WO1999030376A2 - Battery-included pcb - Google Patents

Battery-included pcb Download PDF

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Publication number
WO1999030376A2
WO1999030376A2 PCT/KR1998/000389 KR9800389W WO9930376A2 WO 1999030376 A2 WO1999030376 A2 WO 1999030376A2 KR 9800389 W KR9800389 W KR 9800389W WO 9930376 A2 WO9930376 A2 WO 9930376A2
Authority
WO
WIPO (PCT)
Prior art keywords
battery
metal plate
pcb
layer
plate
Prior art date
Application number
PCT/KR1998/000389
Other languages
French (fr)
Other versions
WO1999030376A3 (en
Inventor
Jae Keun Park
Original Assignee
Mi Rae Battery Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mi Rae Battery Co., Ltd. filed Critical Mi Rae Battery Co., Ltd.
Publication of WO1999030376A2 publication Critical patent/WO1999030376A2/en
Publication of WO1999030376A3 publication Critical patent/WO1999030376A3/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M6/00Primary cells; Manufacture thereof
    • H01M6/14Cells with non-aqueous electrolyte
    • H01M6/16Cells with non-aqueous electrolyte with organic electrolyte
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00Secondary cells; Manufacture thereof
    • H01M10/04Construction or manufacture in general
    • H01M10/0436Small-sized flat cells or batteries for portable equipment
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00Secondary cells; Manufacture thereof
    • H01M10/05Accumulators with non-aqueous electrolyte
    • H01M10/052Li-accumulators
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50Current conducting connections for cells or batteries
    • H01M50/531Electrode connections inside a battery casing
    • H01M50/536Electrode connections inside a battery casing characterised by the method of fixing the leads to the electrodes, e.g. by welding
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to a printed circuit board (PCB) which includes a battery.
  • PCB printed circuit board
  • a battery is included inside the card.
  • the battery is usually an alkali or mercury battery and installed on the upper surface of a PCB. Since many parts are needed to include the battery and the battery itself has a predetermined thickness, there is a limit in manufacturing a melody-generating card to be no greater than a particular thickness.
  • PCB comprising: an anode portion integrally formed by a lower substrate, a metal plate formed on the lower substrate, and an anode material layer coated on the metal plate; and a cathode portion integrally formed by an upper substrate and a nickel layer, a lithium layer, and a polymer layer deposited in order on the upper substrate; wherein the metal plate is mesh- shaped and has a circumferential plate along the circumference of the metal plate which is connect to the metal plate, and the lithium layer comprising the polymer layer is formed to have a surface corresponding to the area of the metal plate and a circumferential plate is formed along the circumference of the upper substrate.
  • FIG. 1 is a sectional view showing the upper and lower substrates which include a battery according to the present invention
  • FIG. 2 is a view showing a preferred embodiment of the present invention
  • FIG. 3 is a perspective view showing the battery-included PCB according to the present invention which is mounted on an ordinary PCB having a predetermined thickness.
  • a nickel (Ni) layer 8 is formed on the lower surface of an upper substrate 1 which forms a negative terminal layer.
  • a lithium (Li) layer 3 is vacuum-deposited on the nickel layer 8.
  • a conductive (ion-permissible) polymer layer 4 of an extremely thin film is preferably formed on the lithium layer 3.
  • the material of the polymer layer 4 is not limited to the above polymer material and other materials can be used in its place.
  • a lower substrate 2 disposed to face the upper substrate 1 has a metal plate 5 formed on the upper surface thereof.
  • An anode material layer 6 including carbon or carbon-based compound is formed on the metal plate 5.
  • the metal plate 5 which will be a positive terminal layer is formed to have a mesh shape.
  • FIG. 2 shows an example of the battery-included PCB according to the present invention which is applied to a melody card.
  • the metal plate 5 is formed to have a mesh-shaped, occupying most of the area at the center of the lower substrate 2.
  • the anode material layer 6 on which anode material has already been formed is deposited on the metal plate 5.
  • the mesh-shaped metal plate 5 is connected to a circumferential plate 51.
  • the circumferential plate 51 is formed of a metal plate along the circumferential edge of the lower substrate 2, surrounding the area for the metal plate 5.
  • a copper (Cu) thin film is deposited on the circumferential plate 51 where the anode material layer 6 is not formed.
  • the circumferential plate 51 by being coated with lead is combined with the upper substrate 1 forming a seal.
  • the lower substrate 2 forms the anode
  • the lower surface of the upper substrate 1 forming the cathode (-), facing the anode above, is shown at the upper right portion of FIG. 2. As shown in the drawing, the lithium layer 3 having the polymer layer 4 coated thereon occupies most of the area at the center of the upper substrate 1.
  • a first hole 31 is formed at one side of the upper substrate 1.
  • a circumferential plate 32 formed of a thin copper film is formed along the circumferential edge of the upper substrate 1 , surrounding the area for the polymer layer 4.
  • a second hole 33 having a surface area protruding inwardly is formed at one side portion of the circumferential plate 32, opposing the position of the first hole 31.
  • the circumferential plate 32 and the circumferential plate 51 of the lower substrate 2 are combined with one another, for example, by soldering. Meanwhile, an IC portion 11 including an IC is formed on the upper surface of the upper substrate 1. Also, an IC connecting portion 12, an LED chip 13 and a switch portion 14 commonly accompanying the IC are formed on the upper substrate 1.
  • FIG. 3 shows that a battery including the thin upper and lower substrates which are combined with each other by soldering is attached on the upper surface of a PCB 7 having a common predetermined thickness.
  • the battery can be attached to the PCB by previously forming an adhesive layer on the lower surface of the battery, i.e., on the bottom of the lower substrate.
  • the battery since the battery is formed by combining the thin upper and lower substrates 1 and 2 and attaching the battery on a PCB having a relatively much greater thickness than that of the battery, the total thickness of the battery-included PCB according to the present invention shows no difference from the thickness of the PCB.
  • the total thickness of the layers forming a battery only excluding the upper and lower substrates is about 3 micrometers.
  • the nickel layer 8 as a negative terminal and the metal plate 5 as a positive terminal form a cathode and an anode, respectively.
  • the polymer layer 4 formed of polymer activates ion-conductivity.
  • the second hole 33 of the upper substrate 1 shown in FIG. 2 contacts the surface of the circumferential plate 51 connected to the surface forming the metal plate 5 and the anode material layer 6 of the lower substrate 2, while the first hole 31 of the upper substrate 1 contacts the position between the circumferential plate 51 and the metal plate 5 of the lower substrate 2.
  • the inner circumferential surfaces of the first and second holes 31 and 33 are formed of conductive metal. Accordingly, the second hole 33 of the upper substrate 1 and the surface of the metal plate 5 of the lower substrate 2 which forms the anode material layer 6 conduct electricity, and the first hole 31 is conductive with the nickel, lithium, and polymer layers 8, 3, and 4 formed on the lower surface of the upper substrate 1.
  • the electrical connection between the lower substrate 2 forming the anode and the upper substrate 1 forming the cathode can be made by the switch portion 14 for electrically connecting the first and second holes 31 and 33 of the upper substrate 1.
  • the switch portion 14 Any structure for the above switching operation is possible and it is not limited to the above structure of the switch portion 14.
  • the battery-included PCB according to the present invention can be structured as a rechargeable type.
  • the conventional lithium battery can be replaced by mounting a thin battery on a common PCB, thus simplifying the structure and reducing the number of parts.
  • the battery-included PCB of the present invention can be used for various electronic devices, especially for ones which devices that are required to be thin.
  • the battery used in the present invention is structured to prevent natural discharge compared to other battery type, the length of use thereof can be extended considerably.
  • PCB having a predetermined thickness it is possible to adopt the present invention to any other object which is required to be thin, instead of a PCB.
  • a battery according to the present invention additionally and form an adhesive layer on the bottom thereof, i.e., a sticker type, so that the battery can be easily attached to any products.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Primary Cells (AREA)
  • Battery Mounting, Suspending (AREA)
  • Battery Electrode And Active Subsutance (AREA)

