CN220235046U - Double-sided circuit board with partially embedded copper - Google Patents
Double-sided circuit board with partially embedded copper Download PDFInfo
- Publication number
- CN220235046U CN220235046U CN202321122923.5U CN202321122923U CN220235046U CN 220235046 U CN220235046 U CN 220235046U CN 202321122923 U CN202321122923 U CN 202321122923U CN 220235046 U CN220235046 U CN 220235046U
- Authority
- CN
- China
- Prior art keywords
- copper
- core
- circuit board
- hole
- sided circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 43
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 43
- 239000010949 copper Substances 0.000 title claims abstract description 43
- 239000000853 adhesive Substances 0.000 claims abstract description 7
- 230000001070 adhesive effect Effects 0.000 claims abstract description 7
- 230000001788 irregular Effects 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 2
- 239000010410 layer Substances 0.000 abstract description 11
- 230000017525 heat dissipation Effects 0.000 abstract description 6
- 230000000149 penetrating effect Effects 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 239000002356 single layer Substances 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The application discloses two-sided circuit board of local embedded copper, including core, copper billet and prepreg adhesive linkage, the core runs through and is equipped with the mounting hole, the copper billet is inlayed and is located in the mounting hole and pass through the prepreg adhesive linkage with the core is fixed. The beneficial effects of the utility model are as follows: through the arrangement of the mounting holes in the core plate in a penetrating way, then the copper blocks are embedded, and the prepreg bonding layer is arranged in the gap between the mounting holes and the copper blocks, so that the copper blocks are embedded on the single-layer core plate, and the design requirement of local heat dissipation of the PCB is met.
Description
Technical Field
The application belongs to the technical field of circuit board manufacturing, and particularly relates to a double-sided circuit board with locally embedded copper.
Background
With the rapid development of electronic products, miniaturization and portability of products, high-power and high-heat-dissipation devices need good heat dissipation design, PCB local heat dissipation design requirements are wide, copper blocks are usually embedded into core boards in common local heat dissipation copper block embedded PCB design, but the copper blocks are usually products with more than two core boards of a multi-layer board, and local copper embedding is difficult to process in the design of double-sided circuit boards of a single core board.
Disclosure of Invention
An objective of the embodiments of the present application is to provide a double-sided circuit board with partially copper embedded, which can solve at least one technical problem related in the background art.
In order to solve the technical problems, the application is realized as follows:
the utility model provides a two-sided circuit board of local embedded copper, includes core, copper billet and prepreg adhesive linkage, the core runs through and is equipped with the mounting hole, the copper billet is inlayed and is located in the mounting hole and through prepreg adhesive linkage with the core is fixed.
Optionally, the copper block and the core plate are arranged at intervals, and the prepreg bonding layer is filled in a gap between the copper block and the core plate.
Optionally, the mounting hole is any one of a circular hole, a rectangular hole, an elliptical hole, a triangular hole and an irregular polygonal hole.
Optionally, the cross-sectional shape of the copper block is consistent with the shape of the mounting hole.
Optionally, the upper and lower surfaces of the copper block are respectively flush with the upper and lower surfaces of the core plate.
The beneficial effects of the utility model are as follows: through the arrangement of the mounting holes in the core plate in a penetrating way, then the copper blocks are embedded, and the prepreg bonding layer is arranged in the gap between the mounting holes and the copper blocks, so that the copper blocks are embedded on the single-layer core plate, and the design requirement of local heat dissipation of the PCB is met.
Drawings
Fig. 1 is a schematic structural diagram of a partially copper-embedded double-sided circuit board according to an embodiment of the present application.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
The terms first, second and the like in the description and in the claims, are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged, as appropriate, such that embodiments of the present application may be implemented in sequences other than those illustrated or described herein, and that the objects identified by "first," "second," etc. are generally of a type and not limited to the number of objects, e.g., the first object may be one or more. Furthermore, in the description and claims, "and/or" means at least one of the connected objects, and the character "/", generally means that the associated object is an "or" relationship.
The following describes in detail the partially copper-embedded double-sided circuit board provided in the embodiment of the present application through specific embodiments and application scenarios thereof with reference to the accompanying drawings.
Referring to fig. 1, the embodiment of the application provides a double-sided circuit board with partially embedded copper, which comprises a core board 1, a copper block 2 and a prepreg bonding layer 3, wherein the core board 1 is provided with a mounting hole 11 in a penetrating manner, and the copper block 2 is embedded in the mounting hole 11 and is fixed with the core board 1 through the prepreg bonding layer 3.
Specifically, the copper block 2 and the core plate 1 are arranged at intervals, and the prepreg bonding layer 3 is filled in the gap 4 between the copper block 2 and the core plate 1.
In some embodiments, the mounting hole 11 is any one of a circular hole, a rectangular hole, an elliptical hole, a triangular hole, and an irregular polygonal hole. Accordingly, the cross-sectional shape of the copper block 2 is identical to the shape of the mounting hole 11.
The upper and lower surfaces of the copper block 2 are respectively flush with the upper and lower surfaces of the core plate 1.
It should be further noted that the core board 1 includes a base material layer 12 and copper layers 13 respectively covering the upper and lower surfaces of the base material layer 12.
The beneficial effects of the utility model are as follows: through the arrangement of the mounting holes in the core plate in a penetrating way, then the copper blocks are embedded, and the prepreg bonding layer is arranged in the gap between the mounting holes and the copper blocks, so that the copper blocks are embedded on the single-layer core plate, and the design requirement of local heat dissipation of the PCB is met.
The embodiments of the present application have been described above with reference to the accompanying drawings, but the present application is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many forms may be made by those of ordinary skill in the art without departing from the spirit of the present application and the scope of the claims, which are also within the protection of the present application.
Claims (3)
1. The utility model provides a two-sided circuit board of local embedded copper, its characterized in that includes core, copper billet and prepreg adhesive linkage, the core runs through and is equipped with the mounting hole, the copper billet is inlayed and is located in the mounting hole and pass through prepreg adhesive linkage with the core is fixed, the copper billet with the interval sets up between the core, prepreg adhesive linkage fill in the copper billet with in the clearance between the core, the upper and lower surface of copper billet with the upper and lower surface of core is parallel and level respectively, the core includes the substrate layer and covers respectively in the copper layer of substrate layer upper and lower surface.
2. The partially copper-clad double-sided circuit board according to claim 1, wherein the mounting hole is any one of a circular hole, a rectangular hole, an elliptical hole, a triangular hole, and an irregular polygonal hole.
3. The partially copper-clad double-sided circuit board according to claim 2, wherein the copper block has a cross-sectional shape conforming to the shape of the mounting hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321122923.5U CN220235046U (en) | 2023-05-11 | 2023-05-11 | Double-sided circuit board with partially embedded copper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321122923.5U CN220235046U (en) | 2023-05-11 | 2023-05-11 | Double-sided circuit board with partially embedded copper |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220235046U true CN220235046U (en) | 2023-12-22 |
Family
ID=89178536
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321122923.5U Active CN220235046U (en) | 2023-05-11 | 2023-05-11 | Double-sided circuit board with partially embedded copper |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220235046U (en) |
-
2023
- 2023-05-11 CN CN202321122923.5U patent/CN220235046U/en active Active
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