CN209948111U

CN209948111U - Conductive connection structure

Info

Publication number: CN209948111U
Application number: CN201920930905.7U
Authority: CN
Inventors: 苏陟
Original assignee: Guangzhou Fangbang Electronics Co Ltd
Current assignee: Guangzhou Fangbang Electronics Co Ltd
Priority date: 2019-06-19
Filing date: 2019-06-19
Publication date: 2020-01-14
Anticipated expiration: 2029-06-19

Abstract

The utility model provides a conductive connection structure, including at least two-layer conducting layer, arbitrary adjacent two-layer be equipped with the interior gluey rete between the conducting layer, the conducting layer orientation the surface of interior gluey rete is for having the face of relief of convex part and concave part, and arbitrary adjacent two-layer the conducting layer passes through the convex part is connected. Compared with the prior art, the conductive connection structure has the advantages of simple manufacturing process, low production cost, good conductivity and the like.

Description

Conductive connection structure

Technical Field

The utility model relates to an electronic component encapsulates technical field, especially relates to an electrically conductive connection structure.

Background

With the development of electronic products towards miniaturization and high integration, the requirements of the packaging technology of electronic components and the manufacturing technology of printed circuit boards on interconnection materials become more and more severe, and the traditional interconnection materials cannot meet the requirements of environment and technology.

The conductive adhesive is an adhesive with certain conductive performance after being cured or dried, and the conductive adhesive becomes an ideal substitute of the traditional Sn-Pb solder as a new electronic material and has higher competitiveness. However, it is found that the conductive paste has not only a problem of poor conductive effect but also a problem of unstable connection performance during use.

In order to solve the above problems, a flexible connector is proposed in the art, which includes a first conductive layer, an insulating layer, and a second conductive layer stacked in sequence, and the first conductive layer and the second conductive layer are connected and conducted through a conductive hole formed in the insulating layer, so that an electronic component and a circuit board are electrically connected through the first conductive layer, the conductive hole, and the second conductive layer. However, the manufacturing process of the flexible connector is complex, and a large amount of time cost and labor cost are required to be consumed — in order to enable the first conductive layer and the second conductive layer to be electrically connected, when manufacturing, firstly, mechanical drilling, laser drilling or stamping and other manners are required to be adopted to form connecting holes for connecting copper foils on two sides on the flexible copper-clad plate, and then, hole metallization is required to be performed on the connecting holes to form conductive holes.

Therefore, it is necessary to design an interconnection structure with good conductive effect, stable connection performance, simple manufacturing process and low cost.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem, the utility model provides a conductive connection structure, this conductive connection structure are used for the erection joint of circuit board, have simple manufacture process, low in production cost, electric conductive property advantage such as good.

Based on the structure, the utility model provides a conductive connection structure, which comprises at least two conductive layers, wherein an inner glue film layer is arranged between any two adjacent conductive layers, and the surface of the conductive layer facing to the inner glue film layer is a relief surface with convex parts and concave parts;

and respectively marking any two adjacent conductive layers as a first conductive layer and a second conductive layer, wherein at least one convex part of the first conductive layer extends into the inner glue film layer between the two conductive layers and is connected with the relief surface of the second conductive layer, and at least one convex part of the second conductive layer extends into the inner glue film layer between the two conductive layers and is connected with the relief surface of the first conductive layer.

Preferably, the shape of each of the convex portions is the same or different, and the size of each of the concave portions is the same or different.

Preferably, the inner glue film layer is made of thermosetting glue or thermoplastic glue.

Preferably, the conductive layer located at the outermost side of the conductive connection structure is referred to as an outer conductive layer, and a surface of the outer conductive layer facing away from the inner adhesive film layer is also the relief surface.

Preferably, an outer adhesive film layer is further arranged on one side of the outer conductive layer, which faces away from the inner adhesive film layer, and the convex part of the outer conductive layer, which faces away from the inner adhesive film layer, is hidden in the outer adhesive film layer or extends into the outer adhesive film layer and is exposed.

