CN207603989U - A kind of control deep drilling plate of high-density multi-layered wiring - Google Patents
A kind of control deep drilling plate of high-density multi-layered wiring Download PDFInfo
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- CN207603989U CN207603989U CN201721719643.7U CN201721719643U CN207603989U CN 207603989 U CN207603989 U CN 207603989U CN 201721719643 U CN201721719643 U CN 201721719643U CN 207603989 U CN207603989 U CN 207603989U
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- layer
- copper foil
- layers
- solder mask
- foil layer
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model discloses a kind of control deep drilling plates of high-density multi-layered wiring, are related to technical field of PCB board；Including the first solder mask, the first copper foil layer, the first PP layers, the first core layer, the 2nd PP layers, the second core layer, the 3rd PP layers, the second copper foil layer and the second solder mask；First PP layers be arranged between the first copper foil layer and the first core layer, the 2nd PP layers be arranged between the first core layer and the second core layer, the 3rd PP layers be arranged between the second core layer and the second copper foil layer；First solder mask is coated on the upper surface of the first copper foil layer, and the second solder mask is coated on the lower surface of the second solder mask；First solder mask, the first copper foil layer, the control deep hole being provided through in the first PP layers and the first core layer, the control deep hole are used to implement electrically conducting for the first copper foil layer and the first core layer；The beneficial effects of the utility model are：With different levels conducting in the middle part of entire control deep drilling plate is realized, so as to fulfill the demand of highdensity multilayer wiring.
Description
Technical field
The utility model is related to technical field of PCB board, more specifically, high-density multi-layered matching the utility model is related to a kind of
The control deep drilling plate of line.
Background technology
With the rapid development of electronics and information industry, the update of electronic product is accelerated, and the speed of digital operation is more next
Faster, signal frequency is higher and higher, requires the features such as resistance to high current, high temperature resistant, and electronic product is small-sized increasingly to integrated
Change, multifunction development, this just proposes more requirements to circuit board industry on technology, technique and material.Particularly use
In Aeronautics and Astronautics, satellite communication, navigation, radar, the multilayer circuit board in the fields such as electronic countermeasure and 3G communications.In the prior art
Multi-layer PCB board, due to the limitation of structure, can not realize the direct conducting between different levels, cause pcb board that cannot meet height
The demand of density.
Utility model content
For overcome the deficiencies in the prior art, the utility model provides a kind of control deep drilling plate of high-density multi-layered wiring, this
The presence for controlling deep drilling plate by controlling deep hole is planted, the conducting between different laminates is realized, realizes highdensity multilayer wiring.
Technical solution is used by the utility model solves its technical problem：A kind of control deep drilling of high-density multi-layered wiring
Plate thes improvement is that：Including the first solder mask, the first copper foil layer, the first PP layers, the first core layer, the 2nd PP layers, second
Core layer, the 3rd PP layers, the second copper foil layer and the second solder mask；
Described first PP layers be arranged between the first copper foil layer and the first core layer, the described 2nd PP layers be arranged on
Between one core layer and the second core layer, the described 3rd PP layers be arranged between the second core layer and the second copper foil layer；It is described
The first solder mask be coated on the upper surface of the first copper foil layer, second solder mask is coated on the lower surface of the second solder mask；
First solder mask, the first copper foil layer, the first PP layers, the first core layer, the 2nd PP layers, the second core layer,
The conductive through hole being provided through on 3rd PP layers, the second copper foil layer and the second solder mask, the conductive through hole is for making first
It realizes and electrically conducts between copper foil layer, the first core layer, the second core layer and the second copper foil layer；
First solder mask, the first copper foil layer, the control that is provided through in the first PP layers and the first core layer are deep
Hole, the control deep hole are used to implement electrically conducting for the first copper foil layer and the first core layer.
