CN210610139U - Carbon fiber filled high-thermal-conductivity and electric-conductivity composite material - Google Patents
Carbon fiber filled high-thermal-conductivity and electric-conductivity composite material Download PDFInfo
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- CN210610139U CN210610139U CN201921183208.6U CN201921183208U CN210610139U CN 210610139 U CN210610139 U CN 210610139U CN 201921183208 U CN201921183208 U CN 201921183208U CN 210610139 U CN210610139 U CN 210610139U
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Abstract
The utility model discloses a high heat conduction electricity conductive composite material that carbon fiber was filled, including high heat conduction electricity conductive elastomer and the metal forming that carbon fiber was filled, it has heat conduction electricity conductive adhesive layer all to paste at metal forming upper and lower surface, and one side heat conduction electricity conductive adhesive layer covers the laminating with the high heat conduction elastomer that carbon fiber was filled. The utility model discloses collect functions in an organic whole such as heat conduction, electrically conductive and shock attenuation buffering, can deal with the requirement of heat dissipation of electronic component heat-generating body and ground connection well. The high heat conduction and electric conduction elastic body can ensure that all electronic components are in close contact under certain pressure, so that the heat and the electronic transmission path are kept smooth. And simultaneously, because the utility model discloses in add the metal forming, make it possess and have good heat conductivity and electric conductive property in the plane direction. In addition, the single-face attaching heat-conducting and electric-conducting adhesive layer is beneficial to the installation and the disassembly of the electronic assembly.
Description
Technical Field
The utility model belongs to the technical field of heat dissipation and electromagnetic compatibility, concretely relates to high heat conduction electricity conductive composite that carbon fiber was filled.
Background
Along with the miniaturization and integration of electronic products, the power consumption and heat generation of the electronic products are also increasing, and the problems of electromagnetic wave interference are also accompanied. Therefore, how to quickly discharge heat generated from the electronic components in time and solve the problem of electromagnetic interference in order to ensure high reliability while allowing the electronic product to exhibit optimum performance is an important issue.
At present, heat conducting silica gel sheets are mainly adopted for heat dissipation of electronic products. However, the common thermal conductive sheet silica gel is generally insulated, i.e. only can transfer heat, but cannot conduct electricity to achieve the purpose of grounding or electromagnetic shielding. On the other hand, in order to solve the problem of electromagnetic interference, the conventional technology uses conductive foam, rubber or reed as a material to conduct out electromagnetic waves, and although the conductive effect is achieved, the conductive effect is basically not achieved. Therefore, the two materials cannot be applied to application scenes with both electric conduction and heat conduction requirements.
Disclosure of Invention
The utility model provides a high heat conduction electricity-conduction composite material that carbon fiber was filled to current material and the problem that the scheme can't be applicable to the application scene that has electric conduction and heat conduction demand simultaneously that provides in solving above-mentioned background art.
The utility model adopts the technical proposal that: the utility model provides a high heat conduction electricity conductive composite material that carbon fiber was filled, includes high heat conduction electricity conductive elastomer and the metal forming that carbon fiber was filled, metal forming lower surface and upper surface paste respectively and cover first heat conduction electricity conductive adhesive layer and second heat conduction electricity conductive adhesive layer, first heat conduction electricity conductive adhesive layer with the high heat conduction elastomer that carbon fiber was filled covers the laminating, second heat conduction electricity conductive adhesive layer surface paste and covers the one deck from the type membrane.
Furthermore, carbon fibers in the carbon fiber filled high-thermal-conductivity and electric-conductivity elastomer are directionally arranged in the thickness direction, so that high-thermal-conductivity and electric-conductivity in the thickness direction are provided;
further, the first heat and electricity conducting adhesive layer and the second heat and electricity conducting adhesive layer are prepared by mixing heat and electricity conducting powder and pressure sensitive adhesive;
further, the heat and electricity conducting powder comprises graphite, gold, silver and copper powder;
further, the metal foil is copper foil, aluminum foil or nickel-plated copper foil;
due to the application of the technical scheme, compared with the prior art, the utility model have the following advantage:
the utility model discloses a high heat conduction electrically conductive combined material that carbon fiber was filled collects functions in an organic whole such as heat conduction, electric conduction and shock attenuation buffering, can deal with the requirement of heat dissipation of electronic component heat-generating body and ground connection well. The high heat conduction and electric conduction elastic body can ensure that all electronic components are in close contact under certain pressure, so that the heat and the electronic transmission path are kept smooth. And simultaneously, because the utility model discloses in add the metal forming, make it possess and have good heat conductivity and electric conductive property in the plane direction. In addition, the single-face attaching heat-conducting and electric-conducting adhesive layer is beneficial to the installation and the disassembly of the electronic assembly.
