CN114774013B - Temperature-resistant moisture-resistant copper foil adhesive tape and preparation method thereof - Google Patents
Temperature-resistant moisture-resistant copper foil adhesive tape and preparation method thereof Download PDFInfo
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- CN114774013B CN114774013B CN202210521566.3A CN202210521566A CN114774013B CN 114774013 B CN114774013 B CN 114774013B CN 202210521566 A CN202210521566 A CN 202210521566A CN 114774013 B CN114774013 B CN 114774013B
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- layer
- copper foil
- parts
- resistant
- release
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 124
- 239000011889 copper foil Substances 0.000 title claims abstract description 98
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 31
- 238000002360 preparation method Methods 0.000 title claims abstract description 23
- 239000010410 layer Substances 0.000 claims abstract description 196
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims abstract description 46
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims abstract description 44
- KMTRUDSVKNLOMY-UHFFFAOYSA-N Ethylene carbonate Chemical compound O=C1OCCO1 KMTRUDSVKNLOMY-UHFFFAOYSA-N 0.000 claims abstract description 39
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims abstract description 38
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 28
- 229920001577 copolymer Polymers 0.000 claims abstract description 26
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 claims abstract description 18
- 239000003085 diluting agent Substances 0.000 claims abstract description 16
- 239000003999 initiator Substances 0.000 claims abstract description 16
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 claims abstract description 9
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 claims abstract description 9
- VHRYZQNGTZXDNX-UHFFFAOYSA-N methacryloyl chloride Chemical compound CC(=C)C(Cl)=O VHRYZQNGTZXDNX-UHFFFAOYSA-N 0.000 claims abstract description 9
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 claims description 22
- 238000009835 boiling Methods 0.000 claims description 21
- 239000002904 solvent Substances 0.000 claims description 21
- 230000001070 adhesive effect Effects 0.000 claims description 16
- 238000002156 mixing Methods 0.000 claims description 16
- 239000002131 composite material Substances 0.000 claims description 15
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 14
- 239000000853 adhesive Substances 0.000 claims description 14
- 239000011248 coating agent Substances 0.000 claims description 14
- 238000000576 coating method Methods 0.000 claims description 14
- 239000011261 inert gas Substances 0.000 claims description 14
- 239000000203 mixture Substances 0.000 claims description 13
- 239000002245 particle Substances 0.000 claims description 13
- WEQURJQENFWZLR-UHFFFAOYSA-N 2,3-dimethylbutane-2,3-diol prop-1-en-2-yloxyboronic acid Chemical compound CC(=C)OB(O)O.CC(C)(O)C(C)(C)O WEQURJQENFWZLR-UHFFFAOYSA-N 0.000 claims description 11
- 239000004519 grease Substances 0.000 claims description 11
- 229920000642 polymer Polymers 0.000 claims description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 8
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims description 8
- 238000003825 pressing Methods 0.000 claims description 8
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 claims description 7
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 claims description 7
- 238000009713 electroplating Methods 0.000 claims description 7
- 238000005096 rolling process Methods 0.000 claims description 7
- 238000001291 vacuum drying Methods 0.000 claims description 7
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 6
- 150000002632 lipids Chemical class 0.000 claims description 6
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 4
- 229910052786 argon Inorganic materials 0.000 claims description 3
- 239000001307 helium Substances 0.000 claims description 3
- 229910052734 helium Inorganic materials 0.000 claims description 3
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 3
- 229910052754 neon Inorganic materials 0.000 claims description 3
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 claims description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 3
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 3
- SVSUYEJKNSMKKW-UHFFFAOYSA-N 4,4,5,5-tetramethyl-2-prop-1-en-2-yl-1,3,2-dioxaborolane Chemical compound CC(=C)B1OC(C)(C)C(C)(C)O1 SVSUYEJKNSMKKW-UHFFFAOYSA-N 0.000 claims description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 2
- 238000000034 method Methods 0.000 claims description 2
- 238000001035 drying Methods 0.000 claims 1
- 230000001376 precipitating effect Effects 0.000 claims 1
- 238000003756 stirring Methods 0.000 claims 1
- 238000005406 washing Methods 0.000 claims 1
- 239000000047 product Substances 0.000 description 12
- 230000000694 effects Effects 0.000 description 8
- 150000002148 esters Chemical class 0.000 description 6
- 230000005672 electromagnetic field Effects 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- XXZAEGBIGLZHDA-UHFFFAOYSA-N B(O)(O)O.C(=C)(C)CC(O)(C)C(C)(C)O Chemical compound B(O)(O)O.C(=C)(C)CC(O)(C)C(C)(C)O XXZAEGBIGLZHDA-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- ZZPNDIHOQDQVNU-UHFFFAOYSA-N 2-hydroxy-4,4,5,5-tetramethyl-1,3,2-dioxaborolane Chemical compound CC1(C)OB(O)OC1(C)C ZZPNDIHOQDQVNU-UHFFFAOYSA-N 0.000 description 1
- BTWDORUWKSZROD-UHFFFAOYSA-N 3-(1,1-difluoroprop-2-enyl)-1h-quinoxalin-2-one Chemical compound C1=CC=C2N=C(C(F)(F)C=C)C(O)=NC2=C1 BTWDORUWKSZROD-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 241000784732 Lycaena phlaeas Species 0.000 description 1
- 206010028980 Neoplasm Diseases 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 201000011510 cancer Diseases 0.000 description 1
- 125000005587 carbonate group Chemical group 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000021615 conjugation Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000003902 lesion Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- FFRYUAVNPBUEIC-UHFFFAOYSA-N quinoxalin-2-ol Chemical group C1=CC=CC2=NC(O)=CN=C21 FFRYUAVNPBUEIC-UHFFFAOYSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000003335 steric effect Effects 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/28—Metal sheet
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/14—Methyl esters, e.g. methyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a temperature-resistant and moisture-resistant copper foil adhesive tape and a preparation method thereof, wherein an electroplated oxide layer, a release layer, a conductive pressure-sensitive adhesive layer, a conductive paste layer and a copper foil layer are sequentially arranged from top to bottom; the conductive pressure-sensitive adhesive layer is prepared from the following components in parts by weight: 30-40 parts of methyl methacrylate/ethylene carbonate/3- (1, 1-difluoro-2-propylene-1-yl) -2 (1H) -quinoxalinone/vinyl trimethoxy silane/isopropenyl boric acid pinacol ester copolymer, 20-30 parts of copper powder, 10-20 parts of nickel powder, 20-30 parts of diluent, 3-5 parts of ethylene glycol dimethacrylate, 0.5-0.8 part of initiator, 1-3 parts of aluminum chloride and 0.8-1.5 parts of methacryloyl chloride. The heat-resistant moisture-resistant copper foil adhesive tape disclosed by the invention has the advantages of remarkable high-temperature and high-humidity resistance, long service life, strong adhesion performance and sufficient conductivity.
