CN209845582U - Multilayer heat conducting part - Google Patents
Multilayer heat conducting part Download PDFInfo
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- CN209845582U CN209845582U CN201821948008.0U CN201821948008U CN209845582U CN 209845582 U CN209845582 U CN 209845582U CN 201821948008 U CN201821948008 U CN 201821948008U CN 209845582 U CN209845582 U CN 209845582U
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Abstract
The utility model relates to a heat-conduction technical field discloses a multilayer heat-conducting piece, include: a heat conducting member body and a liquid metal layer; the liquid metal layers are uniformly distributed on one side or two sides of the heat conducting piece body and are compounded with the heat conducting piece body into a whole. The utility model provides a pair of multilayer heat-conducting part utilizes liquid metal's characteristic, closely compounds liquid metal layer and heat-conducting part body as an organic whole, is favorable to improving the heat along the transmission efficiency of heat-conducting part thickness direction, improves the heat conduction heat-sinking capability of heat-conducting part, and this multilayer heat-conducting part simple structure, and the cost is lower.
Description
Technical Field
The utility model relates to a heat-conduction technical field especially relates to a multilayer heat-conducting piece.
Background
In electronic devices such as communication devices and power control devices, high performance, large capacity, and miniaturization are being promoted, and high density mounting of electronic components mounted on the electronic devices is becoming remarkable. As electronic components have been increased in capacity and mounted in high density, the amount of heat generated from the electronic components has increased, and it has become increasingly important to ensure heat dissipation of the electronic components in order to ensure operational stability of electronic equipment and reduce environmental load.
The traditional heat conduction method is that people use good heat conductors, such as metal copper or metal aluminum to make heat conduction materials to transfer heat. In recent years, graphite materials having good thermal conductivity have come to be applied. Generally, the surface heat conductivity of high-crystallinity graphite is very high, and the radial heat conductivity perpendicular to the surface is low, so that if the graphite film is used as a heat dissipation material and is adhered to a heating component, the graphite film can only disperse heat, but cannot timely conduct the heat out, and the application range of the graphite as a heat conduction material is limited. At present, natural graphite with high thermal conductivity is generally only used for LCD heat dissipation, high-temperature materials and the like, and artificial graphite with high thermal conductivity is generally used for heat dissipation of smart phones and tablet computers.
Some heat-conducting members with good heat-conducting properties have a high coefficient of heat conduction in the plane, but a low coefficient of heat conduction in the radial direction perpendicular to the plane.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
The utility model aims at providing a multilayer heat-conducting piece for solve or partly solve some heat-conducting pieces that heat conductivility is good, the face coefficient of heat conduction is very high, nevertheless with the lower problem of face vertically radial coefficient of heat conduction.
(II) technical scheme
In order to solve the technical problem, the utility model provides a multilayer heat-conducting piece, include: a heat conducting member body and a liquid metal layer; the liquid metal layers are uniformly distributed on one side or two sides of the heat conducting piece body and are compounded with the heat conducting piece body into a whole.
On the basis of the scheme, the molten liquid metal is sprayed or printed on one side or two sides of the heat conducting member body and solidified to form a liquid metal layer.
On the basis of the scheme, the multilayer heat conducting piece is arranged between the heat source and the radiator, one side of the multilayer heat conducting piece is in contact with the surface of the heat source in a bonding mode, and the other side of the multilayer heat conducting piece is in contact with the surface of the radiator in a bonding mode.
On the basis of the scheme, the thickness of the liquid metal layer is as follows: 0.02-0.2 mm; the thickness of the heat conducting piece body is as follows: 0.01-0.1 mm.
On the basis of the scheme, the melting point of the liquid metal is as follows: 30-235 ℃.
On the basis of the scheme, the liquid metal comprises: simple substance metal or alloy of two or more metals of indium, bismuth, gallium, tin, silver, gold, aluminum and magnesium.
On the basis of the scheme, the heat conducting piece body is of a plane structure, a bent structure or a folded structure.
On the basis of the scheme, the heat conducting piece body comprises a graphite sheet, a copper sheet, an aluminum sheet or a copper wire mesh.
