CN209659705U - A kind of pcb board facilitating gong slot - Google Patents
A kind of pcb board facilitating gong slot Download PDFInfo
- Publication number
- CN209659705U CN209659705U CN201821948498.4U CN201821948498U CN209659705U CN 209659705 U CN209659705 U CN 209659705U CN 201821948498 U CN201821948498 U CN 201821948498U CN 209659705 U CN209659705 U CN 209659705U
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- China
- Prior art keywords
- pcb board
- gong slot
- gong
- prebored hole
- layer
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Abstract
The utility model discloses a kind of pcb boards for facilitating gong slot, including pcb board ontology, prebored hole, gong slot, electronic component, pin and electronics contact, the surface of pcb board ontology offers prebored hole, pcb board ontology offers gong slot surface and between prebored hole, the surface of pcb board ontology and is located at below prebored hole and gong slot and is welded with electronic component.The utility model passes through pcb board ontology, prebored hole, gong slot, electronic component, the setting of pin and electronics contact, the pcb board for facilitating gong slot is constructed jointly, wherein by before pcb board opens up gong slot, it is cut at it and increases some prebored holes, the size of prebored hole is 0.2mm smaller than gong groove width, this prebored hole can be drilled out in drilling operating, it is not required to individually increase process, do not increase production cost, do not influence production efficiency, it cuts a little after increasing prebored hole, the dust that pcb board generates can be siphoned away by intermediate prebored hole gap by dust suction, the problem of effective solution pcb board plate bursting.
Description
Technical field
The utility model relates to technical field of PCB board, specially a kind of pcb board for facilitating gong slot.
Background technique
Pcb board, Chinese are printed circuit board, also known as printed wiring board, are important electronic component, are electronics member devices
The supporter of part is the carrier of electronic component electrical connection, since it is made of electron printing, therefore is referred to as
" printing " circuit board is the supplier of electronic component electrical connection, the history of its existing more than 100 years of development；It sets
Meter is mainly layout design；Major advantage using circuit board is to greatly reduce the mistake of wiring and assembly, improves automation
Horizontal and productive labor rate.
For pcb board in gong slot, exactly cutting for gong slot is a little typically easy to plate bursting during pcb board, the original of generation at present
Because being gong knife since contacting plate face pcb board, it will more pcb board dust is generated, because cutting a tight, the powder that gong goes out
Dirt is difficult to be sucked away, therefore dust will constantly be overstock with the high speed rotation of gong knife to edge, so that gong groove edge occurs
Plate bursting phenomenon.
Utility model content
The purpose of this utility model is to provide a kind of pcb boards for facilitating gong slot, have the advantages of avoiding plate bursting, solve
Pcb board is easy the problem of plate bursting.
To achieve the above object, the utility model provides the following technical solutions: a kind of pcb board facilitating gong slot, including PCB
The surface of plate ontology, prebored hole, gong slot, electronic component, pin and electronics contact, the pcb board ontology offers prebored hole, institute
That states pcb board ontology offers gong slot surface and between prebored hole, the surface of the pcb board ontology and is located at prebored hole
Be welded with electronic component below gong slot, the bottom of the pcb board ontology is fixedly connected with pin, the surface weldering of the pin
It is connected to electronics contact；
The pcb board ontology includes substrate, conductive layer, heat-conducting layer, high-temperature-resistant layer and insulating layer, and the surface of the substrate is set
It is equipped with conductive layer, the conductive layer is provided with heat-conducting layer far from the side of substrate, and the heat-conducting layer is set far from the side of conductive layer
It is equipped with high-temperature-resistant layer, the bottom of the substrate is provided with insulating layer.
Preferably, the high-temperature-resistant layer with a thickness of 0.8~1.0mm, and in short-term tolerable temperature can be greater than 500 DEG C.
Preferably, the surrounding of the pcb board body surface offers mounting hole.
Preferably, the surface of the pcb board ontology and radiating groove is offered between two mounting holes.
Preferably, the insulating layer is resin composite materials, and with a thickness of 1.2~1.5mm, the conductive layer is copper foil material
Material, with a thickness of 1.0~1.4mm.
Preferably, the heat-conducting layer includes aluminium foil veneer glassy layer and rubber layer.
Compared with prior art, the beneficial effects of the utility model are as follows:
The utility model is by pcb board ontology, prebored hole, the setting of gong slot, electronic component, pin and electronics contact, altogether
With constructing the pcb board for facilitating gong slot, wherein by before pcb board opens up gong slot, is cut at it and increase some preborings
The size in hole, prebored hole is 0.2mm smaller than gong groove width, this prebored hole can be drilled out in drilling operating, is not required to individually increase process, no
Increase production cost, do not influence production efficiency, cut a little after increasing prebored hole, the dust that pcb board generates can be in
Between prebored hole gap siphoned away by dust suction, the problem of effective solution pcb board plate bursting.
Detailed description of the invention
FIG. 1 is a schematic structural view of the utility model；
Fig. 2 is the utility model coating structure schematic diagram；
Fig. 3 is the utility model aluminium foil veneer glassy layer and rubber and plastic schematic diagram of a layer structure.
In figure: 1 pcb board ontology, 11 substrates, 12 conductive layers, 13 heat-conducting layers, 1301 aluminium foil veneer glassy layers, 1302 rubber and plastics
Layer, 14 high-temperature-resistant layers, 15 insulating layers, 2 prebored holes, 3 gong slots, 4 electronic components, 5 pins, 6 electronics contacts, 7 mounting holes, 8 heat dissipations
Slot.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Please refer to Fig. 1-3, a kind of pcb board facilitating gong slot, including pcb board ontology 1, prebored hole 2, gong slot 3, electronic component
4, pin 5 and electronics contact 6, the surface of pcb board ontology 1 offer prebored hole 2, and the surrounding on 1 surface of pcb board ontology offers
Mounting hole 7, the surface of pcb board ontology 1 and is located between two mounting holes 7 and offers radiating groove 8, pcb board ontology 1 surface
And gong slot 3 is offered between prebored hole 2, the surface of the pcb board ontology 1 and lower section for being located at prebored hole 2 and gong slot 3 is welded with
Electronic component 4, the bottom of pcb board ontology 1 are fixedly connected with pin 5, and the surface of pin 5 is welded with electronics contact 6；
Pcb board ontology 1 includes substrate 11, conductive layer 12, heat-conducting layer 13, high-temperature-resistant layer 14 and insulating layer 15, substrate 11
Surface is provided with conductive layer 12, and conductive layer 12 is provided with heat-conducting layer 13 far from the side of substrate 11, and heat-conducting layer 13 is pasted including aluminium foil
Surface glass layer 1301 and rubber layer 1302, heat-conducting layer 13 are provided with high-temperature-resistant layer 14, high-temperature-resistant layer far from the side of conductive layer 12
14 with a thickness of 0.8~1.0mm, and in short-term tolerable temperature can be greater than 500 DEG C, the bottom of substrate 11 is provided with insulating layer 15,
Insulating layer 15 is resin composite materials, and with a thickness of 1.2~1.5mm, conductive layer 12 is copper foil material, with a thickness of 1.0~
1.4mm, it is common to construct by pcb board ontology 1, prebored hole 2, the setting of gong slot 3, electronic component 4, pin 5 and electronics contact 6
One facilitates the pcb board of gong slot, wherein by before pcb board opens up gong slot 3, cuts at it and increases some prebored holes 2, in advance
The size of drilling 2 is 0.2mm smaller than 3 width of gong slot, this prebored hole 2 can be drilled out in drilling operating, be not required to individually increase process, not increased
Add production cost, do not influence production efficiency, cut a little after increasing prebored hole 2, the dust that pcb board generates can pass through centre
Prebored hole 2 gap siphoned away by dust suction, the problem of effective solution pcb board plate bursting.
In use, by before pcb board opens up gong slot 3, is cut at it and increase some prebored holes 2, the size of prebored hole 2
0.2mm smaller than 3 width of gong slot, this prebored hole 2 can be drilled out in drilling operating, be not required to individually increase process, do not increased production cost,
Production efficiency is not influenced, is cut a little after increasing prebored hole 2, the dust that pcb board generates can be empty by intermediate prebored hole 2
The problem of gap is siphoned away by dust suction, effective solution pcb board plate bursting, and substrate 11, conductive layer 12, heat-conducting layer 13, high temperature resistant
The setting of layer 14 and insulating layer 15, improves the long service life of pcb board.
In summary: this facilitates the pcb board of gong slot, by pcb board ontology 1, prebored hole 2, gong slot 3, electronic component 4, draws
The cooperation of foot 5 and electronics contact 6 solves the problems, such as that pcb board is easy plate bursting.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (6)
1. a kind of pcb board for facilitating gong slot, including pcb board ontology (1), prebored hole (2), gong slot (3), electronic component (4), pin
(5) and electronics contact (6), it is characterised in that: the surface of the pcb board ontology (1) offers prebored hole (2), the pcb board sheet
Body (1) offers gong slot (3) surface and between prebored hole (2), the surface of the pcb board ontology (1) and is located at pre-
It is welded with electronic component (4) below drilling (2) and gong slot (3), the bottom of the pcb board ontology (1) is fixedly connected with pin
(5), the surface of the pin (5) is welded with electronics contact (6)；
The pcb board ontology (1) includes substrate (11), conductive layer (12), heat-conducting layer (13), high-temperature-resistant layer (14) and insulating layer
(15), the surface of the substrate (11) is provided with conductive layer (12), and the conductive layer (12) is arranged far from the side of substrate (11)
Have heat-conducting layer (13), the heat-conducting layer (13) is provided with high-temperature-resistant layer (14), the substrate far from the side of conductive layer (12)
(11) bottom is provided with insulating layer (15).
2. a kind of pcb board for facilitating gong slot according to claim 1, it is characterised in that: the thickness of the high-temperature-resistant layer (14)
Degree is 0.8~1.0mm, and tolerable temperature can be greater than 500 DEG C in short-term.
3. a kind of pcb board for facilitating gong slot according to claim 1, it is characterised in that: pcb board ontology (1) surface
Surrounding offer mounting hole (7).
4. a kind of pcb board for facilitating gong slot according to claim 1, it is characterised in that: the table of the pcb board ontology (1)
Face and radiating groove (8) are offered between two mounting holes (7).
5. a kind of pcb board for facilitating gong slot according to claim 1, it is characterised in that: the insulating layer (15) is resin
Composite material, with a thickness of 1.2~1.5mm, the conductive layer (12) is copper foil material, with a thickness of 1.0~1.4mm.
6. a kind of pcb board for facilitating gong slot according to claim 1, it is characterised in that: the heat-conducting layer (13) includes aluminium
Foil veneer glassy layer (1301) and rubber layer (1302).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821948498.4U CN209659705U (en) | 2018-11-23 | 2018-11-23 | A kind of pcb board facilitating gong slot |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821948498.4U CN209659705U (en) | 2018-11-23 | 2018-11-23 | A kind of pcb board facilitating gong slot |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209659705U true CN209659705U (en) | 2019-11-19 |
Family
ID=68517120
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821948498.4U Active CN209659705U (en) | 2018-11-23 | 2018-11-23 | A kind of pcb board facilitating gong slot |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209659705U (en) |
-
2018
- 2018-11-23 CN CN201821948498.4U patent/CN209659705U/en active Active
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