CN107731495A - Coil module - Google Patents
Coil module Download PDFInfo
- Publication number
- CN107731495A CN107731495A CN201710057369.XA CN201710057369A CN107731495A CN 107731495 A CN107731495 A CN 107731495A CN 201710057369 A CN201710057369 A CN 201710057369A CN 107731495 A CN107731495 A CN 107731495A
- Authority
- CN
- China
- Prior art keywords
- antenna
- substrate
- pattern
- coil module
- adhesive sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F38/00—Adaptations of transformers or inductances for specific applications or functions
- H01F38/14—Inductive couplings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/30—Combinations of separate antenna units operating in different wavebands and connected to a common feeder system
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/10—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2809—Printed windings on stacked layers
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Networks & Wireless Communication (AREA)
- Manufacturing & Machinery (AREA)
- Details Of Aerials (AREA)
Abstract
The present invention discloses a kind of coil module, and it includes：First substrate, in one side formed with first antenna portion；Insulate adhesive sheet, is simultaneously being provided with the first substrate；Second substrate, it is arranged at the another side of the insulation adhesive sheet, and in one side formed with the second antenna part, wherein, the first substrate and the second substrate by the first antenna portion and second antenna part toward each other in a manner of fit in the insulation adhesive sheet.
Description
Technical field
The present invention relates to a kind of coil module.
Background technology
Recently, as the increase of mobile phone market, wireless charging function are in the trend increased using rate.And then examine
A variety of products using wireless charging function such as desk, the dining table of wireless charging can be carried out by considering, the nothing that can predict future
The market scale of micro USB electrical equipment will further become big.
In addition, in the acceptance division for realizing nearest wireless charging function, NFC function, MST are used compoundly
Multiple functions such as (magnetic force safe transmission) function, WPC functions, and because the thickness of mobile phone is thinning and thin in terms of Structure of need
Membranization.
Therefore, the acceptance division for wireless charging is formed using the two sides circuit base material that can realize filming.
But in the case of using two sides circuit substrate, there is manufacturing cost increase during manufacture circuit substrate, and
And the problem of manufacture yield reduction.
And then in order that the pattern for being formed at the two sides of two sides circuit substrate is insulated, it is necessary to which insulating trip is arranged on into two
The two sides of face circuit substrate, therefore the problem of process increase and manufacturing cost rising be present.
[prior art literature]
[patent document]
(patent document 1) Japanese Laid-Open Patent Publication the 2008-182039th
The content of the invention
The present invention, which provides one kind, can reduce manufacturing cost, and improve the coil module of manufacture yield.
It can be included according to the coil module of one embodiment of the invention：First substrate, in one side formed with first antenna
Portion；Insulate adhesive sheet, is simultaneously being provided with the first substrate；Second substrate, the another side of the insulation adhesive sheet is arranged at,
And in one side formed with the second antenna part, wherein, the first substrate and the second substrate are with the first antenna portion and institute
State the mode of the second antenna part toward each other and fit in the insulation adhesive sheet.
It can be included according to the coil module of one embodiment of the invention：First substrate, have what is formed by isolation material
First substrate and be formed at first substrate one side first antenna portion；Insulate adhesive sheet, is simultaneously being provided with described the
One substrate, and with the connecting pattern for being connected to the first antenna portion；Second substrate, it is arranged at the another of the insulation adhesive sheet
Simultaneously, and there is the second substrate and the second antenna part, the second substrate is formed by isolation material, and second antenna part is formed
In second substrate one side and the first antenna portion is connected to by the connecting pattern, wherein, first base
Plate and the second substrate with the first antenna portion and second antenna part respectively with the one side of the insulation adhesive sheet and
The mode of another side contact is arranged at the insulation adhesive sheet.
The present invention have can reduce manufacturing cost, and improve manufacture yield effect.
Brief description of the drawings
Fig. 1 is the exploded perspective view for showing the coil module according to one embodiment of the invention.
Fig. 2 is the plan for the first substrate for showing the coil module according to one embodiment of the invention.
Fig. 3 is the plan for showing the insulation adhesive sheet according to the coil module of one embodiment of the invention.
Fig. 4 is the enlarged drawing in the A portions for showing Fig. 2.
