CN111394007A - High-conductivity adhesive tape - Google Patents

High-conductivity adhesive tape Download PDF

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Publication number
CN111394007A
CN111394007A CN202010359996.0A CN202010359996A CN111394007A CN 111394007 A CN111394007 A CN 111394007A CN 202010359996 A CN202010359996 A CN 202010359996A CN 111394007 A CN111394007 A CN 111394007A
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China
Prior art keywords
parts
conductive
layer
conductive adhesive
adhesive tape
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Pending
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CN202010359996.0A
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Chinese (zh)
Inventor
闫妍
胡萍
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Zhangjiagang Free Trade Zone Huiying Jufu Material Technology Partnership LP
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Zhangjiagang Free Trade Zone Huiying Jufu Material Technology Partnership LP
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Priority to CN202010359996.0A priority Critical patent/CN111394007A/en
Publication of CN111394007A publication Critical patent/CN111394007A/en
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/20—Esters of polyhydric alcohols or phenols, e.g. 2-hydroxyethyl (meth)acrylate or glycerol mono-(meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/21—Paper; Textile fabrics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/26—Porous or cellular plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/28—Metal sheet
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0862—Nickel
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/16—Metal
    • C09J2400/163—Metal in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/22—Presence of unspecified polymer
    • C09J2400/226—Presence of unspecified polymer in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/26—Presence of textile or fabric
    • C09J2400/263—Presence of textile or fabric in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

The invention discloses a high-conductivity adhesive tape, which comprises a substrate layer, and a conductive adhesive layer and a release layer which are sequentially coated on one side surface of the substrate layer along the thickness direction, wherein the conductive adhesive layer adopts a solvent type acrylate adhesive filled with a conductive filler, the conductive filler comprises 40-60% of copper-coated aluminum oxide powder according to mass percentage, and the balance is at least one selected from silver-plated hollow microspheres, nickel powder, silver powder, graphite powder, graphene or conductive carbon black. The adhesive tape has strong conductivity.

Description

High-conductivity adhesive tape
Technical Field
The invention relates to the technical field of adhesive tapes, in particular to a high-conductivity adhesive tape.
Background
With the development of the consumer electronics industry, consumer electronics products increasingly exhibit the characteristics of miniaturization, light weight and thinness, and under the trend, the integration level of the electronic products is higher and higher, the volume is smaller and smaller, and the power is stronger and stronger; therefore, the trend of high power, high integration and narrow application space is bringing a series of problems of electric conduction, radiation interference and the like to consumer electronics; however, the conventional conductive connection schemes, such as metal spring, wire and cable connection, connector, etc., have large volume and require more space, and thus cannot satisfy the requirements of light weight and narrow space for consumer electronics.
Secondly, the conductive adhesive tape is widely applied to the consumer electronics industry because of light weight, thin thickness, certain bonding capability and corresponding conductive performance, so as to meet the requirements of electrostatic grounding and electromagnetic shielding inside electronic products: however, the conductive adhesive tape is conductive in a manner that conductive particles are mixed in the non-conductive pressure-sensitive adhesive, and when the non-conductive pressure-sensitive adhesive is adhered to a conductive object, the non-conductive pressure-sensitive adhesive is achieved by the contact between the conductive particles and the conductive object and the current tunneling effect between the conductive particles; however, the conventional conductive tape has unstable conductivity due to randomness of contact probability between the conductive particles on the surface and the conductive object, and the probability of existence of the conductive particles capable of effectively conducting electricity is reduced along with reduction of the use (bonding) area (high integration), which restricts the use of the conventional conductive tape in high-integration and high-power consumer electronics. How to solve the above technical problems is a matter that those skilled in the art are dedicated to solve.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide the high-conductivity adhesive tape which is good in conductivity.
In order to achieve the purpose, the invention adopts the technical scheme that: a high-conductivity adhesive tape comprises a substrate layer, and a conductive adhesive layer and a release layer which are sequentially coated on one side surface of the substrate layer along the thickness direction, wherein the conductive adhesive layer is a solvent type acrylate adhesive filled with a conductive filler, the conductive filler comprises 40-60% of copper-coated aluminum oxide powder according to mass percentage, and the balance is at least one selected from silver-plated hollow microspheres, nickel powder, silver powder, graphite powder, graphene or conductive carbon black.
Preferably, the base material adopted by the base material layer is any one selected from copper foil, aluminum foil, conductive cloth and conductive foam.
Preferably, the other side of substrate layer, along the thickness direction still coat in proper order have the conducting resin layer, from the type layer.
Preferably, the filling amount of the conductive filler in the conductive adhesive layer is 50-70%. The conductive filler is too low in filling amount to perform the conductive property, for example, too much filling amount causes poor fluidity, poor wettability, uneven dispersion of the conductive filler, and also increases the cost.
Preferably, the copper-coated aluminum oxide composite powder is prepared by adopting an electroless plating method.
Preferably, the solvent type acrylate adhesive comprises the following components in parts by weight: 10-20 parts of lauryl acrylate, 10-20 parts of methyl acrylate, 30-40 parts of hydroxyethyl acrylate, 1-5 parts of acrylic acid, 0.2-0.4 part of benzoyl peroxide, 150 parts of ethyl acetate and 0.5-2 parts of a cross-linking agent.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages: the conductive adhesive layer of the high-conductivity adhesive tape adopts the solvent type acrylate adhesive filled with the conductive filler, the conductive filler takes the copper-coated alumina powder as a main body and is matched with other conductive particles, the copper-coated alumina powder has good conductivity and good wettability, and the high-conductivity adhesive tape can be uniformly distributed in the adhesive when added into the solvent type acrylate adhesive, so that the adhesive tape has high conductivity.
Detailed Description
The technical solution of the present invention is further illustrated below with reference to specific examples.
The utility model provides a high conductivity sticky tape, includes the substrate layer, along thickness direction coating in proper order on a side of substrate layer conductive adhesive layer with from the type layer. The conductive adhesive layer adopts a solvent type acrylate adhesive filled with a conductive filler, the conductive filler comprises 40-60% of copper-coated alumina powder according to mass percentage, and the balance is at least one selected from silver-plated hollow microspheres, nickel powder, silver powder, graphite powder, graphene or conductive carbon black.
Here, the base material used for the base material layer is selected from any one of copper foil, aluminum foil, conductive cloth, and conductive foam.
In the conductive adhesive layer, the filling amount of the conductive filler is 50-70%. The copper-coated aluminum oxide composite powder is prepared by adopting a chemical plating method. The copper-coated aluminum oxide composite powder is prepared by adopting a chemical plating method. Has more excellent dispersing performance and better toughness of the material.
The solvent type acrylate adhesive comprises the following components in parts by weight: 10-20 parts of lauryl acrylate, 10-20 parts of methyl acrylate, 30-40 parts of hydroxyethyl acrylate, 1-5 parts of acrylic acid, 0.2-0.4 part of benzoyl peroxide, 150 parts of ethyl acetate and 0.5-2 parts of a cross-linking agent.
If the conductive double-sided tape needs to be manufactured, the conductive adhesive layer and the release layer are sequentially coated on the other side face of the base material layer along the thickness direction.
Example 1
The utility model provides a high conductivity sticky tape, includes the substrate layer, along thickness direction coating in proper order on a side of substrate layer conductive adhesive layer with from the type layer. The conductive adhesive layer adopts a solvent type acrylate adhesive filled with a conductive filler, and the conductive filler comprises 50 mass percent of copper-coated alumina powder and the balance of silver-plated hollow microspheres and silver powder.
The solvent type acrylate adhesive comprises the following components in parts by weight: 15 parts of lauryl acrylate, 10 parts of methyl acrylate, 30 parts of hydroxyethyl acrylate, 1 part of acrylic acid, 0.2 part of benzoyl peroxide, 120 parts of ethyl acetate and 1 part of cross-linking agent.
Example 2
The utility model provides a high conductivity sticky tape, includes the substrate layer, along thickness direction coating in proper order on a side of substrate layer conductive adhesive layer with from the type layer. The conductive adhesive layer adopts a solvent type acrylate adhesive filled with a conductive filler, and the conductive filler comprises 40 mass percent of copper-coated alumina powder and the balance of nickel powder and graphite powder.
The solvent type acrylate adhesive comprises the following components in parts by weight: 10 parts of lauryl acrylate, 20 parts of methyl acrylate, 40 parts of hydroxyethyl acrylate, 3 parts of acrylic acid, 0.4 part of benzoyl peroxide, 130 parts of ethyl acetate and 0.5 part of a cross-linking agent.
Example 3
The utility model provides a high conductivity sticky tape, includes the substrate layer, along thickness direction coating in proper order on a side of substrate layer conductive adhesive layer with from the type layer. The conductive adhesive layer adopts a solvent type acrylate adhesive filled with a conductive filler, and the conductive filler comprises 60 mass percent of copper-coated alumina powder, and the balance of silver-plated hollow microspheres and carbon black.
The solvent type acrylate adhesive comprises the following components in parts by weight: 20 parts of lauryl acrylate, 15 parts of methyl acrylate, 35 parts of hydroxyethyl acrylate, 5 parts of acrylic acid, 0.4 part of benzoyl peroxide, 150 parts of ethyl acetate and 2 parts of a cross-linking agent.
Example 4
The utility model provides a high conductivity sticky tape, includes the substrate layer, along thickness direction coating in proper order on a side of substrate layer conductive adhesive layer with from the type layer. The conductive adhesive layer adopts a solvent type acrylate adhesive filled with a conductive filler, and the conductive filler comprises 55 mass percent of copper-coated aluminum oxide powder and the balance of silver powder.
The solvent type acrylate adhesive comprises the following components in parts by weight: 18 parts of lauryl acrylate, 16 parts of methyl acrylate, 35 parts of hydroxyethyl acrylate, 3 parts of acrylic acid, 0.3 part of benzoyl peroxide, 140 parts of ethyl acetate and 1.5 parts of a cross-linking agent.
Comparative example 1
The utility model provides a high conductivity sticky tape, includes the substrate layer, along thickness direction coating in proper order on a side of substrate layer conductive adhesive layer with from the type layer. The conductive adhesive layer adopts a solvent type acrylate adhesive filled with a conductive filler, and the conductive filler comprises 30 mass percent of copper-coated alumina powder and the balance of nickel powder and graphite powder.
The solvent type acrylate adhesive comprises the following components in parts by weight: 10 parts of lauryl acrylate, 20 parts of methyl acrylate, 40 parts of hydroxyethyl acrylate, 3 parts of acrylic acid, 0.4 part of benzoyl peroxide, 130 parts of ethyl acetate and 0.5 part of a cross-linking agent.
Comparative example 2
The utility model provides a high conductivity sticky tape, includes the substrate layer, along thickness direction coating in proper order on a side of substrate layer conductive adhesive layer with from the type layer. The conductive adhesive layer adopts a solvent type acrylate adhesive filled with a conductive filler, and the conductive filler comprises 65 mass percent of copper-coated alumina powder, and the balance of silver-plated hollow microspheres and carbon black.
The solvent type acrylate adhesive comprises the following components in parts by weight: 20 parts of lauryl acrylate, 15 parts of methyl acrylate, 35 parts of hydroxyethyl acrylate, 5 parts of acrylic acid, 0.4 part of benzoyl peroxide, 150 parts of ethyl acetate and 2 parts of a cross-linking agent.
Comparative example 3
The present example provides a high-conductivity adhesive tape, which comprises a substrate layer, a conductive adhesive layer and a release layer, wherein the conductive adhesive layer and the release layer are sequentially coated on one side surface of the substrate layer along the thickness direction. The conductive adhesive layer comprises the following components in parts by weight: 38 parts of butyl acrylate, 7 parts of methyl acrylate, 5 parts of methyl methacrylate, 1 part of acrylic acid, 0.5 part of methacrylic acid, 2 parts of hydroxyethyl acrylate, 1 part of benzoyl peroxide, 20 parts of ethyl acetate, 25 parts of toluene, 0.1 part of dodecyl mercaptan, 12 parts of silver-plated aluminum powder and 18 parts of ground fiber.
The surface resistance test was performed on the tapes of examples 1 to 4 and comparative examples 1 to 3, where the thickness of the base material layer of the tape was 50um, the thickness of the conductive adhesive layer was 30um, the thickness of the release layer was 50um, the surface resistance test was performed using a model HIOKI RM3544 as a resistance tester, the weight of the test jig was 500g, a test piece of 50mm 75mm was cut out, the release layer was removed, the tape was placed in a standard laboratory environment for 2 hours or more, the test environment was capable of maintaining a standard state of 23 ± 2 ℃, 65 ± 5% RH, a sample of 50mm 75mm was horizontally placed on glass, a 500g jig was gently placed on the surface of the sample to be tested, the micro-resistance tester displayed a reading, and data were read and recorded after 30s, and the test data are shown in table 1.
TABLE 1
Examples Example 1 Example 2 Example 3 Example 4 Comparative example 1 Comparative example 2 Comparative example 3
Surface resistance omega/sq 0.28 0.32 0.24 0.26 0.55 0.24 7.1
From table 1, it can be seen that the highly conductive adhesive tape of the present invention has a better surface resistance, and from comparison of comparative example 1 with example 2, it is known that the addition amount of the conductive material is less than 40%, which results in an increase in surface resistance, and from comparison of comparative example 2 with example 3, it is known that the surface resistance is not substantially increased any more when the addition amount of the conductive material exceeds 60%, and therefore, the addition amount of the conductive material is controlled to 40% to 60%, which results in a better conductive performance, and from comparison of comparative example 3 with example, the adhesive tape prepared by the formulation of the present invention has a better surface resistance.
The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.

