CN207491299U - A kind of multiplayer microwave printed board - Google Patents
A kind of multiplayer microwave printed board Download PDFInfo
- Publication number
- CN207491299U CN207491299U CN201721424184.XU CN201721424184U CN207491299U CN 207491299 U CN207491299 U CN 207491299U CN 201721424184 U CN201721424184 U CN 201721424184U CN 207491299 U CN207491299 U CN 207491299U
- Authority
- CN
- China
- Prior art keywords
- layer
- printed board
- dielectric layer
- thickness
- microwave printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
A kind of multiplayer microwave printed board belongs to wiring board technology field, relates generally to a kind of printing harden structure；The utility model is in order to solve the problems, such as that traditional single, double surface microwave printed board cannot meet high density and high-precision demand；The utility model includes the first medium layer, second dielectric layer and the third dielectric layer that are from top to bottom sequentially arranged, first medium layer includes the first copper clad laminate layer, second dielectric layer includes the microstrip line of the first metal coating, microwave patch, the couple feed layer for being etched with symmetrical ladder gap and feed layer pasted successively, and second dielectric layer includes the second copper clad laminate layer；The utility model added losses are small, greatly reduce the leakage of high-frequency energy, and the high density and high-precision for realizing signal are transmitted.
Description
Technical field
A kind of printing harden structure belongs to wiring board technology field, relates generally to a kind of multiplayer microwave printed board.
Background technology
With the continuous development and progress of packet product microwave communication techniques, the demand of microwave printed board is more and more, military-civil
A large amount of electronic products such as radar, antenna, radio and television, mobile communication, fiber optic communication, computer, household electrical appliance, will use micro-
Wave printed board, still, traditional single, double surface microwave printed board cannot meet high density and high-precision demand, to multiplayer microwave
The process requirements of printed board are increasingly urgent.
Utility model content
To solve the above-mentioned problems, the utility model discloses a kind of multiplayer microwave printed board, simple in structure, satisfaction differences
To wiring board high density and high-precision signal transmission demand under conditions of demand.
What the purpose of this utility model was realized in：
A kind of multiplayer microwave printed board, including first medium layer, second dielectric layer and the third being from top to bottom sequentially arranged
Dielectric layer, first medium layer include the first copper clad laminate layer, and second dielectric layer includes the first metal coating, the microwave that paste successively
The microstrip line of patch, the couple feed layer for being etched with symmetrical ladder gap and feed layer, second dielectric layer include the second copper foil base
Plate layer.
First metal coating is radiation patch and the microstrip line of coplanar feed.
The width of the microstrip line is 0.5-0.8mm.
First copper clad laminate layer and the second copper clad laminate layer thickness are identical, thickness 0.01-0.08mm.
The printed board is equipped with several vias, and the radius of via is 0.1-0.2mm.
It is connected between first medium layer and second dielectric layer by the first adhesive sheet, second dielectric layer and third dielectric layer
Between connected by the second adhesive sheet, the thickness of first stop street lamella is more than the thickness of the second adhesive sheet.
The ratio between thickness of the thickness of first adhesive sheet and the second adhesive sheet is 2:1.
The utility model compared with prior art, has the advantages that the utility model has the advantages of simple structure, using more
Layer structure is realized by feed effect and reduces signal reflex, and the additional standing wave of main transmission line is small, reduces introducing noise,
Added losses are small, greatly reduce the leakage of high-frequency energy, and the high density and high-precision for realizing signal are transmitted.
Description of the drawings
Fig. 1 is the utility model overall structure diagram.
Specific embodiment
Specific embodiment of the present invention is described in further detail below in conjunction with the accompanying drawings.
A kind of multiplayer microwave printed board of the present embodiment, including be from top to bottom sequentially arranged first medium layer, second be situated between
Matter layer and third dielectric layer, first medium layer include the first copper clad laminate layer 1 and polyimide film 2, second dielectric layer include according to
Secondary the first metal coating 3 pasted, microwave patch 4, the couple feed layer 5 for being etched with symmetrical ladder gap and feed layer micro-strip
Line 6, second dielectric layer include the second copper clad laminate layer 7 and Arlorn AD255 dielectric-slabs 8.
First metal coating 3 is radiation patch and the microstrip line of coplanar feed.
The width of the microstrip line 6 is 0.8mm.
First copper clad laminate layer 1 is identical with 7 thickness of the second copper clad laminate layer, thickness 0.05mm.
The printed board is equipped with several vias 9, and the radius of via is 0.15mm.
It is connected between first medium layer and second dielectric layer by the first adhesive sheet 10, second dielectric layer and third medium
It is connected between layer by the second adhesive sheet 11, the thickness of first stop street lamella is more than the thickness of the second adhesive sheet.
The ratio between thickness of the thickness of first adhesive sheet 10 and the second adhesive sheet 11 is 2:1.
It should be appreciated that although this specification is described in terms of embodiments, but not each embodiment only includes one
A independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should will illustrate
Book is as an entirety, and the technical solutions in each embodiment can also be properly combined, and forming those skilled in the art can manage
The other embodiment of solution.
