CN108282968A - A kind of substrate of printed circuit board and preparation method thereof - Google Patents
A kind of substrate of printed circuit board and preparation method thereof Download PDFInfo
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- CN108282968A CN108282968A CN201810096112.XA CN201810096112A CN108282968A CN 108282968 A CN108282968 A CN 108282968A CN 201810096112 A CN201810096112 A CN 201810096112A CN 108282968 A CN108282968 A CN 108282968A
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- prepreg
- carrier
- heat carrier
- multiple heat
- circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present invention relates to field of communication technology, a kind of substrate of printed circuit board and preparation method thereof is provided, the making precision to solve the problems, such as PCB is low.Wherein, the production method of the substrate of printed circuit board includes：Multiple heat carriers are pasted on predetermined carrier；It is sequentially placed the first prepreg and the first copper foil in one side of the multiple heat carrier far from the predetermined carrier, and is once laminated；The predetermined carrier is removed, and the second prepreg and the second copper foil are sequentially placed on one side what the multiple heat carrier was bonded with the predetermined carrier, and carries out quadratic-layer pressure, obtains the substrate of printed circuit board.When due to being laminated during making substrate, heat carrier not will produce offset.Therefore, the substrate manufacture printed circuit board of the printed circuit board based on the present invention, can improve the making precision of printed circuit board.
Description
Technical field
The present invention relates to fields of communication technology more particularly to a kind of substrate of printed circuit board and preparation method thereof.
Background technology
PCB (printed circuit board, Printed Circuit Board) is the supporter of electronic component, is electronics member device
The carrier of part electrical connection.Since electronic component will produce heat in the process of work, PCB needs to have heat sinking function,
And for the integrated circuit equipped with dense wire and dense holes, higher cooling requirements are then proposed to PCB.
In order to solve the problems, such as that PCB radiates, material of the embedment with heat conductivility is the main way used at present in PCB
Diameter.In the prior art, it when being embedded to Heat Conduction Material, is usually slotted in advance to PCB and prepreg, then by Heat Conduction Material
Embedded slotting position, to complete the making of PCB motherboards.For this Heat Conduction Material embedded mode, due to the ruler of slot area
The very little size needed more than Heat Conduction Material, when being laminated after being embedded to Heat Conduction Material, Heat Conduction Material easy tos produce offset, from
And influence the making precision of PCB.
As it can be seen that PCB has that making precision is low in the prior art.
Invention content
The embodiment of the present invention provides a kind of substrate of printed circuit board and preparation method thereof, to solve the making precision of PCB
Low problem.
In order to solve the above-mentioned technical problem, the invention is realized in this way：
On the one hand, an embodiment of the present invention provides a kind of production methods of the substrate of printed circuit board, including：
Multiple heat carriers are pasted on predetermined carrier；
It is sequentially placed the first prepreg and the first bronze medal in one side of the multiple heat carrier far from the predetermined carrier
Foil, and be once laminated；
The predetermined carrier is removed, and is sequentially placed on one side what the multiple heat carrier was bonded with the predetermined carrier
Two prepregs and the second copper foil, and quadratic-layer pressure is carried out, obtain the substrate of printed circuit board.
On the other hand, the embodiment of the present invention also provides a kind of substrate of printed circuit board, including：
Prepreg, multiple heat carriers inside the prepreg, set on the first face of the prepreg
First copper foil, and the second copper foil set on the second face of the prepreg, second face are opposite with first face
One side；
Wherein, the prepreg includes the first semi-solid preparation between the multiple heat carrier and first copper foil
Piece, the second prepreg between the multiple heat carrier and second copper foil and be located at first prepreg
Interconnecting piece between second prepreg, the interconnecting piece are consolidated by first prepreg and/or described the second half
Change piece lamination and is formed.
In the embodiment of the present invention, multiple heat carriers are pasted on predetermined carrier；In the multiple heat carrier far from described pre-
If being sequentially placed the first prepreg and the first copper foil in the one side of carrier, and once it is laminated；The predetermined carrier is removed,
And it is sequentially placed the second prepreg and the second copper foil on one side what the multiple heat carrier was bonded with the predetermined carrier, it goes forward side by side
The secondary lamination of row, obtains the substrate of printed circuit board.When due to being laminated during making substrate, heat carrier will not produce
Raw offset.Therefore, the substrate manufacture printed circuit board of the printed circuit board based on the present invention, can improve the system of printed circuit board
Make precision.
Description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, needed in being described below to the embodiment of the present invention
Attached drawing to be used is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention,
For those of ordinary skill in the art, without having to pay creative labor, it can also obtain according to these attached drawings
Obtain other attached drawings.
Fig. 1 is the flow chart of the production method of the substrate of printed circuit board provided in an embodiment of the present invention；
Fig. 2 is one of the production process charts of substrate of printed circuit board provided in an embodiment of the present invention；
Fig. 3 is the two of the production process charts of the substrate of printed circuit board provided in an embodiment of the present invention；
Fig. 4 is the three of the production process charts of the substrate of printed circuit board provided in an embodiment of the present invention；
Fig. 5 is arrangement schematic diagram of the copper billet provided in an embodiment of the present invention on predetermined carrier；
Fig. 6 is the four of the production process charts of the substrate of printed circuit board provided in an embodiment of the present invention；
Fig. 7 is the five of the production process charts of the substrate of printed circuit board provided in an embodiment of the present invention；
Fig. 8 is the structural schematic diagram of the substrate of printed circuit board provided in an embodiment of the present invention；
Fig. 9 is the structural schematic diagram of printed circuit board provided in an embodiment of the present invention.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are some of the embodiments of the present invention, instead of all the embodiments.Based on this hair
Embodiment in bright, the every other implementation that those of ordinary skill in the art are obtained without creative efforts
Example, shall fall within the protection scope of the present invention.
It is the flow chart of the production method of the substrate of printed circuit board provided in an embodiment of the present invention referring to Fig. 1, Fig. 1, such as
Shown in Fig. 1, include the following steps：
Step 101 pastes multiple heat carriers on predetermined carrier.
Wherein, predetermined carrier can be the carrier for having certain degree of hardness, for example, solidification after resin, have certain degree of hardness
Plastic cement etc..In this way, during lamination, will not be deformed due to carrier leads to heat conduction solid offsetting, can improve and lead
The precision of hot body position.In addition, when being dismantled to predetermined carrier, convenient for carrying out integral demounting, operation side to predetermined carrier
Formula is convenient, improves producing efficiency.
Heat carrier and predetermined carrier generation relative displacement can be in predetermined carriers before pasting heat carrier in order to prevent
Upper coating adhesive, to be pasted onto multiple heat carriers on the predetermined carrier coated with adhesive.Before pasting heat carrier,
Adhesive can also be coated in the one side of each heat carrier being bonded with predetermined carrier, it is default to be pasted onto multiple heat carriers
On carrier.In this way, when being laminated, heat conduction solid offsetting can be prevented.
For the ease of determining that the paste position of heat carrier can also carry out before pasting heat carrier on predetermined carrier
Positioning.For example, being opened up on predetermined carrier and the matched groove of the size of heat carrier.Each matching grooves one can be arranged to lead
Then each heat carrier is placed in different grooves by hot body respectively, form effect as shown in Figure 5.When heat carrier according to
When certain rule is arranged, multiple heat carriers can also be arranged in a groove.For example, when multiple heat carriers are arranged in matrix
When, can opening up multirow, either multiple row groove makes every a line or each row heat carrier be placed in the same groove.In this way,
Quickly the position of heat carrier can be positioned, to be pasted to heat carrier.Furthermore it is also possible to which multiple heat carriers are complete
Portion is arranged in a groove, can not only be positioned to the position of heat carrier, and it is solid that half can also be moulded in lamination process
Change the shape of piece.
