CN215647557U - Flexible printed circuit board capable of rapidly dissipating heat - Google Patents

Abstract

The utility model relates to the technical field of circuit boards, and particularly discloses a flexible printed circuit board capable of quickly dissipating heat, which comprises a circuit board substrate, wherein a front circuit, front matte ink, a reinforcing plate and first release paper are sequentially arranged at the upper end of the circuit board substrate, a back circuit, back matte ink, back glue and second release paper are sequentially arranged at the bottom of the circuit board substrate, one end of the back circuit is connected with an electroplating welding spot, and one end of the front circuit is electrically connected with the electroplating welding spot. According to the utility model, the front circuit, the front matte ink and the first release paper are sequentially arranged at the upper end of the circuit board substrate, and the back circuit and the second release paper are sequentially arranged at the bottom of the circuit board substrate, so that the flexible printed circuit board can rapidly dissipate heat, the service life is prolonged, the structure is simple, the assembly is convenient, and the later maintenance cost is low.

Description

Flexible printed circuit board capable of rapidly dissipating heat

Technical Field

The utility model relates to the technical field of circuit boards, in particular to a flexible printed circuit board capable of quickly dissipating heat.

Background

FPC/FPC board, also called flexible circuit board/flexible wiring board; because it is flexible and bendable, it can be widely used in various small electric devices, such as mobile phones, battery modules, etc. It can be seen that the FPC board can be bent, and some deformation occurs in the thickness direction thereof when bent. The adoption of flexible circuit boards to replace the original aluminum-based hard circuit boards has become a new direction for the development of the electronic and electrical element industry and the circuit board industry. However, the existing flexible printed circuit board cannot have good heat dissipation performance, if heat is continuously accumulated and cannot be dissipated, the electronic product is easily overheated to cause burning loss, the structure is complex, the assembly is inconvenient, and the later maintenance cost is high.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem that the flexible printed circuit board capable of rapidly dissipating heat is provided, and the flexible printed circuit board is characterized in that a front circuit, a front matte ink and a first release paper are sequentially arranged at the upper end of a circuit board substrate, and a back circuit and a second release paper are sequentially arranged at the bottom of the circuit board substrate, so that the flexible printed circuit board can rapidly dissipate heat, the service life is prolonged, the structure is simple, the assembly is convenient, and the later maintenance cost is low.

In order to solve the technical problems, the technical scheme of the utility model is as follows:

the utility model provides a quick radiating flexible printed circuit board, includes circuit board substrate, the upper end of circuit board substrate has set gradually front circuit, front matte printing ink, stiffening plate and first from type paper, the bottom of circuit board substrate has set gradually back circuit, back matte printing ink, gum and second from type paper, the one end of back circuit is connected with electroplates the solder joint, the one end of front circuit with electroplate solder joint electric connection.

Preferably, the line width of the front surface lines is 0.15mm-0.25mm, and the line distance between the front surface lines is 1.05mm-1.15 mm.

Preferably, the electroplating welding points comprise a first electroplating welding point and a second electroplating welding point, the first electroplating welding point is electrically connected with the back circuit and the second electroplating welding point respectively, and the second electroplating welding point is provided with a plurality of electroplating through holes.

Preferably, the upper end and the lower end of the reinforcing plate and the upper end and the lower end of the first release paper are respectively provided with a first semicircular groove and a second semicircular groove, and the first semicircular groove and the second semicircular groove are symmetrically arranged.

Preferably, the center of the front matte ink, the center of the first release paper, the center of the back matte ink, the center of the back adhesive and the center of the second release paper are all provided with a mounting through hole.

Preferably, the front circuit, the front matte ink, the reinforcing plate and the first release paper are sequentially stacked from bottom to top at the upper end of the circuit board substrate, and the back circuit, the back matte ink, the back glue and the second release paper are sequentially stacked from top to bottom at the bottom of the circuit board substrate.

By adopting the technical scheme, the flexible printed circuit board capable of rapidly dissipating heat provided by the utility model has the following beneficial effects: the upper end of a circuit board substrate in the flexible printed circuit board is sequentially provided with a front circuit, front matte ink, a reinforcing plate and first release paper, the bottom of the circuit board substrate is sequentially provided with a back circuit, back matte ink, back glue and second release paper, one end of the back circuit is connected with an electroplating welding spot, one end of the front circuit is electrically connected with the electroplating welding spot, the front circuit, the front matte ink and the first release paper are sequentially arranged at the upper end of the circuit board substrate, the back circuit and the second release paper are sequentially arranged at the bottom of the circuit board substrate, heat generated by the front circuit and the back circuit can be rapidly dissipated through the first release paper and the second release paper, make flexible printed circuit board can carry out quick heat dissipation, life has obtained the improvement to the structure is comparatively simple, the equipment is convenient, and later maintenance cost is lower.

Drawings

FIG. 1 is an exploded view of the present invention;

FIG. 2 is a schematic front view of the present invention;

FIG. 3 is a schematic view of the backside structure of the present invention;

FIG. 4 is an enlarged view of the structure at A in FIG. 2;

FIG. 5 is an enlarged view of the structure at B in FIG. 3;

in the figure, 1-a circuit board substrate, 2-a front surface circuit, 3-a front surface matte ink, 4-a reinforcing plate, 5-first release paper, 6-a back surface circuit, 7-a back surface matte ink, 8-a back adhesive, 9-second release paper, 10-a first electroplating welding point, 11-a second electroplating welding point, 12-a first semicircular groove, 13-a second semicircular groove, 14-an electroplating through hole, 15-an installation through hole and 16-a gold-plated lead.