(III) advantageous effects
The utility model provides a pair of multilayer heat-conducting part utilizes liquid metal's characteristic, closely compounds liquid metal layer and heat-conducting part body as an organic whole, is favorable to improving the heat along the transmission efficiency of heat-conducting part thickness direction, improves the heat conduction heat-sinking capability of heat-conducting part, and this multilayer heat-conducting part simple structure, and the cost is lower.
Drawings
Fig. 1 is a schematic view of a multilayer thermal conductor according to an embodiment of the present invention;
fig. 2 is another schematic view of a multilayer thermal conductor according to an embodiment of the present invention;
fig. 3 is a top view of a multilayer thermal conductor in accordance with an embodiment of the present invention;
fig. 4 is a schematic view of a multilayer heat conductor according to embodiment 1 of the present invention;
fig. 5 is a schematic view of a multilayer heat conductor according to embodiment 2 of the present invention;
fig. 6 is a schematic view of a multilayer heat conductor according to embodiment 3 of the present invention.
Description of reference numerals:
1-liquid metal layer; 2-the body of the heat conducting member; 3-graphite sheet layer;
4-aluminum sheet layer.
Detailed Description
The following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
According to the utility model discloses an embodiment provides a multilayer heat-conducting member, refer to fig. 1, this multilayer heat-conducting member includes: a heat-conducting member body 2 and a liquid metal layer 1; the liquid metal in a molten state is sprayed and printed or printed on one side of the heat conducting piece body 2 and solidified to form a liquid metal layer 1, the liquid metal layer 1 is uniformly distributed on one side of the heat conducting piece body 2 and is compounded with the heat conducting piece body 2 into a whole, and the multiple layers of heat conducting pieces are arranged between a heat source and a radiator, one side of each heat conducting piece is in contact with the surface of the heat source in a fitting manner, and the other side of each heat conducting piece is in contact with the.
The present embodiment provides a multilayer heat conducting member, which is formed by a heat conducting member body 2 and a liquid metal together to form a multilayer structure. The liquid metal layer 1 is formed of a liquid metal. The heat conductive member body 2 is a heat conductive layer formed of a heat conductive material. By utilizing the characteristic of low melting point of the liquid metal, the melted liquid metal can be uniformly jet-printed or printed on one side surface of the heat conducting member body 2 by a spray gun, a brush and other tools.
After the liquid metal is solidified, the liquid metal and the heat conductor body 2 are tightly compounded into a whole to form a multi-layer heat conducting piece. The heat-conducting pieces can be arranged between the heat source and the radiator, the heat-conducting pieces can be directly contacted with the heat source and the radiator to quickly transfer the heat of the heat source to the radiator, the heat-radiating efficiency of the heat source is improved, the heat-conducting pieces are filled between the heat source and the radiator to replace air, and the sealing effect can be improved.
This multilayer heat-conducting piece utilizes the characteristic of liquid metal, through the mode of spouting seal or printing with liquid metal layer 1 and heat-conducting piece body 2 closely compound as an organic whole, is favorable to improving the heat along the transmission efficiency of heat-conducting piece thickness direction, improves the heat conduction heat-sinking capability of heat-conducting piece, and this multilayer heat-conducting piece simple structure, and the preparation is convenient and the cost is lower.
On the basis of the above embodiment, further, referring to fig. 2, the other side of the heat conducting member body 2 is compositely connected with the liquid metal layer 1. The multilayer heat conductor can be of a two-layer composite structure or a three-layer composite structure. The liquid metal layers 1 can be arranged on both sides of the heat conductor body 2 in a composite connection mode to form a three-layer composite structure.
Further, another heat conduction layer can be connected to the side of the liquid metal layer 1 away from the heat conductor body 2. The number of layers of the multilayer heat conductor can be set according to the heat dissipation requirement, so as to be suitable for a heat source and a radiator, and the number of layers is not limited.
On the basis of the above embodiment, further, the thickness of the liquid metal layer 1 is: 0.02-0.2 mm; the thickness of the heat-conducting member body 2 is: 0.01-0.1 mm. The multilayer heat conductor with the size can be suitable for more electronic equipment, and the multilayer heat conductor can be placed between a heat source and a radiator, and two sides of the multilayer heat conductor are respectively connected with the heat source and the radiator, so that the heat dissipation efficiency of the heat source is improved.
In addition to the above embodiments, further, the melting point of the liquid metal is: 30-235 ℃. The liquid metal in the melting point range is easy to melt and is in composite connection with the heat conductor body 2, the melting point is not too low, the requirement of the heat conductor can be met, and the liquid metal is not easy to melt and affects normal use in the heat conductor heat conduction process.
On the basis of the above embodiment, further, the liquid metal includes: simple substance metal or alloy of two or more metals of indium, bismuth, gallium, tin, silver, gold, aluminum and magnesium. The liquid metal has good heat-conducting property, and the melting point is suitable for manufacturing the multilayer heat conductor.
On the basis of the above embodiment, further, referring to fig. 3, the heat conductive member body 2 has a planar structure, a bent structure, or a folded structure. The shape of the heat conductor body 2 is adapted to the surface shapes of the heat source and the heat sink, so as to be able to contact with the heat source and the heat sink, and is not limited in particular.
Further, the size of the heat conductor body 2 should be adapted to the contact area between the heat source and the heat sink, and the surface size is determined by the size of the contact area between the heat source and the heat sink. The liquid metal layer 1 is consistent with the heat conductor body 2 in shape and size, is compounded with the heat conductor body 2 into a whole and is attached to the surfaces of a heat source and a radiator.
On the basis of the above embodiment, further, the heat-conducting member body 2 includes a graphite sheet, a copper sheet, an aluminum sheet, or a copper wire mesh.
A graphite sheet may be provided as the heat conductor body 2. The graphite flake is a brand-new heat-conducting and heat-dissipating material, conducts heat uniformly along two directions, and the lamellar structure can be well adapted to any surface. The composite multilayer heat conducting fin composed of the graphite sheet and the liquid metal has good heat conducting capacity, improves the performance of consumer electronic products while shielding heat sources and components, and provides heat isolation in the aspect of thickness while the products are uniformly cooled.
Other materials can also be used to make the heat conductor body 2, such as copper sheets, aluminum sheets, copper wire meshes, and the like, which are all high heat conduction materials to ensure the heat conduction performance of the heat conductor. The heat conductor body 2 may be made of other high thermal conductivity materials, which is not limited to this.
Example 1:
based on the above embodiments, the present embodiment provides a multilayer heat conductor, which includes a graphite sheet layer 3 and a liquid metal layer 1, wherein the melted low-melting-point alloy is uniformly spray-printed or printed on the graphite sheet layer 3 by using a spray gun, a brush, or other tools, and after the low-melting-point alloy is solidified, the low-melting-point alloy and the graphite sheet layer 3 are tightly combined together to form the multilayer heat conductor.
The total thickness of the multilayer heat conductor is between 0.04mm and 0.5 mm; the thickness of the single liquid metal layer 1 ranges from 0.02 mm to 0.2mm, and the thickness of the single graphite sheet layer 3 ranges from 0.01mm to 0.1 mm.
Referring to fig. 4, the operating scenario of the present embodiment is that the contact area between the heat source and the heat sink is 42 × 42mm, and the temperature of the heat source is 120 ℃. Two layers of planar heat conductors are selected for the present embodiment, the effective thickness of the heat conductor is 0.2mm, and the size is 42mm × 42 mm. The liquid metal layer 1 is sprayed and printed on the surface of the graphite sheet layer 3, and the specific process comprises the following steps: and spraying and printing the molten liquid metal on the graphite sheet layer 3 with the thickness of 0.01mm, and cooling to ensure that the thickness of the liquid metal layer 1 is 0.19 mm.
The liquid metal layer 1 is made of bismuth-indium alloy, the melting point is 72 ℃, the Bi content is 33.7%, and the In content is 66.3%.
