CN110783742A - Connector and manufacturing method - Google Patents
Connector and manufacturing method Download PDFInfo
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- CN110783742A CN110783742A CN201811329978.7A CN201811329978A CN110783742A CN 110783742 A CN110783742 A CN 110783742A CN 201811329978 A CN201811329978 A CN 201811329978A CN 110783742 A CN110783742 A CN 110783742A
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- clad laminate
- forming
- conductive
- layer
- copper clad
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
Abstract
The invention provides a connector, which comprises an insulator, a first conducting layer arranged on one side surface of the insulator, and a second conducting layer arranged on the other side surface of the insulator, wherein a conducting medium for connecting the first conducting layer and the second conducting layer is also arranged on the insulator, the surfaces of the first conducting layer or/and the second conducting layer are/is provided with a convex part, and the surface of the convex part is a regular or irregular arc-shaped surface. Compared with the prior art, the connector has the advantages of repeated disassembly and assembly, good conductivity and the like. The invention also provides a manufacturing method of the connector, which has the advantages of simple operation, easy realization and the like.
Description
Technical Field
The invention relates to the technical field of electric connectors, in particular to a connector and a manufacturing method thereof.
Background
The conductive adhesive is an adhesive which has certain conductivity after being cured or dried. It can connect multiple conductive materials together to form an electrical path between the connected materials. In the electronic industry, conductive adhesive has become an indispensable new material. However, the conductive paste still has several problems:
firstly, if too many particles and few glue are arranged in the conductive glue to ensure the electric connection, the bonding performance cannot be ensured, and the conductive glue is easy to fall off; if the particles are too few and the adhesive is too much to ensure the bonding performance, the resistance is large and the electrical connection performance is not good.
The volume or the shape of the base body of the conductive adhesive is easy to change or jump due to the influence of factors such as stress, climate and the like, so that the stacking state of the conductive particles inside the conductive adhesive is easy to change, the conduction effect of the conductive adhesive and the grounding layer of the circuit board is not ideal, and the static charge gathered on the circuit board cannot be well led out, so that the static charge is gathered on the circuit board to form an interference source, and the transmission of signals is influenced.
Disclosure of Invention
In order to solve the technical problems, the invention provides a connector and a manufacturing method thereof, wherein the connector is used for mounting and connecting a circuit board, has the advantages of repeated disassembly and assembly, good conductive performance and the like, and is simple in manufacturing method and easy to realize.
Based on the above, the invention provides a connector, which comprises an insulator, a first conductive layer arranged on one side surface of the insulator, and a second conductive layer arranged on the other side surface of the insulator, wherein the insulator is further provided with a conductive medium for connecting the first conductive layer and the second conductive layer, the surfaces of the first conductive layer or/and the second conductive layer are provided with protrusions, and the surfaces of the protrusions are regular or irregular arc-shaped surfaces.
Preferably, two or more protrusions are provided on the surface of the first conductive layer or/and the second conductive layer, the shape of each protrusion is the same or different, the size of each protrusion is the same or different, and the two or more protrusions are continuously or discontinuously distributed on the surface of the first conductive layer or/and the second conductive layer.
Preferably, the surface of the first conductive layer or/and the second conductive layer is a rough surface.
Preferably, the surface of the first conductive layer or/and the second conductive layer is a flat surface.
Preferably, the material of the protrusion is one or a combination of more of copper, nickel, tin, lead, chromium, molybdenum, zinc, gold, and silver.
Preferably, the protruding portion is provided with an adhesive film layer, and the protruding portion is hidden in the adhesive film layer or penetrates through the adhesive film layer and is exposed.
Preferably, the insulator is provided with a connection hole for connecting the first conductive layer and the second conductive layer, and the conductive medium is provided in the connection hole.
Preferably, the conductive medium fills the connection hole, or the conductive medium is attached to a hole wall of the connection hole to form a conductive hole.
Preferably, two or more connection holes are provided in the insulator.
Preferably, the material of the insulator is one or a combination of more of polyimide, thermoplastic polyimide, modified epoxy resin, modified acrylic resin, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyphenylene, polyvinyl chloride, polysulfone, polyphenylene sulfide, polyether ether ketone, polyphenylene oxide, polytetrafluoroethylene, liquid crystal polymer, and polyoxamide.
The invention also provides a manufacturing method of the connector, which comprises the following steps:
manufacturing a flexible copper clad laminate;
forming a connecting hole on the flexible copper clad laminate;
and forming a conductive medium in the connecting hole to enable the connecting hole to have conductivity, and forming a convex part on the surface of the copper foil on at least one side of the flexible copper clad laminate.
In the manufacturing method of the connector, the connecting holes for connecting the copper foils on two sides are formed on the flexible copper clad laminate by adopting a mechanical drilling, laser drilling or stamping mode.
In the manufacturing method of the connector, the forming of the conductive medium in the connecting hole and the forming of the convex part on the surface of the copper foil on at least one side of the flexible copper clad laminate specifically include:
depositing a layer of thin conductive medium on the hole wall of the connecting hole through chemical reaction, and then increasing the thickness of the conductive medium on the hole wall and forming a conductive hole by adopting one or more of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition and the like, and meanwhile, forming the convex part on the surface of the copper foil on at least one side of the flexible copper clad laminate.
Or a layer of thin conductive medium is deposited on the hole wall of the connecting hole through chemical reaction, and then one or more of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition and the like are adopted to fill the connecting hole with the conductive medium, and meanwhile, the convex part is formed on the surface of the copper foil on at least one side of the flexible copper clad laminate.
In the manufacturing method of the connector, after the convex part is formed on the surface of the copper foil on at least one side of the flexible copper clad laminate, the method further comprises the following steps: forming an adhesive film layer on the surface of the copper foil of the flexible copper clad laminate forming the bulge, and specifically comprising:
coating the adhesive film layer on a release film, and then transferring the adhesive film layer to the surface of the copper foil of the flexible copper clad laminate forming the bulge part in a pressing manner through the release film;
or directly coating the adhesive film layer on the surface of the copper foil of the flexible copper clad laminate on which the bulge part is formed.
The invention also provides a manufacturing method of the second connector, which comprises the following steps:
manufacturing a flexible copper clad laminate;
forming a connecting hole on the flexible copper clad laminate;
forming a conductive medium in the connection hole to make the connection hole conductive;
and forming a convex part on the surface of the copper foil on at least one side of the flexible copper clad laminate.
In the manufacturing method of the connector, the connecting holes for connecting the copper foils on two sides are formed on the flexible copper clad laminate by adopting a mechanical drilling, laser drilling or stamping mode.
In the above method for manufacturing a connector, forming a conductive medium in the connection hole specifically includes:
depositing a layer of thin conductive medium on the hole wall of the connecting hole through chemical reaction, and then increasing the thickness of the conductive medium on the hole wall and forming a conductive hole by adopting one or more of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition and the like;
or depositing a layer of thin conductive medium on the hole wall of the connecting hole through chemical reaction, and filling the connecting hole with the conductive medium by adopting one or more of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition and the like.
In the manufacturing method of the connector, the bulge is formed on the surface of the copper foil on at least one side of the flexible copper clad laminate by adopting one or more of the modes of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition and the like.
In the manufacturing method of the connector, after the convex part is formed on the surface of the copper foil on at least one side of the flexible copper clad laminate, the method further comprises the following steps: forming an adhesive film layer on the surface of the copper foil of the flexible copper clad laminate forming the bulge, and specifically comprising:
coating the adhesive film layer on a release film, and then transferring the adhesive film layer to the surface of the copper foil of the flexible copper clad laminate forming the bulge part in a pressing manner through the release film;
or directly coating the adhesive film layer on the surface of the copper foil of the flexible copper clad laminate on which the bulge part is formed.
The invention also provides a manufacturing method of the third connector, which comprises the following steps:
manufacturing a flexible copper clad laminate;
forming a convex part on the surface of the copper foil on at least one side of the flexible copper clad laminate;
forming a connecting hole on the flexible copper clad laminate;
a conductive medium is formed in the connection hole to make the connection hole conductive.
In the manufacturing method of the connector, the bulge is formed on the surface of the copper foil on at least one side of the flexible copper clad laminate by adopting one or more of the modes of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition and the like.