Using the production method of the embodiment of the present invention, the smaller heat carrier of size can be buried, to obtain PCB.Heat conduction
The shape of body can be specifically cuboid, cylinder, prism or other shapes.
When the shape of the heat carrier is cuboid, the minimum 0.5mm of length of the heat carrier, the heat carrier
The altitude range of the minimum 0.5mm of width, the heat carrier are 100 μm to 2000 μm, between heat carrier described in any two
Minimum 150 μm of spacing.
In this embodiment, heat carrier can be processed in advance, obtains the heat carrier of design size, in this way, can
To obtain the higher heat carrier of accuracy to size.When heat carrier is copper billet, copper foil or copper coin can be processed, be obtained
The copper billet of design size is as heat carrier.It specifically can be to certain thickness copper foil, either copper coin is punched out or laser
Cutting, is processed into the copper billet of required shape and required size.After obtaining copper billet, the surface of copper billet can be carried out at roughening
Reason.
In practical application, the specific size of heat carrier can be determined according to actual design, when the shape of heat carrier is length
When cube, the length minimum of heat carrier can be made as 0.5mm, and the width minimum of heat carrier can be made as 0.5mm, heat carrier
Height it is unrestricted, 100 μm to 2000 μm are only preferred height in the present embodiment.
In this way, convenient for embedded heat carrier, and in the smaller heat carrier of embedded size, heat carrier not will produce offset, can
To improve the aligning accuracy of heat carrier, to improve the heat dissipation effect of PCB.In addition, can be made between heat carrier it is smaller between
Away from the heat dissipation effect of PCB can be further increased.
This step in the specific implementation, multiple heat carriers is affixed to and are coated on the predetermined carrier of adhesive backers, wherein glue
Glutinous material is resin or adhesive film, and heat carrier is copper billet.
It in this embodiment, can first adhesive backers such as coated with resins or adhesive film on predetermined carrier.Adhesive backers
With caking property, and there is the characteristic for being easy surface drying, heat carrier can be attached to by adhesive backers on predetermined carrier after surface drying.
In this way, after the relative position between heat carrier determines, will not shift.
Since adhesive backers has the characteristic that cohesive force declines after high temperature, in this way, adhesive backers can be heated to
It after certain temperature, then cools down, so as to quickly remove the adhesive backers on heat carrier surface and predetermined carrier.
It, can be first by adhesive film sticking on predetermined carrier, then by multiple heat carriers when adhesive backers is adhesive film
It is pasted onto on adhesive film.In this way, when dismantling predetermined carrier, convenient for quickly adhesive film and predetermined carrier are removed.
PCB can be improved since copper has the good characteristic of thermal conductivity as heat carrier using copper billet in present embodiment
Heat dissipation effect, and production cost can be reduced.
In addition, when the height that the spacing between two adjacent heat carriers is more than default spacing or the multiple heat carrier is big
It is described to be sequentially placed the first prepreg in one side of the multiple heat carrier far from the predetermined carrier when preset height
With the first copper foil, and carry out once be laminated the step of before, the method further includes：It is added between two adjacent heat carriers
Adhesive backers；Or add adhesive backers between the multiple heat carrier and first prepreg.
When spacing is larger between two adjacent heat carriers, that is, when being more than default spacing or the height of heat carrier is larger,
When being more than preset height, during to heating prepreg, may exist less due to prepreg and be difficult to fill out
Gap between full heat carrier or the non-uniform situation of filling.
Therefore, adhesive backers can be added between the larger heat carrier in gap, it specifically can be among two heat carriers
Position addition adhesive backers can be flowed, and fill uniformly with heat carrier in this way, when adhesive backers melts at high temperature
Between gap.Adhesive backers can also be added between heat carrier and the first prepreg, avoid starved abnormal.Wherein, glue
Glutinous material can be specifically pure film or resin etc..In this way, the quality of PCB can be improved.
