CN206323638U - A kind of high thermal conductivity buries copper billet circuit board - Google Patents
A kind of high thermal conductivity buries copper billet circuit board Download PDFInfo
- Publication number
- CN206323638U CN206323638U CN201621209588.2U CN201621209588U CN206323638U CN 206323638 U CN206323638 U CN 206323638U CN 201621209588 U CN201621209588 U CN 201621209588U CN 206323638 U CN206323638 U CN 206323638U
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- Prior art keywords
- copper
- tack coat
- copper billet
- thermal conductivity
- circuit board
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Abstract
What the utility model provided a kind of high thermal conductivity buries copper billet circuit board, and the copper billet circuit board that buries of the high thermal conductivity includes the embedding core plate for having a copper billet；One first tack coat and one second tack coat of the both sides of the core plate are laid in respectively；It is bonded in one first layers of copper on first tack coat；And it is bonded in one second layers of copper on second tack coat；Wherein, first layers of copper or/and the second layers of copper are provided with a chip, first tack coat or/and second tack coat and offer some through holes, to improve the thermal conductivity between the chip and the copper billet.The utility model offers some through holes between the tack coat between copper billet and chip, and the low heat conductivity of tack coat is improved, and the heat that chip is produced directly is conducted to copper billet by through hole, improves thermal conductivity, and radiating is uniform, advantageously reduces the temperature of chip.
Description
Technical field
The utility model is related to copper-clad plate, field of circuit boards, more particularly to a kind of high thermal conductivity buries copper billet circuit board.
Background technology
The electric energy that high-power electronic component is operationally consumed, in addition to part is as useful work, is largely changed into
Heat.These heats make element internal temperature rise rapidly, if not in time distributed heat, and electronic component can be persistently overheating,
Its qualitative reliability is caused to decline, severe patient even results in electronic component and failed because of overheat.According to the elaboration of pertinent literature, chip
Junction temperature it is too high can cause many problems, such as quantum effect is relatively low, usage cycles are shorter, even equipment failure.Size is light
Thin and powerful electronic equipment just faces the problem of operating temperature is too high from birth.For the big electronics member of caloric value
Part, it is inadequate to distribute heat by pcb board carrier merely, therefore is usually constructed with its corresponding heat dissipating method.Traditional radiating
Method is usual just like radiator fan, thermal grease, fin etc., but has the disadvantage to produce noise and need to increase exceptional space, this
Lightening trend runs in the opposite direction with current electronic product.Therefore, it is all so as to reduce chip by improving the radiator structure of pcb board
It is an attracting solution of comparison to enclose temperature.Improving the approach of pcb board radiator structure at present has PCB bottoms adhesion metal
Heat conduction aluminium lamination (Embedded Al Plate) is embedded in the middle of base (Bottom Bonding), PCB and by resin-bonding in PCB
Internal embedding copper billet (Buried I-Coin).These methods largely improve the heat transfer efficiency of pcb board.
As shown in figure 1, illustrating a pcb board 1 ', pcb board 1 ' is provided with a chip 2 ', and pcb board 1 ' includes a core plate 20 ',
The two sides of core plate 20 ' has been stacked alternately minimum one group of tack coat 30 ' and layers of copper 40 ', every side of the core plate 20 ' of Fig. 1 displayings
On be equipped with two groups of tack coats 30 ' and layers of copper 40 ', copper billet 10 ' is embedded in pcb board, and specifically, copper billet 10 ' extends to outer
The tack coat 30 ' of side.The heat that chip 2 ' is produced is transferred to copper billet by one group of layers of copper 40 ' and tack coat 30 ' in outside, so that
Play a part of radiating.However, this method can not still meet the demand of electronic component, its development is largely limited.
This patent for the pcb board of internal embedding copper billet carry out structure improve there is provided it is a kind of it is new bury copper billet circuit board, its
With high thermal conductivity, to overcome above-mentioned the deficiencies in the prior art.
Utility model content
The purpose of this utility model be a kind of high thermal conductivity is provided bury copper billet circuit board, improve bulk thermal conductivity,
Radiating is uniform, advantageously reduces the temperature of chip.
To achieve the above object, what the utility model provided a kind of high thermal conductivity buries copper billet circuit board, the high thermal conductivity
The copper billet circuit board that buries include the embedding core plate for having a copper billet；Be laid in respectively the both sides of the core plate one first tack coat and
One second tack coat；It is bonded in one first layers of copper on first tack coat；And be bonded on second tack coat
One second layers of copper；Wherein, first layers of copper or/and the second layers of copper are provided with a chip, first tack coat or/and described
Some through holes are offered on second tack coat, to improve the thermal conductivity between the chip and the copper billet.
As a preferred embodiment of the present utility model, first tack coat and first layers of copper are one group and described
When second tack coat and second layers of copper are one group, the copper billet runs through the core plate, and the two ends of the copper billet are prolonged respectively
Extend the inner side of first tack coat and the inner side of second tack coat.