In the manufacturing method of the connector, the connecting holes for connecting the copper foils on two sides are formed on the flexible copper clad laminate by adopting a mechanical drilling, laser drilling or stamping mode.
In the above method for manufacturing a connector, forming a conductive medium in the connection hole specifically includes:
depositing a layer of thin conductive medium on the hole wall of the connecting hole through chemical reaction, and then increasing the thickness of the conductive medium on the hole wall and forming a conductive hole by adopting one or more of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition and the like;
or depositing a layer of thin conductive medium on the hole wall of the connecting hole through chemical reaction, and filling the connecting hole with the conductive medium by adopting one or more of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition and the like.
In the above method for manufacturing a connector, after forming a conductive medium in the connection hole, the method further includes: forming an adhesive film layer on the surface of the copper foil of the flexible copper clad laminate forming the bulge, and specifically comprising:
coating the adhesive film layer on a release film, and then transferring the adhesive film layer to the surface of the copper foil of the flexible copper clad laminate forming the bulge part in a pressing manner through the release film;
or directly coating the adhesive film layer on the surface of the copper foil of the flexible copper clad laminate on which the bulge part is formed.
The embodiment of the invention has the following beneficial effects:
the connector provided by the embodiment of the invention comprises an insulator, a first conducting layer arranged on one side surface of the insulator, and a second conducting layer arranged on the other side surface of the insulator, wherein a conducting medium for connecting the first conducting layer and the second conducting layer is further arranged on the insulator, the surfaces of the first conducting layer or/and the second conducting layer are/is provided with a convex part, and the surface of the convex part is a regular or irregular arc-shaped surface. Based on the above structure, on one hand, the connector provided by the embodiment of the invention can realize circuit conduction by clamping between two circuit boards or between a circuit board and a grounding metal plate and attaching the conductive layer to the circuit board or the grounding metal plate, so that compared with the traditional welding and bonding, the connector can realize repeated assembly and disassembly of the circuit board, is convenient for maintaining the circuit board, reduces the manufacturing cost of electronic products, and can ensure the installation reliability of the circuit board while realizing effective electric connection. On the other hand, when the connector provided by the embodiment of the invention is clamped between the circuit board and the grounding metal plate, the protruding part can ensure that the conductive layer and the grounding layer of the circuit board and the grounding metal plate form effective electrical connection, so that the connector can effectively lead out static charges accumulated on the circuit board, and the static charges are prevented from accumulating on the circuit board to form an interference source to influence signal transmission.
The invention also provides a manufacturing method of the connector, which has the advantages of simple operation, easy realization and the like.
Drawings
Fig. 1 is a schematic cross-sectional view of a connector according to a first embodiment of the present invention;
FIG. 2 is an enlarged view of area I of FIG. 1;
FIG. 3 is a partial view of a first conductive layer according to a first embodiment of the present invention with a rough surface;
fig. 4 is a schematic cross-sectional view illustrating a connection hole filled with a conductive medium according to a first embodiment of the present invention;
fig. 5 is a schematic cross-sectional view of a connector according to a second embodiment of the present invention.
Description of reference numerals:
10. insulator, 11, first conducting layer, 12, second conducting layer, 13, conducting medium, 14, lug boss, 15, conducting hole, 16, the glued membrane layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example one
As shown in fig. 1, an embodiment of the present invention provides a connector, which mainly includes an insulator 10, a first conductive layer 11 disposed on one side surface of the insulator 10, and a second conductive layer 12 disposed on the other side surface of the insulator 10, wherein a conductive medium 13 connecting the first conductive layer 11 and the second conductive layer 12 is further disposed on the insulator 10, a protrusion 14 is disposed on a surface of the first conductive layer 11 and a surface of the second conductive layer 12, and a surface of the protrusion 14 is a regular or irregular arc surface.