Fig. 5 is the profile along Fig. 3 I-I ' lines.
Symbol description
100：Coil module 120：First substrate
140：Insulate adhesive sheet 160：Second substrate
Embodiment
Hereinafter, refer to the attached drawing and to the present invention the form that is preferable to carry out illustrate.But embodiment energy of the invention
Various other forms are enough deformed into, and the scope of the present invention is not limited to embodiment described below.Also, the reality of the present invention
Form is applied in order to be provided to having the personnel of ABC more completely to illustrate the present invention in the art.In accompanying drawing
The form and dimension of key element etc. perhaps to more specific explanation and exaggerated.
Fig. 1 is the exploded perspective view for showing the coil module according to one embodiment of the invention, and Fig. 2 is shown according to this hair
The plan of the first substrate of the coil module of a bright embodiment, Fig. 3 are to show the coil according to one embodiment of the invention
The plan of the insulation adhesive sheet of module.
Referring to figs. 1 to Fig. 3, first substrate can for example be included according to the coil module 100 of one embodiment of the invention
120th, insulate adhesive sheet 140 and second substrate 160 and form.
First substrate 120 can be typically used for the substrate of PCB substrate, i.e. copper-clad laminate (CCL, Copper Clad
Laminate), and pattern only can be formed in one side.
First substrate 120 can be equipped with first antenna portion 122 in one side.In one example, first substrate 120 has by insulating
Material formed the first substrate (base) 121 and be formed at the first substrate 121 one side above-mentioned first antenna portion 122.
In addition, first substrate 120 is arranged at insulation adhesive sheet (sheet) 140 as follows：First antenna portion 122 connects
Touch in insulation adhesive sheet 140, and the first substrate 121 is externally exposed.
First substrate 121 is the key element as the base material for forming first antenna portion 122, and it can be with heat resistance and resistance to
Pressure property and the material with pliability (Flexibility).In view of the characteristic of this material, the first substrate 121 can use
Polyimides (polyimide) film as thermosetting polymer film.
It is however not limited to this, the first substrate 121 can be formed by the hard material without pliability.
First antenna portion 122 can be by circle, ellipse or the quadrangle wound clockwise or counterclockwise
Flat board type coil is formed.In addition, first antenna portion 122 can include：First NFC antenna pattern 123, along the first substrate 121
Gabarit and formed；First wireless charging antenna pattern 124, it is arranged in the inner side of the first NFC antenna pattern 123；And the
One MST antenna patterns 125, it is arranged between the first NFC antenna pattern 123 and the first wireless charging antenna pattern 124.
In addition, first antenna portion 122 can be by NFC antenna pattern, wireless charging antenna pattern and MST antenna patterns
At least two antenna pattern form.
Also, as illustrated in greater detail in Fig. 4, due to the wireless charging of band ratio first of the first NFC antenna pattern 123
Electricity is high with the frequency band of antenna pattern 124, thus gabarit of the first NFC antenna pattern 123 along the first substrate 121 and be formed as micro-
The conductive pattern of the wide rectangle form of fine rule；And the first wireless charging is needed to carry out power transmission with antenna pattern 124, and use
Less than the frequency band of the first NFC antenna pattern 123, therefore the first wireless charging antenna pattern 124 can be in the first NFC antenna figure
The inner side of case 123 is formed wider than the line width of the line width of the first NFC antenna pattern 123.
In addition, the first MST antenna patterns 125 can for example have and the identical of the first wireless charging antenna pattern 124
Line width.It is however not limited to this, the line width of the first MST antenna patterns 125 can be formed as being narrower than or being wider than the first wireless charging use
The line width of antenna pattern 124.
The one side of insulation adhesive sheet 140 is provided with first substrate 120, and another side is provided with second substrate 160.
Therefore, the adhesive linkage for being ready for use on and being bonded first substrate 120 and second substrate 160 can be matched somebody with somebody on the two sides of insulation adhesive sheet 140
(not shown).
In addition, insulation adhesive sheet 140 can be formed by isolation material, first substrate 120 and second substrate will be provided to
160 antenna part 162 of first antenna portion 122 and second is electrically insulated.
Also, can be equipped with for connecting the antenna part 162 of first antenna portion 122 and second in insulation adhesive sheet 140
Connecting pattern 142.In addition, as illustrated in greater detail in Figure 5, connecting pattern 142 can be by being formed at insulation bonding
The connecting hole 142a of piece 140 fills conductive paste (paste) 142b and formed.
Connecting pattern 142 can be equipped with multiple, to connect 122 and second antenna part of first antenna portion, 162 respective day
Line pattern.
Second substrate 160 is arranged at the another side of insulation adhesive sheet 140, and can be in one side equipped with the second antenna part
162。
Second substrate 160 can be typically used for the substrate of PCB substrate, i.e. copper-clad laminate (CCL, Copper Clad
Laminate), and pattern only can be formed in one side.
In addition, second substrate 160 can be equipped with the second antenna part 162 in one side.In one example, second substrate 160 can be with
Above-mentioned second day with the second substrate (base) 161 formed by isolation material and the one side for being formed at the second substrate 161
Line portion 162.
In addition, second substrate 160 can be arranged at insulation adhesive sheet (sheet) 140 as follows：Second antenna part
162 are contacted with insulation adhesive sheet 140, and the second substrate 161 is externally exposed.
Second substrate 161 is the key element as the base material for forming the second antenna part 162, and it can be with heat resistance and resistance to
Pressure property and the material with pliability (Flexibility).In view of the characteristic of this material, the second substrate 161 can use
Polyamide (polyimide) film as thermosetting polymer film.
It is however not limited to this, the second substrate 161 can be formed by the hard material without pliability.
Second antenna part 162 can be by circle, ellipse or the quadrangle wound clockwise or counterclockwise
Flat board type coil is formed.In addition, the second antenna part 162 can include：Second NFC antenna pattern 163, along the second substrate 161
Gabarit and formed；Second wireless charging antenna pattern 164, it is arranged in the inner side of the second NFC antenna pattern 163；And the
Two MST antenna patterns 165, it is arranged between the second NFC antenna pattern 163 and the second wireless charging antenna pattern 164.
In addition, the second antenna part 162 can be by NFC antenna pattern, wireless charging antenna pattern and MST antenna patterns
At least two antenna pattern is formed.
Also, because the wireless charging of band ratio second of the second NFC antenna pattern 163 is high with the frequency band of antenna pattern 164,
So gabarit of the second NFC antenna pattern 163 along the second substrate 161 and be formed as the conductive pattern of the rectangle form of fine line width
Case；And the second wireless charging is needed to carry out power transmission with antenna pattern 164, and it is used below the second NFC antenna pattern 163
Frequency band, therefore the second wireless charging can be formed wider than with antenna pattern 164 in the inner side of the second NFC antenna pattern 163
The line width of the line width of two NFC antenna patterns 163.
In addition, the 2nd MST antenna patterns 165 can for example have and the identical of the second wireless charging antenna pattern 164
Line width.It is however not limited to this, the line width of the 2nd MST antenna patterns 165 can be formed as being narrower than or being wider than the second wireless charging use
The line width of antenna pattern 164.
Also, the second antenna part 162 is connected to above-mentioned first antenna portion 122 by connecting pattern 142.Therefore, second
Antenna part 162 can have the shape of the shape corresponding to first antenna portion 122.
It is however not limited to this, the second antenna part 162 and first antenna portion 122 can be formed in different shapes.
In addition, first antenna portion 122 can have some drawn in pattern P and portion of terminal S, and the second antenna part
162 have another in extraction pattern P and portion of terminal S.
As described above, the first substrate 120 formed with first antenna portion 122 and while formed with second day
The second substrate 160 in line portion 162 is fitted in insulation adhesive sheet 140 and forms coil module 100, therefore can reduce and be manufactured into
This simultaneously improves manufacture yield.
This is described in detail, uses following structure at present：Antenna part is formed on the two sides of substrate, and is made
The antenna part for being formed at the two sides of substrate is connected by through hole, while is provided for covering antenna part to realize insulation
Insulating trip.
Accordingly, in order in the two sides of substrate formation antenna part, it is necessary to carry out electroless copper, electrolytic copper plating process, therefore deposit
The problem of needing to use equipment, the chemicals of high price, while needing longer manufacturing time.