Abstract

In a battery-included PCB, an anode is integrally formed by a lower substrate (2), a metal plate (5) formed on the lower substrate (2), and an anode material layer (6) coated on the metal plate (5). A cathode is integrally formed by an upper substrate (1) and a nickel layer (8), a lithium layer (3), and a polymer layer (4), deposited in order on the upper substrate (1). The metal plate (5) is mesh-shaped and has a circumferential plate (51) along the circumference of the metal plate (5) which is connected to the metal plate (5). The lithium layer (3) comprising the polymer layer (4) is formed to have a surface corresponding to the area of the metal plate (5). A circumferential plate (32) is formed along the circumference of the upper substrate (1). Therefore, since an ultra-thin battery is formed on a thin PCB, the battery-included PCB can be mounted on an ordinary PCB having a predetermined thickness, enabling manufacturing of thinner products.

Description

BATTERY-INCLUDED PCB
Technical Field
The present invention relates to a printed circuit board (PCB) which includes a battery.
Background Art
In a Christmas card sounding a melody, a battery is included inside the card. The battery is usually an alkali or mercury battery and installed on the upper surface of a PCB. Since many parts are needed to include the battery and the battery itself has a predetermined thickness, there is a limit in manufacturing a melody-generating card to be no greater than a particular thickness.
Also, since other parts of the battery have particular thicknesses due to structural reasons, it is difficult to reduce the thickness of the card without deteriorating the life or performance of the battery. Further, a manufacturing technology to reduce the thickness of a product is required not only for the Christmas card above but also for most electronic devices.
Disclosure of the Invention
Accordingly, to solve the above problems, it is an objective of the present invention to provide a battery-included PCB which can be mounted on an ordinary PCB substrate so that ultra-thin (about 3 micrometers) electronic devices can be manufactured. To achieve the above objective, there is provided a battery-included
PCB comprising: an anode portion integrally formed by a lower substrate, a metal plate formed on the lower substrate, and an anode material layer coated on the metal plate; and a cathode portion integrally formed by an upper substrate and a nickel layer, a lithium layer, and a polymer layer deposited in order on the upper substrate; wherein the metal plate is mesh- shaped and has a circumferential plate along the circumference of the metal plate which is connect to the metal plate, and the lithium layer comprising the polymer layer is formed to have a surface corresponding to the area of the metal plate and a circumferential plate is formed along the circumference of the upper substrate.
Brief Description of the Drawings
FIG. 1 is a sectional view showing the upper and lower substrates which include a battery according to the present invention;
FIG. 2 is a view showing a preferred embodiment of the present invention; and FIG. 3 is a perspective view showing the battery-included PCB according to the present invention which is mounted on an ordinary PCB having a predetermined thickness.
Best mode for carrying out the Invention Referring to FIG. 1 , a nickel (Ni) layer 8 is formed on the lower surface of an upper substrate 1 which forms a negative terminal layer. A lithium (Li) layer 3 is vacuum-deposited on the nickel layer 8. A conductive (ion-permissible) polymer layer 4 of an extremely thin film is preferably formed on the lithium layer 3. Here, the material of the polymer layer 4 is not limited to the above polymer material and other materials can be used in its place.
A lower substrate 2 disposed to face the upper substrate 1 has a metal plate 5 formed on the upper surface thereof. An anode material layer 6 including carbon or carbon-based compound is formed on the metal plate 5. The metal plate 5 which will be a positive terminal layer is formed to have a mesh shape.
FIG. 2 shows an example of the battery-included PCB according to the present invention which is applied to a melody card.
The metal plate 5 is formed to have a mesh-shaped, occupying most of the area at the center of the lower substrate 2. The anode material layer 6 on which anode material has already been formed is deposited on the metal plate 5. The mesh-shaped metal plate 5 is connected to a circumferential plate 51. The circumferential plate 51 is formed of a metal plate along the circumferential edge of the lower substrate 2, surrounding the area for the metal plate 5. A copper (Cu) thin film is deposited on the circumferential plate 51 where the anode material layer 6 is not formed. The circumferential plate 51 by being coated with lead is combined with the upper substrate 1 forming a seal. The lower substrate 2 forms the anode
(+)
The lower surface of the upper substrate 1 forming the cathode (-), facing the anode above, is shown at the upper right portion of FIG. 2. As shown in the drawing, the lithium layer 3 having the polymer layer 4 coated thereon occupies most of the area at the center of the upper substrate 1.
A first hole 31 is formed at one side of the upper substrate 1. A circumferential plate 32 formed of a thin copper film is formed along the circumferential edge of the upper substrate 1 , surrounding the area for the polymer layer 4. A second hole 33 having a surface area protruding inwardly is formed at one side portion of the circumferential plate 32, opposing the position of the first hole 31.
The circumferential plate 32 and the circumferential plate 51 of the lower substrate 2 are combined with one another, for example, by soldering. Meanwhile, an IC portion 11 including an IC is formed on the upper surface of the upper substrate 1. Also, an IC connecting portion 12, an LED chip 13 and a switch portion 14 commonly accompanying the IC are formed on the upper substrate 1.
FIG. 3 shows that a battery including the thin upper and lower substrates which are combined with each other by soldering is attached on the upper surface of a PCB 7 having a common predetermined thickness.
Here, the battery can be attached to the PCB by previously forming an adhesive layer on the lower surface of the battery, i.e., on the bottom of the lower substrate. As shown in the drawing, since the battery is formed by combining the thin upper and lower substrates 1 and 2 and attaching the battery on a PCB having a relatively much greater thickness than that of the battery, the total thickness of the battery-included PCB according to the present invention shows no difference from the thickness of the PCB.
Thus, there is an effect of mounting an extremely thin battery which provides numerous application opportunities to various products. Since the drawings above is for explanation of the present invention, an actual battery can be manufactured to be even thinner.
For reference, the total thickness of the layers forming a battery only excluding the upper and lower substrates is about 3 micrometers.
The operation of the battery-included PCB having the above structure is as follows.
The nickel layer 8 as a negative terminal and the metal plate 5 as a positive terminal form a cathode and an anode, respectively. The polymer layer 4 formed of polymer activates ion-conductivity.
As an electrical connection between the cathode and the anode, the second hole 33 of the upper substrate 1 shown in FIG. 2 contacts the surface of the circumferential plate 51 connected to the surface forming the metal plate 5 and the anode material layer 6 of the lower substrate 2, while the first hole 31 of the upper substrate 1 contacts the position between the circumferential plate 51 and the metal plate 5 of the lower substrate 2. The inner circumferential surfaces of the first and second holes 31 and 33 are formed of conductive metal. Accordingly, the second hole 33 of the upper substrate 1 and the surface of the metal plate 5 of the lower substrate 2 which forms the anode material layer 6 conduct electricity, and the first hole 31 is conductive with the nickel, lithium, and polymer layers 8, 3, and 4 formed on the lower surface of the upper substrate 1.
Therefore, the electrical connection between the lower substrate 2 forming the anode and the upper substrate 1 forming the cathode can be made by the switch portion 14 for electrically connecting the first and second holes 31 and 33 of the upper substrate 1. Any structure for the above switching operation is possible and it is not limited to the above structure of the switch portion 14.
Since the principle of charging and discharging by movement of ions in the structure shown in FIG. 1 is similar to that of a common battery, the description of the function and operation thereof will be omitted.
Industrial Applicability It is obvious that the battery-included PCB according to the present invention can be structured as a rechargeable type.
According to the above structure of the present invention, the conventional lithium battery can be replaced by mounting a thin battery on a common PCB, thus simplifying the structure and reducing the number of parts. The battery-included PCB of the present invention can be used for various electronic devices, especially for ones which devices that are required to be thin.
That is, in the present invention, since a battery can be integrally formed extremely thin on a PCB, there is an effect of usefulness in all PCB requiring mounting of a battery.
Also, since the battery used in the present invention is structured to prevent natural discharge compared to other battery type, the length of use thereof can be extended considerably.
It is noted that the present invention is not limited to the preferred embodiment described above, and it is apparent that variations and modifications by those skilled in the art can be effected within the spirit and scope of the present invention defined in the appended claims.
For example, although the present invention is applied to a typical
PCB having a predetermined thickness, it is possible to adopt the present invention to any other object which is required to be thin, instead of a PCB.
That is, it is possible to manufacture a battery according to the present invention additionally and form an adhesive layer on the bottom thereof, i.e., a sticker type, so that the battery can be easily attached to any products.