Alternatively, it is also possible to determine the quantity of prepreg according to the gap between heat carrier.When the height of heat carrier is larger
When, when the spacing between heat carrier is larger, then the gap between heat carrier is larger, can place relatively large number of prepreg,
The case where avoiding starved；When the height of heat carrier is small, and the spacing between heat carrier is smaller, then the gap between heat carrier
It is small, relatively small number of prepreg can be placed.In this way, due to having reinforcing material in prepreg, the strong of PCB can be increased
Degree.
Optionally, described before the step of pasting multiple heat carriers on predetermined carrier, the method further includes：To described
One side of multiple heat carriers far from the predetermined carrier carries out a roughening treatment.
Wherein, roughening treatment can be brown processing, Darkening process or super roughening treatment etc., the surface of heat carrier is thick
After change processing, the contact area between heat carrier and the first prepreg can be increased, so as to improve heat carrier and first
The reliability connected between prepreg not will produce relative displacement between heat carrier and the first prepreg, so as to carry
The precision that high PCB makes.
Step 102 is sequentially placed the first prepreg in one side of the multiple heat carrier far from the predetermined carrier
With the first copper foil, and once it is laminated.
Wherein, one side of the heat carrier far from predetermined carrier it is to be understood that in heat carrier with the face phase that is bonded predetermined carrier
To another side.
Specifically, be sequentially placed in one side of the multiple heat carrier far from the predetermined carrier the first prepreg and
First copper foil, and suppressed；By first heating prepreg to the first preset temperature, first preset temperature is institute
State the melting temperature of the first prepreg；First prepreg is heated to the second default temperature by first preset temperature
Degree, second preset temperature are the solidification temperature of first prepreg.
In this embodiment, the first preset temperature is the melting temperature of the first prepreg it is to be understood that the first half
Cured sheets can flow when being in the first preset temperature；The solidification temperature of first prepreg is it is to be understood that the first semi-solid preparation
Piece is solid-state when being in the second preset temperature.
After by the first heating prepreg to the first preset temperature, the flowing of the first prepreg, and fill uniformly with more
Gap between a heat carrier can fill up the gap between heat carrier when the first prepreg is enough.Continue
When one prepreg is heated to the second preset temperature, the first prepreg becomes solid-state from flow regime, the first prepreg and
It is combined closely between multiple heat carriers as an entirety.Reinforcing material in first prepreg can further enhance heat carrier
And the first connection between prepreg.
In addition, while to the first heating prepreg, it can also be to the first prepreg, the first copper foil and heat conduction
Body pressurizes, and to make heat carrier combine closely with the first prepreg, can also make the first prepreg and the first copper foil
Joint place is more smooth.
It should be noted that when carrying out secondary lamination to the second prepreg, the second copper foil and heat carrier, it equally can be with
It is laminated using the above embodiment.
Combined in this way, during lamination, between heat carrier and prepreg it is even closer, using this kind of embodiment
It is laminated, heat carrier not will produce offset.
Step 103, the removal predetermined carrier, and the one side being bonded with the predetermined carrier in the multiple heat carrier according to
The second prepreg of secondary placement and the second copper foil, and quadratic-layer pressure is carried out, obtain the substrate of printed circuit board.
In this step, predetermined carrier is removed, exposes the surface of heat carrier.When being coated with adhesive on predetermined carrier
When, predetermined carrier and adhesive can be removed successively, expose the surface of heat carrier.Exposing being sequentially placed on one side for heat carrier
Second prepreg and the second copper foil, and carry out quadratic-layer pressure.The process being specifically laminated can be with the process of same lamination, to keep away
Exempt to repeat, details are not described herein again.After carrying out secondary lamination, heat carrier is embedded in prepreg, obtains printed circuit board
Substrate.After obtaining substrate, hole machined, plating, figure can be carried out to substrate by substrate according to the fabrication processing of PCB
The techniques such as transfer, welding resistance, surface treatment, molding and test, making becomes the preferable PCB of required heat dissipation effect.Specifically
Manufacture craft may refer to the prior art, and details are not described herein again.