Preferably, the convex part of the outer conductive layer, which faces away from the inner adhesive film layer, is hidden in the outer adhesive film layer, and the thickness of the outer adhesive film layer is smaller than the average height of the convex part.

Preferably, the outer adhesive film layer is made of pressure-sensitive adhesive, heat-curable adhesive or thermoplastic adhesive.

Preferably, the height of the projections is in the range of 0.2 to 30 μm.

Preferably, the relief surface is further provided with a convex portion, and the convex portion is distributed on the convex portion and/or the concave portion.

Preferably, the convex part is in a regular or irregular solid geometry.

Preferably, the shape of the convex part is sharp angle shape, inverted cone shape, particle shape, dendritic shape, column shape or block shape.

Preferably, the material of the protrusion is one or a combination of more of copper, nickel, tin, lead, chromium, molybdenum, zinc, gold, and silver.

Preferably, the height of the protrusions themselves is in the range of 0.2 to 15 μm.

Preferably, the number of the convex portions on the same relief surface is two or more, the shapes of the convex portions are the same or different, and the sizes of the convex portions are the same or different.

Implement the embodiment of the utility model provides a, following beneficial effect has:

on the one hand, compare with traditional welding and bonding, the embodiment of the utility model provides a conductive connection structure accessible presss from both sides tightly between two circuit boards or between circuit board and ground connection metal sheet, and make the two-layer conducting layer in the outside be connected with two circuit boards or circuit board and ground connection metal sheet respectively, with this circuit that realizes between two circuit boards or between circuit board and the ground connection metal sheet switches on, not only can realize the dismouting repeatedly of circuit board from this, the maintenance of the circuit board of being convenient for, reduce the manufacturing cost of electronic product, can also be when realizing electrical connection, guarantee the installation reliability of circuit board.

On the other hand, compared with the existing flexible connector, the conductive connection structure provided by the utility model has no conductive hole, and when in manufacture, drilling and hole metallization are not needed, and only two conductive layers are extruded in opposite directions, so that the manufacture is more convenient and faster, and the cost is lower; moreover, the two conductive layers are electrically connected by the convex part extending into the inner glue film layer, so the conductive connection structure provided by the utility model has better conductive effect and more stable connection performance; and because the inner rubber film layer has certain elasticity and anti deformability, can play the effect of buffering, thereby, the utility model provides a conductive connection structure is difficult for taking place to warp when the dismouting repeatedly, has guaranteed electric connection's reliability between two block circuit boards or between circuit board and the ground connection metal sheet.

Drawings

Fig. 1 is a schematic cross-sectional view of a conductive connection structure according to an embodiment of the present invention;

fig. 2 is a schematic cross-sectional view of a conductive connection structure using three conductive layers according to an embodiment of the present invention;

fig. 3 is a schematic cross-sectional view of a conductive connection structure provided with an outer adhesive film layer according to an embodiment of the present invention;

fig. 4 is a schematic cross-sectional view of a conductive connection structure provided with a protruding portion according to an embodiment of the present invention;

fig. 5 is a schematic cross-sectional view of a conductive connection structure using a double conductive layer according to an embodiment of the present invention.

Description of reference numerals:

1. a conductive layer; 1a, a first conductive layer; 1b, a second conductive layer; 101. an outer conductive layer; 102. an inner conductive layer; 11. a convex portion; 11a, a first convex portion; 11b, a second convex portion; 11c, a third convex portion; 11d, a fourth convex portion; 12. a recess; 12a, a first recess; 12b, a second recess; 12c, a third recess; 12d, a fourth recess; 13. a boss portion; 13a, a first boss; 13b, a second boss; 13c, a third boss; 13d, a fourth boss; 2. an inner glue film layer; 3. an outer adhesive film layer; 3a, a first outer adhesive film layer; 3b and a second outer adhesive film layer.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.

As shown in fig. 1, an embodiment of the present invention provides a conductive connection structure, which mainly includes at least two conductive layers 1, an inner adhesive film layer 2 is disposed between any two adjacent conductive layers 1, and a surface of the conductive layer 1 facing the inner adhesive film layer 2 is a relief surface having a convex portion 11 and a concave portion 12; any two adjacent conductive layers 1 are referred to as a first conductive layer 1a and a second conductive layer 1b, respectively, at least one convex portion 11 of the first conductive layer 1a extends into the internal glue film layer 2 between the two conductive layers 1 and is connected to the relief surface of the second conductive layer 1b, and similarly, at least one convex portion 11 of the second conductive layer 1b extends into the internal glue film layer 2 between the two conductive layers 1 and is connected to the relief surface of the first conductive layer 1a, that is, the convex portion 11 may be connected to the convex portion 11, the convex portion 11 may be connected to the concave portion 12, or the convex portion 11 may be connected to the transition between the convex portion 11 and the concave portion 12.

Based on the structure, the embodiment of the utility model provides a conductive connection structure has following beneficial effect:

on the one hand, compare with traditional welding and bonding, the embodiment of the utility model provides a conductive connection structure accessible presss from both sides tightly between two circuit boards or between circuit board and ground connection metal sheet, and make two-layer conducting layer 1 in the outside be connected with two circuit boards or circuit board and ground connection metal sheet respectively, with this circuit between realizing two circuit boards or between circuit board and the ground connection metal sheet switches on, not only can realize the dismouting repeatedly of circuit board from this, the maintenance of the circuit board of being convenient for, reduce the manufacturing cost of electronic product, can also be when realizing electrical connection, guarantee the installation reliability of circuit board.

On the other hand, compared with the existing flexible connector, the conductive connection structure provided by the utility model has no conductive hole, and when in manufacture, drilling and hole metallization are not needed, and only two conductive layers 1 are required to be oppositely extruded, so that the manufacture is more convenient and faster, and the cost is lower; moreover, because the two conductive layers 1 are electrically connected by the convex part 11 extending into the inner glue film layer 2, the conductive connection structure provided by the utility model has better conductive effect and more stable connection performance; and because inner rubber coating 2 has certain elasticity and anti deformability, can play the effect of buffering, thereby, the utility model provides a conductive connection structure is difficult for taking place to warp when the dismouting repeatedly, has guaranteed electric connection's reliability between two block boards or between circuit board and the ground connection metal sheet.

Alternatively, as shown in fig. 1, the projections 11 may have the same or different shapes and the recesses 12 may have the same or different sizes, that is, the curvature, height, shape, etc. of each projection 11 may be different and the curvature, depth, shape, etc. of each recess 12 may be different. In the present embodiment, the range of the height H of the projections 11 itself is preferably 0.2 to 30 μm. The relief surface formed by the protrusions 11 and the recesses 12 may be a regular and periodic corrugated pattern or an irregular and disordered corrugated pattern, but it is understood that only one of these patterns is illustrated here, and other similar shapes are also within the scope of the present application, and are not illustrated here.

Alternatively, as shown in fig. 1 and fig. 2, the conductive layer 1 located at the outermost side of the conductive connection structure is referred to as an outer conductive layer 101, and the outer conductive layer 101 is generally provided with two layers; marking the rest of the conductive layers 1 as inner conductive layers 102, and then all the inner conductive layers 102 are positioned between the two outer conductive layers 101; in order to further improve the conductive effect of this electrically conductive connection structure, the surface of two-layer or wherein arbitrary one layer outer conducting layer 101 outside the gum rete 2 that is dorsad is the face of rising and lying prostrate equally, works as on this basis the utility model discloses when electrically conductive connection structure that provides presss from both sides tightly between circuit board and ground connection metal sheet, outer conducting layer 101 outside the gum rete 2 convex part 11 can guarantee that conducting layer 1 and the ground plane of circuit board or ground connection metal sheet form more effective electrical connection, thereby, the utility model provides an electrically conductive connection structure can derive the static charge of gathering on the circuit board effectively, avoids the static charge to gather on the circuit board and form the interference source and influence the transmission of signal.

Optionally, as shown in fig. 3, an outer adhesive film layer 3 is further disposed on a side of the outer conductive layer 101 facing away from the inner adhesive film layer 2, and for the protrusion 11 of the outer conductive layer 101 facing away from the inner adhesive film layer 2, the protrusion is hidden in the outer adhesive film layer 3 or extends into and is exposed from the outer adhesive film layer 3, in this embodiment, the protrusion 11 of the outer conductive layer 101 facing away from the inner adhesive film layer 2 is hidden in the outer adhesive film layer 3, and the thickness of the outer adhesive film layer 3 is smaller than the average height of the protrusion 11. Based on this, like the inner glue film layer 2, the outer glue film layer 3 also has certain elasticity and deformation resistance, and can play a role in buffering, so that when the conductive connection structure is clamped between two circuit boards or between a circuit board and a grounding metal plate, due to the elastic force of the outer glue film layer 3 and the inner glue film layer 2, a more reliable electrical connection can be formed between the convex part 11 of the outer conductive layer 101, which is back to the inner glue film layer 2, and the circuit board or the grounding metal plate.

Optionally, as shown in fig. 4, in order to further improve the reliability of the electrical connection between two adjacent conductive layers 1 and the electrical conductivity of the conductive connection structure, a protruding portion 13 is further disposed on the undulating surface of the conductive layer 1, the protruding portion 13 is disposed on both the protruding portion 11 and the recessed portion 12, and if the outer conductive layer 101 is further disposed on the side facing away from the inner adhesive film layer 2, the protruding portion 13 on the undulating surface of the outer conductive layer 101 facing the outer adhesive film layer 3 is hidden in the outer adhesive film layer 3 or protrudes into and is exposed from the outer adhesive film layer 3. Based on this, the protruding portion 13 can increase the contact area of the two adjacent conductive layers 1 and the contact area of the conductive layer 1 and the ground layer or the ground metal plate of the circuit board, and simultaneously increase the friction force between the two adjacent conductive layers 1 and the friction force between the conductive layer 1 and the ground layer or the ground metal plate of the circuit board, thereby achieving the purpose of improving the electrical connection reliability and the conductive performance. It should be noted that the above technical effect can also be produced when the protruding portions 13 are distributed only on the protruding portions 11 or the recessed portions 12.

Specifically, as shown in fig. 4, the protruding portions 13 have a regular or irregular solid geometry, such as an acute angle shape, an inverted cone shape, a granular shape, a dendritic shape, a columnar shape, a block shape, and the like, and two or more protruding portions 13 located on the same relief surface are provided, the shape of each protruding portion 13 may be the same or different, and the size of each protruding portion 13 may also be the same or different, that is, the shape of two or more protruding portions 13 may be one or more of an acute angle shape, an inverted cone shape, a granular shape, a dendritic shape, a columnar shape, and a block shape, and the size of two or more protruding portions 13 having the same shape may be different. In the present embodiment, the range of the height h of the convex portion 13 itself is preferably 0.2 to 15 μm. In addition, two or more protrusions 13 are continuously or discontinuously distributed, and when the two or more protrusions 13 are in the shape of an acute angle and continuously distributed, a regular and periodic three-dimensional insection pattern or an irregular and disordered three-dimensional insection pattern can be formed.

Alternatively, the conductive layer 1 is preferably made of copper, and the protruding portion 13 is preferably made of a combination of one or more of copper, nickel, lead, chromium, molybdenum, zinc, tin, gold, and silver, that is, the protruding portion 13 may be made of a single component, that is, one of copper, nickel, tin, lead, chromium, molybdenum, zinc, gold, and silver, or may be made of one or more of copper, nickel, tin, lead, chromium, molybdenum, zinc, gold, and silver as a main body, and then one or more of metals other than the main body is formed on the surface of the main body by one or more of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition, and the like, thereby forming the protruding portion 13 made of a composite material. In the present embodiment, the bump 13 is preferably made of a composite material mainly made of copper, and one or more metals selected from nickel, tin, lead, chromium, molybdenum, zinc, gold, and silver are formed on the surface of copper, because the bump 13 made of copper alone is easily oxidized or worn, and the nickel, tin, gold, and silver formed on the surface of copper can improve the corrosion resistance and wear resistance of the bump 13, and can further prolong the service life of the conductive connection structure.

Optionally, in order to prevent the adjacent two conductive layers 1 from separating, the material of the inner glue film layer 2 is preferably a heat-curable glue or a thermoplastic glue with good stability, such as thermoplastic polyimide, modified thermoplastic polyimide, acrylic acid, modified acrylic acid, epoxy resin, modified epoxy resin, and the like. Different from the inner glue film layer 2, according to the practical application of the conductive connection structure, the material of the outer glue film layer 3 can be a pressure-sensitive adhesive which can be repeatedly peeled off, such as acrylic, silica gel and polyurethane pressure-sensitive adhesives, or a heat-curable adhesive or a thermoplastic adhesive which has good stability, and when the outer glue film layer 3 and the inner glue film layer 2 are both made of the heat-curable adhesive or the thermoplastic adhesive, the two can be different.

In order to make the features and advantages of the conductive connection structure provided by the embodiment of the present invention more comprehensible, the conductive connection structure using the double-layer conductive layer 1 will be further described in detail with reference to fig. 5.

As shown in fig. 5, the conductive connection structure includes a first conductive layer 1a, an inner glue film layer 2, and a second conductive layer 1b stacked in sequence, and it is obvious that the first conductive layer 1a and the second conductive layer 1b are outer conductive layers 101 of the conductive connection structure, and the conductive connection structure does not have an inner conductive layer 102. The surface of the first conductive layer 1a facing the inner glue film layer 2 is a relief surface and comprises a first convex portion 11a and a first concave portion 12a, the surface of the second conductive layer 1b facing the inner glue film layer 2 is also a relief surface and comprises a second convex portion 11b and a second concave portion 12b, the first convex portion 11a extends into the inner glue film layer 2 and is connected with the second concave portion 12b, and the second convex portion 11b extends into the inner glue film layer 2 and is connected with the first concave portion 12 a. Thereby, an electrical connection is established between the first conductive layer 1a and the second conductive layer 1 b.

Further, as shown in fig. 5, the surface of the first conductive layer 1a facing away from the inner adhesive film layer 2 is also a relief surface, which includes a third convex portion 11c and a third concave portion 12c, and a first outer adhesive film layer 3a is further disposed on the side of the first conductive layer 1a facing away from the inner adhesive film layer 2, and the third convex portion 11c is hidden in the first outer adhesive film layer 3 a; similarly, the surface of the second conductive layer 1b facing away from the inner adhesive film layer 2 is also a relief surface, which includes a fourth convex portion 11d and a fourth concave portion 12d, and a second outer adhesive film layer 3b is further disposed on the side of the second conductive layer 1b facing away from the inner adhesive film layer 2, and the fourth convex portion 11d is hidden in the second outer adhesive film layer 3 b.

Further, as shown in fig. 5, a first protruding portion 13a is disposed on a relief surface of the first conductive layer 1a facing the inner glue film layer 2, and the first protruding portion 13a is distributed on both the first protruding portion 11a and the first recessed portion 12 a; similarly, the second conductive layer 1b has a second protruding portion 13b on the undulation surface facing the inner film layer 2, and the second protruding portion 13b is distributed in both the second protruding portion 11b and the second recessed portion 12 b.

Furthermore, as shown in fig. 5, a third protrusion 13c is disposed on the relief surface of the first conductive layer 1a facing away from the inner adhesive film layer 2, the third protrusion 13c is distributed on the third protrusion 11c and the third recess 12c, and the third protrusion 13c is hidden in the first outer adhesive film layer 3 a; similarly, a fourth protrusion 13d is disposed on the undulation surface of the second conductive layer 1b facing away from the inner adhesive film layer 2, the fourth protrusion 13d is distributed in the fourth protrusion 11d and the fourth recess 12d, and the fourth protrusion 13d is hidden in the second outer adhesive film layer 3 b.

Based on the above structure, when the conductive connection structure is clamped between two circuit boards or between a circuit board and a grounding metal plate, the static charge on the circuit board on the same side as the first conductive layer 1a is conducted to the circuit board or the grounding metal plate on the same side as the second conductive layer 1b through the third protruding part 13c, the first conductive layer 1a, the first protruding part 13a, the second protruding part 13b, the second conductive layer 1b and the fourth protruding part 13d in sequence, so as to realize the transfer of the static charge.

To sum up, the utility model provides a conductive connection structure, including at least two-layer conducting layer 1, be equipped with interior glued membrane layer 2 between arbitrary adjacent two-layer conducting layer 1, conducting layer 1 is towards the surface of having the surface of interior glued membrane layer 2 for having convex part 11 and concave part 12, and arbitrary adjacent two-layer conducting layer 1 is connected through convex part 11. Compared with the prior art, the conductive connection structure has the advantages of simple manufacturing process, low production cost, good conductivity and the like.

It should be understood that the terms "first", "second", etc. are used herein to describe various information, but the information should not be limited to these terms, and these terms are only used to distinguish one type of information from another. For example, "first" information may also be referred to as "second" information, and similarly, "second" information may also be referred to as "first" information, without departing from the scope of the present invention.

The foregoing is a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and variations can be made without departing from the principle of the present invention, and these modifications and variations are also considered as the protection scope of the present invention.

Claims

1. A conductive connection structure is characterized by comprising at least two conductive layers, wherein an inner glue film layer is arranged between any two adjacent conductive layers, and the surface of each conductive layer facing the inner glue film layer is a relief surface with convex parts and concave parts;

2. The conductive connection structure according to claim 1, wherein the shape of each of the convex portions is the same or different, and the size of each of the concave portions is the same or different.

3. The conductive connection structure of claim 1, wherein the inner adhesive film layer is made of thermosetting adhesive or thermoplastic adhesive.

4. The conductive connection structure according to claim 1, wherein the conductive layer located at the outermost side of the conductive connection structure is referred to as an outer conductive layer, and a surface of the outer conductive layer facing away from the inner adhesive film layer is also the relief surface.

5. The structure of claim 4, wherein an outer adhesive film layer is further disposed on a side of the outer conductive layer opposite to the inner adhesive film layer, and the convex portion of the outer conductive layer opposite to the inner adhesive film layer is hidden in the outer adhesive film layer or extends into the outer adhesive film layer and is exposed.

6. The structure of claim 5, wherein the convex portion of the outer conductive layer facing away from the inner adhesive film layer is hidden in the outer adhesive film layer, and the thickness of the outer adhesive film layer is smaller than the average height of the convex portion.

7. The structure of claim 5, wherein the outer adhesive layer is made of a pressure-sensitive adhesive, a heat-curable adhesive, or a thermoplastic adhesive.

8. The conductive connection structure according to claim 1, wherein the height of the convex portion itself is in the range of 0.2 to 30 μm.

9. The conductive connection structure according to claim 1, wherein the relief surface is further provided with a convex portion, and the convex portion is distributed on the convex portion and/or the concave portion.

10. The conductive connection structure according to claim 9, wherein the convex portion has a regular or irregular solid geometry.

11. The conductive connection structure according to claim 10, wherein the shape of the convex portion is a pointed angle, an inverted cone, a granular shape, a dendritic shape, a columnar shape, or a block shape.

12. The conductive connection structure of claim 9, wherein the material of the bump is one or more of copper, nickel, tin, lead, chromium, molybdenum, zinc, gold, and silver.

13. The conductive connection structure according to claim 9, wherein the height of the bump itself is in the range of 0.2 to 15 μm.

14. The electrically conductive connection structure according to claim 9, wherein the protrusions on the same undulating surface are provided in two or more numbers, the shapes of the protrusions are the same or different, and the sizes of the protrusions are the same or different.