Claims (6)

1. The high-conductivity adhesive tape is characterized by comprising a substrate layer, and a conductive adhesive layer and a release layer which are sequentially coated on one side surface of the substrate layer along the thickness direction, wherein the conductive adhesive layer is a solvent type acrylate adhesive filled with a conductive filler, the conductive filler comprises 40-60% of copper-coated aluminum oxide powder according to mass percentage, and the balance is at least one selected from silver-plated hollow microspheres, nickel powder, silver powder, graphite powder, graphene or conductive carbon black.
2. The highly conductive adhesive tape according to claim 1, wherein the base material used for the base material layer is selected from any one of copper foil, aluminum foil, conductive cloth, and conductive foam.
3. The highly conductive adhesive tape according to claim 1, wherein the other side surface of the substrate layer is further coated with the conductive adhesive layer and the release layer in this order in the thickness direction.
4. The highly conductive adhesive tape according to claim 1, wherein the conductive filler is filled in the conductive adhesive layer in an amount of 50 to 70%.
5. The highly conductive adhesive tape according to claim 1, wherein the copper-coated aluminum oxide composite powder is prepared by an electroless plating method.
6. The highly conductive adhesive tape according to claim 1, wherein the solvent-based acrylate adhesive comprises the following components in parts by weight: 10-20 parts of lauryl acrylate, 10-20 parts of methyl acrylate, 30-40 parts of hydroxyethyl acrylate, 1-5 parts of acrylic acid, 0.2-0.4 part of benzoyl peroxide, 150 parts of ethyl acetate and 0.5-2 parts of a cross-linking agent.
CN202010359996.0A 2020-04-30 2020-04-30 High-conductivity adhesive tape Pending CN111394007A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112680168A (en) * 2020-12-28 2021-04-20 苏州德佑新材料科技股份有限公司 Premixing method of conductive glue, conductive adhesive tape and preparation method thereof

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TW201020304A (en) * 2008-11-20 2010-06-01 Taiwan First Li Bond Co Ltd Epoxy resin-based thermal adhesive
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CN101967361A (en) * 2009-07-27 2011-02-09 日邦树脂(无锡)有限公司 Composition of epoxy resin heat-conducting adhesive
CN104830247A (en) * 2015-03-24 2015-08-12 王传广 Sheet/branch silver-coated copper powder and green halogen-free low-silver-content economical electrically conductive adhesive capable of replacing traditional electrically conductive adhesives with high silver contents
KR20160026148A (en) * 2014-08-29 2016-03-09 주식회사 엘지화학 Conductive laminate
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CN106987218A (en) * 2017-04-14 2017-07-28 苏州德佑胶带技术有限公司 The preparation method of electromagnetic shielding adhesive tape and electromagnetic shielding adhesive tape
CN108097978A (en) * 2017-12-02 2018-06-01 温州宏丰电工合金股份有限公司 A kind of preparation method for covering copper Alpha-alumina/Graphite Composite Powder
CN110240874A (en) * 2019-06-26 2019-09-17 苏州德佑胶带技术有限公司 A kind of Antistatic type electromagnetic shielding adhesive tape and preparation method thereof
CN110982463A (en) * 2019-10-30 2020-04-10 上海润势科技有限公司 Conductive adhesive and solar cell

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1169946A (en) * 1965-09-13 1969-11-05 Minnesota Mining & Mfg Electrically Conductive Adhesive Tape
RU2008152157A (en) * 2006-07-04 2010-08-10 3М Инновейтив Пропертиз Компани (Jp) SURFACE-CONDUCTING ADHESIVE TAPE HAVING DIFFERENT ADHESION ON BOTH SURFACES AND METHOD FOR ITS MANUFACTURE
TW201020304A (en) * 2008-11-20 2010-06-01 Taiwan First Li Bond Co Ltd Epoxy resin-based thermal adhesive
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