CN207603988U - A kind of high frequency mixed pressure blind hole plate - Google Patents
A kind of high frequency mixed pressure blind hole plate Download PDFInfo
- Publication number
- CN207603988U CN207603988U CN201721719338.8U CN201721719338U CN207603988U CN 207603988 U CN207603988 U CN 207603988U CN 201721719338 U CN201721719338 U CN 201721719338U CN 207603988 U CN207603988 U CN 207603988U
- Authority
- CN
- China
- Prior art keywords
- copper foil
- high frequency
- layers
- foil layer
- core plates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model discloses a kind of high frequency mixed pressure blind hole plates, are related to technical field of PCB board；Including high frequency ROGERS core plates, the first PP layers, the first copper foil layer, the 2nd PP layers, 4 core plates of FR, the 3rd PP layers and the second copper foil layer；First PP layers be arranged between high frequency ROGERS core plates and the first copper foil layer, the 2nd PP layers be arranged between 4 core plate of the first copper foil layer and FR, the 3rd PP layers be arranged between 4 core plates of FR and the second copper foil layer；High frequency ROGERS core plates, the first PP layers, the first copper foil layer, the 2nd PP layers, 4 core plates of FR, the 3rd PP layers and the second copper foil layer be both provided with perforative conductive through hole, which electrically conducts for will be formed between high frequency ROGERS core plates, the first copper foil layer and the second copper foil layer；High frequency ROGERS core plates are pressed with high frequency thermosetting property ceramic carbon hydrogen compound material by copper foil and are formed；The beneficial effects of the utility model are：High-frequency signal can export faster, reduce energy consumption, avoid interfering with each other and being connected between layers of copper.
Description
Technical field
The utility model is related to technical field of PCB board, more specifically, the utility model is related to a kind of high frequency mixed pressure blind holes
Plate.
Background technology
With the rapid development of electronics and information industry, the update of electronic product is accelerated, and the speed of digital operation is more next
Faster, signal frequency is higher and higher, requires the features such as resistance to high current, high temperature resistant, and electronic product is small-sized increasingly to integrated
Change, multifunction development, this just proposes more requirements to circuit board industry on technology, technique and material.Particularly use
In Aeronautics and Astronautics, satellite communication, navigation, radar, the multilayer circuit board in the fields such as electronic countermeasure and 3G communications.General T g's is more
Sandwich circuit board is due to non-refractory, the use that dielectric constant is high, loss very much not adapts to these occasion electronic products.The prior art
High frequency pcb board, the output of high-frequency signal is slower, and energy consumption is higher, even will appear between multiple layers of copper and interferes with each other or lead
It is logical.
Utility model content
For overcome the deficiencies in the prior art, the utility model provides a kind of high frequency mixed pressure blind hole plate, and the high frequency mixed pressure is blind
Orifice plate can be such that high-frequency signal exports faster, while reduce energy consumption, avoid interfering with each other and being connected between layers of copper.
Technical solution is used by the utility model solves its technical problem：A kind of high frequency mixed pressure blind hole plate improves
Part is：Including high frequency ROGERS core plates, the first PP layers, the first copper foil layer, the 2nd PP layers, FR-4 core plates, the 3rd PP layers with
And second copper foil layer；
Described first PP layers be arranged between high frequency ROGERS core plates and the first copper foil layer, the 2nd PP layers of setting
Between the first copper foil layer and FR-4 core plates, the described 3rd PP layers be arranged between FR-4 core plates and the second copper foil layer；
The high frequency ROGERS core plates, the first PP layers, the first copper foil layer, the 2nd PP layers, FR-4 core plates, the 3rd PP layers with
And second copper foil layer be both provided with perforative conductive through hole, which is used for high frequency ROGERS core plates, the first copper foil layer
And second form between copper foil layer and electrically conduct；
The high frequency ROGERS core plates are pressed with high frequency thermosetting property ceramic carbon hydrogen compound material by copper foil and are formed.
In such a configuration, the high frequency mixed pressure blind hole plate further includes the first solder mask and the second solder mask, described
The first solder mask be coated on the upper surfaces of the high frequency ROGERS core plates, second solder mask is coated on described the
The lower surface of two copper foil layers.
In such a configuration, first solder mask and the second solder mask green ink, black ink, reddish oil
Ink, blue ink, white ink or Yellow ink；Circuit is mutual when first solder mask and the second solder mask are for preventing welding
Interference.
In such a configuration, first copper foil layer and the second copper foil layer are routing layer or shielded layer, the first copper foil
Welding electronic component is used on layer and the second copper foil layer.
In such a configuration, the described first PP layers, the 2nd PP layers and the 3rd PP layers of material for epoxy resin and
Glass fabric, for avoiding interfering with each other between the first copper foil layer and the second copper foil layer.
In such a configuration, the high frequency ROGERS core plates are provided with multiple blind holes.
