CN207604002U

CN207604002U - A kind of blind buried via hole plate of new structure

Info

Publication number: CN207604002U
Application number: CN201721728332.7U
Authority: CN
Inventors: 陈裕斌; 江涛; 余东良; 江善华
Original assignee: Shenzhen Hui He Precision Circuit Co Ltd
Current assignee: Shenzhen Hui He Precision Circuit Co Ltd
Priority date: 2017-12-11
Filing date: 2017-12-11
Publication date: 2018-07-10
Anticipated expiration: 2027-12-11

Abstract

The utility model discloses a kind of blind buried via hole plates of new structure, are related to technical field of PCB board；Including the first core layer, the first PP layers, the second core layer, the 2nd PP layers and third core layer；Described first PP layers be arranged between the first core layer and the second core layer, the described 2nd PP layers be arranged between the second core layer and third core layer；First core layer, the first PP layers, the second core layer, be both provided with perforative conductive through hole in the 2nd PP layers and third core layer；A blind buried via hole is both provided in first core layer, the second core layer and third core layer, and there is electro-coppering in blind buried via hole；The beneficial effects of the utility model are：It avoids that wraping plate occurs in pressing process, and causes scrapping for pcb board；By the design of blind buried via hole, make to realize between multiple core layers and electrically conduct, be electrically connected so that being realized between each sandwich circuit, improve multiple-plate density, reduce the number of plies.

Description

A kind of blind buried via hole plate of new structure

Technical field

The utility model is related to technical field of PCB board, more specifically, the utility model is related to a kind of the blind of new structure Buried via hole plate.

Background technology

It is to improve multi-layer board density with blind hole and buried via hole, reduces the effective ways of the number of plies and plate face size, and subtracts significantly The quantity of plated through hole is lacked.The English of blind hole is Blind Via, and it is on one side on the surface of plank which, which has, is then communicated to plate Until the inside of son.Connect the via hole of surface layer and internal layer without penetrating through full page.Blind hole be located at printed wiring board top layer and Bottom surface has certain depth, and for the connection of surface line and following internal layer circuit, the depth in hole is typically not greater than one Fixed ratio (aperture).Buried via hole refer to connect internal layer between and in the sightless via hole in production board surface layer.When multi-layer board is laminated, Being easy to, because wraping plate occurs due to structure is asymmetric, pcb board be caused to scrap in pressing process.

Utility model content

For overcome the deficiencies in the prior art, the utility model provides a kind of blind buried via hole plate of new structure, the novel knot The blind buried via hole plate of structure makes to realize between multiple core layers and electrically conducted by the design of blind buried via hole so that each sandwich circuit it Between realize be electrically connected.

Technical solution is used by the utility model solves its technical problem：A kind of blind buried via hole plate of new structure, It thes improvement is that：Including the first core layer, the first PP layers, the second core layer, the 2nd PP layers and third core layer；

Described first PP layers be arranged between the first core layer and the second core layer, the described 2nd PP layers be arranged on Between two core layers and third core layer；

First core layer, the first PP layers, the second core layer, be both provided in the 2nd PP layers and third core layer Perforative conductive through hole；

A blind buried via hole, and blind buried via hole are both provided in first core layer, the second core layer and third core layer It is interior that there is electro-coppering；Blind buried via hole in first core layer is used to that the circuit of the first core layer upper and lower surface to be made to electrically conduct, Blind buried via hole in second core layer is for making the circuit of the second core layer upper and lower surface electrically conduct, the third core layer On blind buried via hole for the circuit of third core layer upper and lower surface to be made to electrically conduct.

In such a configuration, the blind buried via hole plate of the new structure further includes the first solder mask and the second solder mask, First solder mask is coated on the upper surface of first core layer, and second solder mask is coated on described the The lower surface of three core layers, the conductive through hole is through the first solder mask and the second solder mask.

In such a configuration, first solder mask and the second solder mask green ink, black ink, reddish oil Ink, blue ink, white ink or Yellow ink；Circuit is mutual when first solder mask and the second solder mask are for preventing welding Interference.

In such a configuration, the described first PP layers and the 2nd PP layer of material is epoxy resin and glass fabric, For avoiding interfering with each other between the first core layer, the second core layer and third core layer.

In such a configuration, the upper surface of first solder mask and the lower surface of the second solder mask are also respectively provided with One surface-treated layer.

The beneficial effects of the utility model are：It avoids that wraping plate occurs in pressing process, and causes scrapping for pcb board；It is logical The design of blind buried via hole is crossed, makes to realize between multiple core layers and electrically conducts, is electrically connected so that being realized between each sandwich circuit, Multiple-plate density is improved, reduces the number of plies.

Description of the drawings

Fig. 1 is a kind of schematic cross-section of the blind buried via hole plate of new structure of the utility model.

Specific embodiment

The utility model is further illustrated with reference to the accompanying drawings and examples.

The technique effect of the design of the utility model, concrete structure and generation is carried out below with reference to embodiment and attached drawing It clearly and completely describes, to be completely understood by the purpose of this utility model, feature and effect.Obviously, described embodiment It is the part of the embodiment rather than whole embodiments of the utility model, the embodiment based on the utility model, the skill of this field The other embodiment that art personnel are obtained without creative efforts belongs to the model of the utility model protection It encloses.In addition, all connection/connection relations arrived involved in patent, not singly refer to component and directly connect, and refer to can be according to specific Performance, by adding or reducing couple auxiliary, to form more preferably coupling structure.Each skill in the utility model creation Art feature, can be with combination of interactions under the premise of not conflicting conflict.

With reference to shown in Fig. 1, the utility model discloses a kind of blind buried via hole plate of new structure, in the present embodiment, novel The blind buried via hole plate of structure includes the first core layer 101, the first PP layers 102, the second core layer 103, the 2nd PP layers 104 and third Core layer 105；The first PP layers 102 are arranged between the first core layer 101 and the second core layer 103, and described second PP layers 104 are arranged between the second core layer 103 and third core layer 105；In addition, the blind buried via hole plate of the new structure is also Including the first solder mask 106 and the second solder mask 107, first solder mask 106 is coated on first core layer 101 Upper surface, second solder mask 107 is coated on the lower surface of the third core layer 105, first welding resistance Layer 106 and 107 green ink of the second solder mask, black ink, red ink, blue ink, white ink or Yellow ink； Circuit interferes with each other or upper tin when first solder mask 106 and the second solder mask 107 are for preventing welding, avoids the short of heterogeneous networks Road, while prevent copper face from aoxidizing and corroding.The upper surface of first solder mask 106 and the lower surface of the second solder mask 107 are also A surface-treated layer is respectively arranged with, which is usually any one in turmeric, spray tin or electricity gold, mainly for It prevents copper face from aoxidizing and corroding, tin is easily gone up when being welded convenient for electronic component.

In the above-described embodiment, the material of the first PP layers 102 and the 2nd PP layers 104 is epoxy resin and glass Fiber cloth, for avoiding interfering with each other between the first core layer 101, the second core layer 103 and third core layer 105.

Further, first core layer 101, the first PP layers 102, the second core layer 103, the 2nd PP layers 104 with And perforative conductive through hole 108 is both provided in third core layer 105, the conductive through hole 108 is through 106 He of the first solder mask Second solder mask 107；One is both provided in first core layer 101, the second core layer 103 and third core layer 105 Blind buried via hole 109, and there is electro-coppering in blind buried via hole 109；Blind buried via hole 109 in first core layer 101 is used to make the first core The circuit of 101 upper and lower surface of plate layer electrically conducts, and the blind buried via hole 109 in second core layer 103 is used to make the second core layer The circuit of 103 upper and lower surfaces electrically conducts, and the blind buried via hole 109 in the third core layer 105 is used to make third core layer 105 The circuit of lower surface electrically conducts；In the above-described embodiment, the blind buried via hole 109 in the second core layer 103 is located at center, Blind buried via hole 109 in first core layer 101 and third core layer 105 is located at two of the blind buried via hole 109 in the second core layer 103 Side forms symmetrical structure, avoids that wraping plate occurs in pressing process, and causes scrapping for pcb board.Pass through blind buried via hole 109 Design, makes to realize between multiple core layers and electrically conducts, and is electrically connected so that being realized between each sandwich circuit, raising multi-layer board Density, reduce the number of plies.

It is the preferable of the utility model to be implemented to be illustrated, but the utility model creation is not limited to institute above Embodiment is stated, those skilled in the art can also make various be equal without departing from the spirit of the present invention Deformation is replaced, these equivalent deformations or replacement are all contained in the application claim limited range.

Claims

1. a kind of blind buried via hole plate of new structure, it is characterised in that：Including the first core layer, the first PP layers, the second core layer, Two PP layers and third core layer；

Described first PP layers be arranged between the first core layer and the second core layer, the described 2nd PP layers be arranged on the second core Between plate layer and third core layer；

First core layer, the first PP layers, the second core layer, be both provided in the 2nd PP layers and third core layer and run through Conductive through hole；

A blind buried via hole is both provided in first core layer, the second core layer and third core layer, and is had in blind buried via hole There is electro-coppering；Blind buried via hole in first core layer is described for the circuit of the first core layer upper and lower surface to be made to electrically conduct Blind buried via hole in second core layer is for making the circuit of the second core layer upper and lower surface electrically conduct, in the third core layer Blind buried via hole is used to that the circuit of third core layer upper and lower surface to be made to electrically conduct.

2. a kind of blind buried via hole plate of new structure according to claim 1, it is characterised in that：The new structure it is blind Buried via hole plate further includes the first solder mask and the second solder mask, and first solder mask is coated on the upper of first core layer Surface, second solder mask are coated on the lower surface of the third core layer, and the conductive through hole is through first Solder mask and the second solder mask.

3. a kind of blind buried via hole plate of new structure according to claim 2, it is characterised in that：First solder mask and Second solder mask green ink, black ink, red ink, blue ink, white ink or Yellow ink；First solder mask Circuit interferes with each other during with the second solder mask for preventing welding.

4. a kind of blind buried via hole plate of new structure according to claim 1, it is characterised in that：Described first PP layers and the Two PP layers of material is epoxy resin and glass fabric, for avoiding the first core layer, the second core layer and third core plate Interfering with each other between layer.

5. a kind of blind buried via hole plate of new structure according to claim 2, it is characterised in that：First solder mask it is upper Surface and the lower surface of the second solder mask are also respectively provided with a surface-treated layer.