But due to forming first antenna portion 122 and second respectively in the one side of first substrate 120 and second substrate 160
Antenna part 162, it is possible to omit electroless copper, electrolytic copper plating process, and so that the first substrate 121 and the second substrate 161 to
The mode of upper and lower part exposure is arranged, so as to omit the process that insulating trip is attached to upper and lower part, and can be without using
Insulating trip.
Finally, it is possible to reduce manufacturing cost, and manufacture yield can be improved.
More than, embodiments of the invention are described in detail, but there is ABC in the art
Personnel can be clearly recognized that, interest field not limited to this of the invention, do not departing from the sheet described in claims
In the range of the technological thought of invention, a variety of modification and variation can be carried out.
Claims (16)
1. a kind of coil module, including：
First substrate, in one side formed with first antenna portion；
Insulate adhesive sheet, is simultaneously being provided with the first substrate；
Second substrate, the another side of the insulation adhesive sheet is arranged at, and in one side formed with the second antenna part,
The first substrate and the second substrate by the first antenna portion and second antenna part toward each other in a manner of
Fit in the insulation adhesive sheet.
2. coil module as claimed in claim 1, wherein,
In the insulation adhesive sheet equipped with the connecting pattern for connecting the first antenna portion and second antenna part.
3. coil module as claimed in claim 2, wherein,
The connecting pattern to the connecting hole for being formed at the insulation adhesive sheet by filling conductive paste to be formed.
4. coil module as claimed in claim 1, wherein,
The first substrate has：First substrate, is formed by isolation material；The first antenna portion, it is formed at first base
On bottom,
The second substrate has：Second substrate, is formed by isolation material；Second antenna part, it is formed at second base
On bottom.
5. coil module as claimed in claim 4, wherein,
First antenna portion and the second antenna part are by the circle, ellipse or the quadrangle that wind clockwise or counterclockwise
Plate coil formed.
6. coil module as claimed in claim 5, wherein,
The first antenna portion and second antenna part are by NFC antenna pattern, wireless charging antenna pattern and MST antenna diagrams
At least two antenna patterns in case are formed.
7. coil module as claimed in claim 5, wherein,
The first antenna portion is made up of following antenna pattern：First NFC antenna pattern, along the gabarit of the first substrate and shape
Into；First wireless charging antenna pattern, it is arranged in the inner side of the first NFC antenna pattern；And the first MST antenna diagrams
Case, it is arranged between the first NFC antenna pattern and the first wireless charging antenna pattern.
8. coil module as claimed in claim 4, wherein,
First substrate and second substrate are formed by thermosetting polymer film.
9. coil module as claimed in claim 1, wherein,
The first antenna portion has any one drawn in pattern and portion of terminal, and second antenna part, which has, draws pattern
With another in portion of terminal.
10. coil module as claimed in claim 5, wherein,
Second antenna part is made up of following antenna pattern：Second NFC antenna pattern, along the gabarit of the second substrate and shape
Into；Second wireless charging antenna pattern, it is arranged in the inner side of the second NFC antenna pattern；And the 2nd MST antenna diagrams
Case, it is arranged between the second NFC antenna pattern and the second wireless charging antenna pattern.
11. a kind of coil module, wherein, including：
First substrate, there is the first substrate formed by isolation material and be formed at the first antenna of the one side of first substrate
Portion；
Insulate adhesive sheet, is simultaneously being provided with the first substrate, and with the connecting pattern for being connected to the first antenna portion；
Second substrate, is arranged at the another side of the insulation adhesive sheet, and has the second substrate and the second antenna part, and described second
Substrate is formed by isolation material, second antenna part be formed at the one side of second substrate and by the connecting pattern and
The first antenna portion is connected to,
Wherein, the first substrate and the second substrate with the first antenna portion and second antenna part respectively with it is described
The mode of one side and the another side contact for the adhesive sheet that insulate is arranged at the insulation adhesive sheet.
12. coil module as claimed in claim 11, wherein,
The connecting pattern to the connecting hole for being formed at the insulation adhesive sheet by filling conductive paste to be formed.