The beneficial effects of the utility model are：High frequency ROGERS core plates are by copper foil and high frequency thermosetting property ceramic carbon hydrogen compound
Material presses to be formed, so that high-frequency signal can export faster, reduces energy consumption, while more have convenient for high-rise intensive pcb board
Effect is manufactured, while avoid interfering with each other and being connected between layers of copper, convenient for combination, fire-retardant and insulation well between layers of copper.
Description of the drawings
Fig. 1 is a kind of schematic cross-section of high frequency mixed pressure blind hole plate of the utility model.
Specific embodiment
The utility model is further illustrated with reference to the accompanying drawings and examples.
The technique effect of the design of the utility model, concrete structure and generation is carried out below with reference to embodiment and attached drawing
It clearly and completely describes, to be completely understood by the purpose of this utility model, feature and effect.Obviously, described embodiment
It is the part of the embodiment rather than whole embodiments of the utility model, the embodiment based on the utility model, the skill of this field
The other embodiment that art personnel are obtained without creative efforts belongs to the model of the utility model protection
It encloses.In addition, all connection/connection relations arrived involved in patent, not singly refer to component and directly connect, and refer to can be according to specific
Performance, by adding or reducing couple auxiliary, to form more preferably coupling structure.Each skill in the utility model creation
Art feature, can be with combination of interactions under the premise of not conflicting conflict.
With reference to shown in Fig. 1, the utility model discloses a kind of high frequency mixed pressure blind hole plate, in the present embodiment, high frequency mixed pressure
Blind hole plate includes high frequency ROGERS core plates 101, the first PP layers 102, the first copper foil layer 103, the 2nd PP layers 104, FR-4 core plates
105th, the 3rd PP layers 106 and the second copper foil layer 107；The first PP layers 102 are arranged on high frequency ROGERS core plates 101 and
Between one copper foil layer 103, the 2nd PP layers 104 are arranged between the first copper foil layer 103 and FR-4 core plates 105, described
3rd PP layers 106 are arranged between 105 and second copper foil layer 107 of FR-4 core plates；The high frequency ROGERS core plates 101, first
PP layers 102, the first copper foil layer 103, the 2nd PP layers 104, FR-4 core plates 105, the 3rd PP layers 106 and the second copper foil layer 107 are
The conductive through hole 108 being provided through, the conductive through hole 108 be used for by high frequency ROGERS core plates 101, the first copper foil layer 103 with
And second form between copper foil layer 107 and electrically conduct；The high frequency ROGERS core plates 101 are by copper foil and high frequency thermosetting property ceramics
Hydrocarbon material presses to be formed, so that high-frequency signal can export faster, reduces energy consumption, while convenient for high-rise intensive
Pcb board is more effectively manufactured, while avoids interfering with each other and being connected between layers of copper, convenient for being combined well between layers of copper, fire-retardant
And insulation.In addition, the high frequency ROGERS core plates 101 are provided with multiple blind holes 109, convenient for the welding of electronic component.
Further, the high frequency mixed pressure blind hole plate further includes the first solder mask 110 and the second solder mask 111, described
The first solder mask 110 be coated on the upper surfaces of the high frequency ROGERS core plates 101, second solder mask 111 is coated with
In the lower surface of second copper foil layer 107；In the present embodiment, first solder mask 110 and the second solder mask 111
Green ink, black ink, red ink, blue ink, white ink or Yellow ink；First solder mask 110 and second
Circuit interferes with each other or upper tin when solder mask 111 is for preventing welding, avoids short circuit caused by heterogeneous networks, while prevent copper face
Oxidation and corrosion.
In the present embodiment, first copper foil layer 103 and the second copper foil layer 107 are routing layer or shielded layer, first
For welding electronic component on 103 and second copper foil layer 107 of copper foil layer, shielding electromagnetic radiation can be used as once, reduce signal
Loss output also avoids polluting and damaging human body；The first PP layers 102, the 2nd PP layers 104 and the 3rd PP layers
106 material is epoxy resin and glass fabric, for avoiding the phase between the first copper foil layer 103 and the second copper foil layer 107
Mutually interference, convenient for combination, fire-retardant and insulation well between layers of copper.The FR-4 core plates 105 are copper foil and PP layers of bonding
Sheet metal layer together, it is main more effectively to be manufactured convenient for high-rise intensive pcb board.
It is the preferable of the utility model to be implemented to be illustrated, but the utility model creation is not limited to institute above
Embodiment is stated, those skilled in the art can also make various be equal without departing from the spirit of the present invention
Deformation is replaced, these equivalent deformations or replacement are all contained in the application claim limited range.