In such a configuration, first solder mask and the second solder mask green ink, black ink, reddish oil
Ink, blue ink, white ink or Yellow ink；Circuit is mutual when first solder mask and the second solder mask are for preventing welding
Interference.
In such a configuration, first copper foil layer and the second copper foil layer are routing layer or shielded layer, the first copper foil
Welding electronic component is used on layer and the second copper foil layer.
In such a configuration, the described first PP layers, the 2nd PP layers and the 3rd PP layers of material for epoxy resin and
Glass fabric, for avoiding interfering with each other between the first copper foil layer and the second copper foil layer.
The beneficial effects of the utility model are：Control deep hole is used to implement the first copper foil layer and is led with the electrical of the first core layer
It is logical；So as to fulfill electrically conducting for the first core layer of outermost one layer of the first copper foil layer and internal layer, entire control deep drilling is realized
With different levels conducting in the middle part of plate, so as to fulfill the demand of highdensity multilayer wiring.
Description of the drawings
Fig. 1 is a kind of schematic cross-section of the control deep drilling plate of high-density multi-layered wiring of the utility model.
Specific embodiment
The utility model is further illustrated with reference to the accompanying drawings and examples.
The technique effect of the design of the utility model, concrete structure and generation is carried out below with reference to embodiment and attached drawing
It clearly and completely describes, to be completely understood by the purpose of this utility model, feature and effect.Obviously, described embodiment
It is the part of the embodiment rather than whole embodiments of the utility model, the embodiment based on the utility model, the skill of this field
The other embodiment that art personnel are obtained without creative efforts belongs to the model of the utility model protection
It encloses.In addition, all connection/connection relations arrived involved in patent, not singly refer to component and directly connect, and refer to can be according to specific
Performance, by adding or reducing couple auxiliary, to form more preferably coupling structure.Each skill in the utility model creation
Art feature, can be with combination of interactions under the premise of not conflicting conflict.
With reference to shown in Fig. 1, the utility model discloses a kind of control deep drilling plate of high-density multi-layered wiring, in the present embodiment
In, including the first solder mask 101, the first copper foil layer 102, the first PP layers 103, the first core layer 104, the 2nd PP layers 105, second
Core layer 106, the 3rd PP layers 107, the second copper foil layer 108 and the second solder mask 109；The first PP layers 103 are arranged on
Between first copper foil layer 102 and the first core layer 104, the 2nd PP layers 105 are arranged on the first core layer 104 and the second core
Between plate layer 106, the 3rd PP layers 107 are arranged between the second core layer 106 and the second copper foil layer 108；Described
One solder mask 101 is coated on the upper surface of the first copper foil layer 102, and second solder mask 109 is coated on the second solder mask 109
Lower surface；It also needs to be surface-treated on first solder mask 101, general surface treatment is turmeric, spray tin or electricity are golden wherein
Any one, mainly prevents copper face oxidation, corrosion, tin is easily gone up when being welded convenient for electronic component.Further, described
One solder mask 101, the first copper foil layer 102, the first PP layers 103, the first core layer 104, the 2nd PP layers 105, the second core layer
106th, the conductive through hole 110 being provided through on the 3rd PP layers 107, the second copper foil layer 108 and the second solder mask 109, this is led
Electric through-hole 110 is used to make between the first copper foil layer 102, the first core layer 104, the second core layer 106 and the second copper foil layer 108
Realization electrically conducts；In addition, first solder mask 101, the first copper foil layer 102, the first PP layers 103 and the first core layer
The control deep hole 111 being provided through on 104, the control deep hole 111 are used to implement the first copper foil layer 102 and the first core layer 104
It electrically conducts；So as to fulfill electrically conducting for outermost one layer of the first copper foil layer 102 and the first core layer 104 of internal layer, realize
With different levels conducting in the middle part of entire control deep drilling plate, so as to fulfill the demand of highdensity multilayer wiring.
