CN217265543U

CN217265543U - Temperature-resistant moisture-proof copper foil adhesive tape

Info

Publication number: CN217265543U
Application number: CN202221147850.0U
Authority: CN
Inventors: 付建斌; 刘川; 于卓宏; 李晶
Original assignee: Ningbo Qihe New Material Technology Co ltd
Current assignee: Ningbo Qihe New Material Technology Co ltd
Priority date: 2022-05-13
Filing date: 2022-05-13
Publication date: 2022-08-23
Anticipated expiration: 2032-05-13

Abstract

The utility model discloses a temperature resistant moisture-proof copper foil adhesive tape relates to sticky tape technical field, the sticky tape body, sticky tape body is inside from top to bottom is equipped with metal oxide layer, heat-resistant layer, curing agent layer, conductive adhesive layer and copper foil layer in proper order, the vacuum cavity that runs through mutually with the curing agent layer is seted up to conductive adhesive layer's inside symmetry. The utility model discloses, through setting up metal oxide layer and heat-resistant layer, increase the wear resistance of sticky tape body surface to improve sticky tape body in use's high temperature resistant characteristic, when avoiding equipment to close on the high temperature organism, thermal-insulated effect is poor to cause equipment operating efficiency lower, through setting up the curing agent layer, makes the waterproof layer closely laminate with conductive adhesive layer, contacts conductive adhesive layer when the waterproof layer is avoided outside water infiltration by the curing agent layer.

Description

Temperature-resistant moisture-proof copper foil adhesive tape

Technical Field

The utility model relates to an sticky tape technical field, more specifically relates to a moisture-proof copper foil sticky tape of temperature resistant.

Background

With the advent of the digital age, electronic products such as notebook computers, palm computers, mobile phones, copiers and the like come into thousands of households, but the products generate noise due to interference of high-frequency electromagnetic waves, so that the use quality is affected, if a human body is exposed to a strong electromagnetic field for a long time, the electronic products are likely to be susceptible to cancer lesions, so that electromagnetic interference is imperative, shielding is to isolate metal between two space regions so as to control induction and radiation of an electric field, a magnetic field and electromagnetic waves from one region to the other region, and specifically, a shielding body is used for surrounding an interference source of a component, a circuit, a combined part, a cable or the whole system, so that the interference electromagnetic field is prevented from diffusing outwards or surrounding a receiving circuit, equipment or the system by the shielding body, and the interference electromagnetic field is prevented from being affected by the external electromagnetic field.

In chinese utility model patent application no: CN202121655714.8 discloses a high and low temperature resistant copper foil tape, which comprises a copper foil, wherein a curing agent layer is arranged on one side of the copper foil, a pressure sensitive adhesive layer is arranged on the other side of the copper foil, an adhesive tape layer is arranged on one side of the curing agent layer, which is far away from the copper foil, and antioxidant coatings are respectively coated on two sides of the copper foil. When the high-temperature and low-temperature resistant copper foil adhesive tape is used for electronic products which are in an overheated and humid environment for a long time, water vapor is easy to permeate into the adhesive surface, so that the adhesive force of the adhesive tape is seriously reduced, even the adhesive tape is not sticky and falls off, the risk of weakening the shielding efficiency due to the attenuation of the conductive performance is accompanied, and the conductive performance of a conductor in the operation process is reduced, so that the conductive performance is not beneficial to long-term use.

Therefore, it is necessary to provide a heat-resistant and moisture-resistant copper foil adhesive to solve the above problems.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The utility model aims to provide a: in order to solve resistant high low temperature copper foil sticky tape, when using the electronic product who is in overheat and humid environment for a long time, make steam infiltration sticky surface easily, lead to the adhesive force of sticky tape seriously to descend and lose even and glue and drop to along with the risk that electric conductive property decay shielding effectiveness weakens, reduce the electric conductive property of conductor in service and be unfavorable for the problem of long-term use, the utility model provides a resistant wet-resistant copper foil sticky tape of temperature resistant.