Example 2:
this embodiment is substantially the same as embodiment 1, and for the sake of brevity of description, in the description process of this embodiment, the same technical features as embodiment 1 are not described again, and only differences between this embodiment and embodiment 1 are explained:
referring to fig. 5, the operating scenario of the present embodiment is that the contact area between the heat source and the heat sink is 42 × 42mm, and the heat source temperature is 80 ℃. The embodiment selects three layers of heat conductors with plane structures, the effective thickness of the heat conductors is 0.3mm, and the size of the heat conductors is 42mm multiplied by 42 mm. And (3) spraying and printing the liquid metal layer 1 on the surface of the graphite sheet layer 3, wherein the thickness of the graphite sheet layer 3 is 0.01mm, and the thickness of the liquid metal is 0.29 mm.
The liquid metal layer 1 is made of bismuth indium tin alloy, the melting point is 60 ℃, the Bi content is 32.5%, the In content is 51%, and the tin content is 16.5%;
example 3:
referring to fig. 6, the operating scenario of the present embodiment is that the contact area between the heat source and the heat sink is 38 × 38mm, and the temperature of the heat source is 180 ℃. The present embodiment selects three layers of heat conductors with planar structure, the effective thickness of the heat conductor is 0.21mm, and the size is 38mm × 38 mm. The thickness of the liquid metal layer 1 and the aluminum sheet layer 4 is 0.07mm by spray printing on the surface of the aluminum sheet, and the thickness of the liquid metal layer 1 is 0.07 mm. The liquid metal layer 1 is indium, and the melting point is 156 ℃.
The multilayer heat conductor provided by the above embodiments combines the low melting point alloy and the heat conductor body 2 tightly without using any adhesive or resin to glue the heat conductor body 2 and the liquid metal layer 1, and has the advantages of excellent heat conductivity, leakage resistance, excellent operability, simple structure, low cost and the like in the using process of the multilayer heat conductor.
The multilayer heat conductor is arranged between the heating body and the heat radiation body, has the advantages of simple structure, good sealing effect, good heat conduction capability, low cost and the like.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. A multilayer heat-conductive member, comprising: a heat conducting member body and a liquid metal layer; the liquid metal layers are uniformly distributed on one side or two sides of the heat conducting piece body and are compounded with the heat conducting piece body into a whole.
2. A thermally conductive multilayer element as claimed in claim 1, wherein molten liquid metal is sprayed or printed on one or both sides of the element body to form a liquid metal layer after solidification.
3. A thermally conductive multilayer element as claimed in claim 2, wherein the multilayer element is disposed between the heat source and the heat sink with one side in abutting contact with the surface of the heat source and the other side in abutting contact with the surface of the heat sink.
4. A multilayer heat-conducting member according to claim 1, 2 or 3, wherein the liquid metal layer has a thickness of: 0.02-0.2 mm; the thickness of the heat conducting piece body is as follows: 0.01-0.1 mm.
5. A multilayer heat-conducting member according to claim 2 or 3, wherein the liquid metal has a melting point of: 30-235 ℃.
6. A multilayer heat transfer element as claimed in claim 5, wherein the liquid metal comprises: simple substance metal or alloy of two or more metals of indium, bismuth, gallium, tin, silver, gold, aluminum and magnesium.
7. A multilayer heat-conductive member as set forth in claim 1, 2 or 3, wherein said heat-conductive member body has a planar structure, a curved structure or a folded structure.
8. A multilayer heat-conductive member as set forth in claim 1, 2 or 3, wherein said heat-conductive member body comprises a graphite sheet, a copper sheet, an aluminum sheet or a copper wire mesh.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821948008.0U CN209845582U (en) | 2018-11-23 | 2018-11-23 | Multilayer heat conducting part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821948008.0U CN209845582U (en) | 2018-11-23 | 2018-11-23 | Multilayer heat conducting part |
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| CN209845582U true CN209845582U (en) | 2019-12-24 |
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| CN201821948008.0U Active CN209845582U (en) | 2018-11-23 | 2018-11-23 | Multilayer heat conducting part |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022002170A1 (en) * | 2020-07-03 | 2022-01-06 | 华为技术有限公司 | Heat conduction member, single board, computing device and manufacturing method |
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2018
- 2018-11-23 CN CN201821948008.0U patent/CN209845582U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022002170A1 (en) * | 2020-07-03 | 2022-01-06 | 华为技术有限公司 | Heat conduction member, single board, computing device and manufacturing method |
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