As another preferred embodiment of the present utility model, first tack coat is to be stacked alternately with first layers of copper
Some groups, the copper billet extends to the inner side of the first tack coat of one layer of outermost, and the through hole is opened in one layer of outermost
The first tack coat.
Similarly, second tack coat and second layers of copper are some groups be stacked alternately, and the copper billet is extended to most
The inner side of second tack coat of one layer of outside, the through hole is opened in the second tack coat of one layer of outermost.
It is preferred that the position of the chip is corresponding with the position of the copper billet.
It is preferred that the position of the through hole is corresponding with the position of the chip.
It is preferred that the aperture of the through hole is 0.1mm~0.2mm.
It is preferred that the hole wall spacing of adjacent two through hole is 0.2mm~0.3mm.
It is preferred that the through hole is copper facing hole.Copper facing in through hole is interruption in the longitudinal direction, to avoid conducting
Copper billet and chip.
It is preferred that Heat Conduction Material is packed with the through hole, to further speed up the speed of radiating.
Prior art is compared, and the utility model offers some through holes, core between the tack coat between copper billet and chip
The heat that piece is produced directly is transferred to copper billet by through hole, it is to avoid because the low thermal conductivity of tack coat, thermal resistance are big and have influence on entirety
Thermal conductivity, so as to improve the thermal conductivity for burying copper billet circuit board, thermal conductivity can improve 50%, and radiating is uniform, be conducive to drop
The temperature of low chip, reduction temperature is up to 3 degrees Celsius.
Brief description of the drawings
Fig. 1 buries the structural representation of copper billet pcb board for prior art.
Fig. 2 is the structural representation for burying copper billet circuit board of the utility model high thermal conductivity.
Embodiment
The several different most preferred embodiments of the utility model are illustrated below with reference to the accompanying drawings.
What the utility model aimed to provide a kind of high thermal conductivity buries copper billet circuit board 1, can improve bulk thermal conductivity, and radiating is equal
It is even, advantageously reduce the temperature of chip 2.
As shown in Fig. 2 the copper billet circuit board 1 that buries of high thermal conductivity includes a core plate 20, the both sides of core plate 20 are laid in respectively
At least one first tack coat 30 and at least one second tack coat 50, be bonded at least 1 at least one first tack coat 30
One layers of copper 40 and at least one second layers of copper 60 being bonded at least one second tack coat 50.In the present embodiment, first glues
Knot layer 30, the second tack coat 50, the first layers of copper 40, the second layers of copper 60 are respectively provided with two layers, the first tack coat 30 and the first layers of copper 40
It is stacked alternately, the second tack coat 50 is stacked alternately with the second layers of copper 60.Certainly, in other embodiment, the first tack coat 30 with
First layers of copper 40, or the second tack coat 50 and the quantity of the second layers of copper 60 can change as needed, and the first tack coat 30 and
The group number of one layers of copper 40 can be different with the group number of the second layers of copper 60 from the second tack coat 50.For example, the first tack coat 30, second is viscous
Knot layer 50, the first layers of copper 40 and the second layers of copper 60 can be one layer.
Wherein, the first layers of copper 40 or/and the second layers of copper 60 are provided with a chip 2, in the present embodiment, in the first layers of copper 40
Provided with a chip 2.Copper billet 10 is embedded in core plate 20 and extends to the first tack coat 30 and the second tack coat of one layer of outermost
Some through holes 70 are offered on 50 inner side, the first tack coat 30 or/and the second tack coat 50 of one layer of outermost, in this implementation
In example, through hole 70 is offered on the first tack coat 30 and the second tack coat 50.Opening up for through hole 70 can improve chip 2 and copper billet
Thermal conductivity between 10.When the first tack coat 30, the second tack coat 50, the first layers of copper 40 and the second layers of copper 60 are one layer,
Copper billet 10 runs through core plate 20, and the two ends of copper billet 10 extend to the first tack coat 30, the inner side of the second tack coat 50.
, can the copper facing in through hole 70, formation copper facing hole in order to further speed up rate of heat dispation；Also it can be clogged in through hole 70
Heat Conduction Material.Certainly, the copper facing of copper facing hole in the longitudinal direction is interruption, nonconducting, in order to avoid conduct copper billet 10 and core
Piece 2.
The position of the position of chip 2, the position of through hole 70 and copper billet 10 is corresponding, is more beneficial for the transmission of heat,
Do not influence in the case of burying the wiring of copper billet circuit board 1, the scope that through hole 70 is opened up is consistent with the size of chip 2.Through hole 70
Aperture be 0.1mm~0.2mm, the hole wall spacing of adjacent two through hole 70 is 0.2mm~0.3mm.