Description
Technical Field
The invention relates to the technical field of adhesives, in particular to a heat-resistant moisture-resistant copper foil adhesive tape and a preparation method thereof.
Background
With the advent of the digital age, electronic products such as notebook computers, palm computers, mobile phones, copiers and the like have been moved to thousands of households, and the products bring convenience to people, but at the same time, electromagnetic pollution is also caused. If the human body is exposed to a strong electromagnetic field for a long time, cancer lesions may be easily caused, so that electromagnetic interference prevention is imperative.
The existing electromagnetic interference prevention method is mainly electromagnetic shielding. Electromagnetic shielding is the isolation of metal between two spatial regions to control the induction and radiation of electric, magnetic and electromagnetic waves from one region to another. Specifically, a shielding body is used for surrounding a component, a circuit, an assembly, a cable or an interference source of the whole system to prevent an interference electromagnetic field from diffusing outwards; or the receiving circuit, device or system is surrounded by a shield to protect them from external electromagnetic fields. The realization of electromagnetic shielding is independent of the shielding body, and the quality of the shielding body directly influences the electromagnetic shielding effect. Therefore, development of a shield excellent in performance is imperative.
The copper foil tape is used as a common metal tape, is a common shielding body and is mainly used for realizing electromagnetic shielding effect. The copper foil adhesive tape can isolate the damage of electromagnetic waves to human bodies and avoid affecting the functions of electronic products. In addition, the copper foil tape has good effect on electrostatic discharge after grounding. The copper foil adhesive tape has strong adhesion and good conductivity, and can be cut into various specifications according to the requirements of customers. The copper foil adhesive tapes in the market are more numerous, but the main structure is that an acrylic acid adhesive containing silver, copper or nickel is coated on an electrolytic or calendared copper foil, and then a release material is coated on the acrylic acid adhesive to form the common copper foil adhesive tape. However, copper foil in the market is porous and easy to infiltrate water vapor, the compactness of conventional release materials is poor, and solid particles such as nickel, copper powder and the like in the glue are easy to separate out on the surface of the glue, so that the release film is arched to form gaps. The electronic product in the overheated and humid environment for a long time is easy to lead water vapor to permeate into the adhesive surface, so that the adhesive force of the adhesive tape is seriously reduced, even the adhesive is lost and falls off, and the risk of weakening the shielding effectiveness due to the attenuation of the conductive performance is accompanied, thus being unfavorable for long-term use.
Therefore, the development of the high-temperature-resistant and high-humidity-resistant copper foil tape with remarkable high-temperature and high-humidity resistance, long service life, strong adhesive property and sufficient conductivity and the preparation method thereof meet the market demand, have wide market value and application prospect, and have great significance in promoting the development of electromagnetic shielding technology.
Disclosure of Invention
The invention mainly aims to solve the technical problems, and provides the high-temperature and high-humidity resistant copper foil tape with remarkable high-temperature and high-humidity resistance, long service life, strong adhesion performance and sufficient conductivity and the preparation method thereof through structural and formula design.
In order to achieve the above purpose, the invention provides a heat-resistant and moisture-resistant copper foil tape, which comprises an electroplated oxide layer, a release layer, a conductive pressure-sensitive adhesive layer, a conductive paste layer and a copper foil layer from top to bottom in sequence; the conductive pressure-sensitive adhesive layer is made of pressure-sensitive adhesive added with copper powder and nickel powder.
Preferably, the electroplated oxide layer is SiO electroplated on the non-release surface of the release layer 2 Or Al 2 O 3 And (3) a film layer.
Preferably, the thickness of the electroplated oxide layer is 0.001-0.05 μm.
Preferably, the release layer is made of any one of PE release film, PET release film, PS release film and PMMA release film.
Preferably, the thickness of the release layer is 12-100 μm.