Claims (6)
1. a kind of high frequency mixed pressure blind hole plate, it is characterised in that：Including high frequency ROGERS core plates, the first PP layers, the first copper foil layer,
Two PP layers, FR-4 core plates, the 3rd PP layers and the second copper foil layer；
Described first PP layers be arranged between high frequency ROGERS core plates and the first copper foil layer, the described 2nd PP layers be arranged on
Between one copper foil layer and FR-4 core plates, the described 3rd PP layers be arranged between FR-4 core plates and the second copper foil layer；
The high frequency ROGERS core plates, the first PP layers, the first copper foil layer, the 2nd PP layers, FR-4 core plates, the 3rd PP layers and
Two copper foil layers are both provided with perforative conductive through hole, the conductive through hole be used for by high frequency ROGERS core plates, the first copper foil layer and
It is formed and electrically conducted between second copper foil layer；
The high frequency ROGERS core plates are pressed with high frequency thermosetting property ceramic carbon hydrogen compound material by copper foil and are formed.
2. a kind of high frequency mixed pressure blind hole plate according to claim 1, it is characterised in that：The high frequency mixed pressure blind hole plate is also
Including the first solder mask and the second solder mask, first solder mask is coated on the upper table of the high frequency ROGERS core plates
Face, second solder mask are coated on the lower surface of second copper foil layer.
3. a kind of high frequency mixed pressure blind hole plate according to claim 2, it is characterised in that：First solder mask and second
Solder mask green ink, black ink, red ink, blue ink, white ink or Yellow ink；First solder mask and
Circuit interferes with each other when two solder masks are for preventing welding.
4. a kind of high frequency mixed pressure blind hole plate according to claim 1, it is characterised in that：First copper foil layer and second
Copper foil layer is routing layer or shielded layer, and welding electronic component is used on the first copper foil layer and the second copper foil layer.
5. a kind of high frequency mixed pressure blind hole plate according to claim 1, it is characterised in that：First PP layers, the 2nd PP
Layer and the 3rd PP layer material be epoxy resin and glass fabric, for avoiding between the first copper foil layer and the second copper foil layer
Interfere with each other.
6. a kind of high frequency mixed pressure blind hole plate according to claim 1, it is characterised in that：The high frequency ROGERS core plates are set
It is equipped with multiple blind holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721719338.8U CN207603988U (en) | 2017-12-11 | 2017-12-11 | A kind of high frequency mixed pressure blind hole plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721719338.8U CN207603988U (en) | 2017-12-11 | 2017-12-11 | A kind of high frequency mixed pressure blind hole plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207603988U true CN207603988U (en) | 2018-07-10 |
Family
ID=62765307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721719338.8U Expired - Fee Related CN207603988U (en) | 2017-12-11 | 2017-12-11 | A kind of high frequency mixed pressure blind hole plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207603988U (en) |
-
2017
- 2017-12-11 CN CN201721719338.8U patent/CN207603988U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8077472B2 (en) | Printed circuit board with tin pads | |
| US10790565B2 (en) | Cavity filter | |
| CN102088821A (en) | Electronic device with embedded electromagnetic materials | |
| CN109803481B (en) | Multilayer printed circuit board and method for manufacturing multilayer printed circuit board | |
| CN207603988U (en) | A kind of high frequency mixed pressure blind hole plate | |
| WO2020135204A1 (en) | High-frequency circuit board and manufacturing method therefor | |
| CN208093700U (en) | A kind of structure for promoting TEM all dielectric performance of filter | |
| JP4829028B2 (en) | Circuit board and circuit board manufacturing method | |
| CN204518224U (en) | A kind of metal-cored pcb board | |
| CN207603989U (en) | A kind of control deep drilling plate of high-density multi-layered wiring | |
| CN206611637U (en) | The product structure of multi-layer precise circuit is made on ceramic substrate | |
| CN207720517U (en) | A kind of RF tag plate of compound solder mask structure | |
| CN105024556A (en) | LTCC(low-temperature co-fired ceramic hybrid)-based hybrid integrated DC-DC converter and manufacture method thereof | |
| CN207340283U (en) | High-frequency multilayer printed wiring board is used in one kind communication | |
| CN208338007U (en) | A kind of bilayer microwave high-frequency printed board | |
| CN208317109U (en) | A kind of microwave board for the gold-plated structure meeting spun gold welding | |
| CN207604002U (en) | A kind of blind buried via hole plate of new structure | |
| CN207820302U (en) | A kind of new structural countersunk head orifice plate | |
| CN207040003U (en) | A kind of high-frequency microwave circuit board | |
| CN207491299U (en) | A kind of multiplayer microwave printed board | |
| CN207603987U (en) | A kind of pcb board with blind slot | |
| CN208016096U (en) | A kind of pcb board of the blue glue-line of coating | |
| CN102036472A (en) | Microwave high-frequency metal base circuit board | |
| CN210670732U (en) | Multilayer high-frequency microwave PCB | |
| JP2016171191A (en) | Wiring board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180710 Termination date: 20211211 |