Specifically, as shown in fig. 1, the surfaces of the first conductor 11 and the second conductor 12 are provided with a plurality of protrusions 14, the shape of each protrusion 14 may be the same or different, and the size of each protrusion 14 may be the same or different, that is, the radian, height, edge profile shape, and the like of each protrusion 14 are different. The plurality of protrusions 14 are continuously or discontinuously distributed on the surface of the first conductor 11 or/and the second conductor 12, and when the plurality of protrusions 14 are continuously distributed, the plurality of protrusions 14 form a regular, periodic corrugated pattern, or an irregular, disordered corrugated pattern. Of course, only one of them is listed here, and other combinations of similar shapes are also within the scope of protection of the present application, and are not listed here.
Based on the above structure, on one hand, the connector provided in the embodiment of the present invention can be clamped between two circuit boards or between a circuit board and a grounding metal plate, and the first conductive layer 11 and the second conductive layer 12 are respectively attached to the circuit board or the grounding metal plate, so as to achieve circuit conduction between the two circuit boards or between the circuit board and the grounding metal plate. On the other hand, when the connector provided by the embodiment of the invention is clamped between the circuit board and the grounding metal plate, the protruding portion 14 can ensure that the first conductive layer 11 and the second conductive layer 12 are respectively and effectively electrically connected with the grounding layer of the circuit board and the grounding metal plate, so that the connector can effectively lead out static charges accumulated on the circuit board, and the static charges are prevented from accumulating on the circuit board to form an interference source to influence signal transmission.
Alternatively, as shown in fig. 2 to 3, the surfaces of the first conductive layer 11 and the second conductive layer 12 may be flat surfaces or rough surfaces. The flat surface and the rough surface referred to herein mean surfaces of the first conductive layer 11 and the second conductive layer 12 where the protruding portion 14 is located, that is, a reference surface where the protruding portion 14 is located, and are not a plane formed by two or more protruding portions 14. When the surfaces of the first conductive layer 11 and the second conductive layer 12 are rough surfaces, they include concave portions and convex portions, the convex portions 14 are distributed over both the concave portions and the convex portions, and the sum of the height H of any one convex portion and the height H of the convex portion 14 itself on the convex portion is also 1 to 30 μm. Of course, the height H of the convex portion 14 provided on the convex portion may be 1 to 30 μm, and the sum of the height H of the convex portion and the height H of the convex portion 14 on the convex portion is greater than 1 to 30 μm, so that the electrical connection performance of the connector can be further enhanced.
Optionally, the material of the protruding portion 14 is one or a combination of copper, nickel, lead, chromium, molybdenum, zinc, tin, gold, and silver. Specifically, the bump 14 may be composed of a single component, i.e., one of copper, nickel, tin, lead, chromium, molybdenum, zinc, gold, and silver, or may be composed of one of copper, nickel, tin, lead, chromium, molybdenum, zinc, gold, and silver as a main component, and then one or more of metals other than the main component may be formed on the surface of the main component by one or more of electroplating, electroless plating, physical vapor deposition, and chemical vapor deposition, thereby forming the bump 14 of a composite material. In the present embodiment, the projection 14 is preferably made of a composite material mainly made of copper, and one or more metals selected from nickel, tin, lead, chromium, molybdenum, zinc, gold, and silver are formed on the surface of copper, because the projection 14 made of copper alone is easily oxidized or worn, and the nickel, tin, gold, and silver formed on the surface of copper can improve the corrosion resistance and wear resistance of the projection 14, and further improve the electrical conductivity of the connector, thereby prolonging the service life of the connector.
As shown in fig. 1, a connection hole for connecting the first conductive layer 11 and the second conductive layer 12 is formed on the insulator 10, the conductive medium 13 is attached to a wall of the connection hole to form a conductive hole 15, and the conductive hole 15 may be a through hole, a buried hole, or a blind hole. Of course, as shown in fig. 4, during the formation of the conductive medium 13, the operator may also choose to fill the entire connection hole with the conductive medium 13, i.e., not form the conductive hole 15. In addition, two or more connection holes may be disposed between the first conductive layer 11 and the second conductive layer 12, and a conductive medium 13 is disposed in each connection hole to further improve the conductive performance of the connector.
