CN107018621A - A kind of method that copper billet is buried in printed circuit board - Google Patents
A kind of method that copper billet is buried in printed circuit board Download PDFInfo
- Publication number
- CN107018621A CN107018621A CN201710357365.3A CN201710357365A CN107018621A CN 107018621 A CN107018621 A CN 107018621A CN 201710357365 A CN201710357365 A CN 201710357365A CN 107018621 A CN107018621 A CN 107018621A
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- Prior art keywords
- copper billet
- copper
- printed circuit
- circuit board
- copper foil
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
A kind of method that copper billet is buried in printed circuit board, including：A) preboring is positioned into the first copper foil patch of tooling hole on the supporting plate；) the first copper billet in the first copper foil surface produced by graphic plating；From) make to bury in the first copper billet by being laminated increasing layer；It is right) windowing task is carried out on the second copper foil and dielectric layer, process groove；E) groove is filled and led up in plating, forms the second copper billet；F) carry out line pattern making in processing plate both sides and surface treatment makes, obtain the printed circuit board buried in copper billet.This method makes copper billet be buried in printed circuit intralamellar part, it is ensured that the Performance Match of copper billet and board structure of circuit, with well stable reliability；Copper billet graphic designs are convenient, and the heat transfer thermal conduction characteristic of circuit design is realized to greatest extent, multilayer can be obtained and bury copper billet structure printed circuit board, and obtained printed circuit board arrangement is stable, good reliability.
Description
Technical field
The present invention relates to the manufacturing technology of printed circuit board or semiconductor integrated circuit package substrate, and in particular to Yi Zhong
The method that copper billet is buried in printed circuit board.
Background technology
With the development of electronics techniques, people require more and more higher to the integrated level of printed circuit board.Electronic product
High integration, minimize, be miniaturizated to inevitable development need, printed circuit board or semiconductor integrated circuit package base
Plate, also develops towards light, thin, short, small designer trends.Simultaneously for the design requirement also more and more higher of electronic system, especially
It is multilayer printed circuit board electronic element on circuit board packing density and integrated level more and more higher, power consumption is increasing, right
The thermal diffusivity of multilayer printed circuit board requires also more and more higher.
Based on electrical performance requirements, local heat dissipation capacity is big, and the design of conventional printed circuit boards is extremely difficult to effect, and some are special
The printed circuit board of different radiator structure just arises at the historic moment.Conventional design is the fluting embedment metal derby radiating between circuit board.Bury
The metal derby stock size entered is smaller, is required after embedment and printed circuit board one entirety of formation, realizes electric interconnection；More
Say, it is desirable to which the metal derby being embedded in circuit board is good with surrounding medium bonding, without lamination problem, and the gold being embedded to body
Category block surface and printed circuit board outer layer will also realize electric interconnection, thus intactly link together.
Based on above demand, it is developed and a variety of buries copper billet technology.The technology of conventional embedment copper billet is, first will be by copper
At fluting on block insertion printed circuit board, then copper billet is fixed, frequently with screen print process, in copper billet and printing electricity
Heat cured resin material is painted between plate：Or directly printing conductive copper cream etc. is adhesively fixed in advance, realized most after follow-up baking
It is fixed eventually, an entirety is formed, finally by laminating method increasing layer, realizes that copper billet is buried in printed circuit intralamellar part.
Process above method flow is complicated, cumbersome, and there are many controlling difficulties, it is often more important that：Due to binding material
There is the difference in performance with printed circuit board material, CTE (Coefficient of Thermal between the two
Expansion, thermal coefficient of expansion) difference substantially, subsequent thermal process easily vertical direction (Z-direction) stretching, there is cause
Order the hidden danger of reliability.
The content of the invention
It is an object of the invention to provide a kind of method for burying copper billet in printed circuit board, copper billet is set to be buried in printing electricity
The thermal coefficient of expansion of road intralamellar part, core material and copper billet has good uniformity, has during subsequent thermal good
Stability, it is ensured that the Performance Match of copper billet and board structure of circuit, can also be according to product with well stable reliability
The need for carry out copper billet shape design, realize to greatest extent circuit design heat transfer thermal conduction characteristic, it is possible to achieve multilayer is buried
Copper billet structure printed circuit board.
