KR20090094983A - A metal core package and a multilayer printed circuit board including the metal core package and a fabricating method of the same - Google Patents

Abstract

A metal core package and a multilayer printed circuit board including the metal core package and a fabricating method of the same are provided to acquire the excellent radiating effects by forming at least two metal cores layers and radiation-insulating layer having excellent conductivity. A first through-hole is formed at a metal core layer(16), and an internal circuit layer is formed at the metal core layer. The internal circuit layer includes a first land and a first circuit pattern on the both sides of the metal core on which an insulating film is formed. The first insulating layer is formed at the both side of the metal core layer sequentially, and external circuit layers(21,22) include a second land and a second circuit pattern. A first conductive paste bump(18) is formed, passing through the first insulating layer to enable the connection between circuit layers.

Description

A metal core package and a multilayer printed circuit board including the metal core package and a fabricating method of the same}

The present invention relates to a metal core package, a multilayer printed circuit board including the same, and a method for manufacturing the same. More particularly, the heat dissipation characteristics and the bending strength can be improved while reducing the manufacturing cost and manufacturing time of the multilayer printed circuit board. A metal core package, a multilayer printed circuit board including the same, and a method of manufacturing the same.

In general, a printed circuit board is wired to one side or both sides of a board made of various thermosetting synthetic resins, and then the IC or electronic components are disposed and fixed on the board, and the electrical wiring is implemented to be coated with an insulator.

One of the most problematic areas when configuring an electronic circuit using an IC or an electronic component on a printed circuit board is a countermeasure against heat of a component in which heat is generated. That is, when a predetermined voltage is applied to the electronic component, a current flows, which inevitably generates heat due to resistance loss. At this time, there are some electronic parts that do not interfere with operation due to natural air cooling due to the low heat generation.However, in the case of heat generating parts in which the temperature of electronic parts continuously increases due to a lot of heat generated, there is a limit to only natural air cooling. And breakage is sometimes a problem, such heat generation causes a problem in the reliability of the entire electronics.

In order to solve this problem, various structures for heat dissipation and cooling have been proposed. For example, Korean Utility Model Publication No. 20-1991-0005748 discloses a printed circuit board having a heat sink.

However, this requires a separate additional structure for heat dissipation, so there is a problem in that it cannot adequately cope with the slim / miniaturization trend of various electronic products. Moreover, since the additional structure is included, there is a problem that the unit cost of the product rises and causes a failure.

Therefore, a method of improving heat dissipation efficiency by inserting a metal having high thermal conductivity into a printed circuit board instead of adding an additional structure to increase heat dissipation efficiency without such a problem has been proposed.

FIG. 1 illustrates a conventional manufacturing process of a multilayer printed circuit board having such a heat radiating metal. Referring to FIG. 1, the manufacturing process will be described below.

First, the through-hole 2 is processed to the metal core 1 with high thermal conductivity using a CNC drill (FIG. 1A).

Next, the insulating material 3 and the copper foil layer 4 are laminated on the metal core 1 (FIG. 1B).

Next, the via hole 5 is formed through the mechanical processing in the through hole 2 of the metal core 1 for the interlayer connection. Here, the via hole 5 should be processed to a size smaller than the through hole 2 of the metal core 1 to insulate the copper plating layer of the inner wall of the via hole 5 by copper plating (FIG. 1C).

Next, a copper plating layer is formed on the inner wall of the via hole 5 to form an interlayer connection between chemical copper plating, that is, an electroless copper plating process and an electrolytic copper plating process, and an inner circuit pattern 6 is formed by exposure, development and etching (Fig. 1d).

Next, the insulating layers 7a, 7b, and 7c and the circuit layer 8 are formed by a general build-up method to form an outer layer as many as desired layers (FIG. 1E).

Thereafter, the photoresist layer 9 is formed on the surface of the outer layer to protect the outer surface and insulation properties, thereby manufacturing a multilayer printed circuit board (FIG. 1F).

The conventional multilayer printed circuit board improves heat dissipation efficiency by inserting a metal core having excellent thermal conductivity into an inner layer core.

However, the conventional multilayer printed circuit board attempts to dissipate heat by inserting a metal core 1 therein, but only one metal core 1 has a limitation in dissipating heat generated from the multilayer printed circuit board.

In addition, in order to manufacture a multilayer printed circuit board according to a conventional manufacturing process, a plurality of lamination forming processes and hole processing processes have to be performed, thereby increasing the manufacturing cost. In addition, the same process "hole processing process, plating process, circuit pattern formation process" proceeds in series, there was a problem that the progress time of the entire process in the case of multiple layers increased. That is, in the conventional multilayer printed circuit board, holes were formed by mechanical processing, and interlayer connection was made by plating the holes. However, the increase of the process due to repetitive work and the interlayer connection due to misalignment became a problem.

The present invention has been made to solve the above problems, an object of the present invention is to add a plurality of heat dissipating material having excellent thermal conductivity, a metal core package having excellent heat dissipation performance, and a multilayer printed circuit board including the same and its manufacture To provide a way.

Another object of the present invention is a metal core package and a multilayer printed circuit board including the same, which do not need to repeat a molding process, a laser hole processing process, a plating process, and a circuit forming process by partially or collectively stacking the conductive paste bumps. And to provide a method for producing the same.

In the metal core package according to the present invention, a metal core layer having a first through hole and an inner circuit layer including a first land and a first circuit pattern formed on both surfaces of a metal core having an insulating film formed thereon, the metal A first insulating layer sequentially formed on both sides of the core layer, an outer circuit layer including a second land and a second circuit pattern, and a first conductive paste bump formed through the first insulating layer for interlayer circuit layer connection; Characterized in that.

Here, the metal core is made of any one of stainless steel, aluminum (Al), nickel (Ni), magnesium (Mg), zinc (Zn), tantalum (Ta), and alloys thereof.

The insulating film may be an insulating resin coating film or an anodization film.

The first conductive paste bumps may be formed between the first lands and the second lands or may be filled in the first through holes and connected to the second lands.

In the multilayer printed circuit board according to the present invention, a metal core layer having a first through hole, an inner circuit layer including a first land and a first circuit pattern formed on both surfaces of a metal core having an insulating film formed thereon, and the metal A first insulating layer sequentially formed on both surfaces of the core layer, an outer circuit layer including a second land and a second circuit pattern, and a first conductive paste bump formed through the first insulating layer for interlayer circuit layer connection; The second conductive paste bump penetrates the interlayer circuit layer between the pair of metal core packages, a second conductive paste bump formed on the second land of one surface of the metal core package, and a pair of the metal core packages. It characterized in that it comprises a second insulating layer.

The method may further include a heat dissipation insulating layer formed on the outermost layer of the metal core package of the multilayer printed circuit board.

The method may further include a photoresist layer formed on the outermost layer of the metal core package of the multilayer printed circuit board.

In addition, the metal core is characterized in that composed of any one of stainless steel, aluminum (Al), nickel (Ni), magnesium (Mg), zinc (Zn), tantalum (Ta), and alloys thereof.

The insulating film may be an insulating resin coating film or an anodization film.

The first conductive paste bumps may be formed between the first lands and the second lands or may be filled in the first through holes and connected to the second lands.

In addition, the heat radiation insulating layer is characterized by consisting of a binder containing carbon nanotubes (CNT).

The method of manufacturing a metal core package according to the present invention includes the steps of (a) forming a first through hole in the metal core and insulating the surface thereof, and (b) forming first lands and first circuit patterns on both surfaces of the metal core. Forming an inner circuit layer comprising the step of manufacturing a metal core layer, (c) forming a first conductive paste bump on the copper foil layer, (d) the first conductive paste bump to penetrate the first insulating layer Stacking the first insulating layer on a copper foil layer to manufacture a paste bump layer, (e) aligning and pressing the pair of paste bump layers to face each other for interlayer connection on both sides of the metal core layer, and then pressing (f) forming an outer circuit layer including a second land and a second circuit pattern on the copper foil layer.

In this case, the first through hole is characterized in that formed through laser processing or mechanical drilling.

In addition, in the step (a), the insulation treatment of the metal core is performed by coating an insulation resin or forming an anodization film by an anodization process.

In addition, the first conductive paste bump is characterized in that the strength is greater than the first insulating layer.

In the method of manufacturing a multilayer printed circuit board according to the present invention, (a) forming a first through hole in a metal core and insulating the surface thereof, (b) a first land and a first circuit on both surfaces of the metal core Forming an inner circuit layer including a pattern to manufacture a metal core layer, (c) forming a first conductive paste bump on the copper foil layer, and (d) the first conductive paste bump penetrates the first insulating layer. Manufacturing a paste bump layer by laminating the first insulating layer on the copper foil layer so as to (e) align and compress the pair of paste bump layers opposite to each other for interlayer connection to both surfaces of the metal core layer; (F) forming an outer circuit layer including a second land and a second circuit pattern on the copper foil layer to manufacture a metal core package, (g) a second on the second land on one surface of the metal core package Conductive paste bumps And forming (h) heat dissipating insulation on an outer surface of the pair of metal core packages arranged through the second through hole to allow the second conductive paste bumps to be interlayer connected with each other. Further disposing the layer to heat pressurization with a press.

At this time, after the step (h) is characterized in that it further comprises the step of forming an open portion by the laser direct ablation (LDA) in the heat insulating insulating layer.

In addition, in the step (h), the second conductive paste bumps are pre-laminated through the second insulating layer, and then the heat dissipating insulating layer is further disposed on the outer surface of the pair of metal core packages. It is characterized by being heated and pressurized.

In the step (h), the heat dissipation layer may be additionally disposed on the outer surface of the pair of metal core packages arranged with the second insulating layer therebetween, and may be heated and pressed in a batch. .

In addition, the first through hole is characterized in that formed through laser processing or mechanical drilling.

In addition, in the step (a), the insulation treatment of the metal core is performed by coating an insulation resin or forming an anodization film by an anodization process.

In addition, the first conductive paste bump and the second conductive paste bump are characterized in that the strength is greater than the first insulating layer and the second insulating layer, respectively.

Another method of manufacturing a multilayer printed circuit board according to the present invention includes the steps of (a) forming a first through hole in a metal core and insulating the surface thereof, (b) a first land and a first circuit on both surfaces of the metal core. Forming an inner circuit layer including a pattern to manufacture a metal core layer, (c) forming a first conductive paste bump on the copper foil layer, and (d) the first conductive paste bump penetrates the first insulating layer. Manufacturing a paste bump layer by laminating the first insulating layer on the copper foil layer so as to (e) align and compress the pair of paste bump layers opposite to each other for interlayer connection to both surfaces of the metal core layer; (F) forming a second land and a second circuit pattern on the copper foil layer to manufacture a metal core package, and (g) forming a second conductive paste bump on the second land on one surface of the metal core package. step (h) arranging a pair of the metal core packages so that the second conductive paste bumps can be interlayered through the second through holes with a second insulating layer interposed therebetween, and pressurizing with a press. Characterized in that.

In this case, after the step (h) further comprises forming a photoresist layer on the outer surface of the metal core package layer.

In addition, the step (h) is characterized in that the second conductive paste bump is pre-laminated through the second insulating layer, and the pair of the metal core package disposed thereafter is heated and pressed by a press.

In addition, in the step (h), the pair of the metal core packages arranged with the second insulating layer interposed therebetween may be heated and pressed by a press.

In addition, the first through hole is characterized in that formed through laser processing or mechanical drilling.

In addition, in the step (a), the insulation treatment of the metal core is performed by coating an insulation resin or forming an anodization film by an anodization process.

In addition, the first conductive paste bump and the second conductive paste bump are characterized in that the strength is greater than the first insulating layer and the second insulating layer, respectively.

According to the metal core package according to the present invention, a multilayer printed circuit board including the same, and a method of manufacturing the same, an excellent heat dissipation effect is provided by providing two or more metal core layers and a heat dissipation insulating layer having a metal core having excellent thermal conductivity.

In addition, the heat dissipation insulation layer protects the outermost circuit pattern and simultaneously performs an electrical insulation function, thereby eliminating the need for a separate PSR process.

In addition, the molding process, laser hole processing process, plating process, and circuit forming process are not repeated using a partial or batch lamination method, and thus, there is an advantage in manufacturing time and cost.

Hereinafter, a metal core package according to a preferred embodiment of the present invention, a multilayer printed circuit board including the same, and a manufacturing method thereof will be described in detail with reference to the accompanying drawings.

2 is a view showing a metal core package according to a preferred embodiment of the present invention.

The metal core package 23 according to a preferred embodiment of the present invention includes the metal core layer 16, the outer circuit layers 21 and 22, and the first conductive paste bumps 18.

The first core 14 and the first circuit pattern of the metal core layer 16 are formed on both surfaces of the metal core 10 having the first through hole 11 for interlayer connection and the insulating layer 12 formed on the surface thereof. An inner circuit layer including (15) is formed.

Here, the metal core 10 is to perform a supporting function and heat dissipation function, stainless steel, aluminum (Al), nickel (Ni), magnesium (Mg), zinc (Zn), tantalum (Ta), and these It consists of either alloy.

In addition, the insulating film 12 is for providing electrical insulation of the metal core 10, and is preferably an insulating resin coating film or an anodizing film.

The outer circuit layer includes a first insulating layer 19 sequentially formed on both surfaces of the metal core layer 16, a second land 21 and a second circuit pattern 22 on which conductive paste bumps are formed, and a metal core. Layer 16 is connected via first conductive paste bump 18.

The first conductive paste bumps 18 connect the metal core layer 16 and the outer circuit layer 21 and are formed using a conductive paste.

Here, the first conductive paste bump 18 is formed between the first land 14 of the metal core layer 16 and the second land 21 of the outer circuit layer, as shown in FIG. 1 is filled in the through hole 11 and is connected to the second land 21. That is, it is formed at a predetermined position within a range necessary for connecting a plurality of circuit layers between layers.

3 is a diagram illustrating a multilayer printed circuit board according to a preferred embodiment of the present invention.

A multilayer printed circuit board according to a preferred embodiment of the present invention includes a pair of metal core packages 23, a second conductive paste bump 24, and a second insulating layer 25.

Since the metal core package 23 is the same as that shown in FIG. 2, a detailed description thereof will be omitted.

The second conductive paste bumps 24 are used to connect the pair of metal core packages 23 and are formed in the second land 21 on one surface of the metal core package.

The second insulating layer 25 is disposed between the metal core packages 23 to penetrate the second conductive paste bumps 24 to facilitate interlayer connection of the pair of metal core packages 23.

4 is a diagram illustrating a multilayer printed circuit board on which a heat dissipation insulation layer is formed according to a preferred embodiment of the present invention.

In the multilayer printed circuit board having the heat dissipation insulation layer formed thereon, the heat dissipation insulation layer 26 is formed on the outermost layer of the multilayer printed circuit board shown in FIG. 2, and the heat dissipation insulation layer 26 protects the circuit pattern of the outermost layer. Heat dissipation while providing electrical isolation.

On the other hand, the heat dissipation insulating layer 26 is formed with an open portion 27 for exposing the second land 21 to be connected to electronic products and the like.

Here, the heat dissipation insulating layer 26 is made of a binder including a carbon nanotube (CNT) that performs both heat dissipation performance and insulation performance, and the heat dissipation performance is improved due to the carbon nanotubes and the multilayered printed circuit. It is made of a binder so that it can be easily laminated on the outer circuit layer of the substrate.

5 is a diagram illustrating a multilayer printed circuit board having a photoresist layer according to a preferred embodiment of the present invention.

In the multilayer printed circuit board on which the photoresist layer is formed, the photoresist layer 30 is formed on the outermost surface of the multilayer printed circuit board shown in FIG. 2, and the photoresist layer 30 protects the circuit pattern of the outermost surface. And provide electrical isolation.