Preferably, the conductive pressure-sensitive adhesive layer is prepared from the following components in parts by weight: 30-40 parts of methyl methacrylate/ethylene carbonate/3- (1, 1-difluoro-2-propylene-1-yl) -2 (1H) -quinoxalinone/vinyl trimethoxy silane/isopropenyl boric acid pinacol ester copolymer, 20-30 parts of copper powder, 10-20 parts of nickel powder, 20-30 parts of diluent, 3-5 parts of ethylene glycol dimethacrylate, 0.5-0.8 part of initiator, 1-3 parts of aluminum chloride and 0.8-1.5 parts of methacryloyl chloride.
Preferably, the preparation method of the methyl methacrylate/ethylene carbonate/3- (1, 1-difluoro-2-propylene-1-yl) -2 (1H) -quinoxalinone/vinyl trimethoxysilane/isopropenylboronic acid pinacol ester copolymer comprises the following steps: methyl methacrylate, ethylene carbonate, 3- (1, 1-difluoro-2-propylene-1-yl) -2 (1H) -quinoxalinone, vinyltrimethoxysilane, isopropenylboronic acid pinacol ester and azodiisobutyronitrile are added into a high boiling point solvent, stirred and reacted for 3-5 hours under the inert gas atmosphere at 50-65 ℃, then the mixture is precipitated in water, the precipitated polymer is washed by ethanol for 3-6 times, and finally the mixture is dried to constant weight at 85-95 ℃ in a vacuum drying oven, so that the methyl methacrylate/ethylene carbonate/3- (1, 1-difluoro-2-propylene-1-yl) -2 (1H) -quinoxalinone/vinyltrimethoxysilane/isopropenylboronic acid pinacol ester copolymer is obtained.
Preferably, the mass ratio of methyl methacrylate, ethylene carbonate, 3- (1, 1-difluoro-2-propylene-1-yl) -2 (1H) -quinoxalinone, vinyl trimethoxy silane, isopropenyl boric acid pinacol ester, azodiisobutyronitrile and high boiling point solvent is (2-4) 1 (0.3-0.5) 0.8-1.2) 0.5 (0.05-0.07) 20-30.
Preferably, the high boiling point solvent is at least one of dimethyl sulfoxide, N-dimethylformamide and N-methylpyrrolidone; the inert gas is any one of nitrogen, helium, neon and argon.
Preferably, the particle size of the copper powder is 1-3 mu m; the particle size of the nickel powder is 1-3 mu m.
Preferably, the diluent is a mixture formed by mixing methyl methacrylate and hydroxyethyl methacrylate according to the mass ratio of (2-3) to 1.
Preferably, the initiator is at least one of azobisisobutyronitrile and azobisisoheptonitrile.
Preferably, the conductive pressure sensitive adhesive layer is 15 to 25 μm.
Preferably, the conductive paste layer is an electric power composite lipid layer with the thickness of 0.1-5 mu m.
Preferably, the power composite ester layer is made of kunlun 801 power grease.
Preferably, the copper foil layer is an electrolytic copper foil or a rolled copper foil layer.
Preferably, the thickness of the copper foil layer is 30-45 μm.
The invention also aims at providing a preparation method of the heat-resistant and moisture-resistant copper foil adhesive tape, which comprises the following steps:
step S1, coating the adhesive coated surface of a copper foil layer with conductive paste;
step S2, electroplating oxide on the non-release surface of the release layer;
step S3, uniformly mixing the components of the conductive pressure-sensitive adhesive layer according to parts by weight, and coating the components on the release layer; then bonding, pressing and rolling the release surface of the coated release layer and the conductive paste surface on the copper foil layer;
s4, curing in sequence; and (5) slitting to obtain a specified width, thereby obtaining a finished product of the heat-resistant moisture-resistant copper foil adhesive tape.
Due to the application of the technical scheme, the invention has the following beneficial effects:
(1) The invention discloses a heat-resistant and moisture-resistant copper foil adhesive tape, which is characterized in that a layer of conductive paste (electric composite grease) is coated between a copper foil and an adhesive surface, and a large amount of gaps which can be observed under a microscope on a contact surface can be filled after the electric grease is coated, so that the contact surface is changed from a small amount of point contact to surface contact, and more conductive tunnels, namely tunnel effect, are formed under the action of an electromagnetic field. Thus, the conductivity of the contact surface is greatly improved, and the immersion of oxygen, moisture and impurities in the air is sealed, so that the connection point of the conductor can keep good conductivity in long-term operation.
(2) According to the heat-resistant moisture-resistant copper foil tape disclosed by the invention, the compact oxide layer is electroplated on the non-release surface of the release layer, so that a compact water vapor barrier layer is formed, and the moisture-resistant capability of the tape is effectively improved. Copper powder and nickel powder are added in the conductive pressure-sensitive adhesive layer, so that the conductive pressure-sensitive adhesive layer has the effects of conducting electricity and heat, copper powder and nickel powder can be fully infiltrated into glue in a laminating and pressing mode, meanwhile, each layer is more tightly gapless, no separation occurs on the surface, the performance stability is better, and the conductive performance is better.