Claims (7)
1. a kind of multiplayer microwave printed board, first medium layer, second dielectric layer and third including being from top to bottom sequentially arranged are situated between
Matter layer, first medium layer include the first copper clad laminate layer, and second dielectric layer includes the first metal coating pasted successively, microwave patch
The microstrip line of piece, the couple feed layer for being etched with symmetrical ladder gap and feed layer, second dielectric layer include the second copper clad laminate
Layer.
2. a kind of multiplayer microwave printed board according to claim 1, it is characterised in that：First metal coating is pasted for radiation
The microstrip line of piece and coplanar feed.
3. a kind of multiplayer microwave printed board according to claim 1, it is characterised in that：The width of the microstrip line is 0.5-
0.8mm。
4. a kind of multiplayer microwave printed board according to claim 1, it is characterised in that：First copper clad laminate layer and the second copper foil
Substrate layer thickness is identical, thickness 0.01-0.08mm.
5. a kind of multiplayer microwave printed board according to claim 1, it is characterised in that：The printed board is equipped with several mistakes
Hole, the radius of via is 0.1-0.2mm.
6. a kind of multiplayer microwave printed board according to claim 1, it is characterised in that：First medium layer and second dielectric layer it
Between by the first adhesive sheet connect, between second dielectric layer and third dielectric layer pass through the second adhesive sheet connect, first stop
The thickness of street lamella is more than the thickness of the second adhesive sheet.
7. a kind of multiplayer microwave printed board according to claim 6, it is characterised in that：The thickness of first adhesive sheet and second
The ratio between thickness of adhesive sheet is 2:1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721424184.XU CN207491299U (en) | 2017-10-31 | 2017-10-31 | A kind of multiplayer microwave printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721424184.XU CN207491299U (en) | 2017-10-31 | 2017-10-31 | A kind of multiplayer microwave printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207491299U true CN207491299U (en) | 2018-06-12 |
Family
ID=62478335
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721424184.XU Active CN207491299U (en) | 2017-10-31 | 2017-10-31 | A kind of multiplayer microwave printed board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207491299U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113540768A (en) * | 2020-04-20 | 2021-10-22 | 成都恪赛科技有限公司 | Connecting structure applied to microwave system |
-
2017
- 2017-10-31 CN CN201721424184.XU patent/CN207491299U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113540768A (en) * | 2020-04-20 | 2021-10-22 | 成都恪赛科技有限公司 | Connecting structure applied to microwave system |
| CN113540768B (en) * | 2020-04-20 | 2024-04-05 | 成都恪赛科技有限公司 | Connection structure applied to microwave system |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN206490891U (en) | The low-dielectric loss FRCC substrates of structure are folded with combined type | |
| CN106376172B (en) | A kind of mixed pressure Metal Substrate microwave printed board and design method | |
| CN206840863U (en) | Combined type LCP high-frequency high-speed Double-sided copper clad laminates | |
| CN206932462U (en) | Combined type LCP high-frequency high-speed FRCC base materials | |
| CN102555349A (en) | Method for manufacturing ceramic filled polytetrafluoroethylene glass fiber copper-clad substrate | |
| CN207491299U (en) | A kind of multiplayer microwave printed board | |
| CN105828517A (en) | Preparation method of low-loss and high-flexibility high frequency transmission FPC board | |
| CN205255668U (en) | Low dielectricity glued membrane | |
| CN107592726A (en) | A kind of metal high efficiency and heat radiation board manufacturing method | |
| CN204795828U (en) | Use flexible printed wiring board structure of ferrite as substrate | |
| CN208128629U (en) | FPC based on high frequency FRCC Yu FCCL single sided board | |
| CN105848409A (en) | FPC with low-loss high-flexibility high-frequency transmission | |
| CN208317109U (en) | A kind of microwave board for the gold-plated structure meeting spun gold welding | |
| CN208338007U (en) | A kind of bilayer microwave high-frequency printed board | |
| CN104010436A (en) | Flexible metal-coated substrate with electromagnetic shielding effect and manufacturing technology | |
| CN103687293A (en) | Stacked circuit board and manufacturing technology thereof | |
| CN207040003U (en) | A kind of high-frequency microwave circuit board | |
| CN102036472A (en) | Microwave high-frequency metal base circuit board | |
| CN206977794U (en) | Multilayer impedance circuit board | |
| CN207340283U (en) | High-frequency multilayer printed wiring board is used in one kind communication | |
| CN207854265U (en) | High frequency high-transmission FPC with FRCC | |
| CN201726597U (en) | Microwave high-frequency ceramic circuit board | |
| CN201986258U (en) | Microwave high-frequency circuit board | |
| CN207235201U (en) | A kind of low PIM high performance microwaves high frequency composite ceramic substrate | |
| CN205622979U (en) | FPC board of low -loss high flexibility high frequency transmission |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |