CN115785865A - Conductive adhesive and solar cell - Google Patents

Conductive adhesive and solar cell Download PDF

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Publication number
CN115785865A
CN115785865A CN202211500258.9A CN202211500258A CN115785865A CN 115785865 A CN115785865 A CN 115785865A CN 202211500258 A CN202211500258 A CN 202211500258A CN 115785865 A CN115785865 A CN 115785865A
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conductive
resin
rubber
conductive adhesive
elastomer
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段晶晶
张磊
郭明波
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Shanghai Runshi Technology Co ltd
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Shanghai Runshi Technology Co ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J127/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers
    • C09J127/02—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J127/12—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
    • H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
    • H01L31/0512—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module made of a particular material or composition of materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Abstract

A conductive adhesive for bonding a laminated solar cell to form a series circuit comprises an elastomer, resin, a curing agent and conductive particles; wherein at least part of the surface of the conductive particles is coated with a compound for improving the compatibility of the conductive particles with a resin or an elastomer. The conductive adhesive provided by the application can be a solvent-free component, does not generate bubbles in the curing process, and is suitable for interlayer bonding between the laminated solar cells and between the solder strips and the electrodes. In addition, the conductive adhesive can obtain high conductivity under the condition of low silver content, has high adhesive force, and has good moist heat resistance and low temperature flexibility.

Description

Conductive adhesive and solar cell
Technical Field
The present invention relates to a conductive paste, and more particularly, to a conductive paste that can be used to provide adhesiveness and conductivity to electronic components such as solar cells, and to a solar cell using the same.
Background
Conductive adhesives, which are generally formed by dispersing conductive particles in a thermosetting resin, can provide adhesion and conductivity between two electronic parts, and are now widely used in the field of electronics and electronics.
One particularly important electrical device is a solar cell, typically a shingled solar cell, where conventional cells are cut into small pieces and arranged in shingles and bonded together by conductive adhesive to form a series circuit. For another example, when the heterojunction solar cell with the amorphous silicon layer is connected with the main gate electrode by the solder strip, if the traditional welding mode is adopted, the temperature is generally over 300 ℃, the amorphous silicon layer and the transparent conductive thin film layer can be damaged, and at the moment, the heterojunction solar cell can be connected by using the conductive adhesive, so that the requirement of a low-temperature process is met. For the applications listed above, there are also requirements for the properties of the conductive paste, such as: no solvent, high resistance to heat and humidity, low-temp flexibility, low cost, etc.
Currently common thermal curing resin systems include epoxy, acrylic, silicone, and the like. The organic silicon system has the best performance on damp-heat resistance and low-temperature flexibility, but has poor adhesion to base materials, and meanwhile, because silicon materials have poor wettability to various base materials, in order to obtain low contact resistance, a solvent is usually required to be added to enhance the wettability to the base materials, and in the solvent volatilization process, bubbles are easily formed in an interlayer bonding structure to influence the bonding and subsequent weather resistance; acrylic acid has good adhesion with epoxy systems, but has poor resistance to moist heat and low temperature flexibility, and can cause adhesion reduction and contact resistance increase after long-term use in extreme climatic environments. Therefore, there is a need to develop new conductive adhesive systems.
On the other hand, in order to obtain better conductivity, silver powder with higher content is generally added into a resin system for conducting, such as nano silver epoxy conductive adhesive disclosed in CN108034394A and silver-based low-temperature conductive adhesive disclosed in CN 10210980A. In order to obtain better conductivity, higher silver powder needs to be added, but the cost of the silver powder is higher, and the mechanical properties of the conductive adhesive are influenced by the higher content of the conductive particles. Therefore, there is a need to develop a conductive paste product having excellent mechanical properties and a low content of conductive particles while maintaining high conductive properties.