(II) technical scheme

The utility model discloses a realize above-mentioned purpose and specifically adopt following technical scheme:

the utility model provides a temperature resistant moisture-proof copper foil sticky tape, includes the sticky tape body, inside metal oxide layer, heat-resistant layer, curing agent layer, conductive adhesive layer and the copper foil layer of from top to bottom being equipped with in proper order of sticky tape body, the inside symmetry of conductive adhesive layer is seted up and is run through the vacuum cavity mutually with the curing agent layer.

Furthermore, the bottom ends of the insides of the vacuum cavities are fixedly connected with lower elastic blocks, and the tops of the vacuum cavities are symmetrically and fixedly connected with elastic rods.

Furthermore, the bottoms of the elastic rods are fixedly connected with a fixing plate, and the bottoms of the fixing plates are in fit connection with the upper surface of the lower elastic block.

Furthermore, the metal oxide layer is formed by electroplating one of SiO2 and Al2O3 with the thickness of 0.001-0.05 μm on the non-release surface of the release film.

Further, the heat-resistant layer is organic silicon resin, and thickness is 0.1-0.5mm, the thickness of curing agent layer is 1um-3 um.

Further, the conductive adhesive layer is an electric composite grease layer with the thickness of 0.1-5 microns.

Further, the copper foil layer is a conventional calendered copper foil.

(III) advantageous effects

The utility model has the advantages as follows:

1. the utility model discloses, through setting up metal oxide layer and heat-resistant layer, increase the wear resistance of sticky tape body surface to improve sticky tape body in use's high temperature resistant characteristic, when avoiding equipment to close on the high temperature organism, thermal-insulated effect is poor to cause equipment operating efficiency lower, through setting up the curing agent layer, makes the waterproof layer closely laminate with conductive adhesive layer, contacts conductive adhesive layer when the waterproof layer is avoided outside water infiltration by the curing agent layer.

2. The utility model discloses, be connected with equipment surface through a plurality of strip adhesive linkage, when reducing the viscose use, improve tearing of sticky tape and peel off the ability, set up the vacuum cavity through the inside at the sticky tape body, reduce the use of sticky tape material to promote fixed plate and lower elastic block contact through a plurality of elastic rods, be convenient for receive the fast recovery original state after pressure at the sticky tape.

Drawings

Fig. 1 is a schematic perspective view of the structure of the present invention;

FIG. 2 is a schematic perspective sectional view of the structure of the present invention;

fig. 3 is an enlarged schematic view of the structure of region a in fig. 2 according to the present invention.

Reference numerals: 1. a tape body; 5. a metal oxide layer; 6. a heat-resistant layer; 8. a curing agent layer; 9. a conductive adhesive layer; 10. a copper foil layer; 12. a vacuum chamber; 13. a lower elastic block; 14. an elastic rod; 15. and (5) fixing the plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

Example 1

Referring to fig. 1-3, a temperature-resistant and moisture-resistant copper foil tape comprises a tape body 1, a metal oxide layer 5 and a heat-resistant layer 6 sequentially disposed from top to bottom inside the tape body 1, curing agent layer 8, conductive adhesive layer 9 and copper foil layer 10, metal oxide layer 5 is at the non-compound fat layer of electric power that electroplates 0.001 mu m thick SiO2 from the type face of type membrane, heat-resistant layer 6 is organic silicon resin, thickness is 0.1mm, the thickness of curing agent layer 8 is 1um, conductive adhesive layer 9 is 0.1 mu m thick electric power complex fat layer, copper foil layer 10 is conventional calendering copper foil, the inside symmetry of conductive adhesive layer 9 is seted up the vacuum chamber 12 that runs through mutually with curing agent layer 8, the inside bottom fixedly connected with of a plurality of vacuum chambers 12 is elastic block 13 down, the top symmetry fixedly connected with elastic rod 14 of a plurality of vacuum chambers 12, the bottom fixedly connected with fixed plate 15 of a plurality of elastic rod 14, the bottom of a plurality of fixed plate 15 and the upper surface laminating of elastic block 13 are connected down.