In this way, during making, heat carrier not will produce offset, and the making precision of substrate is high, so as to improve
The precision of PCB.And using the manufacture craft of the embodiment of the present invention, convenient for the smaller heat carrier of manufactured size.
This step in the specific implementation, removes the predetermined carrier；The multiple heat carrier and the predetermined carrier are pasted
The one side of conjunction carries out secondary roughening treatment；It is sequentially placed the second semi-solid preparation on one side in the secondary roughening treatment of the multiple heat carrier
Piece and the second copper foil, and quadratic-layer pressure is carried out, obtain the substrate of printed circuit board.
In this embodiment, after removing predetermined carrier, expose the surface of heat carrier, and one that heat carrier is exposed
Face carries out roughening treatment, can be specifically brown processing, Darkening process or super roughening treatment.In this way, can increase heat carrier with
Contact area between prepreg, it is solid half so as to improve the reliability of the connection between heat carrier and prepreg
After changing piece solidification, heat carrier and prepreg are closely connected as one.
In order to make it easy to understand, below copper billet as heat carrier, and is combined legend, to the system of the embodiment of the present invention
It is illustrated as flow.
The first step：To the copper product 1 of preset thickness, if copper foil or copper coin are processed, the copper for meeting size requirement is obtained
Block 11, it is specific as shown in Figure 2.At this point it is possible to be carried out at Darkening process, brown processing or super roughening to the surface of copper billet 11
Reason, to improve the reliability connected between copper billet and prepreg.
Second step：Adhesive 3 is coated on predetermined carrier 2, forms structure as shown in Figure 3.Wherein, adhesive specifically may be used
To be resin or adhesive film.
Third walks：Affixing on one side of being not handled by of the copper billet 11 processed is coated with to the predetermined carrier 2 of adhesive 3
On, form such as Fig. 4 and structure as shown in Figure 5.
4th step：It is sequentially placed the first prepreg 41 and the first copper foil above the treated one side in 11 surface of copper billet
51, and be laminated, form structure as shown in FIG. 6.First prepreg 41 flows at high temperature, flows between copper billet 11
Gap, when continuing to heat the first prepreg 41, the first prepreg 41 becomes solid-state, to make 41 He of the first prepreg
Copper billet 11 is integrated into a whole.After treatment due to copper billet 11, increase with the contact area of the first prepreg 41, increase
The cohesive force of first prepreg 41 and copper billet 11.
5th step：Predetermined carrier 2 and adhesive 3 are removed, structure as shown in Figure 7 is formed.Since adhesive 3 is passing through
After high temperature, cohesive force declines, and can quickly remove predetermined carrier 2 and the adhesive 3 being attached on copper billet 11.
6th step：After removal predetermined carrier 2 and adhesive 3, expose copper billet, and exposing being sequentially placed on one side for copper billet
Second prepreg 42 and the second copper foil 52, are laminated, obtain the substrate of printed circuit board as shown in Figure 8.
7th step：Drilled, be electroplated by existing technique to substrate, pattern transfer, welding resistance, surface treatment, molding, survey
The techniques such as examination can obtain PCB as shown in Figure 9, complete the making that the heat dissipation PCB of small copper block is embedded in middle layer.
Using the production method of the embodiment of the present invention, the Machinability Evaluation of small size super-thick copper heat dissipation PCB, energy can be solved
Enough improve the making precision of PCB.
Referring to Fig. 8, Fig. 8 is the structural schematic diagram of the substrate of printed circuit board provided in an embodiment of the present invention.Such as Fig. 8 institutes
Show, the substrate of printed circuit board includes：Prepreg 4, is set to institute at multiple heat carriers 11 inside the prepreg 4
State first copper foil 51 in the first face of prepreg 4, and the second copper foil 52 set on the second face of the prepreg 4, institute
It is the one side opposite with first face to state the second face；
Wherein, the prepreg 4 includes first between the multiple heat carrier 11 and first copper foil 51
Prepreg 41, the second prepreg 42 between the multiple heat carrier 11 and second copper foil 52 and be located at institute
The interconnecting piece between the first prepreg 41 and second prepreg 42 is stated, the interconnecting piece is by first prepreg
41 and/or second prepreg 42 lamination and formed.
Wherein, interconnecting piece can be the prepreg in the gap between multiple heat carriers, to the first semi-solid preparation
When piece is laminated, the first prepreg flows into the gap between multiple heat carriers, and when be laminated to the second prepreg, the second half consolidate
The gap between multiple heat carriers can also be flowed by changing piece, and the prepreg being located in multiple heat conduction body spaces forms interconnecting piece.
In the specific implementation, can the first copper foil and the first prepreg first be placed in the one side of multiple heat carriers, gone forward side by side
Then row lamination is placed the second copper foil and the second prepreg in the another side of multiple heat carriers, and is laminated, printed
The substrate of circuit board.Due to prepreg during lamination Heated Flow and wrap up multiple heat carriers, make multiple heat carriers
It being embedded in prepreg, heat carrier not will produce offset, and heat carrier and prepreg can be closely connected as one, to
The making precision of printed circuit board can be mentioned.
Optionally, the shape of each heat carrier 11 is cuboid, and the length of each heat carrier 11 is minimum
0.5mm, the minimum 0.5mm of width of each heat carrier 11, the altitude range of each heat carrier 11 be 100 μm extremely
2000μm。
Wherein, multiple heat carriers 11 are according to certain arrangement that puts in order, and are embedded in prepreg 4, the first copper foil
51 and second copper foil 52 be respectively arranged on two opposite surfaces of prepreg.Since the size that heat carrier can make is smaller, and make
Make craft precision height, user can make the printed circuit board for including small size heat carrier according to actual demand, and can improve
The precision of printed circuit board.
Optionally, minimum 150 μm of the spacing between heat carrier 11 described in any two.
In this embodiment, user can design the spacing between heat carrier according to actual conditions.It can between heat carrier
The spacing of making is smaller, disclosure satisfy that actual demand, can improve heat dissipation effect.
Optionally, the heat carrier 11 is copper billet.
When heat carrier is copper billet, copper foil or copper coin can be processed, the copper billet conduct for obtaining design size is led
Hot body.It can improve PCB's since copper has the good characteristic of thermal conductivity as heat carrier using copper billet in present embodiment
Heat dissipation effect, and production cost can be reduced.
The embodiment of the present invention is described with above attached drawing, but the invention is not limited in above-mentioned specific
Embodiment, the above mentioned embodiment is only schematical, rather than restrictive, those skilled in the art
Under the inspiration of the present invention, without breaking away from the scope protected by the purposes and claims of the present invention, it can also make very much
Form belongs within the protection of the present invention.
Claims (10)
1. a kind of production method of the substrate of printed circuit board, which is characterized in that including：
Multiple heat carriers are pasted on predetermined carrier；
The first prepreg and the first copper foil are sequentially placed in one side of the multiple heat carrier far from the predetermined carrier, and
Once it is laminated；
It removes the predetermined carrier, and the second half is sequentially placed on one side what the multiple heat carrier was bonded with the predetermined carrier
Cured sheets and the second copper foil, and quadratic-layer pressure is carried out, obtain the substrate of printed circuit board.
2. according to the method described in claim 1, it is characterized in that, it is described in the multiple heat carrier far from the predetermined carrier
One side on be sequentially placed the first prepreg and the first copper foil, and the step of being once laminated, including：
The first prepreg and the first copper foil are sequentially placed in one side of the multiple heat carrier far from the predetermined carrier, and
It is suppressed；
By first heating prepreg to the first preset temperature, first preset temperature is first prepreg
Melting temperature；
First prepreg is heated to the second preset temperature by first preset temperature, second preset temperature is
The solidification temperature of first prepreg.
3. according to the method described in claim 2, it is characterized in that, the step for pasting multiple heat carriers on predetermined carrier
Suddenly, including：
Multiple heat carriers are affixed to and are coated on the predetermined carrier of adhesive backers.