On the other hand, the photoresist layer 30 is formed with an open portion 31 for exposing the second land 21 to be connected to the electronic products and the like.

Here, the conventional photosensitive ink may be used for the photoresist layer 30.

FIG. 6 is a view illustrating a manufacturing process of the metal core package and the multilayer in-circuit board including the same as illustrated in FIGS. 2 to 4.

First, as shown in FIG. 6A, a first through hole 11 for connecting between two layers is formed in the metal core 10 by mechanical drilling (for example, a Computer Numerial Control drill).

Here, the metal core 10 is made of any one of stainless steel, aluminum (Al), nickel (Ni), magnesium (Mg), zinc (Zn), tantalum (Ta), and alloys thereof.

In addition, the hole may be processed by the CO2 or Yag laser drill method by processing the first through hole 11.

Next, as shown in FIG. 6B, an insulating film 12 is formed on the entire surface of the metal core 10 to form a circuit layer.

Here, the insulating treatment process for forming the insulating film 12 may be coated with an insulating resin such as epoxy or anodizing (Anodizing) process.

In more detail about the anodic oxidation process, the metal core 10 is immersed in an electrolyte solution such as boric acid, phosphoric acid, sulfuric acid, and chromic acid, and then the anode is applied to the metal core 10 and the cathode is applied to the electrolyte solution. An oxide film layer (Al ₂ O ₄ ) (that is, grown by performing an oxidation treatment on an aluminum core) is grown on the entire surface of (10).

Next, as shown in FIG. 6C, a thin seed layer 13 is formed of chemical copper plating on the insulated metal core 10.

Next, as shown in FIG. 6D, the first land 14 and the first circuit pattern 15 are formed on the metal core 10 using a conventional circuit pattern forming method such as semi-additive. The metal core layer 16 is manufactured by forming an inner layer circuit layer including the same.

Next, as shown in FIG. 6E, the first conductive paste bumps 18 are formed in the copper foil layer 17.

Here, the first conductive paste bumps 18 are formed by screen printing the paste on the copper foil layer 17 several times.

Next, as shown in FIG. 6F, the first insulating layer 19 is laminated on the copper foil layer 17 so that the first conductive paste bump 18 penetrates the first insulating layer 19. 20) is prepared.

Here, it is preferable that the first conductive paste bump 18 has a greater strength than the first insulating layer 19 so as to penetrate the first insulating layer 19, and the first insulating layer 19 is semi-cured formed of a thermosetting resin. Prepreg in a state is preferable.

Next, as shown in FIG. 6G, the pair of paste bump layers 20 are aligned and pressed to face each other for interlayer connection to both surfaces of the metal core layer 16.

Next, as shown in FIG. 6H, an external circuit layer including the second land 21 and the second circuit pattern 22 is formed on the copper foil of the paste bump layer 20. Here, the second land 21 is electrically connected to the first land 14 by the first conductive paste bump 18. Thus, the four rows of metal core packages 23 shown in FIG. 2 including the metal core layer 16 are fabricated.

At this time, the first conductive paste bumps 18 of the paste bump layer 20 are filled through the first insulating layer 19 and filled in the first through holes 11 of the metal core layer 16 to at least part of the inner circuit layer. Laminate to overlap. When the conductive paste forming the first conductive paste bumps 18 is compressed, the binder component in the conductive paste is extruded, whereby the conductive components and the coupling between the conductive component and the inner circuit layer of the metal core layer 16 become firm, This is because the conductive material of the paste enables electrical connection between the layers.

Next, as shown in FIG. 6I, a second conductive paste bump 24 is formed in the second land 21 on one surface of the metal core package 23 for interlayer connection of the pair of metal core packages. 6I illustrates that the second conductive paste bump 24 is formed in the second land 21 of the metal core package 23 disposed below for convenience of illustration, but the upper metal core package 23 or It will also be included in the present invention that second conductive paste bumps 24 are formed in both the upper and lower metal core packages.

Here, the second conductive paste bumps 24 are printed by a screen print method. Screen printing is a method of printing a bump through a conductive paste transfer process through a mask having an opening. That is, the position of the opening part of a mask is aligned, and an electrically conductive paste is apply | coated to the upper surface of a mask. Then, when the conductive paste is pushed using a squeegee or the like, the conductive paste is extruded through the opening and transferred onto the second land 21, whereby printing with a desired shape and height is possible.

Next, as illustrated in FIG. 6J, a pair of metal core packages 23 are interlayered through the second conductive paste bumps 24.

Here, first, the second insulating layer 25 is prepared, and a pair of the metal core package 23 and the heat dissipation insulating layer 26 are arranged in this order. At this time, the metal core package 23 is arranged such that the second conductive paste bumps 24 formed in the second land 21 of the metal core package 23 face inward. Subsequently, the second land 21 of the metal core package 23 is connected to the second conductive paste bumps 24 formed on one surface of the other metal core package 23 by heating and pressing by a press to connect a pair of metal core packages ( The multilayer printed circuit board shown in FIG. 4 is manufactured by making the interlayer 23) interlayer.

Meanwhile, although FIG. 6J illustrates that the heat dissipation insulation layer 26 is arranged and arranged in the outermost layer of the pair of metal core packages 23, the pair of metal core packages 23 without the heat dissipation insulation layer 26 is illustrated. The multilayer printed circuit board shown in Fig. 3 is manufactured by arranging and collectively stacking the second insulating layer 25 between the layers.

In addition, as shown in FIG. 6J, the interlayer connection may be arranged by sequentially arranging the upper metal core package 23, the second insulating layer 25, and the lower metal core package 23, and heating and pressing them in a batch. The second insulating layer 25 is pre-laminated on the metal core package 23 so that the batch lamination method or the second conductive paste bump 24 penetrates the second insulating layer 25, and then a pair of metal cores are formed. The package 23 may be performed by a batch lamination method after preliminary lamination to heat and press the package 23 through a press.

In this case, when the batch lamination method is used, the interlayer connection is possible at one time, and thus the manufacturing process time is further shortened compared to the manufacturing process by the conventional build-up method. Achieve consistency and reduce manufacturing process time.

Meanwhile, as shown in FIG. 6K, in the present embodiment, an open part 27 is formed in the heat dissipation insulating layer 26 so as to be connected to another electronic product or a base substrate, thereby forming an outermost layer of the multilayer printed circuit board. Exposing the two lands 21. Here, the open portion 27 is preferably formed by the LDA method.

By the above process, the multilayer printed circuit board shown in FIG. 4 is manufactured.

FIG. 7 is a view illustrating a manufacturing process of the multilayer printed circuit board illustrated in FIG. 5, and the manufacturing process thereof will be described below with reference to the drawing.

First, as shown in FIG. 7A, the metal core package 23 is manufactured to form the second conductive paste bumps 24 on the second lands 21 on one surface thereof. Since it is formed in the same manner by the process shown in Figures 6a to 6j detailed description thereof will be omitted.

Next, as shown in FIG. 7B, the second insulating layer 25 is prepared, and the pair of metal core packages 23 are arranged in sequence with the gap therebetween. At this time, the pair of metal core packages 23 are aligned so that the second conductive paste bumps 24 formed on the second lands 21 of the metal core packages 23 face inward, and are pressurized by a press.

Next, as shown in FIG. 7C, the photoresist layer 30 is formed to protect the outer circuit layer of the outermost layer of the heat pressurized printed circuit board and to have insulation. In this case, it is preferable to form the open part 31 in the photoresist layer 30 so as to connect with another electronic product or the base substrate to expose the second land 21 formed in the outermost layer of the multilayer printed circuit board.

By the above process, the multilayer printed circuit board shown in FIG. 5 is manufactured.

On the other hand, the present invention is not limited to the described embodiments, it is apparent to those skilled in the art that various modifications and variations can be made without departing from the spirit and scope of the present invention. Therefore, such modifications or variations will have to belong to the claims of the present invention.

1 is a view showing a manufacturing process of a conventional multilayer printed circuit board;

2 shows a metal core package according to a preferred embodiment of the present invention;

3 is a view showing a manufacturing process of a multilayer printed circuit board according to a preferred embodiment of the present invention;

4 is a view showing a multilayer printed circuit board having a heat radiation insulating layer according to a preferred embodiment of the present invention;

5 is a view showing a multilayer printed circuit board on which a photoresist layer is formed according to a preferred embodiment of the present invention;

6 is a view illustrating a manufacturing process of a metal core package of FIGS. 2 to 4 and a multilayer printed circuit board including the same; And

FIG. 7 is a view illustrating a manufacturing process of the multilayer printed circuit board of FIG. 5.

For the main part of the drawing

10 metal core 12 insulating film

13 seed layer 16 metal core layer

18: first conductive paste bump 20: paste bump layer

23: metal core package 24: the second conductive paste bump

25: second insulating layer 26: heat dissipation insulating layer

30: photoresist layer

Claims (29)

A metal core layer having a first through hole formed therein and an inner circuit layer including first lands and first circuit patterns formed on both surfaces of the metal core having an insulating film formed thereon; An outer circuit layer including first and second insulating layers sequentially formed on both surfaces of the metal core layer, and a second land and a second circuit pattern; And First conductive paste bumps formed through the first insulating layer for interlayer circuit layer connection Metal core package comprising a. The method according to claim 1, The metal core is a metal core package comprising any one of stainless steel, aluminum (Al), nickel (Ni), magnesium (Mg), zinc (Zn), tantalum (Ta), and alloys thereof. The method according to claim 1, The insulating film is a metal core package, characterized in that the insulating resin coating film or anodized film. The method according to claim 1, The first conductive paste bump is formed between the first land and the second land, or filled in the first through-hole metal core package, characterized in that connected to the second land. A metal core layer having a first through hole formed therein and an inner circuit layer including first lands and first circuit patterns formed on both surfaces of the metal core having an insulating film formed thereon; An outer circuit layer including first and second insulating layers sequentially formed on both surfaces of the metal core layer, and a second land and a second circuit pattern; First conductive paste bumps formed through the first insulating layer for interlayer circuit layer connection A pair of metal core packages configured to include; A second conductive paste bump formed on the second land of one surface of the metal core package; And A second insulating layer having the second conductive paste bump penetrated therebetween for connecting an interlayer circuit layer between the pair of metal core packages Multilayer printed circuit board comprising a. The method according to claim 5, And a heat radiation insulating layer formed on an outermost layer of the metal core package of the multilayer printed circuit board. The method according to claim 5, And a photoresist layer formed on the outermost layer of the metal core package of the multilayer printed circuit board. The method according to claim 5, The metal core is a multilayer printed circuit board comprising any one of stainless steel, aluminum (Al), nickel (Ni), magnesium (Mg), zinc (Zn), tantalum (Ta), and alloys thereof. The method according to claim 5, The insulating film is a multilayer printed circuit board, characterized in that the insulating resin coating film or anodized film. The method according to claim 5, And the first conductive paste bump is formed between the first land and the second land or filled in the first through hole and connected to the second land. The method according to claim 6, Multilayer printed circuit board, characterized in that the heat insulating insulating layer made of a binder containing carbon nanotubes (CNT). (a) forming a first through hole in the metal core and insulating the surface; (b) forming a metal core layer by forming an inner circuit layer including a first land and a first circuit pattern on both surfaces of the metal core; (c) forming a first conductive paste bump on the copper foil layer; (d) manufacturing a paste bump layer by laminating the first insulating layer on the copper foil layer so that the first conductive paste bump penetrates the first insulating layer; (e) aligning and pressing the pair of paste bump layers opposite to each other for interlayer connection to both surfaces of the metal core layer; And (f) forming an outer circuit layer including a second land and a second circuit pattern on the copper foil layer Method of manufacturing a metal core package comprising a. The method according to claim 12, The first through hole is a method of manufacturing a metal core package, characterized in that formed through laser processing or mechanical drilling. The method according to claim 12, In the step (a), the insulation treatment of the metal core is performed by coating an insulating resin or forming an anodization film by an anodizing process. The method according to claim 12, The first conductive paste bumps have a greater strength than the first insulating layer. (a) forming a first through hole in the metal core and insulating the surface; (b) forming a metal core layer by forming an inner circuit layer including a first land and a first circuit pattern on both surfaces of the metal core; (c) forming a first conductive paste bump on the copper foil layer; (d) manufacturing a paste bump layer by laminating the first insulating layer on the copper foil layer so that the first conductive paste bump penetrates the first insulating layer; (e) aligning and pressing the pair of paste bump layers opposite to each other for interlayer connection to both surfaces of the metal core layer; (f) forming an outer circuit layer including a second land and a second circuit pattern on the copper foil layer to manufacture a metal core package; (g) forming a second conductive paste bump on the second land on one surface of the metal core package; And (h) a heat dissipation insulating layer is further provided on an outer surface of the pair of metal core packages arranged to allow interlayer connection between the second conductive paste bumps through the second through hole and having a second insulating layer therebetween; The method of manufacturing a multilayer printed circuit board comprising the step of placing and pressing by heat in a press. The method according to claim 16, After the step (h) further comprising the step of forming an open portion by the laser direct ablation (LDA) in the heat insulating insulating layer. The method according to claim 16, In the step (h), the second conductive paste bumps are pre-laminated through the second insulating layer, and then the heat dissipating insulating layer is additionally disposed on the outer surface of the pair of metal core packages, and is heated and pressed by a press. Method of manufacturing a multilayer printed circuit board, characterized in that. The method according to claim 16, In the step (h), multi-layer printing, wherein the heat dissipation layer is additionally disposed on an outer surface of the pair of metal core packages arranged with the second insulating layer interposed therebetween, and is heated and pressed by a batch. Method of manufacturing a circuit board. The method according to claim 16, The first through hole is a method of manufacturing a multilayer printed circuit board, characterized in that formed through laser processing or mechanical drilling. The method according to claim 16, In the step (a), the insulation treatment of the metal core is performed by coating an insulation resin or forming an anodization film by an anodization process. The method according to claim 16, The first conductive paste bumps and the second conductive paste bumps have a greater strength than the first insulating layer and the second insulating layer, respectively. (a) forming a first through hole in the metal core and insulating the surface; (b) forming a metal core layer by forming an inner circuit layer including a first land and a first circuit pattern on both surfaces of the metal core; (c) forming a first conductive paste bump on the copper foil layer; (d) manufacturing a paste bump layer by laminating the first insulating layer on the copper foil layer such that the first conductive paste bump penetrates the first insulating layer; (e) aligning and pressing the pair of paste bump layers opposite to each other for interlayer connection to both surfaces of the metal core layer; (f) manufacturing a metal core package by forming a second land and a second circuit pattern on the copper foil layer; (g) forming a second conductive paste bump on the second land on one surface of the metal core package; And (h) arranging a pair of the metal core packages so that the second conductive paste bumps can be interlayered through the second through holes with a second insulating layer interposed therebetween, and pressurizing with a press. Method of manufacturing a multilayer printed circuit board, characterized in that. The method according to claim 23, And forming a photoresist layer on the outer surface of the metal core package layer after the step (h). The method according to claim 23, In the step (h), the second conductive paste bumps are pre-laminated through the second insulating layer, and then the pair of the metal core packages disposed thereon is heated and pressed by a press. Manufacturing method. The method according to claim 23, In the step (h), the method of manufacturing a multilayer printed circuit board, wherein the pair of the metal core packages arranged with the second insulating layer interposed therebetween are heated and pressed by a press. The method according to claim 23, The first through hole is a method of manufacturing a multilayer printed circuit board, characterized in that formed through laser processing or mechanical drilling. The method according to claim 23, In the step (a), the insulation treatment of the metal core is performed by coating an insulation resin or forming an anodization film by an anodization process. The method according to claim 23, The first conductive paste bumps and the second conductive paste bumps have a greater strength than the first insulating layer and the second insulating layer, respectively.

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