CN207947940U - A kind of circuit board improving molded polytetrafluoroethylarticle - Google Patents
A kind of circuit board improving molded polytetrafluoroethylarticle Download PDFInfo
- Publication number
- CN207947940U CN207947940U CN201820117363.7U CN201820117363U CN207947940U CN 207947940 U CN207947940 U CN 207947940U CN 201820117363 U CN201820117363 U CN 201820117363U CN 207947940 U CN207947940 U CN 207947940U
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- board
- pcb board
- phenolic
- layer
- circuit board
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- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Drilling And Boring (AREA)
Abstract
The utility model discloses a kind of circuit boards improving molded polytetrafluoroethylarticle, are related to circuit board technology field；Brown paper including the first phenolic board, the second phenolic board, the pcb board of multilayer and multilayer；The multi-layer PCB board is stacked successively, and is both provided with brown paper between adjacent pcb board；Multi-layer PCB board is stacked to form pcb board layer successively, and the pcb board layer is between the first phenolic board and the second phenolic board；The utility model has the beneficial effects that：It avoids the surrounding of the drilling on pcb board from burr and burr occur well, avoids drilling from occurring damaging in hole, to improve the yields of pcb board bore process.
Description
Technical field
The utility model is related to technical field of PCB board, more specifically, the utility model is related to a kind of improvement polytetrafluoroethyl-nes
The molding circuit board of alkene.
Background technology
Pcb board, also known as printed circuit board, printed wiring board, abbreviation printed board are cut into a scale using insulation board as base material
Very little, at least attached thereon there are one conductive patterns, and are furnished with hole（Such as component hole, fastener hole, plated through-hole）, and realize electronics member
Interconnection between device.Since this plate is made of electron printing, therefore it is referred to as " printing " circuit board.
Pcb board in the prior art is required to drill, bore mode in the prior art, is that pcb board is laminated
It directly drills afterwards, this bore mode will produce burr and burr, the fraction defective of product is caused to improve.
Utility model content
For overcome the deficiencies in the prior art, the utility model provides a kind of circuit board improving molded polytetrafluoroethylarticle,
By being inserted into brown paper between adjacent pcb board so that pcb board impulse- free robustness in drilling improves the yields of product.
Technical solution adopted by the utility model to solve its technical problems is：A kind of electricity improving molded polytetrafluoroethylarticle
Road plate, thes improvement is that：Brown paper including the first phenolic board, the second phenolic board, the pcb board of multilayer and multilayer；Institute
The multi-layer PCB board stated is stacked successively, and is both provided with brown paper between adjacent pcb board；Multi-layer PCB board is stacked to be formed successively
Pcb board layer, the pcb board layer is between the first phenolic board and the second phenolic board.
In such a configuration, the circuit board of the improvement molded polytetrafluoroethylarticle includes six layers of PCB being sequentially overlapped
Plate, first phenolic board are mutually close to the upper surface of first layer pcb board, second phenolic board and layer 6 pcb board
Lower surface be mutually close to.
In such a configuration, the thickness of the brown paper is 0.1mm.
In such a configuration, the thickness of first phenolic board is 0.5mm.
In such a configuration, the thickness of second phenolic board is 0.5mm.
The utility model has the beneficial effects that：Due between the first phenolic board, the second phenolic board and adjacent pcb board
The presence of brown paper can be very good to avoid the surrounding of the drilling on pcb board when the pcb board to multiple stackings drills
There is burr and burr, avoids drilling from occurring damaging in hole, to improve the yields of pcb board bore process.
Description of the drawings
Fig. 1 is a kind of side structure schematic diagram of the circuit board of improvement molded polytetrafluoroethylarticle of the utility model.
Specific implementation mode
The utility model is further illustrated with reference to the accompanying drawings and examples.
The technique effect of the design of the utility model, concrete structure and generation is carried out below with reference to embodiment and attached drawing
It clearly and completely describes, to be completely understood by the purpose of this utility model, feature and effect.Obviously, described embodiment
It is a part of the embodiment of the utility model, rather than whole embodiments, it is based on the embodiments of the present invention, the skill of this field
The other embodiment that art personnel are obtained without creative efforts belongs to the model of the utility model protection
It encloses.In addition, all connection/connection relations arrived involved in patent, not singly refer to component and directly connect, and referring to can be according to specific
Performance, by adding or reducing couple auxiliary, to form more preferably coupling structure.Each skill in the utility model creation
Art feature, can be with combination of interactions under the premise of not conflicting conflict.
Shown in referring to Fig.1, the utility model discloses a kind of circuit board improving molded polytetrafluoroethylarticle, specifically,
In the present embodiment, include the brown paper 40 of the first phenolic board 10, the second phenolic board 20, the pcb board 30 of multilayer and multilayer；It is described
Multi-layer PCB board 30 be stacked successively, and be both provided with brown paper 40 between adjacent pcb board 30；Multi-layer PCB board 30 is stacked successively
30 layers of pcb board is formed, 30 layers of the pcb board is between the first phenolic board 10 and the second phenolic board 20.
In the present embodiment, the circuit board of the improvement molded polytetrafluoroethylarticle includes six layers of pcb board being sequentially overlapped
30, first phenolic board 10 is mutually close to the upper surface of first layer pcb board 30, second phenolic board 20 and layer 6
Mutually it is close to the lower surface of pcb board 30.
Also, the thickness of the brown paper 40 is 0.1mm；The thickness of first phenolic board 10 is 0.5mm；It is described
The second phenolic board 20 thickness be 0.5mm.
By above-mentioned structure, due to the ox between the first phenolic board 10, the second phenolic board 20 and adjacent pcb board 30
The presence of mulberry paper 40 can be very good to avoid the drilling on pcb board 30 when the pcb board 30 to multiple stackings drills
There is burr and burr in surrounding, avoids drilling from occurring damaging in hole, to improve the yields of 30 bore process of pcb board.
It is to be illustrated to the preferable implementation of the utility model, but the utility model creation is not limited to institute above
Embodiment is stated, those skilled in the art can also make various be equal without departing from the spirit of the present invention
Deformation is replaced, these equivalent deformations or replacement are all contained in the application claim limited range.
Claims (5)
1. a kind of circuit board improving molded polytetrafluoroethylarticle, it is characterised in that：Including the first phenolic board, the second phenolic board, more
The pcb board of layer and the brown paper of multilayer；The multi-layer PCB board is stacked successively, and is both provided with ox between adjacent pcb board
Mulberry paper；Multi-layer PCB board is stacked to form pcb board layer successively, the pcb board layer be located at the first phenolic board and the second phenolic board it
Between.
2. a kind of circuit board improving molded polytetrafluoroethylarticle according to claim 1, it is characterised in that：The improvement
The circuit board of molded polytetrafluoroethylarticle includes six layers of pcb board being sequentially overlapped, first phenolic board and first layer pcb board
Upper surface is mutually close to, and second phenolic board is mutually close to the lower surface of layer 6 pcb board.
3. a kind of circuit board improving molded polytetrafluoroethylarticle according to claim 1, it is characterised in that：The brown paper
Thickness be 0.1mm.
4. a kind of circuit board improving molded polytetrafluoroethylarticle according to claim 1, it is characterised in that：Described first
The thickness of phenolic board is 0.5mm.
5. a kind of circuit board improving molded polytetrafluoroethylarticle according to claim 1, it is characterised in that：Described second
The thickness of phenolic board is 0.5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820117363.7U CN207947940U (en) | 2018-01-23 | 2018-01-23 | A kind of circuit board improving molded polytetrafluoroethylarticle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820117363.7U CN207947940U (en) | 2018-01-23 | 2018-01-23 | A kind of circuit board improving molded polytetrafluoroethylarticle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207947940U true CN207947940U (en) | 2018-10-09 |
Family
ID=63702275
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820117363.7U Active CN207947940U (en) | 2018-01-23 | 2018-01-23 | A kind of circuit board improving molded polytetrafluoroethylarticle |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207947940U (en) |
-
2018
- 2018-01-23 CN CN201820117363.7U patent/CN207947940U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200426 Address after: 223001 No.11, 14 and 15 plant of Zhongxin Hua Electronic Industrial Park Development (Lianshui) Co., Ltd., Xingsheng Road, Lianshui Economic Development Zone, Huai'an City, Jiangsu Province Patentee after: Jiangsu ainuoxin Circuit Technology Co., Ltd Address before: 518000 Shenzhen, Guangdong Province, Baoan District, Sha Tin Street, Gonghe fourth industrial area A4 building A7 unit 1 to three, A5 unit 309 to 311 Patentee before: LETTER IN AINO RF CIRCUIT (SHENZHEN) Co.,Ltd. |
|
| TR01 | Transfer of patent right |