4. according to the method described in claim 1, it is characterized in that, being preset when the spacing between two adjacent heat carriers is more than
When spacing or the height of the multiple heat carrier are more than preset height, it is described in the multiple heat carrier far from the predetermined carrier
One side on be sequentially placed the first prepreg and the first copper foil, and before the step of be once laminated, the method is also wrapped
It includes：
Adhesive backers is added between two adjacent heat carriers；Or
Adhesive backers is added between the multiple heat carrier and first prepreg.
5. according to the method described in claim 1, it is characterized in that, described the step of pasting multiple heat carriers on predetermined carrier
Before, the method further includes：
Roughening treatment is carried out to one side of the multiple heat carrier far from the predetermined carrier；
The removal predetermined carrier, and it is sequentially placed the second half on one side what multiple heat carriers were bonded with the predetermined carrier
Cured sheets and the second copper foil, and the step of carrying out quadratic-layer pressure, obtaining the substrate of printed circuit board, including：
Remove the predetermined carrier；
Secondary roughening treatment is carried out to the one side that the multiple heat carrier is bonded with the predetermined carrier；
It is sequentially placed the second prepreg and the second copper foil on one side in the secondary roughening treatment of the multiple heat carrier, and carries out two
Secondary lamination obtains the substrate of printed circuit board.
6. method according to claim 3 or 4, which is characterized in that the adhesive backers is resin or adhesive film.
7. a kind of substrate of printed circuit board, which is characterized in that including：
Prepreg, multiple heat carriers inside the prepreg, first set on the first face of the prepreg
Copper foil, and the second copper foil set on the second face of the prepreg, second face are opposite with first face one
Face；
Wherein, the prepreg include the first prepreg between the multiple heat carrier and first copper foil,
The second prepreg between the multiple heat carrier and second copper foil and positioned at first prepreg and
Interconnecting piece between second prepreg, the interconnecting piece is by first prepreg and/or second semi-solid preparation
Piece is laminated and is formed.
8. the substrate of printed circuit board according to claim 7, which is characterized in that the shape of each heat carrier is length
Cube, the minimum 0.5mm of length of each heat carrier, the minimum 0.5mm of width of each heat carrier are each described
The altitude range of heat carrier is 100 μm to 2000 μm.
9. the substrate of printed circuit board according to claim 7, which is characterized in that between heat carrier described in any two
Minimum 150 μm of spacing.
10. the substrate of the printed circuit board according to any one of claim 7 to 9, which is characterized in that the heat carrier is
Copper billet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201810096112.XA CN108282968B (en) | 2018-01-31 | 2018-01-31 | printed circuit board substrate and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810096112.XA CN108282968B (en) | 2018-01-31 | 2018-01-31 | printed circuit board substrate and manufacturing method thereof |
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| CN108282968A true CN108282968A (en) | 2018-07-13 |
| CN108282968B CN108282968B (en) | 2020-01-31 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108882538A (en) * | 2018-07-17 | 2018-11-23 | 乐健科技（珠海）有限公司 | Circuit board and preparation method thereof |
| CN111885812A (en) * | 2020-07-14 | 2020-11-03 | 珠海方正科技高密电子有限公司 | Circuit board and circuit board manufacturing method |
| CN112208169A (en) * | 2020-09-30 | 2021-01-12 | 宁波甬强科技有限公司 | Copper-clad plate and manufacturing method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108882538A (en) * | 2018-07-17 | 2018-11-23 | 乐健科技（珠海）有限公司 | Circuit board and preparation method thereof |
| CN111885812A (en) * | 2020-07-14 | 2020-11-03 | 珠海方正科技高密电子有限公司 | Circuit board and circuit board manufacturing method |
| CN112208169A (en) * | 2020-09-30 | 2021-01-12 | 宁波甬强科技有限公司 | Copper-clad plate and manufacturing method thereof |
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