CN213603048U - High-density multilayer ceramic circuit board - Google Patents
High-density multilayer ceramic circuit board Download PDFInfo
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- CN213603048U CN213603048U CN202022120524.8U CN202022120524U CN213603048U CN 213603048 U CN213603048 U CN 213603048U CN 202022120524 U CN202022120524 U CN 202022120524U CN 213603048 U CN213603048 U CN 213603048U
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Abstract
The utility model discloses a high-density multilayer ceramic circuit board, which comprises a ceramic fiber bonding sheet, wherein the upper side and the lower side of the ceramic fiber bonding sheet are both provided with anti-interference mechanisms; the anti-interference mechanism comprises a ceramic circuit substrate, a low-frequency magnetic field shielding foil and a heat dissipation aluminum foil; the upper side and the lower side of the ceramic fiber bonding sheet are both bonded with one end of a ceramic circuit substrate, the other end of the ceramic circuit substrate is bonded with a low-frequency magnetic field shielding foil, and one end, far away from the ceramic circuit substrate, of the low-frequency magnetic field shielding foil is bonded with a heat dissipation aluminum foil. The utility model discloses a low frequency magnetic field shielding foil piece on the ceramic circuit base plate can utilize low frequency magnetic field shielding foil piece, shields electromagnetic signal to avoided electromagnetic signal, produced the interference to the ceramic circuit base plate, be favorable to more practical use a high density multilayer ceramic circuit board.
Description
Technical Field
The utility model relates to a ceramic circuit board technical field specifically is a high density multilayer ceramic circuit board.
Background
In recent years, with the development of wireless communication, optical fiber communication, high-performance electronic computers, and high-speed data network products, the trend is inevitable for the development of high-frequency and high-speed PCB products due to the high-speed information processing and the high-speed wireless analog front end module. The ceramic-based material has the advantages of good insulation, small dielectric constant, low loss factor, strong heat resistance and high heat conductivity coefficient, can meet the requirements on high frequency and high speed of signal transmission, and is very suitable for being applied to circuit boards in related fields such as high-frequency microwave boards, radio frequency antennas, couplers, 4G communication, frequency converters and the like. The ultrathin composite substrate made of ceramics has excellent electrical insulation performance, high heat conduction characteristic, excellent soft solderability and high adhesion strength, can be etched into various patterns like a PCB (printed circuit board), and has great current carrying capacity. Therefore, the ceramic substrate has become a basic material for high-power electronic circuit structure technology and interconnection technology.
Patent No. cn201620372954.x discloses a multilayer ceramic circuit board, from a first outer copper foil, first ceramic-based double-sided board, second ceramic-based double-sided board and second outer copper foil have been stacked gradually towards another relative outside surface direction of multilayer circuit board's an outside surface, wherein, first ceramic-based double-sided board and the equal two-sided etching of second ceramic-based double-sided board have the circuit layer as the inlayer circuit, first outer copper foil, first ceramic-based double-sided board, second ceramic-based double-sided board and second outer copper foil loop through ceramic fibre bonding sheet and paste the combination, above each layer structure is pasted in proper order and is stacked the back through the pressfitting and multilayer circuit board. The beneficial effects of the utility model reside in that, a circuit layer including different shapes is provided: 1. the heat dissipation is convenient; 2. the requirements for arranging different components can be met; 3. when different components are arranged, the distance between the components can be regularly circulated, and signals between the components are not easy to interfere.
Currently, the existing high-density multilayer ceramic circuit boards have some disadvantages, for example; the existing high-density multilayer ceramic circuit board can not effectively prevent the interference of electromagnetic signals, and has common heat dissipation effect.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high density multilayer ceramic circuit board has solved the problem that proposes in the background art.
In order to achieve the above object, the utility model provides a following technical scheme: a high-density multilayer ceramic circuit board comprises a ceramic fiber bonding sheet, wherein anti-interference mechanisms are arranged on the upper side and the lower side of the ceramic fiber bonding sheet;
the anti-interference mechanism comprises a ceramic circuit substrate, a low-frequency magnetic field shielding foil and a heat dissipation aluminum foil; the upper side and the lower side of the ceramic fiber bonding sheet are both bonded with one end of a ceramic circuit substrate, the other end of the ceramic circuit substrate is bonded with a low-frequency magnetic field shielding foil, and one end, far away from the ceramic circuit substrate, of the low-frequency magnetic field shielding foil is bonded with a heat dissipation aluminum foil.
As an embodiment of the present invention, a plurality of first grooves (5) are opened to the one end equidistance that ceramic circuit substrate (2) is close to low frequency magnetic field shielding foil (3), a plurality of second grooves (6) are opened to the one end equidistance that low frequency magnetic field shielding foil (3) is close to ceramic circuit substrate (2).
As an optimized embodiment of the present invention, the graphite heat dissipation block is fixedly connected inside the first groove and the second groove.
As an optimized embodiment of the utility model, a plurality of louvres have been seted up to the inside equidistance of graphite radiating block.
Compared with the prior art, the beneficial effects of the utility model are as follows:
1. the utility model discloses a low frequency magnetic field shielding foil piece on the ceramic circuit base plate can utilize low frequency magnetic field shielding foil piece, shields electromagnetic signal to avoided electromagnetic signal, produced the interference to the ceramic circuit base plate, be favorable to more practical use a high density multilayer ceramic circuit board.
2. The utility model discloses a plurality of graphite radiating blocks and louvre between ceramic line base plate and the low frequency magnetic field shielding foil piece not only can set up a plurality of miniature graphite radiating blocks between ceramic line base plate and low frequency magnetic field shielding foil piece, utilizes graphite radiating block and louvre, increases the radiating effect of ceramic line way board, is favorable to more practical use a high density multilayer ceramic line way board.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
fig. 1 is a front view of a high-density multilayer ceramic circuit board according to the present invention.