One common method is to use cheaper copper, nickel or alloy powders or those coated with silver or even other non-conductive solid particles coated with silver. However, compared with the conductive paste using silver powder, the obtained product has relatively high resistance and poor heat resistance and moisture resistance, and particularly, when silver-coated copper powder with a wide application range is used in the photovoltaic field, electrochemical corrosion of copper occurs, and further the photovoltaic cell is polluted, and the light conversion efficiency is affected.
Another method is to add insulating particles to the conductive paste, as disclosed in WO2008023565A1, and to add insulating particles to the thermosetting resin, wherein the average particle size of the insulating particles is larger than the average particle size of the conductive particles. However, similarly, if a large amount of the insulating particle filler is added, the viscosity and mechanical properties, particularly the adhesive properties, of the conductive paste are greatly affected, and the amount of the insulating particles added is limited, resulting in a limitation in conductivity. In addition, in the patent technology, the particle sizes of the insulating particles and the conductive particles need to be strictly controlled.
Disclosure of Invention
In view of the problems of the conventional conductive adhesive, the present application provides a conductive adhesive, preferably a curable conductive adhesive, and more preferably a conductive adhesive that can be used for bonding a tiled solar cell to form a series circuit. The application also provides a solar cell module using the conductive adhesive.
The first aspect of the application provides a conductive adhesive, which comprises an elastomer, a resin, a curing agent and conductive particles; wherein the elastomer is incompatible or partially compatible with the resin.
In a preferred embodiment, the elastomer is a liquid elastomer or a solid elastomer dispersed in a liquid curable monomer; the curing agent is a combination of one or more curing agents for curing the elastomer or curable monomer, and the resin.
In a preferred embodiment, the elastomer and resin can form a dispersed phase and continuous phase system during curing, wherein the dispersed phase is dispersed in the continuous phase in the form of particles and/or blocks.
In a preferred embodiment, the elastomer may be a solid rubber, including any one or more of diene rubber, alkene rubber, polyurethane rubber, silicone rubber, polysulfide rubber, fluorine rubber, acrylate rubber, etc.; the elastomer may be dispersed in a liquid curable monomer, such as a monomer containing an epoxy group, an acrylate group, or other unsaturated group.
In a preferred embodiment, the elastomer may be a liquid rubber, preferably a solvent-free oligomer, which can be reacted with the curing agent to cure into a three-dimensional network.
In a preferred embodiment, the resin may be acrylic resin, epoxy resin, polyurethane, silicone resin, phenolic resin, polyimide resin, various rubbers, and the like.
In a preferred embodiment, the conductive particles are preferably silver, but may be other useful conductive metals, alloys, or conductive materials such as graphite.
In a preferred embodiment, at least part of the surface of the conductive particles is coated with a compound for improving the compatibility of the conductive particles with the resin or elastomer.
Preferably, the compound may be one or more of a fatty acid, a metal soap, a thioether, an amide, a polyethylene wax, an organosilicon compound.
In a preferred embodiment, the elastomer to resin weight ratio is preferably 1: (0.3-3), more preferably 1: (0.5-2), more preferably 1: (1-1.5).
In a preferred embodiment, the weight proportion of the conductive particles in the low-temperature conductive adhesive is preferably at least 50%, more preferably at least 50-90%, and more preferably 50-70%.
In a preferred embodiment, the weight ratio of the curing agent in the low-temperature conductive adhesive is preferably sufficient to ensure that complete curing can be achieved.
In a preferred embodiment, the weight proportion of the curing agent in the low-temperature conductive adhesive is preferably not more than 3%, more preferably not more than 2%, and more preferably not more than 1%.
In a preferred embodiment, the low-temperature conductive adhesive may further include an auxiliary agent, and the auxiliary agent may be a toughening agent, a lubricant, a plasticizer, an inorganic filler, a pigment, or the like.
More preferably, the weight proportion of the auxiliary agent in the low-temperature conductive adhesive is preferably not more than 5%, more preferably not more than 3.5%, and more preferably not more than 2%.
In a second aspect of the present application, a method for applying the low-temperature conductive adhesive is provided, including: mixing the elastomer, resin, a curing agent and conductive particles to obtain a pasty material, wherein the elastomer and the resin form a dispersed phase and a continuous phase system, and the dispersed phase is dispersed in the continuous phase in a granular or blocky form; wherein the volume fraction of the conductive particles in the continuous phase is greater than the volume fraction of the conductive particles in the dispersed phase.
And coating the pasty material on the surface of an object to be bonded, and reacting and curing.
In a preferred embodiment, the object is preferably an electronic component, the surface of the object preferably contains conductive tracks or conductive electrodes, and more preferably the paste-like coating connects the conductive tracks or conductive electrodes of adjacent electronic components.
More preferably, the object is a laminated solar cell, the surface of the object is a laminating surface of the laminated solar cell, and more preferably, the paste material connects the conductive grid lines or the conductive grids of the adjacent cell pieces.
The application also provides a solar cell, which comprises at least two cell pieces, wherein the low-temperature conductive adhesive is used for connecting the conductive grid lines and/or the conductive grid electrodes of the adjacent cell pieces.
In a preferred embodiment, the solar cell comprises conductive solder strips, and the conductive solder strips are respectively connected with the conductive grid lines and/or the conductive grids of each cell slice through the low-temperature conductive adhesive.
In a preferred embodiment, the solar cell is a heterojunction cell, and includes at least two heterojunction cells, and the conductive solder strip is connected with the conductive grid line and/or the conductive grid of each heterojunction cell through the low-temperature conductive adhesive.
In a preferred embodiment, the solar cell is a laminated solar cell, and includes cells arranged in a laminated manner, and the cured low-temperature conductive adhesive is contained between the stacked surfaces of adjacent cells, and connects the conductive grid lines and/or conductive grids of the adjacent cells.
The conductive adhesive provided by the application can be a solvent-free component, does not generate bubbles in the curing process, and is suitable for bonding between a laminated tile type solar cell and a welding strip and an electrode. In addition, the conductive adhesive can obtain high conductivity under the condition of low silver content, has high adhesive force, and has good moist heat resistance and low temperature flexibility.
Drawings
FIG. 1 is a cross-sectional electron micrograph of a cell of a solar cell of the shingled type containing the conductive adhesive of the present application;
FIG. 2 is a schematic view of the surface of the stack of cells of the solar cell;
fig. 3 is a schematic view of another solar cell connection.
Detailed Description
The conductive adhesive provided by the application comprises an elastomer, resin, a curing agent and conductive particles; wherein the elastomer is incompatible or partially compatible with the resin.
In a preferred embodiment, the elastomer is a liquid elastomer or a solid elastomer dispersed in a liquid curable monomer; the curing agent is a combination of one or more curing agents for curing the elastomer or curable monomer, and the resin.
In a preferred embodiment, the elastomer and the resin can form a dispersed phase and continuous phase system during curing, wherein the dispersed phase is dispersed in the continuous phase in a particle and/or block form.
In a preferred embodiment, the weight ratio of elastomer to resin is preferably 1: 0.3-3, more preferably 1: 0.5-2, more preferably 1: 1-1.5.
In a preferred embodiment, the weight proportion of the conductive particles in the low-temperature conductive adhesive is preferably at least 50%, more preferably at least 50-90%, and more preferably 50-70%.
In a preferred embodiment, the weight ratio of the curing agent in the low-temperature conductive adhesive is preferably sufficient to ensure that complete curing can be achieved.
In a preferred embodiment, the weight proportion of the curing agent in the low-temperature conductive adhesive is preferably not more than 3%, more preferably not more than 2%, and more preferably not more than 1%.
In a preferred embodiment, the low-temperature conductive adhesive may further include an auxiliary agent, and the auxiliary agent may be a toughening agent, a lubricant, a plasticizer, an inorganic filler, a pigment, or the like.
The specific surface area of the conductive particles is preferably 0.5 to 1m 2 A ratio of 0.7 to 0.9 m/g is more preferable 2 /g。
In a preferred embodiment, the conductive particle size distribution D10/D50/D90 is preferably: (0.5-1) μm/(2-3) μm/(7-8) μm, and more preferably (0.7-0.8) μm/(2.5-2.8) μm/(7.5-7.8) μm.
Taking silver powder as an example, the following examples of the present application relate to the following components:
silver powder I and silver powder II: the silver powder is flake silver powder, and has a loose packing density of 3.3g/ml and a specific surface area of 0.76m 2 (ii)/g, particle size distribution D10/D50/D90=0.8 μm/2.5 μm/7.5 μm. Putting silver powder and oleic acid into a ball milling tank according to the weight ratio of 100: 1, adding alcohol as a solvent, carrying out ball milling for a proper time, washing with alcohol, filtering, and drying to obtain silver powder I. Putting silver powder and Magnasoft 800L (produced by Mitigo advanced materials Co.) into a ball milling tank at a weight ratio of 100: 1, adding ethyl acetate as solvent, and ball millingWashing with ethyl acetate after a proper amount of time, filtering and drying to obtain silver powder II.
An elastomer A: fluororubber G751 liquid fluororubber DAI-EL G101 was produced by Daiko fluorine chemical Co., ltd. An elastomer B: vinyl silicone oil DMS-V21 and vinyl silicone oil VDV-0131 are both produced by Gelest. The fluororubber G751 may be directly dissolved in the liquid fluororubber DAI-EL G101, or may be dissolved in a reactive or non-reactive monomer solvent.
Resin A: the epoxy resin E51 is produced by southeast star synthetic materials limited; the epoxy resin modifier CF2403 is manufactured by Katy applied materials Co.
Resin B: the urethane acrylate 6113 is produced by chang materials industries ltd.
Curing agent/crosslinking agent: hexamethyldiamine carbamate, boron trifluoride o-toluidine, triallyl isocyanurate, bis-tetra-vulcanizing agent and cumene hydroperoxide.
Auxiliary agent: magnesium oxide.
Insulating particles: the silicone microspheres XJ750 were produced by Happy materials industries, inc.
And (3) mixing the resin mixture and silver powder according to the formulas shown in the tables 1 and 2 by a planetary stirrer or a three-roll mill and the like to obtain the paste low-temperature conductive adhesive.
Performance test method
Volume resistivity
Using the examples or comparative examples, specimens having a size of 4 mm. Times.40 mm were printed on a glass substrate by screen printing. The sample was placed in an oven at 150 ℃ and heated for 2 minutes to obtain a cured conductive adhesive sample. The sheet resistance of the sample was measured using an RTS8 type four-probe micro resistance tester (manufactured by four-probe technologies ltd, guangzhou). While the thickness of the sample was measured using a stylus profilometer. The volume resistivity of the cured sample was calculated from the following equation:
ρ (volume resistivity) = sheet resistance × thickness × geometric correction coefficient
Shear strength
The conductive adhesive is uniformly glued on a one-inch wide ceramic wafer according to a set gluing amount, the other ceramic wafer is placed at a set position, after the ceramic wafers are stacked under a certain pressure, the two ceramic wafers are placed in a 150 ℃ drying oven and heated for 2 minutes, and the conductive adhesive is fully cured.
The tensile shear strength of the adhesive is determined according to the rules of GB/T7124-2008 (rigid material to rigid material), the tensile shear strength of the adhesive is determined by applying a tensile force in the direction parallel to the bonding surface and in the direction of the main axis of the sample, the shear stress at the single lap bonding part of the rigid material is measured (ISO 4587:2003, IDT), the position of the testing machine for placing the sample is adjusted, the test force, deformation and displacement are cleared, and the sample is placed. The prepared sample strip is clamped on a clamp, and the test is started after the specific width of the sample strip is input. And (3) testing the speed of a tensile machine by 1mm/min, recording a peak force value, testing the gluing width of the sample after fracture, and calculating to obtain a tensile and shearing strength value.