Detailed Description

The following further describes embodiments of the present invention with reference to the drawings. It should be noted that the description of the embodiments is provided to help understanding of the present invention, but the present invention is not limited thereto. In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the utility model and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the utility model.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

As shown in fig. 1, in the exploded view of the present invention, as can be seen from fig. 1, fig. 2 and fig. 3, the flexible printed circuit board with rapid heat dissipation includes a circuit board substrate 1, a front circuit 2, a front matte ink 3, a reinforcing plate 4 and a first release paper 5 are sequentially disposed at an upper end of the circuit board substrate 1, a back circuit 6, a back matte ink 7, a back adhesive 8 and a second release paper 9 are sequentially disposed at a bottom of the circuit board substrate 1, one end of the back circuit 6 is connected to an electroplating pad, and one end of the front circuit 2 is electrically connected to the electroplating pad. It can be understood that the front circuit 2, the front matte ink 3, the reinforcing plate 4 and the first release paper 5 are sequentially stacked from bottom to top at the upper end of the circuit board substrate 1, the back circuit 6, the back matte ink 7, the back glue 8 and the second release paper 9 are sequentially stacked from top to bottom at the bottom of the circuit board substrate 1, the circuit board substrate 1 adopts a PI substrate with a thickness of 13um, the front matte ink 3 and the back matte ink 7 both adopt black matte ink with a thickness of 15um, the front circuit 2 and the back circuit 6 can both adopt copper wires and the like with a thickness of 18um, the electroplating welding spot adopts a nickel plating layer and a gold plating layer, wherein the nickel plating layer has a thickness of 2.7um, the gold plating layer has a thickness of 0.1um, the back glue 8 adopts 3M6653 back glue with a thickness of 30um, the first release paper 5 and the second release paper 9 both adopt antistatic release paper, its thickness is 50 um.

Specifically, fig. 4 is an enlarged schematic structural diagram at a in fig. 2, and as can be seen from fig. 1 to 5, the line width of the front surface lines 2 is 0.15mm to 0.25mm, and the line distance between the front surface lines 2 is 1.05mm to 1.15 mm; the electroplating welding points comprise first electroplating welding points 10 and second electroplating welding points 11, the first electroplating welding points 10 are respectively electrically connected with the back circuit and the second electroplating welding points 11, and a plurality of electroplating through holes 14 are formed in the second electroplating welding points 11; the upper end and the lower end of the reinforcing plate 4 and the upper end and the lower end of the first release paper 5 are respectively provided with a first semicircular groove 12 and a second semicircular groove 13, and the first semicircular groove 12 and the second semicircular groove 13 are mutually and symmetrically arranged; the center of the front matte ink 3, the center of the first release paper 5, the center of the back matte ink 7, the center of the back adhesive 8 and the center of the second release paper 9 are all provided with a mounting through hole 15. It can be understood that the front traces 2 are sequentially routed inward around the edge of the front surface of the circuit board substrate 1, the back traces 6 are routed along the lower right corner edge of the back surface of the circuit board substrate 1, and the other ends of the back traces 6 are connected with gold-plated leads 16.

It can be understood that the flexible printed circuit board is reasonable in design and unique in structure, the front circuit 2, the front matte ink 3 and the first release paper 5 are sequentially arranged at the upper end of the circuit board substrate 1, the back circuit 6 and the second release paper 9 are sequentially arranged at the bottom of the circuit board substrate 1, and heat generated by the front circuit 2 and the back circuit 6 can be rapidly dissipated through the first release paper 5 and the second release paper 9, so that the flexible printed circuit board can rapidly dissipate heat, the service life is prolonged, the structure is simple, the assembly is convenient, and the later maintenance cost is low.

The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. It will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, and the scope of protection is still within the scope of the utility model.

Claims (6)

1. The utility model provides a quick radiating flexible printed circuit board which characterized in that: the circuit board comprises a circuit board substrate, the upper end of the circuit board substrate is sequentially provided with a front circuit, front matte ink, a reinforcing plate and first release paper, the bottom of the circuit board substrate is sequentially provided with a back circuit, back matte ink, gum and second release paper, one end of the back circuit is connected with an electroplating welding spot, and one end of the front circuit is electrically connected with the electroplating welding spot.

2. The flexible printed circuit board for rapid heat dissipation according to claim 1, wherein: the line width of the front lines is 0.15mm-0.25mm, and the line distance between the front lines is 1.05mm-1.15 mm.

3. The flexible printed circuit board for rapid heat dissipation according to claim 1, wherein: the electroplating welding points comprise first electroplating welding points and second electroplating welding points, the first electroplating welding points are electrically connected with the back circuit and the second electroplating welding points respectively, and a plurality of electroplating through holes are formed in the second electroplating welding points.

4. The flexible printed circuit board for rapid heat dissipation according to claim 1, wherein: first semicircular groove and second semicircular groove have been seted up respectively to the upper and lower both ends of stiffening plate and first upper and lower both ends from type paper, first semicircular groove sets up with second semicircular groove mutual symmetry.

5. The flexible printed circuit board for rapid heat dissipation according to claim 1, wherein: and the center of the front matte ink, the center of the first release paper, the center of the back matte ink, the center of the back adhesive and the center of the second release paper are all provided with mounting through holes.

6. The flexible printed circuit board for rapid heat dissipation according to claim 1, wherein: the front circuit, the front matte ink, the reinforcing plate and the first release paper are sequentially stacked from bottom to top at the upper end of the circuit board substrate, and the back circuit, the back matte ink, the back glue and the second release paper are sequentially stacked from top to bottom at the bottom of the circuit board substrate.

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