CN205596442U - Multilayer ceramic circuit board - Google Patents
Multilayer ceramic circuit board Download PDFInfo
- Publication number
- CN205596442U CN205596442U CN201620372954.XU CN201620372954U CN205596442U CN 205596442 U CN205596442 U CN 205596442U CN 201620372954 U CN201620372954 U CN 201620372954U CN 205596442 U CN205596442 U CN 205596442U
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- China
- Prior art keywords
- ceramic base
- dual platen
- layer
- ceramic
- line layer
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model relates to a multilayer ceramic circuit board, from relative another surperficial direction in the outside of outside surface orientation of multilayer circuit board stacks gradually and is provided with first outer copper foil, first ceramic base double sided board, the outer copper foil of second ceramic base double sided board and second, wherein, the equal two -sided etching of first ceramic base double sided board and second ceramic base double sided board has the line layer as the inlayer circuit, first outer copper foil, first ceramic base double sided board, the outer copper foil of second ceramic base double sided board and second loops through ceramic fibre gluing piece and pastes the combination, above each layer structure paste in proper order stack after the pressfitting and multilayer circuit board. The beneficial effects of the utility model reside in that, a line layer: of including different shapes is provided 1. Be convenient for dispel the heat, 2. Can satisfy the requirement of arranging different components and parts, 3. When arranging different components and parts, regular the following of distance between them, and the signal between the components and parts is difficult disturbs.
Description
Technical field
This utility model relates to wiring board art, particularly to a kind of multi-layer ceramics wiring board.
Background technology
In recent years, produce along with wireless telecommunications, fiber optic communication, high-performance electronic computer, high speed data network
Product development, information processing high speed, wireless simulation front-end module, development high frequency, high speed
PCB product becomes inevitable trend.Ceramic based material has that insulating properties is good, dielectric constant is little, fissipation factor
Advantage low, that thermostability is strong, heat conductivity is high, can meet and transmit high frequency, the requirement of high speed for signal,
It is highly suitable to be applied for the association areas such as high-frequency microwave plate, radio-frequency antenna, coupling and device, 4G communication, converter
Wiring board.The ultra-thin composite base plate made by pottery is utilized to have a good electrical insulation performance, high thermal conduction characteristic,
Excellent solderability and high adhesive strength, and can etch various figure as pcb board, have
The biggest current capacity.Therefore, ceramic substrate has become high-power electric and electronic circuit structure technology and interconnection
The basic material of technology.
The advantage of multilayer circuit board: packaging density is high, volume is little, light weight due to packaging density high, each group
Line between part (including components and parts) reduces, and therefore improves reliability；The wiring number of plies can be increased, thus
Increase design flexibility；The circuit with a constant impedance can be constituted；High speed transmission circuit can be formed；Can arrange
Circuit, magnetic circuit screen layer, also can arrange metal-cored heat dissipating layer with features needs such as satisfied shielding, heat radiations；
Installing simple, reliability is high.
The line layer shape of multilayer circuit board the most on the market is single, it is impossible to meets and arranges various components and parts
Demand；On the other hand in line layer, signal easily forms interference.
Utility model content
In view of the above-mentioned problems in the prior art, main purpose of the present utility model is to solve existing skill
The defect of art, this utility model provides a kind of multi-layer ceramics wiring board, and this multi-layer ceramics wiring board has structure
Simply, line layer various shapes, and be difficult to interference feature.
This utility model provides a kind of multi-layer ceramics wiring board, from an outer surface court of described multilayer circuit board
Be cascading to relatively another outer surface direction the first outer copper foil, the first ceramic base dual platen,
Second ceramic base dual platen and the second outer copper foil, wherein, described first ceramic base dual platen and the second pottery
Base dual platen is the most two-sided is etched with the line layer as internal layer circuit, described first outer copper foil, the first pottery
Base dual platen, the second ceramic base dual platen and the second outer copper foil pass sequentially through ceramic fibre gluing sheet and paste knot
Closing, above each Rotating fields is pasted successively and is obtained multilayer circuit board after stacking through pressing.
Optionally, described first ceramic base dual platen and the second ceramic base dual platen all include ceramic substrate,
The both side surface of ceramic substrate forms line layer.
Optionally, the line layer of described first ceramic base dual platen includes with the center of the first ceramic base dual platen
For the center of circle formed concentric circular line layer and centered by the center of the first ceramic base dual platen formed radial
Line layer, described concentric circular line layer and described radial circuit layer intersect, and form multiple intersection point.
Optionally, described intersection point skewness.
Optionally, described second ceramic base dual platen forms latticed line layer.
This utility model has the following advantages and beneficial effect:
This utility model provides a kind of multi-layer ceramics wiring board, includes difform line layer: be 1. easy to
Heat radiation；2. can meet the requirement arranging different components and parts；3. when arranging different components and parts, between them
Follow apart from regular, and the signal between components and parts is difficult to interference.