13. coil module as claimed in claim 11, wherein,
First antenna portion and the second antenna part are by the circle, ellipse or the quadrangle that wind clockwise or counterclockwise
Plate coil formed.
14. coil module as claimed in claim 11, wherein,
The first antenna portion and second antenna part are by NFC antenna pattern, wireless charging antenna pattern and MST antenna diagrams
At least two antenna patterns in case are formed.
15. coil module as claimed in claim 11, wherein,
The first antenna portion has any one drawn in pattern and portion of terminal, and second antenna part, which has, draws pattern
With another in portion of terminal.
16. coil module as claimed in claim 11, wherein,
First substrate and second substrate are formed by thermosetting polymer film.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2016-0101811 | 2016-08-10 | ||
| KR20160101811 | 2016-08-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107731495A true CN107731495A (en) | 2018-02-23 |
Family
ID=61201245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710057369.XA Pending CN107731495A (en) | 2016-08-10 | 2017-01-26 | Coil module |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR20180018273A (en) |
| CN (1) | CN107731495A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109492741A (en) * | 2018-11-26 | 2019-03-19 | 昆山联滔电子有限公司 | A kind of electronics module and electronic device |
| CN111886754A (en) * | 2018-03-23 | 2020-11-03 | 阿莫技术有限公司 | Combined antenna module |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102349202B1 (en) * | 2021-08-04 | 2022-01-10 | 주식회사 한국플렉스 | Manufacturing method of tri-mode antenna |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101523693A (en) * | 2006-08-04 | 2009-09-02 | Sk化学株式会社 | Induction coil for cordless energy charging and data transfer |
| CN102709686A (en) * | 2012-05-14 | 2012-10-03 | 中兴通讯股份有限公司 | Antenna module and mobile terminal device |
| CN103915903A (en) * | 2012-12-28 | 2014-07-09 | 三星电机株式会社 | Coil for cordless charging and cordless charging apparatus using the same |
| CN104321928A (en) * | 2012-03-23 | 2015-01-28 | Lg伊诺特有限公司 | Antenna assembly and method for manufacturing same |
| CN105098363A (en) * | 2014-05-21 | 2015-11-25 | Tdk株式会社 | Antenna device and manufacturing method thereof |
| CN204927513U (en) * | 2015-09-11 | 2015-12-30 | 深圳市佳沃通信技术有限公司 | Synthetic coil antenna |
-
2017
- 2017-01-26 CN CN201710057369.XA patent/CN107731495A/en active Pending
- 2017-03-30 KR KR1020170040522A patent/KR20180018273A/en not_active Application Discontinuation
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101523693A (en) * | 2006-08-04 | 2009-09-02 | Sk化学株式会社 | Induction coil for cordless energy charging and data transfer |
| CN104321928A (en) * | 2012-03-23 | 2015-01-28 | Lg伊诺特有限公司 | Antenna assembly and method for manufacturing same |
| CN102709686A (en) * | 2012-05-14 | 2012-10-03 | 中兴通讯股份有限公司 | Antenna module and mobile terminal device |
| CN103915903A (en) * | 2012-12-28 | 2014-07-09 | 三星电机株式会社 | Coil for cordless charging and cordless charging apparatus using the same |
| CN105098363A (en) * | 2014-05-21 | 2015-11-25 | Tdk株式会社 | Antenna device and manufacturing method thereof |
| CN204927513U (en) * | 2015-09-11 | 2015-12-30 | 深圳市佳沃通信技术有限公司 | Synthetic coil antenna |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111886754A (en) * | 2018-03-23 | 2020-11-03 | 阿莫技术有限公司 | Combined antenna module |
| CN111886754B (en) * | 2018-03-23 | 2023-01-31 | 阿莫技术有限公司 | Combined antenna module |
| CN109492741A (en) * | 2018-11-26 | 2019-03-19 | 昆山联滔电子有限公司 | A kind of electronics module and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20180018273A (en) | 2018-02-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20190829 Address after: Han Guo Jingjidao Applicant after: Company WITS Address before: Gyeonggi Do Korea Suwon Applicant before: Samsung Electro-Mechanics Co., Ltd. |
|
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180223 |