Claims

What is claimed is:
1. A battery-included PCB comprising: an anode portion integrally formed by a lower substrate (2), a metal plate (5) formed on said lower substrate (2), and an anode material layer (6) coated on said metal plate (5); and a cathode portion integrally formed by an upper substrate (1) and a nickel layer (8), a lithium layer (3), and a polymer layer (4) deposited in order on said upper substrate (1); wherein said metal plate (5) is mesh-shaped and has a circumferential plate (51) along the circumference of said metal plate (5) which is connect to said metal plate (5), and said lithium layer (3) comprising said polymer layer (4) is formed to have a surface corresponding to the area of said metal plate (5) and a circumferential plate (32) is formed along the circumference of said upper substrate (1).
2. The battery-included PCB as claimed in claim 1 , wherein said battery-included PCB is formed on a PCB substrate 7.
3. The battery-included PCB as claimed in claim 1 , wherein a first hole (31) is formed at one side of said lithium layer (3) which includes said polymer layer (4) and a second hole (33) is formed at said circumference plate (32) formed on the circumference of said upper substrate (1).
4. The battery-included PCB as claimed in claim 1 , wherein a circuit portion including an IC portion (11), an IC connecting portion (12), an
LED chip (13) provided on the upper surface of said upper substrate (1).
5. The battery-included PCB as claimed in claim 1 , wherein said circumference plate (51) of said lower substrate (2) and said circumference plate (32) of said upper substrate (1) are combined with each other forming a seal by a lead coating.
6. The battery-included PCB as claimed in any one of claims 1 through 5, wherein an adhesive layer is formed at the bottom of said lower plate (2).
PCT/KR1998/000389 1997-12-05 1998-12-01 Battery-included pcb WO1999030376A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1019970066335A KR100294240B1 (en) 1997-12-05 1997-12-05 PCB comprising a battery
KR1997/66335 1997-12-05

Publications (2)

Publication Number Publication Date
WO1999030376A2 true WO1999030376A2 (en) 1999-06-17
WO1999030376A3 WO1999030376A3 (en) 1999-12-09

Family

ID=19526567

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR1998/000389 WO1999030376A2 (en) 1997-12-05 1998-12-01 Battery-included pcb

Country Status (2)

Country Link
KR (1) KR100294240B1 (en)
WO (1) WO1999030376A2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004064095A1 (en) * 2003-01-14 2004-07-29 Perlos Oyj Electronic device
EP1601042A1 (en) * 2004-05-28 2005-11-30 Antig Technology Co., Ltd. Secondary battery comprising tanks made from printed circuit board material
EP1615287A1 (en) * 2004-07-05 2006-01-11 Antig Technology Co., Ltd. Secondary battery, and secondary battery matrix and multi-lamination secondary battery matrix having the same
EP1655794A2 (en) * 2004-11-03 2006-05-10 Antig Technology Co., Ltd. Double-electrode plate with electrical circuitry layer laminate and the secondary battery with the same
US7329473B2 (en) * 2004-05-14 2008-02-12 Antig Technology Co., Ltd. Secondary battery
CN108482149A (en) * 2018-03-22 2018-09-04 普汽新能(北京)科技有限公司 A method of assembling batteries of electric automobile group with high-low pressure integrated circuit board

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100754072B1 (en) * 2006-05-16 2007-08-31 삼성전기주식회사 Printed circuit board and manufacturing method of the same
KR101251666B1 (en) * 2006-12-04 2013-04-05 엘지이노텍 주식회사 Battery built-in printed circuit board and method for manufacturing the same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03238771A (en) * 1990-02-16 1991-10-24 Toyo Ink Mfg Co Ltd Thin type cell
US5181025A (en) * 1991-05-24 1993-01-19 The United States Of America As Represented By The Secretary Of The Air Force Conformal telemetry system
JPH06203826A (en) * 1992-08-12 1994-07-22 Yuasa Corp Thin battery and method for mounting same
JPH06314565A (en) * 1993-04-30 1994-11-08 Yuasa Corp Manufacture of thin battery
JPH0817179A (en) * 1994-06-28 1996-01-19 Sony Corp Battery incorporated in electronic equipment

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03238771A (en) * 1990-02-16 1991-10-24 Toyo Ink Mfg Co Ltd Thin type cell
US5181025A (en) * 1991-05-24 1993-01-19 The United States Of America As Represented By The Secretary Of The Air Force Conformal telemetry system
JPH06203826A (en) * 1992-08-12 1994-07-22 Yuasa Corp Thin battery and method for mounting same
JPH06314565A (en) * 1993-04-30 1994-11-08 Yuasa Corp Manufacture of thin battery
JPH0817179A (en) * 1994-06-28 1996-01-19 Sony Corp Battery incorporated in electronic equipment

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004064095A1 (en) * 2003-01-14 2004-07-29 Perlos Oyj Electronic device
US7329473B2 (en) * 2004-05-14 2008-02-12 Antig Technology Co., Ltd. Secondary battery
EP1601042A1 (en) * 2004-05-28 2005-11-30 Antig Technology Co., Ltd. Secondary battery comprising tanks made from printed circuit board material
EP1615287A1 (en) * 2004-07-05 2006-01-11 Antig Technology Co., Ltd. Secondary battery, and secondary battery matrix and multi-lamination secondary battery matrix having the same
EP1655794A2 (en) * 2004-11-03 2006-05-10 Antig Technology Co., Ltd. Double-electrode plate with electrical circuitry layer laminate and the secondary battery with the same
EP1655794A3 (en) * 2004-11-03 2008-06-04 Antig Technology Co., Ltd. Double-electrode plate with electrical circuitry layer laminate and the secondary battery with the same
CN108482149A (en) * 2018-03-22 2018-09-04 普汽新能(北京)科技有限公司 A method of assembling batteries of electric automobile group with high-low pressure integrated circuit board

Also Published As

Publication number Publication date
WO1999030376A3 (en) 1999-12-09
KR19990047806A (en) 1999-07-05
KR100294240B1 (en) 2001-07-12

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