CN209806166U

CN209806166U - FPC board

Info

Publication number: CN209806166U
Application number: CN201822206110.XU
Authority: CN
Inventors: 李战领
Original assignee: Zhuhai Excel Electronic Technology Co Ltd
Current assignee: Zhuhai Excel Electronic Technology Co Ltd
Priority date: 2018-12-26
Filing date: 2018-12-26
Publication date: 2019-12-17
Anticipated expiration: 2028-12-26

Abstract

The utility model discloses a FPC board, which comprises a circuit copper layer, wherein the upper end and the lower end of the circuit copper layer are both provided with a first electric connection position, and the first electric connection position is provided with nickel-plated gold; the thickness of the circuit copper layer is 12-40 um, and the thickness of the first adhesive layer and the second adhesive layer is 12-35 um; the first protective layer and the second protective layer are 12-35 um thick; the lower extreme of second protective layer is folded in proper order and is equipped with third adhesive layer and steel layer, and the steel layer is stainless steel, third adhesive layer thickness 12 ~ 40um, steel layer 80 ~ 120 um. The nickel layer of the first electric connection position and the second electric connection position of the circuit copper layer is used for butting an external circuit, the reliability is high, the failure fault rate is far lower than that of the design of the through hole plating copper, the fault occurrence rate of the mobile phone loudspeaker is greatly reduced, and the brand is guaranteed.

Description

FPC board

Technical Field

The utility model relates to a circuit board especially relates to a FPC board that cell-phone speaker used.

Background

The double-layer copper metal substrate of the prior art of the mobile phone loudspeaker is generally provided with a through hole, wherein the through hole is communicated with upper-layer copper, an insulating layer and lower-layer copper, and the wall surface of the through hole is plated with a copper layer which enables the upper-layer copper and the lower-layer copper to be communicated; the upper layer copper and the lower layer copper are etched into corresponding circuit layers, and the copper plating layer enables the two circuit layers to be electrically connected into corresponding complete circuits.

However, in this arrangement, failure is more likely to occur; usually 100000 cases have a silent fault, maintenance usually needs to replace the FPC assembly, which causes poor reputation to the mobile phone name card, reputation influence sales volume receives large influence and/or recall loss is very large.

SUMMERY OF THE UTILITY MODEL

For overcoming prior art's not enough, reduce cell-phone speaker fault incidence, the utility model discloses a technical scheme be:

A FPC board comprises a circuit copper layer, wherein the upper end and the lower end of the circuit copper layer are respectively provided with a first electric connection position, and a gold-plated layer is arranged at the first electric connection position; the upper end of the circuit copper layer is sequentially overlapped with a first adhesive layer and a first protective layer, and the first adhesive layer and the first protective layer are provided with openings at positions corresponding to the first electric connection positions; a second adhesive layer and a second protective layer are sequentially stacked at the lower end of the circuit copper layer, and openings are formed in the positions, corresponding to the first electric connection positions, of the second adhesive layer and the second protective layer; the thickness of the circuit copper layer is 12-40 um.

According to another embodiment of the present invention, further, the first adhesive layer and the second adhesive layer are 12-35 um thick; first protective layer and second protective layer are thick 12 ~ 35 um.

According to another embodiment of the present invention, further, the copper layer of the circuit is 30-40 um thick; the thickness of the first adhesive layer and the second adhesive layer is 20-30 um; the first protective layer and the second protective layer are 20-30 um thick.

According to another embodiment of the present invention, the first protective layer and the second protective layer are polyimide or ink.

According to another embodiment of the present invention, further, a second electrical connection site is further disposed at the upper end of the circuit copper layer, and the second electrical connection site is provided with a gold plating layer; the first adhesive layer and the first protective layer are provided with openings at positions corresponding to the second electric connection positions.

According to another embodiment of the present invention, further, the lower end of the second protective layer is sequentially stacked with a third adhesive layer and a steel layer.

According to the utility model discloses a further embodiment, further have, the sticky layer of third is thick 12 ~ 400um, and the steel layer is 80 ~ 200 um.

According to another embodiment of the present invention, further, the steel layer is stainless steel.

According to another embodiment of the present invention, further, a fourth adhesive layer is stacked on the lower end of the steel layer.

According to another embodiment of the present invention, further, the thickness of the gold-plating layer is greater than or equal to 0.17 um; the gold-plated layer is connected with the circuit copper layer through the nickel-plated layer, and the thickness of the nickel-plated layer is 3-8 um.

The utility model discloses a pair of FPC board, following beneficial effect has: the nickel layer of the first electric connection position and the second electric connection position of the circuit copper layer is used for butting an external circuit, the reliability is high, the failure fault rate is far lower than that of the design of the through hole plating copper, the fault occurrence rate of the mobile phone loudspeaker is greatly reduced, and the brand is guaranteed.

Drawings

Fig. 1 is a schematic structural diagram of the present invention.

Detailed Description

the following detailed description of the embodiments of the present invention will be made with reference to the accompanying drawings.

As shown in fig. 1, an FPC board includes a circuit copper layer 1, first electrical connection sites 21 are provided at upper and lower ends of the circuit copper layer 1, and a gold plating layer 2a is provided at the first electrical connection sites 21; the upper end of the circuit copper layer 1 is sequentially overlapped with a first adhesive layer 3 and a first protective layer 4, and the first adhesive layer 3 and the first protective layer 4 are provided with openings at positions corresponding to the first electric connection positions 21; a second adhesive layer 5 and a second protective layer 6 are sequentially stacked at the lower end of the circuit copper layer 1, and openings are formed in the positions, corresponding to the first electric connection positions 21, of the second adhesive layer 5 and the second protective layer 6; the thickness of the circuit copper layer is 12-40 um. Preferably, the thickness of the circuit copper layer is 30-40 um, such as 35 um.