Accompanying drawing explanation
The pressing structure schematic diagram of the multilayer circuit board that Fig. 1 provides for this utility model；
Showing of multilayer circuit board the first ceramic base dual platen upper surface line layer that Fig. 2 provides for this utility model
It is intended to；
Showing of multilayer circuit board the second ceramic base dual platen upper surface line layer that Fig. 3 provides for this utility model
It is intended to；
Shown in figure as follows:
100 is the first outer copper foil；
200 is the first ceramic base dual platen；
201 is the ceramic substrate of the first ceramic base dual platen；
202 is the concentric circular line layer of the first ceramic base dual platen；
203 is the radial circuit layer of the first ceramic base dual platen；
204 is intersection point；
300 is the second ceramic base dual platen；
301 is the ceramic substrate of the second ceramic base dual platen；
302 is the latticed line layer of the second ceramic base dual platen；
400 is the second outer copper foil.
Detailed description of the invention
For making the purpose of this utility model embodiment, technical scheme and advantage clearer, below in conjunction with this
Accompanying drawing in utility model embodiment, carries out clear, complete to the technical scheme in this utility model embodiment
Ground describes, it is clear that described embodiment is a part of embodiment of this utility model rather than whole realities
Execute example.Generally herein described in accompanying drawing and the assembly of this utility model embodiment that illustrates can with various not
Same configuration is arranged and is designed.Therefore, below to the embodiment of the present utility model provided in the accompanying drawings
Describe the claimed scope of the present utility model that is not intended to limit in detail, but it is new to be merely representative of this practicality
The selected embodiment of type.Based on the embodiment in this utility model, those of ordinary skill in the art are not making
Go out the every other embodiment obtained under creative work premise, broadly fall into the scope of this utility model protection.
Of the present utility model embodiment is described below in detail, and the example of described embodiment is shown in the drawings, its
In the most same or similar label represent same or similar element or there is same or like function
Element.The embodiment described below with reference to accompanying drawing is exemplary, it is intended to be used for explaining this utility model,
And it is not intended that to restriction of the present utility model.
In description of the present utility model, it is to be understood that term " " center ", " longitudinally ", " horizontal stroke
To ", " length ", " width ", " thickness ", " on ", D score, "front", "rear",
"left", "right", " vertically ", " level ", " top ", " end " " interior ", " outward ", " suitable
Hour hands ", the orientation of the instruction such as " counterclockwise " or position relationship be based on orientation shown in the drawings or pass, position
System, is for only for ease of and describes this utility model and simplify description rather than instruction or the device of hint indication
Or element must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that to this
The restriction of utility model.
Additionally, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or dark
Show relative importance or the implicit quantity indicating indicated technical characteristic.Thus, define " first ",
The feature of " second " can express or implicitly include one or more this feature.New in this practicality
In the description of type, " multiple " are meant that two or more, unless otherwise expressly limited specifically.
In this utility model, unless otherwise clearly defined and limited, term " install ", " being connected ",
" connect ", the term such as " fixing " should be interpreted broadly, and connects for example, it may be fixing, it is also possible to be
Removably connect, or be integrally connected；Can be to be mechanically connected, it is also possible to be electrical connection；Can be direct
It is connected, it is also possible to be indirectly connected to by intermediary, can be the connection of two element internals.For ability
For the those of ordinary skill in territory, above-mentioned term tool in this utility model can be understood as the case may be
Body implication.
In this utility model, unless otherwise clearly defined and limited, fisrt feature second feature it " on "
Or D score can include that the first and second features directly contact, it is also possible to include the first and second features not
It is directly contact but by the other characterisation contact between them.And, fisrt feature is in second feature
On " ", " top " and " above " include fisrt feature directly over second feature and oblique upper, or
It is merely representative of fisrt feature level height higher than second feature.Fisrt feature second feature " under ", " under
Side " and " below " include that fisrt feature immediately below second feature and obliquely downward, or is merely representative of the first spy
Levy level height less than second feature.
With specific embodiment, this utility model is further described below with reference to accompanying drawings.
Embodiment
As it is shown in figure 1, a kind of multi-layer ceramics wiring board provided for this utility model embodiment 1, from described
One outer surface of multilayer circuit board has been cascading towards relatively another outer surface direction the first outer layer
Copper Foil the 100, first ceramic base dual platen the 200, second ceramic base dual platen 300 and the second outer copper foil 400,
Wherein, the first ceramic base dual platen 200 and the second ceramic base dual platen 300 is the most two-sided is etched with as internal layer
The line layer of circuit, first outer copper foil the 100, first ceramic base dual platen the 200, second ceramic base dual platen
300 and second outer copper foil 400 pass sequentially through ceramic fibre gluing sheet 500 paste combine, above each layer tie
Structure is pasted successively and is obtained multilayer circuit board after stacking through pressing.
First ceramic base dual platen 200 includes ceramic substrate 201, and the upper surface at ceramic substrate 201 is formed
Concentric circular line layer 202 with the center of the first ceramic base dual platen 200 as the center of circle and double with the first ceramic base
Radial circuit layer 203 centered by the center of panel 200；Concentric circular line layer 202 and radial circuit
Layer 203 intersects, and forms multiple intersection point 204, intersection point 204 skewness, in Fig. 1, and the friendship in left side
Point 204 ratios are sparse, and the intersection point 204 on right side is denser, are so easy to arrange difference in different point of intersection
Components and parts, between different components and parts signal be difficult to interference.The lower surface line layer of ceramic substrate 201
Shape and upper surface line layer shape just as.
Second ceramic base dual platen 300 includes ceramic substrate 301, and the upper surface at ceramic substrate 301 is formed
Latticed line layer 302；The line layer shape of the lower surface of ceramic substrate 301 and the line layer of upper surface
Shape is identical.
The multi-layer ceramics wiring board that this utility model provides, the shape of described every layer of ceramic circuit-board is the most different,
Difform line layer is adaptable to the connection of different electric elements.As, the first ceramic base dual platen 200
Forming concentric circular and radial crossing line layer, this line layer can meet the cloth of the components and parts such as resistance, electric capacity
Put；Second ceramic base dual platen 300 is set to latticed line layer, and the line layer of this shape is more suitable for inductance
The layout of the components and parts such as coil.
It is last it is noted that above-described each embodiment is merely to illustrate the technical solution of the utility model,
It is not intended to limit；Although this utility model being described in detail with reference to previous embodiment, this area
Those of ordinary skill it is understood that the technical scheme described in previous embodiment still can be repaiied by it
Change, or wherein part or all of technical characteristic is carried out equivalent；And these amendments or replacement, not
The essence making appropriate technical solution departs from the scope of this utility model each embodiment technical scheme.
Claims (5)
1. a multi-layer ceramics wiring board, it is characterised in that: from an outer surface court of described multilayer circuit board
Be cascading the first outer copper foil (100), the first ceramic base pair to another outer surface direction relatively
Panel (200), the second ceramic base dual platen (300) and the second outer copper foil (400), wherein, described
One ceramic base dual platen (200) and the second ceramic base dual platen (300) is the most two-sided is etched with as interior layer line
The line layer on road, described first outer copper foil (100), the first ceramic base dual platen (200), the second pottery
Base dual platen (300) and the second outer copper foil (400) pass sequentially through ceramic fibre gluing sheet (500) and paste
In conjunction with, above each Rotating fields is pasted successively and is obtained multilayer circuit board after stacking through pressing.
Multi-layer ceramics wiring board the most according to claim 1, it is characterised in that described first ceramic base
Dual platen (200) and the second ceramic base dual platen (300) all include ceramic substrate, at the two of ceramic substrate
Side surface forms line layer.
Multi-layer ceramics wiring board the most according to claim 2, it is characterised in that described first ceramic base
The line layer of dual platen (200) includes being that the center of circle is formed with the center of the first ceramic base dual platen (200)
Concentric circular line layer (202) and the radiation formed centered by the center of the first ceramic base dual platen (200)
Shape line layer (203), described concentric circular line layer (202) and described radial circuit layer (203) intersect,
Form multiple intersection point (204).
Multi-layer ceramics wiring board the most according to claim 3, it is characterised in that described intersection point (204)
Skewness.
Multi-layer ceramics wiring board the most according to claim 2, it is characterised in that described second ceramic base
Dual platen (300) forms latticed line layer (302).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620372954.XU CN205596442U (en) | 2016-04-28 | 2016-04-28 | Multilayer ceramic circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620372954.XU CN205596442U (en) | 2016-04-28 | 2016-04-28 | Multilayer ceramic circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205596442U true CN205596442U (en) | 2016-09-21 |
Family
ID=56933443
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620372954.XU Expired - Fee Related CN205596442U (en) | 2016-04-28 | 2016-04-28 | Multilayer ceramic circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205596442U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113225901A (en) * | 2021-05-12 | 2021-08-06 | 四川锐宏电子科技有限公司 | Multilayer thick film ceramic-based circuit board and preparation process thereof |
-
2016
- 2016-04-28 CN CN201620372954.XU patent/CN205596442U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113225901A (en) * | 2021-05-12 | 2021-08-06 | 四川锐宏电子科技有限公司 | Multilayer thick film ceramic-based circuit board and preparation process thereof |
| CN113225901B (en) * | 2021-05-12 | 2023-01-10 | 四川锐宏电子科技有限公司 | Multilayer thick film ceramic-based circuit board and preparation process thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160921 Termination date: 20190428 |