(3) The invention discloses a heat-resistant moisture-resistant copper foil tape, which is prepared from the following components in parts by weight: 30-40 parts of methyl methacrylate/ethylene carbonate/3- (1, 1-difluoro-2-propylene-1-yl) -2 (1H) -quinoxalinone/vinyl trimethoxysilane/isopropenyl boric acid pinacol ester copolymer, 20-30 parts of copper powder, 10-20 parts of nickel powder, 20-30 parts of diluent, 3-5 parts of ethylene glycol dimethacrylate, 0.5-0.8 part of initiator, 1-3 parts of aluminum chloride and 0.8-1.5 part of methacryloyl chloride; the components are mutually matched and acted, and the interpenetrating network structure is formed by curing when the adhesive tape is used, so that the temperature resistance and the moisture resistance of the adhesive tape are effectively improved; the copolymer molecular chain contains ester group, trimethoxy silane, carbonate group, fluorine-containing quinoxalinone group and boric acid pinacol ester, and the structures enable the temperature resistance and the humidity resistance of the prepared product to be further improved under the multiple actions of electronic effect, steric effect and conjugation effect, and the service life of the product is further prolonged. And meanwhile, the adhesive property can be improved by combining with other components.
Detailed Description
The following description is presented to enable one of ordinary skill in the art to make and use the invention. The preferred embodiments in the following description are by way of example only and other obvious variations will occur to those skilled in the art.
Example 1
A heat-resistant and moisture-resistant copper foil tape comprises an electroplated oxide layer, a release layer, a conductive pressure-sensitive adhesive layer, a conductive paste layer and a copper foil layer from top to bottom in sequence; the conductive pressure-sensitive adhesive layer is made of pressure-sensitive adhesive added with copper powder and nickel powder.
The electroplated oxide layer is SiO electroplated on the non-release surface of the release layer 2 A film layer; the thickness of the electroplated oxide layer is 0.001 μm; the release layer is made of PE release film; the thickness of the release layer was 12 μm.
The conductive pressure-sensitive adhesive layer is prepared from the following components in parts by weight: 30 parts of methyl methacrylate/ethylene carbonate/3- (1, 1-difluoro-2-propylene-1-yl) -2 (1H) -quinoxalinone/vinyl trimethoxysilane/isopropenylboronic acid pinacol ester copolymer, 20 parts of copper powder, 10 parts of nickel powder, 20 parts of diluent, 3 parts of ethylene glycol dimethacrylate, 0.5 part of initiator, 1 part of aluminum chloride and 0.8 part of methacryloyl chloride.
The preparation method of the methyl methacrylate/ethylene carbonate/3- (1, 1-difluoro-2-propylene-1-yl) -2 (1H) -quinoxalinone/vinyl trimethoxy silane/isopropenyl boric acid pinacol ester copolymer comprises the following steps: methyl methacrylate, ethylene carbonate, 3- (1, 1-difluoro-2-propylene-1-yl) -2 (1H) -quinoxalinone, vinyl trimethoxy silane, isopropenyl boric acid pinacol ester and azodiisobutyronitrile are added into a high boiling point solvent, stirred and reacted for 3 hours at 50 ℃ in an inert gas atmosphere, the precipitated polymer is precipitated in water and washed by ethanol for 3 times, and finally the polymer is dried to constant weight at 85 ℃ in a vacuum drying oven, so that the methyl methacrylate/ethylene carbonate/3- (1, 1-difluoro-2-propylene-1-yl) -2 (1H) -quinoxalinone/vinyl trimethoxy silane/isopropenyl boric acid pinacol ester copolymer is obtained.
The mass ratio of the methyl methacrylate to the ethylene carbonate to the 3- (1, 1-difluoro-2-propylene-1-yl) -2 (1H) -quinoxalinone to the vinyl trimethoxy silane to the isopropenyl boric acid pinacol ester to the azodiisobutyronitrile to the high boiling point solvent is 2:1:0.3:0.8:0.5:0.05:20; the high boiling point solvent is dimethyl sulfoxide; the inert gas is nitrogen.
The particle size of the copper powder is 1 mu m; the particle size of the nickel powder is 1 mu m; the diluent is a mixture formed by mixing methyl methacrylate and hydroxyethyl methacrylate according to a mass ratio of 2:1; the initiator is azodiisobutyronitrile; the conductive pressure sensitive adhesive layer is 15 μm; the conductive paste layer is an electric power composite lipid layer with the thickness of 0.1 mu m; the electric power composite ester layer is made of Kunlun 801 electric power grease; the copper foil layer is an electrolytic copper foil layer; the thickness of the copper foil layer was 30 μm.
A preparation method of a heat-resistant and moisture-resistant copper foil adhesive tape comprises the following steps:
step S1, coating the adhesive coated surface of a copper foil layer with conductive paste;
step S2, electroplating oxide on the non-release surface of the release layer;
step S3, uniformly mixing the components of the conductive pressure-sensitive adhesive layer according to parts by weight, and coating the components on the release layer; then bonding, pressing and rolling the release surface of the coated release layer and the conductive paste surface on the copper foil layer;
s4, curing in sequence; and (5) slitting to obtain a specified width, thereby obtaining a finished product of the heat-resistant moisture-resistant copper foil adhesive tape.
Example 2
A heat-resistant and moisture-resistant copper foil tape comprises an electroplated oxide layer, a release layer, a conductive pressure-sensitive adhesive layer, a conductive paste layer and a copper foil layer from top to bottom in sequence; the conductive pressure-sensitive adhesive layer is made of pressure-sensitive adhesive added with copper powder and nickel powder.
The electroplated oxide layer is non-release surface electroplated Al on the release layer 2 O 3 A film layer; the thickness of the electroplated oxide layer is 0.01 mu m; the release layer is made of PET release film; the thickness of the release layer was 30 μm.
