CN210641129U

CN210641129U - Ultra-thin ceramic base circuit board

Info

Publication number: CN210641129U
Application number: CN201921230245.8U
Authority: CN
Inventors: 唐川; 吉建成; 张国兴
Original assignee: MFS TECHNOLOGY (HUNAN) CO LTD
Current assignee: MFS TECHNOLOGY (HUNAN) CO LTD
Priority date: 2019-08-01
Filing date: 2019-08-01
Publication date: 2020-05-29
Anticipated expiration: 2029-08-01

Abstract

The utility model discloses an ultra-thin ceramic base circuit board, including toughened glass, ceramic base and frame, the UV is installed to toughened glass's below and is glued, and the below that the UV glues installs the ceramic base, the inside of frame is provided with splint, and the four corners of splint is provided with dodges the hole, the inside of dodging the hole is provided with the fixed column, the inside of splint is provided with the ceramic base coincidence part, first copper electroplating is installed to the below of ceramic base outer wall, and states the top of ceramic base outer wall and install the second and electroplate, the inside of ceramic base is provided with the conducting hole. The ultrathin ceramic-based circuit board has the advantages that the ceramic base is extremely easy to damage due to vibration in the pretreatment process, glass is used as a carrier, the ceramic base is fixed by UV glue, the damage problem caused by operations such as cleaning and vibration in the process can be prevented, and the purpose of using the glass as the carrier is to ensure that UV light energy can irradiate the UV glue through the glass when the UV adhesive property is removed.

Description

Ultra-thin ceramic base circuit board

Technical Field

The utility model relates to a circuit board technical field specifically is an ultra-thin ceramic base circuit board.

Background

Ceramic-based circuit boards are widely used in various electronic products due to their excellent thermal conductivity, extremely low thermal expansion coefficient, low dielectric constant and electrical loss. The thickness of current conventional ceramic wafer is usually more than 0.2mm, and prior art possesses ripe processing ability to the ceramic wafer more than this thickness, but to the ceramic wafer that the thickness is only 40um, no matter be surface coating film or printing metal thick liquids, the damage of ceramic wafer all can be led to in the current operation to and inhomogeneous coating film also can lead to the serious warpage of product, even slight vibrations can lead to ceramic fracture, and prior art can't satisfy the processing demand of the ceramic wafer of this kind of thickness.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an ultra-thin ceramic base circuit board, it possesses ripe processingcapacity to the potsherd more than this thickness to propose prior art in solving above-mentioned background art, nevertheless only be 40 um's potsherd to thickness, no matter be surface coating or printed metal thick liquids, the current operation all can lead to the damage of potsherd, and inhomogeneous coating film also can lead to the serious warpage of product, slight vibrations can all lead to ceramic breaking even, prior art can't satisfy the processing demand of the potsherd of this kind of thickness, can not be fine satisfy people's user demand problem.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an ultra-thin ceramic base circuit board, includes toughened glass, ceramic base and frame, the UV is installed to toughened glass's below and is glued, and the below that the UV glues installs the ceramic base, the inside of frame is provided with splint, and the four corners of splint is provided with dodges the hole, the inside of dodging the hole is provided with the fixed column, the inside of splint is provided with ceramic base coincidence part, first electro-coppering is installed to the below of ceramic base outer wall, and states the top of ceramic base outer wall and install the second and electroplate, the inside of ceramic base is provided with the conducting hole.

Preferably, vertical central lines among the toughened glass, the UV glue and the ceramic matrix are mutually overlapped, and the toughened glass is parallel to the ceramic matrix.

Preferably, the ceramic matrix is AlN ceramic, and the thickness of the ceramic matrix is 40 um.

Preferably, the thickness of the first electroplated copper and the second electroplating is about 15um, and the thickness of the part of the first electroplated copper and the second electroplating wrapping the via hole is about 10 um.

Preferably, the inside of splint is fretwork column structure, and splint are provided with two.

Preferably, the avoiding hole and the fixing column are four, and the fixing column penetrates through the inside of the avoiding hole.

Compared with the prior art, the beneficial effects of the utility model are as follows:

the method has the advantages that the ceramic base is easily damaged due to vibration in the pretreatment process, glass is used as a carrier, the ceramic base is fixed by the UV glue, the damage problem caused by operations such as cleaning and vibration in the process can be prevented, the glass is used as the carrier, when the UV glue adhesiveness is removed, the UV light can be ensured to irradiate the UV glue through the glass, and the glass is not limited to the glass and can be made of a material with high rigidity and transparency;

in the process of sputtering coating, the ceramic matrix is reinforced by the hollow fixture, and meanwhile, double-sided copper plating is adopted, so that the serious plate warping caused by uneven stress generated by single-sided electroplating is avoided, and the damage of the ceramic matrix is avoided.

Drawings

FIG. 1 is a schematic diagram of the structure of the pretreatment stage of the present invention;

FIG. 2 is a schematic view of the electroplating jig of the present invention;

FIG. 3 is a schematic diagram of the structure of the electroplated ceramic substrate of the present invention.