Optionally, the material of the insulator 10 is one or a combination of more of polyimide, thermoplastic polyimide, modified epoxy resin, modified acrylic resin, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyphenylene, polyvinyl chloride, polysulfone, polyphenylene sulfide, polyether ether ketone, polyphenylene oxide, polytetrafluoroethylene, liquid crystal polymer, and polyoxamide. Specifically, the insulator 10 may be a single component, i.e., one of the above-described various insulating materials, or may be a composite of any of the above-described plural insulating materials. Because of this, the insulator 10 has a certain amount of deformation, when the connector is press-fitted to the circuit board, the protruding portion 14 that first contacts with the circuit board is compressed backward, so that the relatively lower protruding portion 14 can also contact with the circuit board, thereby ensuring reliable electrical connection between the first conductive layer 11 and the second conductive layer 12 and the circuit board.
It should be noted that, according to different practical applications, the connector provided in the embodiment of the present invention may also be configured such that only the surface of the first conductive layer 11 or the second conductive layer 12 is provided with the protruding portion 14, but during the use process, the first conductive layer 11 or the second conductive layer 12 provided with the protruding portion 14 must be attached to the circuit board, so as to effectively ensure the static charge discharge. In addition, the conductive medium 13 in the embodiment of the present invention is preferably copper, but other materials with good conductive performance, such as tin, silver, gold, graphite, copper paste, silver paste, tin paste, carbon nanotube, etc., may also be selected.
Example two
As shown in fig. 5, the connector provided in the embodiment of the present invention is different from the connector provided in the first embodiment in that the protruding portions 14 are provided with the adhesive film layer 16, and for each protruding portion 14, the protruding portion is hidden in the adhesive film layer 16 or penetrates through the adhesive film layer 16 and is exposed. Based on this, when the connector is pressed and bonded with the circuit board, the connector is more stably connected with the circuit board and is not easy to loosen and separate due to the bonding capability of the adhesive film layer 16; during the pressing and bonding process, the adhesive film layer 16 has fluidity, so that the protrusions 14 which do not penetrate the adhesive film layer 16 before all or individually penetrate the adhesive film layer 16 and contact the circuit board together with the protrusions 14 which have penetrated the adhesive film layer 16 before, thereby forming reliable electrical connection between the first conductive layer 11 or/and the second conductive layer 12 and the circuit board, and ensuring that the connector still has good conductive performance during bonding.
Preferably, in the embodiment of the present invention, the adhesive film layer 16 may be a non-conductive adhesive such as a pressure-sensitive adhesive, a thermoplastic adhesive, or a thermosetting adhesive, and may also be a conductive adhesive containing conductive particles. Except for the differences, other specific structures of the embodiment of the present invention are the same as those of the first embodiment, and the corresponding principles and technical effects are also the same, which are not described herein again.
EXAMPLE III
The embodiment of the invention provides a manufacturing method of a connector, which comprises the following steps:
firstly, manufacturing a flexible copper clad laminate;
step two, forming connecting holes for connecting copper foils on two sides on the flexible copper clad laminate by adopting a mechanical drilling, laser drilling or stamping mode;
forming a conductive medium 13 in the connecting hole to enable the connecting hole to have conductivity, and meanwhile, forming a convex part 14 on the surface of the copper foil on at least one side of the flexible copper clad laminate;
and step four, forming an adhesive film layer 16 on the surface of the copper foil of the flexible copper clad laminate on which the bulge part 14 is formed.
In the third step provided by the embodiment of the present invention, the forming of the conductive medium 13 in the connection hole and the forming of the protruding portion 14 on the surface of the copper foil on at least one side of the flexible copper clad laminate specifically include:
depositing a layer of thin conductive medium 13 on the hole wall of the connecting hole through chemical reaction, and then increasing the thickness of the conductive medium 13 on the hole wall and forming a conductive hole 15 by adopting one or more of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition and the like, and meanwhile, forming a convex part 14 on the surface of the copper foil on at least one side of the flexible copper clad laminate;
or firstly depositing a layer of thin conductive medium 13 on the hole wall of the connecting hole through chemical reaction, and then filling the connecting hole with the conductive medium 13 by adopting one or more of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition and the like, and meanwhile, forming a convex part 14 on the surface of the copper foil on at least one side of the flexible copper clad laminate.