In this embodiment, when the reaction temperature is 20 ℃, the structure of the heat-resistant moisture-resistant copper foil tape sequentially includes, from top to bottom, a metal oxide layer 5 and a heat-resistant layer 6, a curing agent layer 8, a conductive adhesive layer 9 and a copper foil layer 10, which are subjected to graded heat bonding treatment, and after test water vapor permeates into the adhesive surface, the adhesive surface is aged and the conductive particles are oxidized faster, and the magnetic shielding effectiveness is poor.

Example 2

Referring to fig. 1-3, a temperature-resistant and moisture-resistant copper foil tape comprises a tape body 1, a metal oxide layer 5 and a heat-resistant layer 6 sequentially disposed from top to bottom inside the tape body 1, curing agent layer 8, conductive adhesive layer 9 and copper foil layer 10, metal oxide layer 5 is at the non-compound fat layer of electric power that electroplates 0.02 mu m thick SiO2 from the type face of type membrane, heat-resistant layer 6 is organic silicon resin, thickness is 0.3mm, the thickness of curing agent layer 8 is 2um, conductive adhesive layer 9 is the compound fat layer of the thick electric power of 2.5 mu m, copper foil layer 10 is conventional calendering copper foil, the inside symmetry of conductive adhesive layer 9 is seted up the vacuum chamber 12 that runs through mutually with curing agent layer 8, the inside bottom fixedly connected with of a plurality of vacuum chambers 12 is elastic block 13 down, the top symmetry fixedly connected with elastic rod 14 of a plurality of vacuum chambers 12, the bottom fixedly connected with fixed plate 15 of a plurality of elastic rod 14, the bottom of a plurality of fixed plate 15 and the upper surface laminating of elastic block 13 are connected.

In the embodiment, when the reaction temperature is 20 ℃, the structure of the heat-resistant moisture-proof copper foil tape sequentially comprises a metal oxide layer 5 and a heat-resistant layer 6 from top to bottom, a curing agent layer 8, a conductive adhesive layer 9 and a copper foil layer 10 which are subjected to graded heat bonding treatment, and test water vapor permeates into the adhesive surface to enable the adhesive surface to be moderate in aging and conductive particle oxidation, and the magnetic shielding effect to be moderate.

Example 3

Referring to fig. 1-3, a temperature-resistant and moisture-resistant copper foil tape comprises a tape body 1, a metal oxide layer 5 and a heat-resistant layer 6 sequentially disposed from top to bottom inside the tape body 1, curing agent layer 8, conductive adhesive layer 9 and copper foil layer 10, metal oxide layer 5 is at the non-compound fat layer of electric power that electroplates 0.05 mu m thick from the type face of type membrane Al2O3, heat-resistant layer 6 is organic silicon resin, thickness is 0.5mm, curing agent layer 8's thickness is 3um, conductive adhesive layer 9 is 0.1-5 mu m thick, copper foil layer 10 is conventional calendering copper foil, the inside symmetry of conductive adhesive layer 9 is seted up the vacuum chamber 12 that runs through mutually with curing agent layer 8, the inside bottom fixedly connected with lower elastic block 13 of a plurality of vacuum chambers 12, the top symmetry fixedly connected with flexible pole 14 of a plurality of vacuum chambers 12, the bottom fixedly connected with fixed plate 15 of a plurality of flexible poles 14, the bottom of a plurality of fixed plates 15 and the upper surface laminating of lower elastic block 13 are connected.

In this embodiment, when the reaction temperature is 20 ℃, the structure of the heat-resistant and moisture-resistant copper foil tape sequentially includes, from top to bottom, a metal oxide layer 5 and a heat-resistant layer 6, a curing agent layer 8, a conductive adhesive layer 9 and a copper foil layer 10, which are subjected to graded heat bonding treatment, and after test water vapor permeates into the adhesive surface, the adhesive surface is slowly aged and the conductive particles are slowly oxidized, and the magnetic shielding effectiveness is poor.