Drawings
Fig. 1 is a schematic view of the sectional structure of a silicon-carbon composite buffer heat sink with high thermal conductivity.
In the figure: 1. high heat conduction electric conduction elastomer, 2, first heat conduction electric conduction adhesive layer, 3, metal foil, 4, second heat conduction electric conduction adhesive layer, 5, from the type membrane.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example 1
Referring to fig. 1, the carbon fiber filled high thermal conductivity and electrical conductivity composite material of the present invention includes a carbon fiber filled high thermal conductivity and electrical conductivity elastomer 1 and a metal foil 3; the carbon fibers in the carbon fiber filled high-thermal-conductivity and electric-conductivity elastomer 1 are directionally arranged in the thickness direction, so that the high-thermal-conductivity and electric-conductivity in the thickness direction is provided; the metal foil 3 can be one of copper foil, aluminum foil and nickel-plated copper foil, and has excellent heat conduction and electric conductivity; the lower surface and the upper surface of the metal foil 3 are respectively coated with a first heat-conducting and electric-conducting adhesive layer 2 and a second heat-conducting and electric-conducting adhesive layer 4; the first heat and electricity conducting adhesive layer 2 and the second heat and electricity conducting adhesive layer 3 are prepared by mixing heat and electricity conducting powder and pressure sensitive adhesive; the pressure-sensitive adhesive is any one of acrylic pressure-sensitive adhesive and organic silicon pressure-sensitive adhesive, and provides different viscosity and temperature resistance; the heat and electricity conducting powder comprises graphite, gold, silver and copper powder; the first heat and electricity conducting adhesive layer 2 is in covering fit with the high heat conducting elastomer 1 filled with the carbon fibers, and the surface of the second heat and electricity conducting adhesive layer 4 is covered with a release film 5.
The utility model discloses collect functions in an organic whole such as heat conduction, electrically conductive and shock attenuation buffering, can deal with the requirement of heat dissipation of electronic component heat-generating body and ground connection well. The high heat conduction and electric conduction elastic body can ensure that all electronic components are in close contact under certain pressure, so that the heat and the electronic transmission path are kept smooth. And simultaneously, because the utility model discloses in add the metal forming, make it possess and have good heat conductivity and electric conductive property in the plane direction. In addition, the single-face attaching heat-conducting and electric-conducting adhesive layer is beneficial to the installation and the disassembly of the electronic assembly.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (2)
1. The utility model provides a high heat conduction electricity conductive composite material that carbon fiber was filled which characterized in that: the utility model provides a high heat conduction electricity conductive composite material that carbon fiber was filled, includes high heat conduction electricity conductive elastomer and the metal forming that carbon fiber was filled, metal forming lower surface and upper surface paste respectively and cover first heat conduction electricity conductive adhesive layer and second heat conduction electricity conductive adhesive layer, first heat conduction electricity conductive adhesive layer with the high heat conduction elastomer that carbon fiber was filled covers the laminating, second heat conduction electricity conductive adhesive layer surface paste and covers the one deck from the type membrane.
2. The carbon fiber-filled high thermal and electrical conductivity composite material as claimed in claim 1, wherein the carbon fibers in the carbon fiber-filled high thermal and electrical conductivity elastomer are oriented in the thickness direction, thereby providing high thermal and electrical conductivity in the thickness direction.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201921183208.6U CN210610139U (en) | 2019-07-25 | 2019-07-25 | Carbon fiber filled high-thermal-conductivity and electric-conductivity composite material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201921183208.6U CN210610139U (en) | 2019-07-25 | 2019-07-25 | Carbon fiber filled high-thermal-conductivity and electric-conductivity composite material |
Publications (1)
Publication Number | Publication Date |
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CN210610139U true CN210610139U (en) | 2020-05-22 |
Family
ID=70694731
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201921183208.6U Expired - Fee Related CN210610139U (en) | 2019-07-25 | 2019-07-25 | Carbon fiber filled high-thermal-conductivity and electric-conductivity composite material |
Country Status (1)
Country | Link |
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CN (1) | CN210610139U (en) |
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2019
- 2019-07-25 CN CN201921183208.6U patent/CN210610139U/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200522 |