In the figure: 1. tempering the glass; 2. UV glue; 3. a ceramic matrix; 301. first electro-coppering; 302. second electroplating; 303. a via hole; 4. a frame; 5. a portion coinciding with the ceramic base; 6. avoiding holes; 7. a splint; 8. and (5) fixing the column.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: an ultrathin ceramic-based circuit board comprises toughened glass 1, a ceramic base 3 and a frame 4, wherein UV glue 2 is arranged below the toughened glass 1, the ceramic base 3 is arranged below the UV glue 2, vertical central lines among the toughened glass 1, the UV glue 2 and the ceramic base 3 are mutually overlapped, the toughened glass 1 is parallel to the ceramic base 3, the ceramic base 3 is AlN ceramic, and the thickness of the ceramic base 3 is 40 microns;

frame 4's inside is provided with splint 7, and splint 7's four corners is provided with dodges hole 6, splint 7's inside is fretwork column structure, and splint 7 is provided with two, the inside of dodging hole 6 is provided with fixed column 8, it is provided with four to dodge hole 6 and fixed column 8, and fixed column 8 runs through in the inside of dodging hole 6, splint 7's inside is provided with and ceramic matrix coincidence 5, first copper electroplating 301 is installed to the below of 3 outer walls of ceramic matrix, and state that the second is electroplated 302 is installed to the top of 3 outer walls of ceramic matrix, 3's inside is provided with conducting hole 303, the thickness that 302 was electroplated to first copper electroplating 301 and second is about 15um, and the position thickness that 302 parcel conducting hole 303 was electroplated to first copper electroplating 301 and second is about 10 um.

The working principle is as follows: when the ultrathin ceramic-based circuit board is used, firstly, a laser drilling machine is used for drilling holes in a ceramic base 3, the hole diameter comprises a positioning hole and a through hole 303 in an effective unit, the hole diameter is set according to the actual requirement of a product, because the pretreatment vibration amplitude is large, tempered glass 1 is prepared, a layer of UV glue 2 is pasted on the surface of the glass, the ceramic base 3 is pasted on the surface of the UV glue 2, the pasting is ensured to be tight and free of bubbles, the surface of the ceramic base 3 is pretreated and cleaned, the glass surface is roughened, the UV light is used for irradiating the glass surface, the viscosity of the UV glue 2 is relieved, the ceramic base 3 is taken down, the process is repeated, the other surface of the ceramic base 3 is cleaned, after the process is;

secondly, after coarsening, preparing an electroplating clamp, wherein the clamp consists of an upper clamping plate and a lower clamping plate 7, the length and the width of the clamp are slightly larger than the size of the ceramic matrix 3, the middle of the clamping plate 7 is hollowed to expose the area of the ceramic matrix 3 to be electroplated, the part of the frame 4, which is overlapped with the ceramic matrix 3, is milled into a certain depth for placing the ceramic matrix 3, when the upper clamping plate 7 and the lower clamping plate 7 are overlapped and clamped, the pressure of the frame 4 of the clamping plate 7 on the ceramic matrix 3 is ensured to be small so as not to crush the ceramic matrix 3, fixing columns 8 are arranged at four corners of the lower clamping plate 7, a position avoiding hole is arranged at the corresponding position of the upper clamping plate 7 and is overlapped with a positioning hole on the ceramic matrix 3, the ceramic matrix 3 is carefully placed on the lower clamping plate during production, the positioning hole is sleeved with the fixing columns 8, forming a ceramic substrate 3 with copper plated on both sides;

finally, the ceramic-based 3 board is placed in wet film liquid together with the clamp, so that the surface of the ceramic-based 3 effective graphic unit is uniformly attached with a photosensitive wet film, the photosensitive wet film is exposed through LDI, developed, etched and removed, two-sided circuits are made, and finally, a laser appearance is completed to obtain a finished ceramic-based 3 circuit board, because the 40um ceramic-based is very easy to damage, and the flexible warpage of the sintering process is realized, the maximum length and width of a single chip is 100mm, the production efficiency is improved, the size of the toughened glass 1 can be set according to the machinable size of equipment, multiple ceramic-based 3 boards are regularly laminated on the surface of the glass and are produced simultaneously, the production efficiency is improved, the electroplating clamp is the same, and the working principle.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides an ultra-thin ceramic base circuit board, includes toughened glass (1), ceramic base (3) and frame (4), its characterized in that: UV glues (2) are installed to the below of toughened glass (1), and the below of UV gluey (2) installs ceramic base (3), the inside of frame (4) is provided with splint (7), and the four corners of splint (7) is provided with dodges hole (6), the inside of dodging hole (6) is provided with fixed column (8), the inside of splint (7) is provided with ceramic base coincidence part (5), first electro-coppering (301) are installed to the below of ceramic base (3) outer wall, and states the top of ceramic base (3) outer wall and install second electroplating (302), the inside of ceramic base (3) is provided with conducting hole (303).

2. The ultra-thin ceramic-based circuit board of claim 1, wherein: the vertical central lines among the toughened glass (1), the UV glue (2) and the ceramic matrix (3) are mutually overlapped, and the toughened glass (1) is parallel to the ceramic matrix (3).

3. The ultra-thin ceramic-based circuit board of claim 1, wherein: the ceramic base (3) is AlN ceramic, and the thickness of the ceramic base (3) is 40 um.

4. The ultra-thin ceramic-based circuit board of claim 1, wherein: the thickness of the first electroplated copper (301) and the second electroplated copper (302) is about 15um, and the thickness of the part of the first electroplated copper (301) and the second electroplated copper (302) wrapping the via hole (303) is about 10 um.

5. The ultra-thin ceramic-based circuit board of claim 1, wherein: the interior of the clamping plate (7) is of a hollow structure, and the number of the clamping plates (7) is two.

6. The ultra-thin ceramic-based circuit board of claim 1, wherein: dodge hole (6) and fixed column (8) and be provided with four, and fixed column (8) run through in the inside of dodging hole (6).