CN207720517U - A kind of RF tag plate of compound solder mask structure - Google Patents
A kind of RF tag plate of compound solder mask structure Download PDFInfo
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- CN207720517U CN207720517U CN201820114334.5U CN201820114334U CN207720517U CN 207720517 U CN207720517 U CN 207720517U CN 201820114334 U CN201820114334 U CN 201820114334U CN 207720517 U CN207720517 U CN 207720517U
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- solder mask
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Abstract
The utility model discloses a kind of RF tag plates of compound solder mask structure, are related to circuit board technology field；Including base material, bottom and compound solder mask, wherein the lower surface of the compound solder mask is close to the upper surface of base material, and the lower surface of the base material is close to the upper surface of the bottom；The compound solder mask is made of two or more solder masks, including the first solder mask and the second solder mask, and the lower surface of the first solder mask is mutually close to the upper surface of the second solder mask, and the lower surface of the second solder mask is mutually close to the upper surface of base material；The thickness of first solder mask is 20 30 um, and the thickness of the second solder mask is 30 40 um；The utility model has the beneficial effects that：The thickness of compound solder mask entirety is promoted to 70 um or so, and the thickness of compound solder mask meets the condition of Laser Jet.
Description
Technical field
The utility model is related to wiring board technology fields, more specifically, the utility model is related to a kind of compound welding resistance oil
The RF tag plate of ink structure.
Background technology
Pcb board, also known as printed circuit board, printed wiring board, abbreviation printed board are cut into a scale using insulation board as base material
Very little, at least attached thereon there are one conductive patterns, and are furnished with hole（Such as component hole, fastener hole, plated through-hole）, and realize electronics member
Interconnection between device.Since this plate is made of electron printing, therefore it is referred to as " printing " circuit board.
A kind of rf board in the prior art has solder mask, it is often necessary to Laser Jet is carried out, and it is in the prior art
Only there is single color, thickness generally in 10-20 um, cannot meet the needs of Laser Jet for rf board, solder mask.
Utility model content
For overcome the deficiencies in the prior art, the utility model provides a kind of RF tag of compound solder mask structure
The compound solder mask of plate, the RF tag plate of the compound solder mask structure is made of two or more solder masks, and hardness meets
The required condition of Laser Jet.
Technical solution adopted by the utility model to solve its technical problems is：A kind of radio frequency of compound solder mask structure
Tag board thes improvement is that：Including base material, bottom and compound solder mask, wherein the lower surface of the compound solder mask
It is close to the upper surface of base material, the lower surface of the base material is close to the upper surface of the bottom；
The compound solder mask is made of two or more solder masks, including the first solder mask and the second solder mask, and
The lower surface of first solder mask is mutually close to the upper surface of the second solder mask, the lower surface of the second solder mask and the upper surface of base material
Mutually it is close to；The thickness of first solder mask is 20-30 um, and the thickness of the second solder mask is 30-40 um.
In such a configuration, first solder mask is the solder mask of white.
In such a configuration, second solder mask is the solder mask of green or black.
In such a configuration, the thickness of first solder mask is 20 um, and the thickness of second solder mask is 40
The thickness of um, compound solder mask are 60 um.
In such a configuration, the thickness of first solder mask is 30 um, and the thickness of second solder mask is 40
The thickness of um, compound solder mask are 70 um.
The utility model has the beneficial effects that：The RF tag plate of such compound solder mask structure of the utility model,
Its compound solder mask has the color of a variety of mixing, and the thickness of compound solder mask entirety is promoted to 70 um or so, compound resistance
The thickness of layer meets the condition of Laser Jet.
Description of the drawings
Fig. 1 is a kind of structural schematic diagram of the RF tag plate of compound solder mask structure of the utility model.
Specific implementation mode
The utility model is further illustrated with reference to the accompanying drawings and examples.
The technique effect of the design of the utility model, concrete structure and generation is carried out below with reference to embodiment and attached drawing
It clearly and completely describes, to be completely understood by the purpose of this utility model, feature and effect.Obviously, described embodiment
It is a part of the embodiment of the utility model, rather than whole embodiments, it is based on the embodiments of the present invention, the skill of this field
The other embodiment that art personnel are obtained without creative efforts belongs to the model of the utility model protection
It encloses.In addition, all connection/connection relations arrived involved in patent, not singly refer to component and directly connect, and referring to can be according to specific
Performance, by adding or reducing couple auxiliary, to form more preferably coupling structure.Each skill in the utility model creation
Art feature, can be with combination of interactions under the premise of not conflicting conflict.