Prior art is compared, between first, second tack coat 30,50 of the utility model between copper billet 10 and chip 2
Some through holes 70 are offered, the heat that chip 2 is produced directly is transferred to copper billet 10 by through hole 70, it is to avoid because first, second glues
Tie the low thermal conductivity of layer 30,50, thermal resistance is big and has influence on overall thermal conductivity, so as to improve the heat conduction for burying copper billet circuit board 1
Rate, thermal conductivity can improve 50%, and radiating is uniform, advantageously reduce the temperature of chip 2, reduction temperature is up to 3 degrees Celsius.
Above disclosed is only preferred embodiment of the present utility model, can not limit this practicality with this certainly new
The interest field of type, therefore the equivalent variations made according to present utility model application the scope of the claims, still belong to the utility model and are covered
Scope.
Claims (10)
1. a kind of high thermal conductivity buries copper billet circuit board, it is characterised in that the copper billet circuit board that buries of the high thermal conductivity includes：
The embedding core plate for having a copper billet；
One first tack coat and one second tack coat of the both sides of the core plate are laid in respectively；
It is bonded in one first layers of copper on first tack coat；And
It is bonded in one second layers of copper on second tack coat；
Wherein, first layers of copper or/and the second layers of copper are provided with a chip, and first tack coat or/and described second are glued
Some through holes are offered on knot layer, to improve the thermal conductivity between the chip and the copper billet.
2. high thermal conductivity as claimed in claim 1 buries copper billet circuit board, it is characterised in that：The copper billet runs through the core
Plate, and the two ends of the copper billet extend respectively to the inner side of first tack coat and the inner side of second tack coat.
3. high thermal conductivity as claimed in claim 1 buries copper billet circuit board, it is characterised in that：First tack coat with it is described
First layers of copper is some groups be stacked alternately, and the copper billet extends to the inner side of the first tack coat of one layer of outermost, described logical
Hole is opened in the first tack coat of one layer of outermost.
4. high thermal conductivity as claimed in claim 1 buries copper billet circuit board, it is characterised in that：Second tack coat with it is described
Second layers of copper is some groups be stacked alternately, and the copper billet extends to the inner side of the second tack coat of one layer of outermost, described logical
Hole is opened in the second tack coat of one layer of outermost.
5. high thermal conductivity as claimed in claim 1 buries copper billet circuit board, it is characterised in that：The position of the chip with it is described
The position of copper billet is corresponding.
6. high thermal conductivity as described in claim 1 or 5 buries copper billet circuit board, it is characterised in that：The position of the through hole with
The position of the chip is corresponding.
7. high thermal conductivity as claimed in claim 1 buries copper billet circuit board, it is characterised in that：The aperture of the through hole is
0.1mm~0.2mm.
8. high thermal conductivity as claimed in claim 1 buries copper billet circuit board, it is characterised in that：The hole wall spacing of adjacent two through hole
For 0.2mm~0.3mm.
9. high thermal conductivity as claimed in claim 1 buries copper billet circuit board, it is characterised in that：The through hole is copper facing hole.
10. high thermal conductivity as claimed in claim 1 buries copper billet circuit board, it is characterised in that：It is packed with leading in the through hole
Hot material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621209588.2U CN206323638U (en) | 2016-11-09 | 2016-11-09 | A kind of high thermal conductivity buries copper billet circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621209588.2U CN206323638U (en) | 2016-11-09 | 2016-11-09 | A kind of high thermal conductivity buries copper billet circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206323638U true CN206323638U (en) | 2017-07-11 |
Family
ID=59263827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621209588.2U Active CN206323638U (en) | 2016-11-09 | 2016-11-09 | A kind of high thermal conductivity buries copper billet circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206323638U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108282968A (en) * | 2018-01-31 | 2018-07-13 | 维沃移动通信有限公司 | A kind of substrate of printed circuit board and preparation method thereof |
| CN112804817A (en) * | 2021-03-04 | 2021-05-14 | 上海七十迈数字科技有限公司 | Chip heat radiation structure |
| CN114641132A (en) * | 2022-05-17 | 2022-06-17 | 四川英创力电子科技股份有限公司 | Printed circuit board with copper block partially embedded and processing method thereof |
-
2016
- 2016-11-09 CN CN201621209588.2U patent/CN206323638U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108282968A (en) * | 2018-01-31 | 2018-07-13 | 维沃移动通信有限公司 | A kind of substrate of printed circuit board and preparation method thereof |
| CN108282968B (en) * | 2018-01-31 | 2020-01-31 | 维沃移动通信有限公司 | printed circuit board substrate and manufacturing method thereof |
| CN112804817A (en) * | 2021-03-04 | 2021-05-14 | 上海七十迈数字科技有限公司 | Chip heat radiation structure |
| CN114641132A (en) * | 2022-05-17 | 2022-06-17 | 四川英创力电子科技股份有限公司 | Printed circuit board with copper block partially embedded and processing method thereof |
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