In the above-described embodiment, first copper foil layer 102 and the second copper foil layer 108 are routing layer or shielded layer,
First copper foil layer 102 with connecting for welding electronic component and network is used on the second copper foil layer 108, in addition it can fine
Conduct shielding electromagnetic radiation layer, reduce loss of signal output, also avoid pollute and human body is damaged.It is in addition, described
109 green ink of the first solder mask 101 and the second solder mask, black ink, red ink, blue ink, white ink or
Person's Yellow ink；Circuit interferes with each other or upper tin when first solder mask 101 and the second solder mask 109 are for preventing welding, avoids
It is short-circuit caused by heterogeneous networks, it is also prevented from copper face oxidation and corrosion.First PP layers 103, the 2nd PP layers 105 and the third
The material of PP layers 107 is epoxy resin and glass fabric, for avoiding between the first copper foil layer 102 and the second copper foil layer 108
Interfere with each other, convenient between layers of copper well combine, it is fire-retardant and insulation.
It is the preferable of the utility model to be implemented to be illustrated, but the utility model creation is not limited to institute above
Embodiment is stated, those skilled in the art can also make various be equal without departing from the spirit of the present invention
Deformation is replaced, these equivalent deformations or replacement are all contained in the application claim limited range.
Claims (4)
1. a kind of control deep drilling plate of high-density multi-layered wiring, it is characterised in that：Including the first solder mask, the first copper foil layer, first
PP layers, the first core layer, the 2nd PP layers, the second core layer, the 3rd PP layers, the second copper foil layer and the second solder mask；
Described first PP layers be arranged between the first copper foil layer and the first core layer, the described 2nd PP layers be arranged on the first core
Between plate layer and the second core layer, the described 3rd PP layers be arranged between the second core layer and the second copper foil layer；Described
One solder mask is coated on the upper surface of the first copper foil layer, and second solder mask is coated on the lower surface of the second solder mask；
First solder mask, the first copper foil layer, the first PP layers, the first core layer, the 2nd PP layers, the second core layer, third
The conductive through hole being provided through on PP layers, the second copper foil layer and the second solder mask, the conductive through hole are used to make the first copper foil
It realizes and electrically conducts between layer, the first core layer, the second core layer and the second copper foil layer；
First solder mask, the first copper foil layer, the control deep hole being provided through in the first PP layers and the first core layer, should
Control deep hole is used to implement electrically conducting for the first copper foil layer and the first core layer.
2. a kind of control deep drilling plate of high-density multi-layered wiring according to claim 1, it is characterised in that：First resistance
Layer and the second solder mask green ink, black ink, red ink, blue ink, white ink or Yellow ink；First
Circuit interferes with each other when solder mask and the second solder mask are for preventing welding.
3. a kind of control deep drilling plate of high-density multi-layered wiring according to claim 1, it is characterised in that：First bronze medal
Layers of foil and the second copper foil layer are routing layer or shielded layer, and welding electronic component is used on the first copper foil layer and the second copper foil layer.
4. a kind of control deep drilling plate of high-density multi-layered wiring according to claim 1, it is characterised in that：First PP
Layer, the 2nd PP layer and the 3rd PP layers material be epoxy resin and glass fabric, for avoiding the first copper foil layer and second
Interfering with each other between copper foil layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721719643.7U CN207603989U (en) | 2017-12-11 | 2017-12-11 | A kind of control deep drilling plate of high-density multi-layered wiring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721719643.7U CN207603989U (en) | 2017-12-11 | 2017-12-11 | A kind of control deep drilling plate of high-density multi-layered wiring |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207603989U true CN207603989U (en) | 2018-07-10 |
Family
ID=62764499
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721719643.7U Expired - Fee Related CN207603989U (en) | 2017-12-11 | 2017-12-11 | A kind of control deep drilling plate of high-density multi-layered wiring |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207603989U (en) |
-
2017
- 2017-12-11 CN CN201721719643.7U patent/CN207603989U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180710 Termination date: 20211211 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |