of the external electrode 12 is not limited to copper reflecting the laser, and the component 13 placed in the first hole 9 may have the external electrode 12 of various electrode materials.

  Further, since the first connecting member 17 is pressurized, the component 13 and the first connecting member 17 are brought into close contact by the elastic force, and the conduction reliability between the external electrode 12 and the first interlayer connecting conductor 16 is improved. be able to.

  Further, an uncured resin layer 6 having the wiring pattern 5 on the lower surface is prepared, and the first connection member 17 is inserted into the first hole 9 while simultaneously pressing the resin layer 6 and the first connection member 17. Therefore, the step of making the upper surface of the first connecting member 17 flush with the upper surface of the component built-in layer 4 and the step of forming the wiring pattern 5 on the component built-in layer 4 can be performed simultaneously. Therefore, the number of steps for forming the component built-in module 1 can be reduced, and the manufacturing cost can be reduced.

  FIG. 5 shows a more specific example of the first connection member having the first interlayer connection conductor. The first connection member 27 shown in FIG. 5 is formed of silicon resin, and a first interlayer connection conductor 26 formed in a spherical shape with solder is incorporated therein. Further, the shape of the first interlayer connection conductor is not limited to these shapes, and may be a rectangular parallelepiped or a cylindrical shape. Furthermore, a structure in which spherical solder or conductive paste having a diameter smaller than the thickness of the silicon resin is continuous from the upper surface to the lower surface of the first connection member may be employed.

  Further, the number and position of the first interlayer connection conductor 26 may be adjusted according to the number and position of the external electrodes 12 of the component 13 placed in the first hole 9. The first interlayer connection conductor 26 may be formed of not only solder but also conductive paste or other conductive material, and the first connection member is not limited to silicon resin but other elastic material. It may be formed.

(Second Embodiment)
A second embodiment corresponding to claims 4 and 5 will be described with reference to FIGS. FIG. 6 is a sectional view of the component built-in module according to the second embodiment, and FIGS. 7 and 8 are explanatory views of the manufacturing process.

  The component built-in module 31 of the present embodiment is replaced with a second connecting member 37 having a second interlayer connecting conductor 36 instead of the base portion 11 made of a thermosetting resin placed at the bottom of the first hole 9. Is different from the component built-in module 1 of the first embodiment. 6 to 8, the same reference numerals as those in FIGS. 1 to 5 denote the same or corresponding components.

  In the present embodiment, the structure of the component built-in layer 4 having the wiring layer 33 and the first hole 9 constituting the “board” of the present invention is the same as that of the first embodiment, and thus the description thereof is omitted. As shown in FIG. 6, a second connection member 37 having second interlayer connection conductors 36 on both sides is placed at the bottom of the first hole 9 of the component built-in layer 4. Similarly to the first connection member, the second connection member 37 is formed of an elastic member such as silicon resin, and the second interlayer connection conductor 36 is formed at a position corresponding to the external electrode 12 of the component 13. .

  On the second connection member 37, the component 13 having the external electrodes 12 on both sides is disposed, and the second interlayer connection conductor 36 is electrically connected to the external electrode 12 of the component 13. Further, a first connection member 17 having first interlayer connection conductors 16 on both sides is disposed on the component 13, and the first interlayer connection conductor 16 is electrically connected to the external electrode 12 of the component 13. Has been.

  A resin layer 6 having a wiring pattern 5 on the lower surface is disposed on the component built-in layer 4, and the wiring pattern 5 is connected to the first interlayer connection conductor 17. That is, the second interlayer connection conductor 36, the external electrode 12 of the component 13, the first interlayer connection conductor 16, and the wiring pattern 5 are electrically connected.

  Note that the second connection member 37 may be formed of other materials as well as the silicon resin as long as the first connection member 17 is a flexible material having a heat resistant temperature of about 300 ° C.

  Next, a method for manufacturing the component built-in module 31 will be described below with reference to FIGS.

  Similarly to the first embodiment, as shown in FIG. 7A, a component built-in layer 4 having a first hole 9 is prepared. As shown in FIG. 2A, a wiring layer 33 is formed on the lower surface of the component built-in layer 4 described above.

  Then, as shown in FIG. 7B, a second connection member 37 having a second interlayer connection conductor 36 is placed at the bottom of the first hole 9. Then, as shown in FIG. 5C, the component 13 is placed on the above-described second connection member 37 in the first hole 9.

  Further, in the first hole 9, the first connection member 17 is placed on the component 13 described above.

  As shown in FIG. 8A, the upper surface of the first connecting member 17 placed on the component 13 described above in the first hole 9 is as shown in FIG. 8A. The height is formed so as to protrude from the upper surface of the component built-in layer 4. As an example, as in the first embodiment, the upper surface of the first connection member 17 is formed so that about 10% of the height of the first connection member 17 protrudes from the upper surface of the component built-in layer 4. ing.

  Thereafter, a resin layer 6 having a wiring pattern 5 is prepared. The resin layer 6 is made of uncured resin, and a wiring pattern 5 having a predetermined circuit pattern is formed on the lower surface of the resin layer 6 by pressure bonding. Then, as shown in FIG. 8B, the resin layer 6 is disposed on the first connection member 17 so that a predetermined position of the wiring pattern 5 is connected to the first interlayer connection conductor 16.

  Then, as in the first embodiment, the resin layer 6 and the first connection member 17 are pressurized from the upper surface of the resin layer 6 by the press machine 21, and as shown in FIG. 8 (c), the first connection member The first connecting member 17 is inserted into the first hole 9 so that the upper surface of 17 is flush with the upper surface of the component built-in layer 4.

  In addition, since the 1st connection member 17 and the 2nd connection member 37 are formed with the elastic member, the 1st connection member 17 and the 2nd connection member 37 are compressed by pressurization.

  Thereafter, the resin layer 6 is thermally cured in a state in which the resin layer 6 and the first connecting member are pressurized by the press machine 21, and the component built-in module 31 is completed.

  As described above, according to the second embodiment, the second connection member 37 containing the second interlayer connection conductor 36 is placed in the first hole 9, and the component 13 is placed on the second connection member 37. Since the first connecting member 17 is placed on the component 13, the component built-in module 31 in which the interlayer connection conductors are arranged above and below the component 13 can be manufactured.

  In addition, since the second connection member 37 is also formed of a stretchable elastic member, the component 13 and the second connection member 37 are brought into close contact with each other, and the conduction reliability between the external electrode 12 and the second interlayer connection conductor 36 is confirmed. Can also be increased.

(Third embodiment)
A third embodiment corresponding to claim 6 will be described with reference to FIGS. FIG. 9 is a cross-sectional view of the component built-in module according to the third embodiment, and FIGS. 10 and 11 are explanatory views of the manufacturing process.

  The component built-in module 41 of this embodiment is substantially the same as the component built-in module 31 shown in the second embodiment, except that the component 13 and the connection member having the interlayer connection conductor are placed in multiple stages. This is different from the component built-in module 31 of the second embodiment. 9 to 11, the same reference numerals as those in FIGS. 1 to 8 denote the same or corresponding parts.

  In the present embodiment, the structure of the component built-in layer 4 having the wiring layer 33 and the first hole 9 constituting the “board” of the present invention is the same as that of the first embodiment, and thus the description thereof is omitted. As shown in FIG. 9, a second connection member 37 having a second interlayer connection conductor 36 is placed at the bottom of the first hole 9 of the component built-in layer 4.

  On the second connection member 37, the component 13 having the external electrode 12 on both sides, the first connection member 47 having the first interlayer connection conductor 46 on both sides, and the component having the external electrode 52 on both sides. 53 and a first connection member 57 having first interlayer connection conductors 56 on both sides are arranged in a laminated manner. The first interlayer connection conductor 46, the external electrode 52, and the first interlayer connection conductor 56 are formed at positions corresponding to the external electrode 12.

  On the component built-in layer 4 and the first connection member 57, the resin layer 6 having the wiring pattern 5 on the lower surface is disposed, and the wiring pattern 5 is connected to the first interlayer connection conductor 56. That is, the wiring layer 33, the second interlayer connection conductor 36, the external electrode 12 of the component 13, the first interlayer connection conductor 46, the external electrode 52 of the component 53, the first interlayer connection conductor 56, The wiring pattern 5 is electrically connected.

  Next, a method for manufacturing the component built-in module 41 will be described below with reference to FIGS.

  First, as in the first embodiment, as shown in FIG. 10A, a component built-in layer 4 having a first hole 9 is prepared. As shown in FIG. 2A, a wiring layer 33 is formed on the lower surface of the component built-in layer 4 described above.

  Next, as shown in FIG. 10B, the second connection member 37 having the second interlayer connection conductor 36 is placed at the bottom of the first hole 9. Then, the component 13 having the external electrode 12 is placed on the above-described second connection member 37 inside the first hole 9.

  And in the inside of the 1st hole 9, similarly to the above-mentioned component 13, the 1st connection member 47, the component 53 which has the external electrode 52, and the 1st connection member which has the 1st interlayer connection conductor 56 57 are sequentially placed. The upper surface of the first connecting member 57 is formed at a height protruding from the upper surface of the component built-in layer 4 as shown in FIG.

  Thereafter, a resin layer 6 having a wiring pattern 5 is prepared. As shown in FIG. 11A, the resin layer 6 is a first layer so that a predetermined position of the wiring pattern 5 is connected to the first interlayer connection conductor 56. The connecting member 57 is disposed.

  Then, as in the first embodiment, the resin layer 6 and the first connection member 57 are pressurized from the upper surface of the resin layer 6 by the press machine 21, and as shown in FIG. 11B, the first connection member The first connecting member 57 is inserted into the first hole 9 so that the upper surface of 57 is flush with the upper surface of the component built-in layer 4.

  Since the first connection members 47 and 57 and the second connection member 37 are formed of an elastic member, the first connection members 47 and 57 and the second connection member 37 are compressed by pressure. .

  Thereafter, the resin layer 6 is heat-cured in a state where the resin layer 6 and the first connecting member 57 are pressurized by the press machine 21, and the component built-in module 41 is completed.

  As described above, according to the third embodiment, a plurality of components 13 and 53 can be built in one first hole 9 at a time. In addition, a plurality of components 13 and 53 can be connected in series or in parallel in one first hole 9, and the degree of freedom in design can be improved.

  The number of parts 13 and 53 is not limited to the above-described embodiment, and the types of parts 13 and 53 are not limited to the same type but may be different types of parts. Further, as described above, the plurality of components are not limited to be stacked in the height direction, and a plurality of components may be arranged in the in-plane direction of the component built-in layer 4.

(Fourth embodiment)
A fourth embodiment corresponding to claims 7 and 8 will be described with reference to FIGS. FIG. 12 is a cross-sectional view of the component built-in module according to the fourth embodiment, and FIGS. 13 and 14 are explanatory views of the manufacturing process.

  In the component built-in module 61 of this embodiment, a second hole 63 is formed in the component built-in layer 4 in addition to the first hole 9, and a third interlayer connection conductor 66 is provided in the second hole 63. The connection member 67 is different from the component built-in modules of the first to third embodiments in that the connection member 67 is arranged as a via that connects the wiring layer 33 and the wiring pattern 5. 12 to 14, the same reference numerals as those in FIGS. 1 to 11 denote the same or corresponding parts.

  As shown in FIG. 12, the component built-in module 61 of the present embodiment includes a third connection member having third interlayer connection conductors 66 on both sides at the bottom of the second hole 63 formed in the component built-in layer 4. A plurality of 67 are stacked and placed. Similar to the first connection member, the third connection member 67 is formed of an elastic member such as silicon resin.

  The resin layer 6 having the wiring pattern 5 on the lower surface is disposed on the component built-in layer 4, and the wiring pattern 5 is formed by the uppermost third connection member 67 of the plurality of third connection members 67. The third interlayer connection conductor 66 is connected. That is, the wiring layer 33 and the wiring pattern 5 are electrically connected through the plurality of third interlayer connection conductors 66.

  Next, a method for manufacturing the component built-in module 61 will be described below with reference to FIGS.

  First, as shown in FIG. 13A, the component built-in layer 4 having the second hole 63 in addition to the first hole 9 is prepared. The component built-in layer 4 is formed of, for example, a thermosetting resin such as an epoxy resin, and the second hole 63 is formed at a desired position by being irradiated with a carbon dioxide laser from the upper surface. Then, as shown in FIG. 5A, the wiring layer 33 is formed on the lower surface of the component built-in layer 4 described above.

  Next, as shown in FIG. 13B, the third connection member 67 having the third interlayer connection conductor 66 is placed at the bottom of the second hole 63. In the second hole 63, the third connection member 67 having the same configuration is further placed on the above-described third connection member 67. Similarly, as shown in FIG. 3C, a plurality of third connection members 67 are sequentially stacked and placed inside the second hole 63. As shown in FIG. 7C, a predetermined number of third connection members 67 are formed in the second holes 63 so that the upper surface of the third connection member 67 protrudes from the upper surface of the component built-in layer 4. Is placed inside.

  Thereafter, a resin layer 6 having a wiring pattern 5 is prepared, and a third connecting member in which a predetermined position of the wiring pattern 5 is placed at the top of the second hole 63 as shown in FIG. The resin layer 6 is disposed so as to connect to the third interlayer connection conductor 66 on the upper surface of 67.

  Then, as in the first to third embodiments, the resin layer 6 and the third connecting member 67 are pressurized from the upper surface of the resin layer 6 by the press machine 21, and as shown in FIG. The third connection member 67 is inserted into the second hole 63 so that the upper surface of the connection member 67 is flush with the upper surface of the component built-in layer 4. In addition, since the 3rd connection member 67 is formed with the elastic member, it is compressed by pressurization.

  Thereafter, the resin layer 6 is thermoset while the resin layer 6 and the third connection member 67 are pressurized by the press machine 21, and the component built-in module 61 is completed.

  As described above, according to the fourth embodiment, the component built-in layer 4 further includes the second hole 63, and the third connection member 67 formed of the elastic member having elasticity in the second hole 63. And the wiring layer 33 and the wiring pattern 5 are electrically connected by the third interlayer connection conductor 66. Therefore, there is no need to form a via hole for connecting the wiring layer 33 and the wiring pattern 5 by laser processing, and a via hole for connecting the wiring layer 33 and the wiring pattern 5 is formed again by laser processing. There is no need to fill the holes with a conductive paste or to perform plating.

  In addition, the number of third connection members 67 stacked in the second hole 63 can be increased or decreased according to the height of the component built-in layer 4.

  Note that the present invention is not limited to the above-described embodiment, and various modifications other than those described above can be made without departing from the spirit of the present invention.

  For example, in the above-described embodiment, the connection member is formed of silicon resin. However, as long as the flexible material has a heat resistant temperature of about 300 ° C., the connection member is made of fluororesin such as Teflon (registered trademark) or other materials. It may be formed. The interlayer connection conductor is not limited to solder, and may be formed of a conductive paste or other conductive material.

  In the above-described embodiment, the first hole 9 and the second hole 63 are formed by irradiation with a carbon dioxide laser, but other lasers may be used. Moreover, you may form these holes not only by laser irradiation but by other methods.

  Further, the configurations and materials of the wiring layer 3, the component built-in layer 4, the wiring pattern 5, and the resin layer 6 are not limited to those described in the above-described embodiment, and their shapes, dimensions, and the like are not limited. May be.

It is sectional drawing of the component built-in module in 1st Embodiment of this invention. It is explanatory drawing which shows the manufacturing process of the component built-in module of FIG. It is explanatory drawing which shows the manufacturing process of the component built-in module of FIG. It is explanatory drawing which shows the manufacturing process of the component built-in module of FIG. It is a schematic block diagram which shows the specific example of the 1st connection member in the component built-in module of FIG. 1, (a) is a perspective view, (b) is AA arrow sectional drawing of (a). It is sectional drawing of the component built-in module in 2nd Embodiment of this invention. It is explanatory drawing which shows the manufacturing process of the component built-in module of FIG. It is explanatory drawing which shows the manufacturing process of the component built-in module of FIG. It is sectional drawing of the component built-in module in 3rd Embodiment of this invention. It is explanatory drawing which shows the manufacturing process of the component built-in module of FIG. It is explanatory drawing which shows the manufacturing process of the component built-in module of FIG. It is sectional drawing of the component built-in module in 4th Embodiment of this invention. It is explanatory drawing which shows the manufacturing process of the component built-in module of FIG. It is explanatory drawing which shows the manufacturing process of the component built-in module of FIG. It is explanatory drawing of the manufacturing process of the conventional component built-in module.

Explanation of symbols

1, 31, 41, 61 Component built-in module 3, 33 Wiring layer (substrate)
4 Component built-in layer (substrate)
5 Wiring pattern layer (in-plane conductor)
6 Resin layer 9 1st hole 11 Base part (adhesion layer)
12, 52 External electrode 13, 53 Parts 16, 46, 56 First interlayer connecting conductor 17, 47, 57 First connecting member 36 Second interlayer connecting conductor 37 Second connecting member 63 Second hole 66 Second Third interlayer connection conductor 67 Third connection member

Claims (9)

Preparing a substrate having a first hole, and placing in the first hole a component having a lower height than the substrate and having an external electrode; and
A first connection member formed of an elastic member and having a first interlayer connection conductor is prepared, and the first connection member is placed in the first hole and on the component. Step B,
Pressurizing the first connecting member so that the upper surface of the first connecting member is flush with the upper surface of the substrate; and
And a step D of forming an in-plane conductor connected to the first interlayer connection conductor on the substrate. In place of the step C and the step D,
A step E of preparing an uncured resin layer having the in-plane conductor on the lower surface, pressurizing the first connecting member with the resin layer, and inserting the first connection member into the first hole. The manufacturing method of the component built-in module of Claim 1.   3. The method of manufacturing a component built-in module according to claim 1, wherein an adhesive layer is formed in the first hole in the step A, and the component is placed on the adhesive layer.   In the step A, a second connection member containing a second interlayer connection conductor is placed in the first hole, and the component is placed on the second connection member. The manufacturing method of the component built-in module according to claim 1 or 2.   The method of manufacturing a component built-in module according to claim 4, wherein the second connection member is formed of an elastic member.   The method for manufacturing a component built-in module according to claim 1, wherein the component includes a plurality of components. The substrate further comprises a second hole;
7. The component built-in module according to claim 1, wherein a third connection member formed of an elastic member and having a third interlayer connection conductor is placed in the second hole. Manufacturing method.   The method of manufacturing a component built-in module according to claim 7, wherein a plurality of the third connection members are disposed in a stacked manner in the second hole. A substrate having a first hole;
A component placed in the first hole, having a lower height than the substrate and having an external electrode;
A first connecting member formed by an elastic member and placed in the first hole and on the component so that the upper surface is flush with the upper surface of the substrate;
The first connection member has a first interlayer connection conductor connected to the external electrode;
A component built-in module comprising: an in-plane conductor formed on the substrate and connected to the first interlayer connection conductor.

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