Tensile-shear strength = bond strength (N)/glue area (length: width) in units of megapascals (Mpa).
Shore hardness
Placing a proper amount of conductive adhesive in a flat-bottomed container to ensure that the thickness of the conductive adhesive is more than or equal to 6mm, placing a sample in a drying oven at 150 ℃ for heating for 2 minutes, and taking out the sample after the conductive adhesive is fully cured. The sample hardness was measured using a standard shore durometer, as specified in ASTM D2240 standard test method for durometer hardness, 9.3, and 5 points were measured evenly across the surface of the sample, averaged.
Resin compatibility Observation
Placing a proper amount of conductive adhesive on a glass slide, placing the glass slide in a 150 ℃ oven for heating for 2 minutes, taking out a sample after the conductive adhesive is fully cured, immersing the sample in liquid nitrogen for freezing, quenching, then performing ion beam polishing on the cross section, and observing the cross section by using a scanning electron microscope. FIG. 1 is an attempt at low temperature conductive adhesive bonding cross-section polishing electron microscopy showing the presence of particles in the continuous phase, which have both dispersed and conductive particles, with the dispersed phase being present as particles or chunks.
Solar cell performance evaluation
Fig. 2 shows the bonding of the laminated solar cell, two solar cells 1 cut into small pieces are stacked at the edges, the main grids 2 are aligned one by one, and the paste-like low-temperature conductive adhesive 3 mixed according to the above method is sandwiched between the two edges and cured, so that the main grids of the two solar cells 1 are electrically connected through the low-temperature conductive adhesive.
Fig. 3 shows another solar cell string, namely a heterojunction solar cell string. The main grid electrodes 5 of the two heterojunction solar cells 4 are connected through the solder strips 7, the paste-like low-temperature conductive adhesive 6 obtained by mixing according to the method is coated between the solder strips 7 and the main grid electrodes 5 and is solidified, so that the main grid electrodes 5 are electrically connected with the solder strips 7 through the low-temperature conductive adhesive, namely the solder strips 7 electrically connect the main grid electrodes 5 of the two heterojunction solar cells 4.
In the above description, the curing does not require high temperature, and is determined by the reaction temperature of the curing agent selected.
And laminating the solar cell string with an EVA (ethylene vinyl acetate copolymer) adhesive film, a glass panel and a back plate, and putting the solar cell string and the EVA adhesive film, the glass panel and the back plate into a vacuum press for hot pressing to obtain the solar cell module. The I-V curve of the solar cell module fabricated by the above method was measured using a solar simulator, and a fill factor representing the electrical characteristics of the solar cell was obtained.
The amounts of the components and the results of the property measurements of examples 1-2 and comparative examples 1-4 are detailed in Table 1.
By comparing examples 1, 2 with comparative example 1, the shear strength is significantly lower in comparative example 1 using only an elastomer than in examples 1 and 2. Comparative example 1 has lower conductivity than example 1 with the same amount of silver powder.
Example 2 compared with comparative example 1, the silver powder used in example 2 of the present application is significantly lower than that used in example 2, but the conductivity is not significantly different, and in the case of example 1 compared with comparative example 1, the conductivity of example 1 of the present application is significantly increased, and it can be seen that the present application can reduce the amount of conductive particles used, or higher conductivity.
In comparative example 4, WO2008023565A1 insulating particles and a binder resin are used, and in example 1 of the present application, compared with comparative example 4, volume resistivity and hardness are similar, and shear strength is significantly improved.
Example 1 compared to comparative example 2, comparative example 2 has no significant difference in conductivity from example 1, but should be significantly lower than example 1. The hardness of example 1 is significantly improved compared to comparative example 3.