The conductive pressure-sensitive adhesive layer is prepared from the following components in parts by weight: 33 parts of methyl methacrylate/ethylene carbonate/3- (1, 1-difluoro-2-propylene-1-yl) -2 (1H) -quinoxalinone/vinyl trimethoxysilane/isopropenylboronic acid pinacol ester copolymer, 22 parts of copper powder, 13 parts of nickel powder, 23 parts of diluent, 3.5 parts of ethylene glycol dimethacrylate, 0.6 part of initiator, 1.5 parts of aluminum chloride and 1 part of methacryloyl chloride.
The preparation method of the methyl methacrylate/ethylene carbonate/3- (1, 1-difluoro-2-propylene-1-yl) -2 (1H) -quinoxalinone/vinyl trimethoxy silane/isopropenyl boric acid pinacol ester copolymer comprises the following steps: methyl methacrylate, ethylene carbonate, 3- (1, 1-difluoro-2-propylene-1-yl) -2 (1H) -quinoxalinone, vinyl trimethoxy silane, isopropenyl pinacol borate and azodiisobutyronitrile are added into a high boiling point solvent, stirred and reacted for 3.5 hours at 55 ℃ in an inert gas atmosphere, the precipitated polymer is precipitated in water and washed by ethanol for 4 times, and finally the polymer is dried to constant weight at 87 ℃ in a vacuum drying oven to obtain the methyl methacrylate/ethylene carbonate/3- (1, 1-difluoro-2-propylene-1-yl) -2 (1H) -quinoxalinone/vinyl trimethoxy silane/isopropenyl pinacol borate copolymer.
The mass ratio of the methyl methacrylate, the ethylene carbonate, the 3- (1, 1-difluoro-2-propylene-1-yl) -2 (1H) -quinoxalinone, the vinyl trimethoxy silane, the isopropenyl boric acid pinacol ester and the azodiisobutyronitrile to the high boiling point solvent is 2.5:1:0.35:0.9:0.5:0.055:22; the high boiling point solvent is N, N-dimethylformamide; the inert gas is helium.
The grain diameter of the copper powder is 1.5 mu m; the particle size of the nickel powder is 1.5 mu m; the diluent is a mixture formed by mixing methyl methacrylate and hydroxyethyl methacrylate according to a mass ratio of 2.2:1; the initiator is azo diisoheptonitrile; the conductive pressure sensitive adhesive layer is 17 μm; the conductive paste layer is a 2 mu m thick electric power composite grease layer; the electric power composite ester layer is made of Kunlun 801 electric power grease; the copper foil layer is a rolled copper foil layer; the thickness of the copper foil layer was 35 μm.
A preparation method of a heat-resistant and moisture-resistant copper foil adhesive tape comprises the following steps:
step S1, coating the adhesive coated surface of a copper foil layer with conductive paste;
step S2, electroplating oxide on the non-release surface of the release layer;
step S3, uniformly mixing the components of the conductive pressure-sensitive adhesive layer according to parts by weight, and coating the components on the release layer; then bonding, pressing and rolling the release surface of the coated release layer and the conductive paste surface on the copper foil layer;
s4, curing in sequence; and (5) slitting to obtain a specified width, thereby obtaining a finished product of the heat-resistant moisture-resistant copper foil adhesive tape.
Example 3
A heat-resistant and moisture-resistant copper foil tape comprises an electroplated oxide layer, a release layer, a conductive pressure-sensitive adhesive layer, a conductive paste layer and a copper foil layer from top to bottom in sequence; the conductive pressure-sensitive adhesive layer is made of pressure-sensitive adhesive added with copper powder and nickel powder.
The electroplated oxide layer is SiO electroplated on the non-release surface of the release layer 2 A film layer; the thickness of the electroplated oxide layer is 0.03 mu m; the release layer is made of a PS release film; the thickness of the release layer was 60 μm.
The conductive pressure-sensitive adhesive layer is prepared from the following components in parts by weight: 35 parts of methyl methacrylate/ethylene carbonate/3- (1, 1-difluoro-2-propylene-1-yl) -2 (1H) -quinoxalinone/vinyl trimethoxysilane/isopropenylboronic acid pinacol ester copolymer, 25 parts of copper powder, 15 parts of nickel powder, 25 parts of diluent, 4 parts of ethylene glycol dimethacrylate, 0.65 part of initiator, 2 parts of aluminum chloride and 1.2 parts of methacryloyl chloride.
The preparation method of the methyl methacrylate/ethylene carbonate/3- (1, 1-difluoro-2-propylene-1-yl) -2 (1H) -quinoxalinone/vinyl trimethoxy silane/isopropenyl boric acid pinacol ester copolymer comprises the following steps: methyl methacrylate, ethylene carbonate, 3- (1, 1-difluoro-2-propylene-1-yl) -2 (1H) -quinoxalinone, vinyl trimethoxy silane, isopropenyl boric acid pinacol ester and azodiisobutyronitrile are added into a high boiling point solvent, stirred and reacted for 4 hours at 58 ℃ in an inert gas atmosphere, the precipitated polymer is precipitated in water and washed by ethanol for 5 times, and finally the polymer is dried to constant weight at 90 ℃ in a vacuum drying oven, so that the methyl methacrylate/ethylene carbonate/3- (1, 1-difluoro-2-propylene-1-yl) -2 (1H) -quinoxalinone/vinyl trimethoxy silane/isopropenyl boric acid pinacol ester copolymer is obtained.
The mass ratio of the methyl methacrylate to the ethylene carbonate to the 3- (1, 1-difluoro-2-propylene-1-yl) -2 (1H) -quinoxalinone to the vinyl trimethoxy silane to the isopropenyl boric acid pinacol ester to the azodiisobutyronitrile to the high boiling point solvent is 3:1:0.4:1:0.5:0.06:25; the high boiling point solvent is N-methyl pyrrolidone; the inert gas is neon.
The particle size of the copper powder is 2 mu m; the particle size of the nickel powder is 2 mu m; the diluent is a mixture formed by mixing methyl methacrylate and hydroxyethyl methacrylate according to a mass ratio of 2.5:1; the initiator is azodiisobutyronitrile; the conductive pressure sensitive adhesive layer is 20 μm; the conductive paste layer is a power composite lipid layer with the thickness of 3.5 mu m; the electric power composite ester layer is made of Kunlun 801 electric power grease; the copper foil layer is an electrolytic copper foil layer; the thickness of the copper foil layer was 39 μm.
A preparation method of a heat-resistant and moisture-resistant copper foil adhesive tape comprises the following steps:
step S1, coating the adhesive coated surface of a copper foil layer with conductive paste;
step S2, electroplating oxide on the non-release surface of the release layer;
step S3, uniformly mixing the components of the conductive pressure-sensitive adhesive layer according to parts by weight, and coating the components on the release layer; then bonding, pressing and rolling the release surface of the coated release layer and the conductive paste surface on the copper foil layer;
s4, curing in sequence; and (5) slitting to obtain a specified width, thereby obtaining a finished product of the heat-resistant moisture-resistant copper foil adhesive tape.
Example 4
A heat-resistant and moisture-resistant copper foil tape comprises an electroplated oxide layer, a release layer, a conductive pressure-sensitive adhesive layer, a conductive paste layer and a copper foil layer from top to bottom in sequence; the conductive pressure-sensitive adhesive layer is made of pressure-sensitive adhesive added with copper powder and nickel powder.
The electroplated oxide layer is non-release surface electroplated Al on the release layer 2 O 3 A film layer; the thickness of the electroplated oxide layer is 0.04 μm; the release layer is made of PMMA release film; the thickness of the release layer was 90 μm.
The conductive pressure-sensitive adhesive layer is prepared from the following components in parts by weight: methyl methacrylate/ethylene carbonate/3- (1, 1-difluoro-2-propen-1-yl) -2 (1H) -quinoxalinone/vinyl trimethoxysilane/isopropenylboronic acid pinacol ester copolymer 38 parts, copper powder 28 parts, nickel powder 18 parts, diluent 27 parts, ethylene glycol dimethacrylate 4.5 parts, initiator 0.75 parts, aluminum chloride 2.5 parts and methacryloyl chloride 1.3 parts.
The preparation method of the methyl methacrylate/ethylene carbonate/3- (1, 1-difluoro-2-propylene-1-yl) -2 (1H) -quinoxalinone/vinyl trimethoxy silane/isopropenyl boric acid pinacol ester copolymer comprises the following steps: methyl methacrylate, ethylene carbonate, 3- (1, 1-difluoro-2-propylene-1-yl) -2 (1H) -quinoxalinone, vinyl trimethoxy silane, isopropenyl pinacol borate and azodiisobutyronitrile are added into a high boiling point solvent, stirred and reacted for 4.5 hours at 63 ℃ in an inert gas atmosphere, the precipitated polymer is precipitated in water and washed by ethanol for 6 times, and finally the polymer is dried to constant weight at 93 ℃ in a vacuum drying oven, so that the methyl methacrylate/ethylene carbonate/3- (1, 1-difluoro-2-propylene-1-yl) -2 (1H) -quinoxalinone/vinyl trimethoxy silane/isopropenyl pinacol borate copolymer is obtained.
The mass ratio of the methyl methacrylate, the ethylene carbonate, the 3- (1, 1-difluoro-2-propylene-1-yl) -2 (1H) -quinoxalinone, the vinyl trimethoxy silane, the isopropenyl boric acid pinacol ester and the azodiisobutyronitrile to the high boiling point solvent is 3.5:1:0.45:1.1:0.5:0.065:28; the high boiling point solvent is a mixture formed by mixing dimethyl sulfoxide, N-dimethylformamide and N-methylpyrrolidone according to a mass ratio of 1:2:2; the inert gas is argon.
The grain diameter of the copper powder is 2.5 mu m; the particle size of the nickel powder is 3 mu m; the diluent is a mixture formed by mixing methyl methacrylate and hydroxyethyl methacrylate according to a mass ratio of 2.8:1; the initiator is a mixture formed by mixing azobisisobutyronitrile and azobisisoheptonitrile according to a mass ratio of 3:5; the conductive pressure sensitive adhesive layer is 23 μm; the conductive paste layer is an electric power composite lipid layer with the thickness of 4.5 mu m; the electric power composite ester layer is made of Kunlun 801 electric power grease; the copper foil layer is an electrolytic copper foil layer; the thickness of the copper foil layer was 42 μm.
A preparation method of a heat-resistant and moisture-resistant copper foil adhesive tape comprises the following steps:
step S1, coating the adhesive coated surface of a copper foil layer with conductive paste;
step S2, electroplating oxide on the non-release surface of the release layer;
step S3, uniformly mixing the components of the conductive pressure-sensitive adhesive layer according to parts by weight, and coating the components on the release layer; then bonding, pressing and rolling the release surface of the coated release layer and the conductive paste surface on the copper foil layer;
s4, curing in sequence; and (5) slitting to obtain a specified width, thereby obtaining a finished product of the heat-resistant moisture-resistant copper foil adhesive tape.
Example 5
A heat-resistant and moisture-resistant copper foil tape comprises an electroplated oxide layer, a release layer, a conductive pressure-sensitive adhesive layer, a conductive paste layer and a copper foil layer from top to bottom in sequence; the conductive pressure-sensitive adhesive layer is made of pressure-sensitive adhesive added with copper powder and nickel powder.
The electroplated oxide layer is SiO electroplated on the non-release surface of the release layer 2 A film layer; the thickness of the electroplated oxide layer is 0.05 μm; the release layer is a PE release film; the thickness of the release layer is 100 μm.
The conductive pressure-sensitive adhesive layer is prepared from the following components in parts by weight: 40 parts of methyl methacrylate/ethylene carbonate/3- (1, 1-difluoro-2-propylene-1-yl) -2 (1H) -quinoxalinone/vinyl trimethoxysilane/isopropenylboronic acid pinacol ester copolymer, 30 parts of copper powder, 20 parts of nickel powder, 30 parts of diluent, 5 parts of ethylene glycol dimethacrylate, 0.8 part of initiator, 3 parts of aluminum chloride and 1.5 parts of methacryloyl chloride.
The preparation method of the methyl methacrylate/ethylene carbonate/3- (1, 1-difluoro-2-propylene-1-yl) -2 (1H) -quinoxalinone/vinyl trimethoxy silane/isopropenyl boric acid pinacol ester copolymer comprises the following steps: methyl methacrylate, ethylene carbonate, 3- (1, 1-difluoro-2-propylene-1-yl) -2 (1H) -quinoxalinone, vinyl trimethoxy silane, isopropenyl boric acid pinacol ester and azodiisobutyronitrile are added into a high boiling point solvent, stirred and reacted for 5 hours at 65 ℃ in an inert gas atmosphere, the mixture is precipitated in water, the precipitated polymer is washed by ethanol for 6 times, and finally the mixture is dried to constant weight at 95 ℃ in a vacuum drying oven, so that the methyl methacrylate/ethylene carbonate/3- (1, 1-difluoro-2-propylene-1-yl) -2 (1H) -quinoxalinone/vinyl trimethoxy silane/isopropenyl boric acid pinacol ester copolymer is obtained.
The mass ratio of the methyl methacrylate to the ethylene carbonate to the 3- (1, 1-difluoro-2-propylene-1-yl) -2 (1H) -quinoxalinone to the vinyl trimethoxy silane to the isopropenyl boric acid pinacol ester to the azodiisobutyronitrile to the high boiling point solvent is 4:1:0.5:1.2:0.5:0.07:30; the high boiling point solvent is dimethyl sulfoxide; the inert gas is nitrogen.
The particle size of the copper powder is 3 mu m; the particle size of the nickel powder is 3 mu m; the diluent is a mixture formed by mixing methyl methacrylate and hydroxyethyl methacrylate according to a mass ratio of 3:1; the initiator is azodiisobutyronitrile; the conductive pressure sensitive adhesive layer is 25 μm; the conductive paste layer is a power composite grease layer with the thickness of 5 mu m; the electric power composite ester layer is made of Kunlun 801 electric power grease; the copper foil layer is an electrolytic copper foil layer; the thickness of the copper foil layer was 45 μm.
A preparation method of a heat-resistant and moisture-resistant copper foil adhesive tape comprises the following steps:
step S1, coating the adhesive coated surface of a copper foil layer with conductive paste;
step S2, electroplating oxide on the non-release surface of the release layer;
step S3, uniformly mixing the components of the conductive pressure-sensitive adhesive layer according to parts by weight, and coating the components on the release layer; then bonding, pressing and rolling the release surface of the coated release layer and the conductive paste surface on the copper foil layer;
s4, curing in sequence; and (5) slitting to obtain a specified width, thereby obtaining a finished product of the heat-resistant moisture-resistant copper foil adhesive tape.
Comparative example 1
The present invention provides a heat-resistant moisture-resistant copper foil tape, which has a structure, a formula and a preparation method similar to those of example 1, except that 3- (1, 1-difluoro-2-propen-1-yl) -2 (1H) -quinoxalinone is not added in the preparation process of methyl methacrylate/ethylene carbonate/3- (1, 1-difluoro-2-propen-1-yl) -2 (1H) -quinoxalinone and no electroplated oxide layer is provided.
Comparative example 2
The invention provides a heat-resistant and moisture-resistant copper foil adhesive tape, which is similar to the structure, the formula and the preparation method of the copper foil adhesive tape in example 1, except that methyl methacrylate/ethylene carbonate/3- (1, 1-difluoro-2-propylene-1-yl) -2 (1H) -quinoxalinone/vinyl trimethoxysilane/isopropenyl boric acid pinacol ester copolymer is not added in the preparation process of the isopropenyl boric acid pinacol ester copolymer, and no conductive paste layer is provided.
In order to further illustrate the beneficial technical effects of the heat-resistant moisture-resistant copper foil adhesive tapes prepared by the embodiments of the invention, the heat-resistant moisture-resistant copper foil adhesive tapes prepared by the embodiments are subjected to relevant performance tests by referring to the current national standard in China, the adhesive tapes are cured for 3 hours at 85 ℃, and the test results are shown in Table 1.
TABLE 1 results of testing the performance of the temperature and moisture resistant copper foil tape
As can be seen from table 1, the heat-resistant moisture-resistant copper foil tape disclosed in the examples of the present invention has excellent conductivity, adhesion property and high temperature and high humidity resistance, which is the result of the synergistic effect of the components and structures.
The foregoing has shown and described the basic principles, principal features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present invention, and various changes and modifications may be made therein without departing from the spirit and scope of the invention, which is defined by the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (8)
1. A heat-resistant and moisture-resistant copper foil tape is characterized by comprising an electroplated oxide layer, a release layer, a conductive pressure-sensitive adhesive layer, a conductive paste layer and a copper foil layer in sequence from top to bottom;
the conductive pressure-sensitive adhesive layer is prepared from the following components in parts by weight: 30-40 parts of methyl methacrylate/ethylene carbonate/3- (1, 1-difluoro-2-propylene-1-yl) -2 (1H) -quinoxalinone/vinyl trimethoxysilane/isopropenyl boric acid pinacol ester copolymer, 20-30 parts of copper powder, 10-20 parts of nickel powder, 20-30 parts of diluent, 3-5 parts of ethylene glycol dimethacrylate, 0.5-0.8 part of initiator, 1-3 parts of aluminum chloride and 0.8-1.5 part of methacryloyl chloride;
the preparation method of the methyl methacrylate/ethylene carbonate/3- (1, 1-difluoro-2-propylene-1-yl) -2 (1H) -quinoxalinone/vinyl trimethoxy silane/isopropenyl boric acid pinacol ester copolymer comprises the following steps: adding methyl methacrylate, ethylene carbonate, 3- (1, 1-difluoro-2-propylene-1-yl) -2 (1H) -quinoxalinone, vinyltrimethoxysilane, isopropenylboronic acid pinacol ester and azodiisobutyronitrile into a high boiling point solvent, stirring and reacting for 3-5 hours under the inert gas atmosphere at 50-65 ℃, precipitating in water, washing the precipitated polymer with ethanol for 3-6 times, and finally drying to constant weight at 85-95 ℃ in a vacuum drying oven to obtain methyl methacrylate/ethylene carbonate/3- (1, 1-difluoro-2-propylene-1-yl) -2 (1H) -quinoxalinone/vinyltrimethoxysilane/isopropenylboronic acid pinacol ester copolymer; the mass ratio of methyl methacrylate, ethylene carbonate, 3- (1, 1-difluoro-2-propylene-1-yl) -2 (1H) -quinoxalinone, vinyl trimethoxy silane, isopropenyl boric acid pinacol ester, azodiisobutyronitrile and high boiling point solvent is (2-4) 1 (0.3-0.5) 0.8-1.2) 0.5 (0.05-0.07) 20-30.
2. The heat and moisture resistant copper foil tape according to claim 1, wherein the electroplated oxide layer is a non-release surface electroplated SiO on a release layer 2 Or Al 2 O 3 A film layer; the thickness of the electroplated oxide layer is 0.001-0.05 mu m.
3. The heat and moisture resistant copper foil tape according to claim 1, wherein the release layer is made of any one of a PE release film, a PET release film, a PS release film, and a PMMA release film; the thickness of the release layer is 12-100 mu m.
4. The heat and moisture resistant copper foil tape according to claim 1, wherein the high boiling point solvent is at least one of dimethyl sulfoxide, N-dimethylformamide, N-methylpyrrolidone; the inert gas is any one of nitrogen, helium, neon and argon.
5. The heat and moisture resistant copper foil tape according to claim 1, wherein the copper powder has a particle size of 1-3 μm; the particle size of the nickel powder is 1-3 mu m.
6. The heat-resistant and moisture-resistant copper foil tape according to claim 1, wherein the diluent is a mixture formed by mixing methyl methacrylate and hydroxyethyl methacrylate according to a mass ratio of (2-3) to 1; the initiator is at least one of azodiisobutyronitrile and azodiisoheptonitrile; the conductive pressure-sensitive adhesive layer is 15-25 mu m.
7. The heat and moisture resistant copper foil tape according to claim 1, wherein the conductive paste layer is a power composite grease layer of 0.1-5 μm thickness; the electric power composite lipid layer is made of Kunlun 801 electric power lipid; the copper foil layer is an electrolytic copper foil or a rolled copper foil layer; the thickness of the copper foil layer is 30-45 mu m.
8. A method for preparing the heat-resistant moisture-resistant copper foil tape according to any one of claims 1 to 7, comprising the steps of:
step S1, coating the adhesive coated surface of a copper foil layer with conductive paste;
step S2, electroplating oxide on the non-release surface of the release layer;
step S3, uniformly mixing the components of the conductive pressure-sensitive adhesive layer according to parts by weight, and coating the components on the release layer; then bonding, pressing and rolling the release surface of the coated release layer and the conductive paste surface on the copper foil layer;
s4, curing in sequence; and (5) slitting to obtain a specified width, thereby obtaining a finished product of the heat-resistant moisture-resistant copper foil adhesive tape.
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| CN114350304A (en) * | 2021-12-21 | 2022-04-15 | 江西塔益莱高分子材料有限公司 | Durable high-transmittance OCA (optically clear adhesive) and preparation method thereof |
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