In order to achieve the above object, the technical scheme that the present invention is provided is as follows：
A kind of method that copper billet is buried in printed circuit board, comprises the following steps：
A) the first copper foil is prepared, it includes extra thin copper foil and carrier copper foil, and extra thin copper foil and carrier copper foil are with detachable shape
Formula is connected；The locating and machining tooling hole on the first copper foil；
B) the first copper foil is attached on the supporting plate, carrier copper foil is located between extra thin copper foil and supporting plate after attaching；
C) dry film is pasted on extra thin copper foil, using tooling hole is positioned, it is determined that needing the first copper billet in embedment printed circuit board
Position, and produced by pattern transfer on dry film and need to be embedded to the position of the first copper billet and figure in printed circuit board,
Wherein, the thickness of dry film is more than the thickness for needing to be embedded to the first copper billet；
D) go out the first copper billet in extra thin copper foil electroplating surface using graphic plating, then remove dry film, obtain carrying first
The processing plate of copper billet；
E) it is obtained processing plate and semi-solid preparation bonding sheet, the second copper foil is pre- folded, and lamination increasing layer is carried out, semi-solid preparation is bonded
Piece turns into dielectric layer, obtains the interior double-layer structure processing plate for burying the first copper billet；
F) to the processing plate obtained in step e), carried out on the second copper foil and dielectric layer at the corresponding region of the first copper billet
Windowing processing, forms groove；
G) groove formed in step f) is electroplated, and groove the second copper billet of formation is filled and led up, so as to bury first in obtaining
The two-sided processing plate of copper billet and the second copper billet；
H) carrier copper foil of supporting plate and the first copper foil is removed, the processing plate of interior embedment copper billet is obtained；
I) by the processing plate obtained in step h) carried out on the extra thin copper foil and the second copper foil of the first copper foil graphic making,
Welding resistance makes and surface treatment makes, and finally gives the interior printed circuit board for burying copper billet.
Further, in step c), the figure of first copper billet is triangle, quadrangle, annular, Else Rule shape or
Irregular shape, micropore or cylindricality.
Preferably, in step a), the thickness of the extra thin copper foil is 1-5 μm, and the thickness of the carrier copper foil is 12-35 μ
m。
Further, in step a), the positioning tooling hole on first copper foil is by machining process, Laser Processing
Method or ion implanting processing method carry out drilling acquisition.
Also, in step d) and/or step g), the electro-plating method is that horizontal continuity plating, vertical continuous plating or copper are former
Sub- sputtering method.
Further, in step e), the thickness of the semi-solid preparation bonding sheet is more than the thickness of the first copper billet, and the semi-solid preparation glues
Sheeting is to have glass fiber material, the resin material without glass fiber material or addition ceramic material.
Also, in step e), the dielectric layer is formed by multilayer semi-solid preparation bonding sheet.
Further, in step e), before lamination increasing layer, first to entering on semi-solid preparation bonding sheet with the interior corresponding position of copper billet of burying
Row windowing processing.
Further, before step h) is carried out, repeating said steps e)-g) n times, so that it is completely interior to obtain n+2 block copper billets
The two-sided smooth processing plate buried, n value is：More than or equal to 1, in step i), in the extra thin copper foil and the n-th+2
Graphic making, welding resistance are carried out on copper foil to make and surface treatment making, finally give the interior multilayer printed circuit board for burying copper billet.
The present invention produces the copper billet for needing to be embedded to, the formation of copper billet by the method for graphic plating in core material
Grow, with good adhesion, be firmly combined with similar to from core material, need not only be added from outside for bonding
The adhesive of copper billet and core material, is also overcomed in the prior art because binding material and printed circuit board material have performance
On difference caused by CTE (Coefficient of Thermal Expansion, thermal coefficient of expansion) difference significantly ask
Topic, especially, in printed circuit board of the invention, in vertical direction (Z-direction), the thermal coefficient of expansion of core material and copper billet
With good uniformity, there is good stability during subsequent thermal.
In the present invention, it can be designed according to the shape of progress copper billet the need for product, realize that circuit is designed to greatest extent
Heat transfer thermal conduction characteristic.According to the scattering demand of actual product, the design of radiating copper block structure of different shapes, such as triangle are realized
Shape, quadrangle, the design of the Else Rule shape such as annular and irregular shape, it is possible to achieve to crucial heat dissipation region around setting
Meter, to reach optimal radiating effect, heat conduction copper billet can also be designed to metal micro-holes, or metal column etc., to facilitate difference
The processing and fabricating of manufacture craft.
Because extra thin copper foil itself can not be individually present, in the present invention, the first copper foil is typically one layer 1-5 μm of ultra-thin copper
The combination of paper tinsel and one layer 12-35 μm of carrier copper foil composition, passes through a kind of micro- adhesion between extra thin copper foil and carrier copper foil
Combination, can subsequently split.
The present invention can require that one layer of selection or multilayer prepreg binding material are used simultaneously according to design thickness,
Its thickness is more than the thickness of copper billet, to ensure that copper billet completely interior can be embedded in prepreg, can also be right before lamination increasing layer
Semi-solid preparation bonds sheet material and carries out windowing task, to ensure that copper billet is embedded in pre-preg materials in effective.
It is compared with the prior art, the present invention has the advantages that：
1) Stability Analysis of Structures, good reliability
The present invention makes copper billet be buried in printed circuit intralamellar part, it is ensured that copper billet and electricity by graphic plating, lamination increasing layer
The Performance Match of the hardened structure in road, with well stable reliability, especially in vertical direction (Z-direction), core material and
Copper has the uniformity of good thermal coefficient of expansion, has good stability during subsequent thermal.
2) design convenient
Using the present invention, can according to actual product radiating requirements, realize setting for radiating copper block structure of different shapes,
The heat transfer thermal conduction characteristic of circuit design is realized to greatest extent, and according to different design requirements, make different structure buries copper billet
Printed circuit board.
3) realize that multilayer buries copper billet structure printed circuit board
Four-layer structure, six layer structure, Yi Jigeng can be realized according to meter is buried in progress multilayer copper billet the need for product
The making of the printed circuit panel products for burying copper billet of multilayer.
Brief description of the drawings
Fig. 1-10 is Making programme figure of the present invention by example of two-ply, wherein：
Fig. 1 is will to form copper billet to carry out the diagrammatic cross-section that preboring positions instrument hole machined with the first copper foil.
Fig. 2 is the diagrammatic cross-section that formation copper billet is attached to support plate surface with the first copper foil.
Fig. 3 is the method by figure dry film pattern transfer, and the schematic diagram of copper billet figure is made in the first copper foil surface.
Fig. 4 is to utilize graphic plating method, produces the first copper billet figure in the first copper foil surface, and remove showing for dry film
It is intended to.
Fig. 5 uses semi-solid preparation bonding sheet in the first copper block surface of formation, and the second copper foil carries out lamination plus layer, and copper is buried in formation
The schematic diagram of block structure.
Fig. 6 is carried out having been formed in copper billet on the outside of the processing plate for burying structure, on the outside of copper billet corresponding region, uses laser
Windowing task is carried out, the structural representation of groove is processed.
Fig. 7 is that groove location progress plating is filled and led up by electroplating, in the first copper billet correspondence position the second copper billet knot of formation
Structure schematic diagram.
Fig. 8 is to remove supporting plate, obtains the processing plate schematic diagram buried in the first copper billet and the second copper billet.
Fig. 9, using pattern transfer technology, is carried out simultaneously in the processing plate both sides for having completed to bury structure in copper billet on two sides
Dry film graphic making, obtains burying the processing plate schematic diagram of structure in two-sided copper billet.
Figure 10 is that welding resistance operation and surface metalation processing operation are carried out on processing plate two sides, obtains final bilateral structure
Printed circuit board structural representation.
Figure 11-14 is the printed circuit board example that the difference produced using present invention process method buries copper billet structure.
Figure 11 is the schematic diagram of two layers of printed circuit board structure of the embedment copper billet being connected using metal micro-holes with copper billet.
Figure 12 is 2, the schematic diagram of four layers of printed circuit board structure of 3 layers of embedment copper billet.
