CN208338007U - A kind of bilayer microwave high-frequency printed board - Google Patents
A kind of bilayer microwave high-frequency printed board Download PDFInfo
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- CN208338007U CN208338007U CN201821069790.9U CN201821069790U CN208338007U CN 208338007 U CN208338007 U CN 208338007U CN 201821069790 U CN201821069790 U CN 201821069790U CN 208338007 U CN208338007 U CN 208338007U
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Abstract
The utility model relates to a kind of double-deck microwave high-frequency printed boards, including first medium layer and second dielectric layer, the first medium layer from top to bottom successively includes: line layer, layer of dielectric material, heat dissipating layer, metal substrate, tin layers and insulating layer, the second dielectric layer from top to bottom successively includes: metal coating, microwave patch, and couple feed layer, by pasting lamella connection between the first medium layer and second dielectric layer.The line layer is equipped with several connecting holes, several heat release holes and element mounting hole.The metal substrate quadrangle, which is provided with, draws tin piece.The utility model bilayer microwave high-frequency prints the requirement that need to meet thermal conductivity, route binding force, dimensional stability, the annular groove being arranged outside connecting hole, heat release hole and element mounting hole can be when tin be crossed in printed board, extra tin solder can be adsorbed in annular groove, to prevent extra solder from gluing in nigh hole, simultaneously, the reduction that signal reflex is realized by couple feed layer, reduces noise.
Description
Technical field
The utility model relates to the technical fields of electronic component, and in particular to a kind of bilayer microwave high-frequency printed board.
Background technique
With the continuous development and progress of microwave communication techniques, the demand of microwave printed board is more and more, military-civil radar,
A large amount of electronic products such as antenna, radio and television, mobile communication, fiber optic communication, computer, household electrical appliance will use microwave print
Making sheet, still, traditional single, double surface printed board are no longer satisfied high density and high-precision requirement, print to multiplayer microwave
The process requirements of plate are increasingly urgent to.
In microwave high-frequency printed circuit board (HFPCB) industry, length is more than that the wiring board of 800mm is known as ultra-long microwave high frequency
Wiring board, manufacturer's maximum working ability 1100mm in the industry at present, more than this length generally cool occur often it is curved
The problem of song deformation, space of a whole page out-of-flatness reduce wiring board peel strength, and it is super not to be able to satisfy antenna of mobile communication base station microwave high-frequency
The high-transmission function of long transmission line plate microwave signal.
5G network seat next generation mobile communication network, highest theory is published books, and speed is reachable, and tens of Gb per second, this is than existing
Fast hundreds times of the transmission speed of row 4G network, with the continuous development of wireless communication technology, wireless sensor technology is quickly pushed away
Extensively, since wireless sense network base station high-frequency microwave signal transmission antenna wants the characteristic of hyperfrequency, high-speed transfer and broad passband
Ask higher and higher, traditional conventional microwave high frequency circuit board is unable to satisfy the characteristic of wireless sense network high frequency, high-speed transfer, there are no
Method meets 5G communication base station antenna requirement, therefore solves the problems, such as this kind of be particularly important.
Utility model content
In view of this, it is necessary to presently, there are aiming at the problem that, a kind of double-deck microwave high-frequency printed board is provided.
A kind of bilayer microwave high-frequency printed board, including first medium layer and second dielectric layer, the first medium layer is by upper
It successively include: line layer, layer of dielectric material, heat dissipating layer, metal substrate, tin layers and insulating layer, the second dielectric layer under
It from top to bottom successively include: metal coating, microwave patch and couple feed layer, the first medium layer and second dielectric layer
Between by paste lamella connection.
The line layer is equipped with several connecting holes, several heat release holes and element mounting hole.
The metal substrate quadrangle, which is provided with, draws tin piece.
The metal coating is the microstrip line of radiation patch and coplanar feed.
The upper surface of the line layer is equipped with solder mask layer.
The insulating layer uses epoxy glass cloth laminated board.
Annular groove is provided with outside the connecting hole, heat release hole and element mounting hole, the annular groove is circular ring shape.
A pilot hole is arranged in the center of the element mounting hole.
The heat dissipating layer uses aluminium alloy plate.
The stickup lamella is high temperature resistant glue-line.
The drawing tin piece is circle.
The drawing tin piece is L shape.
The utility model has the beneficial effects that
The utility model proposes a kind of double-deck microwave high-frequency printed boards, require situation meeting microwave high-frequency impedance, being lost
Under, the utility model bilayer microwave high-frequency, which is printed, need to meet the requirement of thermal conductivity, route binding force, dimensional stability, connecting hole,
Extra tin solder can be adsorbed on annular groove when tin is crossed in printed board by the annular groove being arranged outside heat release hole and element mounting hole
It is interior, thus prevent extra solder from gluing in nigh hole, meanwhile, the reduction of signal reflex is realized by couple feed layer,
Reduce noise.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the double-deck microwave high-frequency printed board in specific embodiment of the present invention.
Fig. 2 is the structural schematic diagram of line layer in specific embodiment of the present invention.
Fig. 3 is the structural schematic diagram of metal substrate in specific embodiment of the present invention.
Numeral mark in attached drawing is respectively:
1: line layer；2: layer of dielectric material；3: heat dissipating layer；4: metal substrate；5: tin layers；6: insulating layer；7: metal coating；
8: microwave patch；9: couple feed layer；10: pasting lamella；11: connecting hole；12: heat release hole；13: element mounting hole；14: drawing
Tin piece；15: solder mask layer；16: annular groove；17: pilot hole.
Specific embodiment
The embodiments of the present invention are described in detail with reference to the accompanying drawing.
Embodiment described below only expresses the several embodiments of the utility model, and the description thereof is more specific and detailed,
But it should not be understood as limiting the scope of the patent of the utility model.It should be pointed out that for the common of this field
For technical staff, without departing from the concept of the premise utility, various modifications and improvements can be made, these all belong to
In the protection scope of the utility model.Therefore, the scope of protection shall be subject to the appended claims for the utility model patent.
As electronic information technology develops, printed board needs to meet radio frequency and digital function simultaneously, design there have been
The printed board of microwave high-frequency material.Since different materials have the coefficient of expansion to expand with heat and contract with cold difference, solves printed board processing
The problem of Curved in the process.
A kind of bilayer microwave high-frequency printed board, as depicted in figs. 1 and 2, including first medium layer and second dielectric layer, it is described
First medium layer from top to bottom successively include: line layer 1, layer of dielectric material 2, heat dissipating layer 3, metal substrate 4, tin layers 5 and absolutely
Edge layer 6, the second dielectric layer from top to bottom successively include: metal coating 7, microwave patch 8 and couple feed layer 9, described
It is connected between first medium layer and second dielectric layer by pasting lamella 10.
The line layer 1 is equipped with several connecting holes 11, several heat release holes 12 and element mounting hole 13, in the present embodiment,
Metal foil layer is equipped with along inner circumferential in the connecting hole 12 and the heat release hole 13.
As shown in figure 3,4 four jiaos of the metal substrate, which is provided with, draws tin piece 14, the drawing tin piece 14 is round or L shape.
In the present embodiment, tin piece 14 is drawn to use the metal for being easy to be stained with glutinous tin material, it can be using gold or copper, when extra scolding tin material passes through
When drawing an angle of tin piece, extra scolding tin material, which is adsorbed in, to be drawn on tin piece 14, prevents the glutinous tin near the welding hole of printed board existing
The phenomenon that as causing electronic building brick short circuit or connection error.
The metal coating 7 is the microstrip line of radiation patch and coplanar feed.
In the present embodiment, the width of microstrip line is 0.6mm.
The upper surface of the line layer 1 is equipped with solder mask layer 15.
The insulating layer 6 uses epoxy glass cloth laminated board.
Annular groove 16 is provided with outside the connecting hole 11, heat release hole 12 and element mounting hole 13, the annular groove 16 is annulus
Shape.In the present embodiment, there are gaps between each annular groove 16, when tin furnace is crossed in printed board, extra tin solder can be adsorbed on ring
In slot 16, so that extra solder be prevented to be sticked in connecting hole 11, heat release hole 12 and the neighbouring hole of element mounting hole 16, electricity is caused
The short circuit or connection error of sub-component.
A pilot hole 17 is arranged in the center of the element mounting hole 13.
The heat dissipating layer 3 uses aluminium alloy plate.
In the present embodiment, the radius of connecting hole is 0.1-0.5mm.
The 10 high temperature resistant glue-line of stickup lamella.
It should be appreciated that although this specification is described in terms of embodiments, not each embodiment only includes one
Independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should be by specification
As a whole, the technical solution in each embodiment may also be suitably combined to form those skilled in the art and can manage
The other embodiments of solution.
Claims (10)
1. a kind of bilayer microwave high-frequency printed board, it is characterised in that: including first medium layer and second dielectric layer, described first is situated between
Matter layer from top to bottom successively include: line layer (1), layer of dielectric material (2), heat dissipating layer (3), metal substrate (4), tin layers (5), with
And insulating layer (6), the second dielectric layer from top to bottom successively include: metal coating (7), microwave patch (8), and coupling feedback
Electric layer (9), by pasting lamella (10) connection between the first medium layer and second dielectric layer；
The line layer (1) is equipped with several connecting holes (11), several heat release holes (12) and element mounting hole (13)；
Metal substrate (4) quadrangle, which is provided with, draws tin piece (14).
2. bilayer microwave high-frequency printed board as described in claim 1, it is characterised in that: the metal coating (7) is radiation patch
The microstrip line of piece and coplanar feed.
3. bilayer microwave high-frequency printed board as described in claim 1, it is characterised in that: the upper surface of the line layer (1) is set
There are solder mask layer (15).
4. bilayer microwave high-frequency printed board as described in claim 1, which is characterized in that the insulating layer (6) uses epoxy glass
Glass cloth laminated board.
5. bilayer microwave high-frequency printed board as described in claim 1, it is characterised in that: the connecting hole (11), heat release hole
(12) and outside element mounting hole (13) it is provided with annular groove (16), the annular groove (16) is circular ring shape.
6. bilayer microwave high-frequency printed board as described in claim 1, which is characterized in that the center of the element mounting hole (13)
One pilot hole (17) is set.
7. bilayer microwave high-frequency printed board as described in claim 1, it is characterised in that: the heat dissipating layer (3) uses aluminium alloy
Plate.
8. bilayer microwave high-frequency printed board as described in claim 1, which is characterized in that the stickup lamella (10) is high temperature resistant
Glue-line.
9. bilayer microwave high-frequency printed board as described in claim 1, which is characterized in that the drawing tin piece (14) is circle.
10. bilayer microwave high-frequency printed board as described in claim 1, which is characterized in that the drawing tin piece (14) is L shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821069790.9U CN208338007U (en) | 2018-07-06 | 2018-07-06 | A kind of bilayer microwave high-frequency printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821069790.9U CN208338007U (en) | 2018-07-06 | 2018-07-06 | A kind of bilayer microwave high-frequency printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208338007U true CN208338007U (en) | 2019-01-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821069790.9U Active CN208338007U (en) | 2018-07-06 | 2018-07-06 | A kind of bilayer microwave high-frequency printed board |
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| Country | Link |
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| CN (1) | CN208338007U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113194607A (en) * | 2021-03-26 | 2021-07-30 | 中国电子科技集团公司第二十九研究所 | Positioning and heat dissipation structure based on blind-mate feed of multilayer printed board |
-
2018
- 2018-07-06 CN CN201821069790.9U patent/CN208338007U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113194607A (en) * | 2021-03-26 | 2021-07-30 | 中国电子科技集团公司第二十九研究所 | Positioning and heat dissipation structure based on blind-mate feed of multilayer printed board |
| CN113194607B (en) * | 2021-03-26 | 2022-06-14 | 中国电子科技集团公司第二十九研究所 | Positioning and heat dissipation structure based on blind-mate feed of multilayer printed board |
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