The temperature-resistant and moisture-resistant copper foil tape manufactured by the process has the advantages that the electronic product is protected in an overheated and humid environment, water vapor is not easy to permeate into the adhesive surface, the adhesive force viscosity of the tape is not easy to decline for a long time, the conductive performance is prevented from being attenuated, the shielding effectiveness is prevented from being weakened, and the service life of the tape is prolonged.

In summary, the following steps: the utility model, through setting up the metal oxide layer 5 and the heat-resistant layer 6, increase the wear-resisting characteristic of the external surface of the adhesive tape body 1, and improve the high temperature resistant characteristic of the adhesive tape body 1 in use, when avoiding the equipment to approach the high temperature organism, the poor heat insulation effect causes the equipment operation efficiency to be lower, through setting up the curing agent layer 8, make the curing agent layer 8 closely laminate with the conductive adhesive layer 9, contact the conductive adhesive layer 9 when avoiding the external water infiltration through the curing agent layer 8, set up the release coating through the outside of the copper foil layer 10, avoid the copper foil to directly contact with the electronic equipment, connect with the equipment surface through a plurality of strip adhesive layers of the release coating bottom, when reducing the use of adhesive, improve the tearing-off stripping ability of the adhesive tape, set up the vacuum cavity 12 in the inside of the adhesive tape body 1, reduce the use of adhesive tape material, and promote the fixed plate 15 to contact with the lower elastic block 13 through a plurality of elastic rods 14, be convenient for receive the quick reconversion after the pressure at the sticky tape, vacuum cavity 12 is located curing agent layer 8 and conductive adhesive layer 9's inside, takes place deformation after avoiding sticky tape body 1 expend with heat and contract with cold, causes inside local collapse after, leads to sticky tape body 1 attenuation, changes electric conductive property, and then reduces heat resistance, and vacuum cavity 12 adopts confined space, does not possess to admit air through the gas pocket from the type membrane.

Above, only be the preferred embodiment of the present invention, not be used for limiting the present invention, the patent protection scope of the present invention is based on the claims, all the structural changes equivalent to the content of the description and drawings of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a temperature resistant moisture-proof copper foil tape, includes sticky tape body (1), its characterized in that: the adhesive tape is characterized in that a metal oxide layer (5), a heat-resistant layer (6), a curing agent layer (8), a conductive adhesive layer (9) and a copper foil layer (10) are sequentially arranged inside the adhesive tape body (1) from top to bottom, and a vacuum cavity (12) which is penetrated through the curing agent layer (8) is symmetrically formed inside the conductive adhesive layer (9).

2. The temperature-resistant moisture-resistant copper foil tape according to claim 1, wherein: the bottom ends of the insides of the vacuum cavities (12) are fixedly connected with lower elastic blocks (13), and the tops of the vacuum cavities (12) are symmetrically and fixedly connected with elastic rods (14).

3. The temperature-resistant moisture-resistant copper foil tape according to claim 2, wherein: the bottoms of the elastic rods (14) are fixedly connected with a fixing plate (15), and the bottoms of the fixing plates (15) are in fit connection with the upper surface of the lower elastic block (13).

4. The temperature-resistant moisture-resistant copper foil tape according to claim 1, wherein: the metal oxide layer (5) is formed by electroplating one of SiO2 and Al2O3 with the thickness of 0.001-0.05 mu m on the non-release surface of the release film.

5. The temperature and moisture resistant copper foil tape according to claim 1, wherein: the heat-resistant layer (6) is organic silicon resin, and the thickness is 0.1-0.5mm, the thickness of curing agent layer (8) is 1um-3 um.

6. The temperature-resistant moisture-resistant copper foil tape according to claim 1, wherein: the conductive adhesive layer (9) is an electric composite grease layer with the thickness of 0.1-5 mu m.

7. The temperature-resistant moisture-resistant copper foil tape according to claim 1, wherein: the copper foil layer (10) is a conventional calendered copper foil.