Figure 13 is 1, the schematic diagram of four layers of printed circuit board structure of 2,3,4 layers of embedment copper billet.
Figure 14 be metal micro-holes be connected with copper billet 2, the schematic diagram of four layers of printed circuit board structure of 3 layers of embedment copper billet.
Embodiment
Below in conjunction with specific embodiment, the invention will be further described.
Embodiment
Referring to Fig. 1~Figure 10, the present invention makes the method for burying copper billet structure two sided pcb, and it includes following step
Suddenly：
A) the first copper foil is prepared, it contains extra thin copper foil 102 and the structure of carrier copper foil 101, and machine drilling is carried out to it, plus
Work goes out to position tooling hole 103, as shown in Figure 1；
B) the first copper foil with positioning tooling hole is pasted in supporting plate 104, forms the processing plate with carrier structure,
Wherein, extra thin copper foil 101 is between supporting plate 104 and carrier copper foil 102, as shown in Figure 2；
C) dry film 105, exposure, development are pasted on the surface of extra thin copper foil 102, with reference to the positioning tooling hole 103 of preboring, is schemed
Shape is shifted, and the dry film figure 106 of copper billet is produced on dry film, as shown in Figure 3；
D) then carry out graphic plating operation, produce copper billet 107 on the surface of extra thin copper foil 102, then remove dry film
105, the first copper billet 107 for needing to be embedded in dielectric layer is obtained, as shown in Figure 4；
E) laminates are then carried out, lamination is carried out using semi-solid preparation bonding sheet, the second copper foil 109 plus layer makes.Wherein,
Turn into dielectric layer 108 after the lamination of semi-solid preparation bonding sheet, the thickness of dielectric layer 108 is more than the thickness of the first copper billet 107, obtains first
The hardened structure of processing buried in copper billet 107, as shown in Figure 5；
F) on the copper foil 109 of dielectric layer 108 and second, corresponding to the interior region for burying the first copper billet 107, Laser Processing is used
Technology carries out windowing task and obtains groove 110, and the size of groove 110 is less than the size of the first copper billet 107, as shown in Figure 6；Then
Groove 110 is filled and led up by electroplating filling perforation operation, the second copper billet 111 is obtained, so as to finally give the first copper billet 107 and the second bronze medal
The processing plate buried in block 111, schematic diagram is as shown in Figure 7；
G) supporting plate 104 and carrier copper foil 101 are removed, obtains the completely interior double-deck processing plate structural representation buried of copper billet
Figure, as shown in Figure 8；
H) on the copper foil 109 of extra thin copper foil 102 and second of double-deck processing plate both sides, pad pasting is carried out, is exposed, is developed, erosion
The pattern transfer operation at quarter, obtains line layer 112 and 112 ', as shown in Figure 9；
I) solder mask coating is carried out in line layer 112 and 112 ', obtains 113 and 113 ' solder masks, then carry out surface
Processing makes, and obtains side metallization 114 and 114 ', finally gives the two sided pcb buried in copper billet, such as Figure 10 institutes
Show.
Further, with above step f), connected using the copper billet of metal aperture 115 and first, Figure 11 structure can be obtained；Weight
Multiple above step e) and Making programme f), can obtain the printed circuit board for burying copper billet structure of sandwich construction, be with four layers
Example, is obtained such as Figure 12, four layers shown in 13,14 bury copper billet structure printed circuit board.
Claims (10)
1. a kind of method that copper billet is buried in printed circuit board, comprises the following steps：
A) the first copper foil is prepared, it includes extra thin copper foil and carrier copper foil, and extra thin copper foil and carrier copper foil are connected with removable form-separating
Connect；The locating and machining tooling hole on the first copper foil；
B) the first copper foil is attached on the supporting plate, carrier copper foil is located between extra thin copper foil and supporting plate after attaching；
C) dry film is pasted on extra thin copper foil, using tooling hole is positioned, it is determined that needing to be embedded to the position of the first copper billet in printed circuit board
Put, and produced by pattern transfer on dry film and need to be embedded to the position of the first copper billet and figure in printed circuit board, wherein,
The thickness of dry film is more than the thickness for needing to be embedded to the first copper billet；
D) go out the first copper billet in extra thin copper foil electroplating surface using graphic plating, then remove dry film, obtain carrying the first copper billet
Processing plate；
E) it is obtained processing plate and semi-solid preparation bonding sheet, the second copper foil is pre- folded, and carry out lamination increasing layer, semi-solid preparation bonding sheet into
For dielectric layer, the interior double-layer structure processing plate for burying the first copper billet is obtained；
F) to the processing plate obtained in step e), opened a window on the second copper foil and dielectric layer at the corresponding region of the first copper billet
Processing, forms groove；
G) groove formed in step f) is electroplated, and groove the second copper billet of formation is filled and led up, so as to bury the first copper billet in obtaining
With the two-sided processing plate of the second copper billet；
H) carrier copper foil of supporting plate and the first copper foil is removed, the processing plate of interior embedment copper billet is obtained；
I) the processing plate obtained in step h) is subjected to graphic making, welding resistance on the extra thin copper foil and the second copper foil of the first copper foil
Make and surface treatment makes, finally give the interior printed circuit board for burying copper billet.
2. the method for copper billet is buried in printed circuit board according to claim 1, it is characterised in that in step c), described
The figure of one copper billet is triangle, quadrangle, annular, Else Rule shape or irregular shape, micropore or cylindricality.
3. the method for copper billet is buried in printed circuit board according to claim 1, it is characterised in that in step a), the first bronze medal
Positioning tooling hole on paper tinsel is drilled by machining process, laser processing or ion implanting processing method
Obtain.
4. the method for copper billet is buried in printed circuit board according to claim 1, it is characterised in that in step a), it is described super
The thickness of thin copper foil is 1-5 μm, and the thickness of the carrier copper foil is 12-35 μm.
5. the method for copper billet is buried in printed circuit board according to claim 1, it is characterised in that step d) and/or step
G) in, the electro-plating method is horizontal continuity plating, vertical continuous plating or copper atom sputtering method.
6. the method for copper billet is buried in printed circuit board according to claim 1, it is characterised in that in step e), given an account of
Matter layer is formed by multilayer semi-solid preparation bonding sheet.
7. the method for copper billet is buried in printed circuit board according to claim 1 or 6, it is characterised in that described in step e)
Semi-solid preparation bonding sheet is to have glass fiber material, the resin material without glass fiber material or addition ceramic material.
8. the method for copper billet is buried in printed circuit board according to claim 1 or 6 or 7, it is characterised in that in step e),
The thickness of the semi-solid preparation bonding sheet is more than the thickness of the first copper billet.
9. the method for copper billet is buried in printed circuit board according to claim any one of 1-8, it is characterised in that step e)
In, before lamination increasing layer, first to carrying out windowing processing with the interior corresponding position of copper billet of burying on semi-solid preparation bonding sheet.
10. the method for copper billet is buried in printed circuit board according to claim any one of 1-8, it is characterised in that carrying out