Shown in referring to Fig.1, the utility model discloses a kind of RF tag plate of compound solder mask structure, specifically,
The RF tag plate of the compound solder mask structure includes base material 10, bottom 30 and compound solder mask 20, wherein described compound
The lower surface of solder mask 20 is close to the upper surface of base material 10, and the lower surface of the base material 10 and the upper surface of the bottom 30 are tight
Patch；Further, the compound solder mask 20 is made of two or more solder masks, in the present embodiment, compound solder mask
20 include the first solder mask 201 and the second solder mask 202, and the lower surface of the first solder mask 201 and the second solder mask 202 is upper
Surface is mutually close to, and the lower surface of the second solder mask 202 is mutually close to the upper surface of base material 10；The thickness of first solder mask 201
Degree is 20-30 um, and the thickness of the second solder mask 202 is 30-40 um.
In the above-described embodiment, first solder mask 201 is the solder mask of white, first solder mask 201
Thickness be 30 um；Second solder mask 202 is the solder mask of green or black, the thickness of second solder mask 202
For 40 um, therefore the whole thickness of compound solder mask 20 is 70 um.
By above-mentioned structure, the RF tag plate of such compound solder mask structure of the utility model, compound resistance
Layer 20 has the color of a variety of mixing, and the thickness of 20 entirety of compound solder mask is promoted to 70 um or so, compound solder mask
20 thickness meets the condition of Laser Jet.
It is to be illustrated to the preferable implementation of the utility model, but the utility model creation is not limited to institute above
Embodiment is stated, those skilled in the art can also make various be equal without departing from the spirit of the present invention
Deformation is replaced, these equivalent deformations or replacement are all contained in the application claim limited range.
Claims (5)
1. a kind of RF tag plate of compound solder mask structure, it is characterised in that：Including base material, bottom and compound welding resistance
Layer, wherein the lower surface of the compound solder mask is close to the upper surface of base material, the lower surface of the base material and the bottom
It is close to upper surface；
The compound solder mask is made of two or more solder masks, including the first solder mask and the second solder mask, and first
The lower surface of solder mask is mutually close to the upper surface of the second solder mask, and the lower surface of the second solder mask and the upper surface of base material are mutually tight
Patch；The thickness of first solder mask is 20-30 um, and the thickness of the second solder mask is 30-40 um.
2. a kind of RF tag plate of compound solder mask structure according to claim 1, it is characterised in that：Described
One solder mask is the solder mask of white.
3. a kind of RF tag plate of compound solder mask structure according to claim 1 or 2, it is characterised in that：It is described
The second solder mask be green or black solder mask.
4. a kind of RF tag plate of compound solder mask structure according to claim 1, it is characterised in that：Described first
The thickness of solder mask is 20 um, and the thickness of second solder mask is 40 um, and the thickness of compound solder mask is 60 um.
5. a kind of RF tag plate of compound solder mask structure according to claim 1, it is characterised in that：Described first
The thickness of solder mask is 30 um, and the thickness of second solder mask is 40 um, and the thickness of compound solder mask is 70 um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820114334.5U CN207720517U (en) | 2018-01-23 | 2018-01-23 | A kind of RF tag plate of compound solder mask structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820114334.5U CN207720517U (en) | 2018-01-23 | 2018-01-23 | A kind of RF tag plate of compound solder mask structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207720517U true CN207720517U (en) | 2018-08-10 |
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ID=63052633
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820114334.5U Active CN207720517U (en) | 2018-01-23 | 2018-01-23 | A kind of RF tag plate of compound solder mask structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207720517U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109228707A (en) * | 2018-08-27 | 2019-01-18 | 郑州云海信息技术有限公司 | A kind of bar code production method on PCB |
-
2018
- 2018-01-23 CN CN201820114334.5U patent/CN207720517U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109228707A (en) * | 2018-08-27 | 2019-01-18 | 郑州云海信息技术有限公司 | A kind of bar code production method on PCB |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: RF tag board with composite solder resist ink structure Effective date of registration: 20220526 Granted publication date: 20180810 Pledgee: Shenzhen Branch of Guoren Property Insurance Co.,Ltd. Pledgor: LETTER IN AINO RF CIRCUIT (SHENZHEN) Co.,Ltd. Registration number: Y2022980006487 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right |