The thicknesses of the first adhesive layer 3 and the second adhesive layer 5 are 12-35 um; the first protective layer 4 and the second protective layer 6 are 12-35 um thick.

The thickness of a circuit copper layer is 30-40 um; the thicknesses of the first adhesive layer 3 and the second adhesive layer 5 are 20-30 um; the first protective layer 4 and the second protective layer 6 are 20-30 um thick. The first protective layer 4 and the second protective layer 6 are made of polyimide or ink. The upper end of the first protective layer 4 is provided with a character layer.

The upper end of the circuit copper layer 1 is also provided with a second electric connection position 22, and the second electric connection position 22 is provided with a gold plating layer 2 a; the first adhesive layer 3 and the first protective layer 4 have openings at positions corresponding to the second electrical connection sites 22.

The lower end of the second protective layer 6 is sequentially overlapped with a third adhesive layer 7 and a steel layer 8. The thickness of the third adhesive layer 7 is 12-40 um, the thickness of the steel layer is 80-200 um, and the steel layer 8 is stainless steel. The third adhesive layer 7 and the steel layer 8 are provided with openings at positions corresponding to the second electrical connection sites 22. Preferably, the thickness of the steel layer 8 is 90-130 um, such as 100 um; the third adhesive layer 7 is 25-35 um thick, such as 30 um. And a fourth adhesive layer 9 is stacked at the lower end of the steel layer 8.

The thickness of the gold-plated layer 2a is more than or equal to 0.17 um; the gold-plated layer 2a is connected with the circuit copper layer 1 through the nickel-plated layer 2b, and the nickel-plated layer 2b is 3-8 um thick. Preferably, the thickness of the gold plating layer 2a is 1-15 um, such as 8 um; the nickel plating layer 2b is 3-6 um thick, such as 4 um.

A manufacturing process of an FPC board comprises steps a-d. And a, cutting a copper plate, wherein the thickness of the copper plate is 12-40 um.

And b, arranging an electric connection position clearance opening on the protective film, coating adhesive on the upper end surface of the copper plate and/or the first protective film, laminating the copper plate with the protective film through the adhesive, laminating the protective film and the copper plate, and pressing at the temperature of 140-180 ℃ and the pressure of 45-55 kg, wherein the thickness of the adhesive layer and the protective film is 12-35 mu m.

And c, etching and/or exposing and developing the copper plate to prepare a circuit copper layer 1, pressing and connecting the lower end face of the circuit copper layer 1 to a second protective film with another electrified connecting position clearance opening through an adhesive, wherein the pressing temperature is 140-180 ℃, the pressure is 45-55 kg, and the thickness of the adhesive layer and the protective film is 12-35 mu m.

And d, plating a gold layer on the electric connection position of the circuit copper layer 1, and sticking a stainless steel sheet to the second protective film through adhesive, wherein the thickness of the stainless steel sheet is 80-120 microns.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship indicated based on the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; may be mechanically coupled, may be electrically coupled or may be in communication with each other; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

The above embodiments are only used for illustrating the technical solutions of the present invention and are not limited thereto, and any modification or equivalent replacement that does not depart from the spirit and scope of the present invention should be covered by the scope of the technical solutions of the present invention.

Claims

1. The FPC board is characterized by comprising a circuit copper layer (1), wherein the upper end and the lower end of the circuit copper layer (1) are respectively provided with a first electric connection position (21), and the first electric connection position (21) is provided with a gold-plated layer (2 a); the upper end of the circuit copper layer (1) is sequentially overlapped with a first adhesive layer (3) and a first protective layer (4), and the first adhesive layer (3) and the first protective layer (4) are provided with openings at positions corresponding to the first electric connection positions (21); the lower end of the circuit copper layer (1) is sequentially overlapped with a second adhesive layer (5) and a second protective layer (6), and the second adhesive layer (5) and the second protective layer (6) are provided with openings at positions corresponding to the first electric connection positions (21); the thickness of the circuit copper layer (1) is 12-40 um.

2. The FPC board of claim 1, wherein the first adhesive layer (3) and the second adhesive layer (5) are 12-35 um thick; the first protective layer (4) and the second protective layer (6) are 12-35 um thick.

3. The FPC board according to claim 2, wherein said circuit copper layer (1) is 30-40 um thick; the thicknesses of the first adhesive layer (3) and the second adhesive layer (5) are 20-30 um; the first protective layer (4) and the second protective layer (6) are 20-30 um thick.

4. An FPC board according to any one of claims 1 to 3, characterized in that said first and second protective layers (4, 6) are polyimide or ink.

5. An FPC board according to any of claims 1 to 3, characterized in that the upper end of said circuit copper layer (1) is further provided with a second electrical connection site (22), the second electrical connection site (22) being provided with a gold plating layer (2 a); the first adhesive layer (3) and the first protective layer (4) are provided with openings at positions corresponding to the second electric connection positions (22).

6. An FPC board as claimed in claim 1, wherein the lower end of the second protective layer (6) is provided with a third adhesive layer (7) and a steel layer (8) in this order.

7. The FPC board of claim 6, wherein the third adhesive layer (7) is 12-40 um thick, and the steel layer (8) is 80-200 um thick.

8. FPC board according to claim 6 or 7, characterized in that said layer of steel (8) is stainless steel.

9. FPC board according to claim 6 or 7, characterized in that the lower end of said steel layer (8) is superimposed by a fourth adhesive layer (9).

10. The FPC board according to any one of claims 1 to 3, wherein the thickness of said gold-plating layer (2a) is greater than or equal to 0.17 um; the gold-plated layer (2a) is connected with the circuit copper layer (1) through the nickel-plated layer (2b), and the nickel-plated layer (2b) is 3-8 um thick.