Before step h), repeating said steps e)-g) n times, so that the completely interior two-sided smooth processing plate buried of n+2 blocks copper billet is obtained, n's
Value is：More than or equal to 1, in step i), graphic making, welding resistance are carried out on the extra thin copper foil and the n-th+2 copper foils
Make and surface treatment makes, finally give the interior multilayer printed circuit board for burying copper billet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710357365.3A CN107018621B (en) | 2017-05-19 | 2017-05-19 | A method of burying copper billet in printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710357365.3A CN107018621B (en) | 2017-05-19 | 2017-05-19 | A method of burying copper billet in printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107018621A true CN107018621A (en) | 2017-08-04 |
| CN107018621B CN107018621B (en) | 2019-05-21 |
Family
ID=59450309
Family Applications (1)
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| CN201710357365.3A Active CN107018621B (en) | 2017-05-19 | 2017-05-19 | A method of burying copper billet in printed circuit board |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108135070A (en) * | 2017-11-28 | 2018-06-08 | 广州兴森快捷电路科技有限公司 | Bury metal derby PCB and preparation method thereof |
| CN108282968A (en) * | 2018-01-31 | 2018-07-13 | 维沃移动通信有限公司 | A kind of substrate of printed circuit board and preparation method thereof |
| CN110809358A (en) * | 2019-10-24 | 2020-02-18 | 广州兴森快捷电路科技有限公司 | Heat dissipation PCB and manufacturing method thereof |
| CN111885812A (en) * | 2020-07-14 | 2020-11-03 | 珠海方正科技高密电子有限公司 | Circuit board and circuit board manufacturing method |
| CN113630969A (en) * | 2021-10-11 | 2021-11-09 | 四川英创力电子科技股份有限公司 | Copper embedding device for printed circuit board and printed circuit board processing method |
| CN113677108A (en) * | 2021-08-16 | 2021-11-19 | 上海美维电子有限公司 | Manufacturing method of embedded copper block |
| CN114071987A (en) * | 2020-07-29 | 2022-02-18 | 北大方正集团有限公司 | SMT chip mounter, copper embedding method, device and medium |
| CN114258184A (en) * | 2020-09-23 | 2022-03-29 | 鹏鼎控股(深圳)股份有限公司 | Circuit board manufacturing method and circuit board |
| CN114928961A (en) * | 2022-05-20 | 2022-08-19 | 重庆方正高密电子有限公司 | Preparation method of PCB and PCB |
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| JP2014192224A (en) * | 2013-03-26 | 2014-10-06 | Ngk Spark Plug Co Ltd | Method for manufacturing wiring board |
| CN106063387A (en) * | 2013-12-12 | 2016-10-26 | At&S奥地利科技与系统技术股份公司 | Method for embedding a component in a printed circuit board |
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| JP2014192224A (en) * | 2013-03-26 | 2014-10-06 | Ngk Spark Plug Co Ltd | Method for manufacturing wiring board |
| CN106063387A (en) * | 2013-12-12 | 2016-10-26 | At&S奥地利科技与系统技术股份公司 | Method for embedding a component in a printed circuit board |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108135070A (en) * | 2017-11-28 | 2018-06-08 | 广州兴森快捷电路科技有限公司 | Bury metal derby PCB and preparation method thereof |
| CN108282968A (en) * | 2018-01-31 | 2018-07-13 | 维沃移动通信有限公司 | A kind of substrate of printed circuit board and preparation method thereof |
| CN108282968B (en) * | 2018-01-31 | 2020-01-31 | 维沃移动通信有限公司 | printed circuit board substrate and manufacturing method thereof |
| CN110809358A (en) * | 2019-10-24 | 2020-02-18 | 广州兴森快捷电路科技有限公司 | Heat dissipation PCB and manufacturing method thereof |
| CN111885812A (en) * | 2020-07-14 | 2020-11-03 | 珠海方正科技高密电子有限公司 | Circuit board and circuit board manufacturing method |
| CN114071987A (en) * | 2020-07-29 | 2022-02-18 | 北大方正集团有限公司 | SMT chip mounter, copper embedding method, device and medium |
| CN114071987B (en) * | 2020-07-29 | 2023-03-21 | 北大方正集团有限公司 | SMT chip mounter, copper embedding method, device and medium |
| CN114258184A (en) * | 2020-09-23 | 2022-03-29 | 鹏鼎控股(深圳)股份有限公司 | Circuit board manufacturing method and circuit board |
| CN114258184B (en) * | 2020-09-23 | 2023-11-10 | 鹏鼎控股(深圳)股份有限公司 | Method for manufacturing circuit board and circuit board |
| CN113677108A (en) * | 2021-08-16 | 2021-11-19 | 上海美维电子有限公司 | Manufacturing method of embedded copper block |
| CN113630969B (en) * | 2021-10-11 | 2022-02-01 | 四川英创力电子科技股份有限公司 | Copper embedding device for printed circuit board and printed circuit board processing method |
| CN113630969A (en) * | 2021-10-11 | 2021-11-09 | 四川英创力电子科技股份有限公司 | Copper embedding device for printed circuit board and printed circuit board processing method |
| CN114928961A (en) * | 2022-05-20 | 2022-08-19 | 重庆方正高密电子有限公司 | Preparation method of PCB and PCB |
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| CN107018621B (en) | 2019-05-21 |
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