In the figure: the ceramic-fiber-based low-frequency magnetic field radiating device comprises a ceramic fiber bonding sheet 2, a ceramic circuit substrate 3, a low-frequency magnetic field shielding foil 4, a radiating aluminum foil 5, a first groove 6, a second groove 7, a graphite radiating block 8 and radiating holes.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
In the description of the present invention, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected" and "disposed" are to be construed broadly, and may for example be fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1, the present invention provides a technical solution: a high-density multilayer ceramic circuit board comprises a ceramic fiber bonding sheet 1, wherein anti-interference mechanisms are arranged on the upper side and the lower side of the ceramic fiber bonding sheet 1;
the interference preventing mechanism comprises a ceramic circuit substrate 2, a low-frequency magnetic field shielding foil 3 and a heat dissipation aluminum foil 4; the upper side and the lower side of the ceramic fiber bonding sheet 1 are both bonded with one end of a ceramic circuit substrate 2, the other end of the ceramic circuit substrate 2 is bonded with a low-frequency magnetic field shielding foil 3, and one end, far away from the ceramic circuit substrate 2, of the low-frequency magnetic field shielding foil 3 is bonded with a heat dissipation aluminum foil 4.
Referring to fig. 1, in the embodiment, the low-frequency magnetic field shielding foil 3 on the ceramic circuit substrate 2 can shield the electromagnetic signal by using the low-frequency magnetic field shielding foil 3, so as to avoid the electromagnetic signal from interfering with the ceramic circuit substrate 2, which is beneficial to more practical use of a high-density multilayer ceramic circuit board.
Wherein, a plurality of first recesses (5) have been seted up to ceramic line base plate (2) one end equidistance near low frequency magnetic field shielding foil (3), a plurality of second recesses (6) have been seted up to low frequency magnetic field shielding foil (3) one end equidistance near ceramic line base plate (2).
Wherein, graphite radiating blocks 7 are fixedly connected inside the first groove 5 and the second groove 6.
Referring to fig. 1 in the embodiment, a plurality of graphite heat dissipation blocks 7 and heat dissipation holes 8 between the ceramic circuit substrate 2 and the low frequency magnetic field shielding foil 3 are used, so that a plurality of small graphite heat dissipation blocks 7 can be arranged between the ceramic circuit substrate 2 and the low frequency magnetic field shielding foil 3, the graphite heat dissipation blocks 7 and the heat dissipation holes 8 are used, the heat dissipation effect of the ceramic circuit board is improved, and the high-density multilayer ceramic circuit board is more practical.
Wherein, a plurality of louvres 8 have been seted up to graphite radiating block 7 inside equidistance.
When a high density multilayer ceramic circuit board is used, through set up low frequency magnetic field shielding foil 3 on ceramic circuit substrate 2, can utilize low frequency magnetic field shielding foil 3, shield electromagnetic signal, thereby electromagnetic signal has been avoided, produce the interference to ceramic circuit substrate 2, through set up a plurality of graphite radiating block 7 and louvre 8 between ceramic circuit substrate 2 and low frequency magnetic field shielding foil 3, not only can be with a plurality of miniature graphite radiating block 7, the setting is between ceramic circuit substrate 2 and low frequency magnetic field shielding foil 3, utilize graphite radiating block 7 and louvre 8, increase the radiating effect of ceramic circuit board.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above, it will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, but that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (4)
1. A high-density multilayer ceramic wiring board comprising a ceramic fiber adhesive sheet (1), characterized in that: the upper side and the lower side of the ceramic fiber bonding sheet (1) are provided with anti-interference mechanisms;
the anti-interference mechanism comprises a ceramic circuit substrate (2), a low-frequency magnetic field shielding foil (3) and a heat dissipation aluminum foil (4); the ceramic fiber bonding sheet is characterized in that one end of a ceramic circuit substrate (2) is bonded to the upper side and the lower side of the ceramic fiber bonding sheet (1), a low-frequency magnetic field shielding foil (3) is bonded to the other end of the ceramic circuit substrate (2), and a heat dissipation aluminum foil (4) is bonded to one end, far away from the ceramic circuit substrate (2), of the low-frequency magnetic field shielding foil (3).
2. The high-density multilayer ceramic circuit board according to claim 1, wherein: ceramic line base plate (2) are close to the one end equidistance of low frequency magnetic field shielding foil (3) and have seted up a plurality of first recesses (5), a plurality of second recesses (6) have been seted up to the one end equidistance that low frequency magnetic field shielding foil (3) are close to ceramic line base plate (2).
3. A high-density multilayer ceramic circuit board according to claim 2, wherein: and graphite radiating blocks (7) are fixedly connected inside the first groove (5) and the second groove (6).
4. A high-density multilayer ceramic circuit board according to claim 3, wherein: a plurality of heat dissipation holes (8) are formed in the graphite heat dissipation block (7) at equal intervals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022120524.8U CN213603048U (en) | 2020-09-24 | 2020-09-24 | High-density multilayer ceramic circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022120524.8U CN213603048U (en) | 2020-09-24 | 2020-09-24 | High-density multilayer ceramic circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN213603048U true CN213603048U (en) | 2021-07-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022120524.8U Active CN213603048U (en) | 2020-09-24 | 2020-09-24 | High-density multilayer ceramic circuit board |
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| Country | Link |
|---|---|
| CN (1) | CN213603048U (en) |
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- 2020-09-24 CN CN202022120524.8U patent/CN213603048U/en active Active
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