In the fourth step provided by the embodiment of the present invention, the forming of the adhesive film layer 16 on the surface of the copper foil of the flexible copper clad laminate on which the bump 14 is formed specifically includes:
coating an adhesive film layer 16 on a release film, and then transferring the adhesive film layer 16 to the surface of the copper foil of the flexible copper clad laminate forming the convex part 14 in a pressing manner through the release film;
or directly coating the surface of the copper foil of the flexible copper clad laminate forming the convex part 14 with the adhesive film layer 16.
Example four
The embodiment of the invention provides a manufacturing method of a connector, which comprises the following steps:
firstly, manufacturing a flexible copper clad laminate;
step two, forming connecting holes for connecting copper foils on two sides on the flexible copper clad laminate by adopting a mechanical drilling, laser drilling or stamping mode;
step three, forming a conductive medium 13 in the connecting hole to enable the connecting hole to have conductivity;
forming a convex part 14 on the surface of the copper foil on at least one side of the flexible copper clad laminate by adopting one or more of the modes of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition and the like;
and step five, forming an adhesive film layer 16 on the surface of the copper foil of the flexible copper clad laminate on which the convex part 14 is formed, wherein the specific method is consistent with the description in the third embodiment, and the details are not repeated here.
In the third step provided in the embodiment of the present invention, the forming of the conductive medium 13 in the connection hole specifically includes:
depositing a layer of thin conductive medium 13 on the hole wall of the connecting hole through chemical reaction, and then increasing the thickness of the conductive medium 13 on the hole wall and forming a conductive hole 15 by adopting one or more of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition and the like;
or firstly depositing a layer of thin conductive medium 13 on the hole wall of the connecting hole through chemical reaction, and then filling the connecting hole with the conductive medium 13 by adopting one or more of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition and the like.
EXAMPLE five
The embodiment of the invention provides a manufacturing method of a connector, which comprises the following steps:
firstly, manufacturing a flexible copper clad laminate;
forming a convex part 14 on the surface of the copper foil on at least one side of the flexible copper clad laminate by adopting one or more of the modes of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition and the like;
step three, forming connecting holes for connecting copper foils on two sides on the flexible copper clad laminate by adopting a mechanical drilling, laser drilling or stamping mode;
forming a conductive medium 13 in the connecting hole to make the connecting hole have conductivity;
and step five, forming an adhesive film layer 16 on the surface of the copper foil of the flexible copper clad laminate on which the convex part 14 is formed, wherein the specific method is consistent with the description in the third embodiment, and the details are not repeated here.
In the fourth step provided in the embodiment of the present invention, the forming of the conductive medium 13 in the connection hole specifically includes:
depositing a layer of thin conductive medium 13 on the hole wall of the connecting hole through chemical reaction, and then increasing the thickness of the conductive medium 13 on the hole wall and forming a conductive hole 15 by adopting one or more of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition and the like;
or firstly depositing a layer of thin conductive medium 13 on the hole wall of the connecting hole through chemical reaction, and then filling the connecting hole with the conductive medium 13 by adopting one or more of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition and the like.
It should be noted that the copper foils on the two sides of the flexible copper clad laminate in the third, fourth and fifth embodiments are the first conductive layer 11 and the second conductive layer 12 in the first embodiment.
In summary, the present invention provides a connector, including an insulator 10, a first conductive layer 11 disposed on one side surface of the insulator 10, and a second conductive layer 12 disposed on the other side surface of the insulator 10, wherein the insulator 10 is further provided with a conductive medium 13 connecting the first conductive layer 11 and the second conductive layer 12, the surfaces of the first conductive layer 11 or/and the second conductive layer 12 are provided with protrusions 14, and the surfaces of the protrusions 14 are regular or irregular arc-shaped surfaces. Compared with the prior art, the connector has the advantages of repeated disassembly and assembly, good conductivity and the like.
In addition, the invention also provides a manufacturing method of the connector, which has the advantages of simple operation, easy realization and the like.
It should be understood that the terms "first", "second", etc. are used herein to describe various information, but the information should not be limited to these terms, which are only used to distinguish one type of information from another. For example, "first" information may also be referred to as "second" information, and similarly, "second" information may also be referred to as "first" information, without departing from the scope of the present invention.
The foregoing is directed to the preferred embodiment of the present invention, and it is understood that various changes and modifications may be made by one skilled in the art without departing from the spirit of the invention, and it is intended that such changes and modifications be considered as within the scope of the invention.
Claims (24)
1. A connector is characterized by comprising an insulator, a first conducting layer arranged on one side surface of the insulator, and a second conducting layer arranged on the other side surface of the insulator, wherein a conducting medium for connecting the first conducting layer and the second conducting layer is further arranged on the insulator, the surfaces of the first conducting layer or/and the second conducting layer are/is provided with a convex part, and the surface of the convex part is a regular or irregular arc-shaped surface.
2. The connector according to claim 1, wherein the surface of the first conductive layer or/and the second conductive layer is provided with two or more of the protrusions, the shape of each of the protrusions is the same or different, the size of each of the protrusions is the same or different, and the two or more of the protrusions are continuously or discontinuously distributed on the surface of the first conductive layer or/and the second conductive layer.
3. The connector according to claim 1, wherein a surface of the first conductive layer or/and the second conductive layer is a rough surface.
4. The connector of claim 1, wherein a surface of the first conductive layer or/and the second conductive layer is a flat surface.
5. The connector of claim 1, wherein the material of the protrusion is one or more of copper, nickel, tin, lead, chromium, molybdenum, zinc, gold, and silver.
6. The connector of claim 1, wherein the protrusion is provided with an adhesive film layer, and the protrusion is hidden in the adhesive film layer or penetrates through the adhesive film layer and is exposed.
7. The connector according to claim 1, wherein a connection hole for connecting the first conductive layer and the second conductive layer is provided in the insulator, and the conductive medium is provided in the connection hole.
8. The connector according to claim 7, wherein the conductive medium fills the connection hole, or the conductive medium adheres to a hole wall of the connection hole and forms a conductive hole.
9. The connector according to claim 7, wherein two or more of the connection holes are provided in the insulator.
10. The connector of claim 1, wherein the insulator is made of one or more of polyimide, thermoplastic polyimide, modified epoxy resin, modified acrylic resin, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polystyrene, polyvinyl chloride, polysulfone, polyphenylene sulfide, polyether ether ketone, polyphenylene oxide, polytetrafluoroethylene, liquid crystal polymer, and polyoxamide.
11. A method of making a connector, comprising the steps of:
manufacturing a flexible copper clad laminate;
forming a connecting hole on the flexible copper clad laminate;
and forming a conductive medium in the connecting hole to enable the connecting hole to have conductivity, and forming a convex part on the surface of the copper foil on at least one side of the flexible copper clad laminate.
12. The method for manufacturing the connector according to claim 11, wherein the connecting holes for connecting the copper foils on two sides are formed on the flexible copper clad laminate by adopting a mechanical drilling, laser drilling or stamping mode.
13. The method for manufacturing the connector according to claim 11, wherein the steps of forming a conductive medium in the connection hole and forming the protrusion on the surface of the copper foil on at least one side of the flexible copper clad laminate specifically comprise:
depositing a layer of thin conductive medium on the hole wall of the connecting hole through chemical reaction, and then increasing the thickness of the conductive medium on the hole wall and forming a conductive hole by adopting one or more of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition and the like, and meanwhile, forming the convex part on the surface of the copper foil on at least one side of the flexible copper clad laminate.
Or a layer of thin conductive medium is deposited on the hole wall of the connecting hole through chemical reaction, and then one or more of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition and the like are adopted to fill the connecting hole with the conductive medium, and meanwhile, the convex part is formed on the surface of the copper foil on at least one side of the flexible copper clad laminate.
14. The method for manufacturing the connector according to claim 11, wherein after the protrusion is formed on the surface of the copper foil on at least one side of the flexible copper clad laminate, the method further comprises the steps of: forming an adhesive film layer on the surface of the copper foil of the flexible copper clad laminate forming the bulge, and specifically comprising:
coating the adhesive film layer on a release film, and then transferring the adhesive film layer to the surface of the copper foil of the flexible copper clad laminate forming the bulge part in a pressing manner through the release film;
or directly coating the adhesive film layer on the surface of the copper foil of the flexible copper clad laminate on which the bulge part is formed.
15. A method of making a connector, comprising the steps of:
manufacturing a flexible copper clad laminate;
forming a connecting hole on the flexible copper clad laminate;
forming a conductive medium in the connection hole to make the connection hole conductive;
and forming a convex part on the surface of the copper foil on at least one side of the flexible copper clad laminate.
16. The method for manufacturing the connector according to claim 15, wherein the connecting holes for connecting the copper foils on two sides are formed on the flexible copper clad laminate by adopting a mechanical drilling, laser drilling or stamping mode.
17. The method for manufacturing a connector according to claim 15, wherein the step of forming a conductive medium in the connection hole specifically includes:
depositing a layer of thin conductive medium on the hole wall of the connecting hole through chemical reaction, and then increasing the thickness of the conductive medium on the hole wall and forming a conductive hole by adopting one or more of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition and the like;
or depositing a layer of thin conductive medium on the hole wall of the connecting hole through chemical reaction, and filling the connecting hole with the conductive medium by adopting one or more of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition and the like.
18. The method for manufacturing the connector according to claim 15, wherein the protrusion is formed on the surface of the copper foil on at least one side of the flexible copper clad laminate by one or more of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition and the like.
19. The method for manufacturing the connector according to claim 15, wherein after the protrusion is formed on the surface of the copper foil on at least one side of the flexible copper clad laminate, the method further comprises the steps of: forming an adhesive film layer on the surface of the copper foil of the flexible copper clad laminate forming the bulge, and specifically comprising:
coating the adhesive film layer on a release film, and then transferring the adhesive film layer to the surface of the copper foil of the flexible copper clad laminate forming the bulge part in a pressing manner through the release film;
or directly coating the adhesive film layer on the surface of the copper foil of the flexible copper clad laminate on which the bulge part is formed.
20. A method of making a connector, comprising the steps of:
manufacturing a flexible copper clad laminate;
forming a convex part on the surface of the copper foil on at least one side of the flexible copper clad laminate;
forming a connecting hole on the flexible copper clad laminate;
a conductive medium is formed in the connection hole to make the connection hole conductive.
21. The method for manufacturing a connector according to claim 20, wherein the protrusion is formed on the surface of the copper foil on at least one side of the flexible copper clad laminate by one or more of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition, and the like.
22. The method for manufacturing the connector according to claim 20, wherein the connecting holes for connecting the copper foils on two sides are formed on the flexible copper clad laminate by means of mechanical drilling, laser drilling or stamping.
23. The method for manufacturing a connector according to claim 20, wherein the step of forming a conductive medium in the connection hole specifically includes:
depositing a layer of thin conductive medium on the hole wall of the connecting hole through chemical reaction, and then increasing the thickness of the conductive medium on the hole wall and forming a conductive hole by adopting one or more of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition and the like;
or depositing a layer of thin conductive medium on the hole wall of the connecting hole through chemical reaction, and filling the connecting hole with the conductive medium by adopting one or more of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition and the like.
24. The method of claim 20, further comprising the step of, after forming a conductive medium in the connection hole: forming an adhesive film layer on the surface of the copper foil of the flexible copper clad laminate forming the bulge, and specifically comprising:
coating the adhesive film layer on a release film, and then transferring the adhesive film layer to the surface of the copper foil of the flexible copper clad laminate forming the bulge part in a pressing manner through the release film;
or directly coating the adhesive film layer on the surface of the copper foil of the flexible copper clad laminate on which the bulge part is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811329978.7A CN110783742A (en) | 2018-11-09 | 2018-11-09 | Connector and manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811329978.7A CN110783742A (en) | 2018-11-09 | 2018-11-09 | Connector and manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110783742A true CN110783742A (en) | 2020-02-11 |
Family
ID=69383020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811329978.7A Pending CN110783742A (en) | 2018-11-09 | 2018-11-09 | Connector and manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110783742A (en) |
-
2018
- 2018-11-09 CN CN201811329978.7A patent/CN110783742A/en active Pending
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