Therefore, 1) the elastic body is used only, so that the shearing strength is poor, and the conductivity is poor; 2) The hardness is reduced obviously by using resin only, and 3) the strength is reduced obviously by adopting the mode of resin and insulating particles, and excellent comprehensive mechanical properties cannot be obtained.
Table 1, component amounts (kg) of examples 1 to 2 and comparative examples 1 to 4 and results of property measurements
Figure BDA0003967176990000081
The amounts of the components and the results of the property measurements of example 3 and comparative examples 5-6 are detailed in Table 2.
Table 2, component amounts (kg) of example 3 and comparative examples 5 to 6 and results of performance test
Figure BDA0003967176990000082
Figure BDA0003967176990000091
Compared with comparative examples 5 and 6, the dispersed phase/continuous phase system formed by the elastomer and the resin is adopted in the embodiment 3 of the application, and the performances such as conductivity, shore hardness and the like are better.
Therefore, the problem that both conductivity and mechanical properties cannot be considered can be well solved by adopting a dispersed phase/continuous phase system formed by the elastomer and the resin.
The embodiments of the present invention have been described in detail, but the embodiments are only examples, and the present invention is not limited to the embodiments described above. Any equivalent modifications and substitutions to those skilled in the art are also within the scope of the present invention. Accordingly, equivalent alterations and modifications are intended to be included within the scope of the present invention, without departing from the spirit and scope of the invention.

Claims (10)

1. A conductive adhesive for bonding a laminated tile type solar cell to form a series circuit is characterized by comprising an elastomer, resin, a curing agent and conductive particles; wherein at least part of the surface of the conductive particles is coated with a compound for improving the compatibility of the conductive particles with a resin or an elastomer.
2. The conductive paste of claim 1, wherein the conductive particles are silver.
3. The conductive paste of claim 1, wherein the compound is selected from one or more of fatty acids, metal soaps, thioethers, amides, polyethylene waxes, and organosilicon compounds.
4. The conductive paste as claimed in claim 3, wherein the conductive particles have a specific surface area of 0.5 to 1m 2 A ratio of 0.7 to 0.9 m/g is more preferable 2 (ii)/g; and/or
The conductive particle size distribution D10/D50/D90 is as follows: (0.5-1) μm/(2-3) μm/(7-8) μm, and more preferably (0.7-0.8) μm/(2.5-2.8) μm/(7.5-7.8) μm.
5. The conductive paste of claim 1, wherein the resin is selected from the group consisting of: any one or more of acrylic resin, epoxy resin, polyurethane, organic silicon resin, phenolic resin and polyimide resin; the elastomer is selected from: the rubber comprises solid rubber and/or liquid rubber, wherein the solid rubber comprises any one or more of diene rubber, alkene rubber, polyurethane rubber, silicon rubber, polysulfide rubber, fluorine rubber and acrylate rubber.
6. The conductive paste of claim 5, wherein the elastomer is dispersed in a liquid curable monomer selected from the group consisting of: monomers containing epoxy groups, acrylate groups, or other unsaturated groups; and/or
The liquid rubber is an oligomer without a solvent, and reacts with the curing agent to be cured to generate a three-dimensional network structure.
7. The conductive adhesive according to claim 1, wherein the weight ratio of the elastomer to the resin is 1: 0.3-3, more preferably 1: 0.5-2, and still more preferably 1: 1-1.5; and/or
The weight proportion of the conductive particles in the low-temperature conductive adhesive is at least 50%, more preferably at least 50-90%, and more preferably 50-70%.
8. A solar cell of the shingle type using the conductive adhesive of claim 1.
9. The solar cell of claim 8, wherein the solar cell comprises a plurality of stacked solar cells, and the cured low temperature conductive adhesive is disposed between stacked surfaces of adjacent solar cells.
10. The solar cell according to claim 9, wherein the conductive adhesive connects the conductive grid lines and/or the conductive grids of the adjacent cells.
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