CN209234099U - A kind of ceramics high-density circuit board - Google Patents
A kind of ceramics high-density circuit board Download PDFInfo
- Publication number
- CN209234099U CN209234099U CN201821439301.4U CN201821439301U CN209234099U CN 209234099 U CN209234099 U CN 209234099U CN 201821439301 U CN201821439301 U CN 201821439301U CN 209234099 U CN209234099 U CN 209234099U
- Authority
- CN
- China
- Prior art keywords
- copper
- alumina ceramic
- base plate
- conductive
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a kind of ceramic high-density circuit board, alumina ceramic-base copper-clad base plate including double-sides belt conductive hole, it is provided with two layers and is respectively arranged at the aluminium oxide glass-fiber-fabric leaching viscosity resin glue layer and conductive layer of the upper and lower ends of alumina ceramic-base copper-clad base plate, aluminium oxide glass-fiber-fabric soaks viscosity resin glue layer and is arranged between conductive layer and alumina ceramic-base copper-clad base plate, a through-hole for turning circuit is respectively equipped between upper and lower two conductive layer and alumina ceramic-base copper-clad base plate, through-hole through aluminium oxide glass-fiber-fabric leaching viscosity resin glue layer and corresponds to each other connection with the conductive hole on alumina ceramic-base copper-clad base plate, through-hole, conductive material is equipped in conductive hole, the radiating groove with external opening is offered between alumina ceramic-base copper-clad base plate and upper and lower two conductive layer, cooling stand is equipped in radiating groove, the opening of radiating groove Equipped with radiator, radiator is fixed on cooling stand by heat-dissipating cover plate.The utility model has good heat-radiating effect and anti-static function.
Description
Technical field
The utility model relates to wiring board technology fields, and in particular to a kind of ceramics high-density circuit board.
Background technique
The development of wireless communication promotes the extensive use of microwave technology, although most of wireless devices still use tradition
Circuit board process, and operating frequency range can be extended to a certain extent, but these processing procedures are not able to satisfy technology and quotient
The demand of industry fast development, thus interconnection and encapsulation technology are faced with stern challenge.With the continuous development of technology, circuit board
Smaller and smaller, electronic component is more and more intensive, and existing ordinary circuit board not can solve the heat dissipation that densification electronic component is brought
Problem and electrostatic problem.
Summary of the invention
The purpose of the utility model is to overcome the deficiencies in the prior art, and providing one kind has good heat-radiating effect and prevent quiet
The ceramic high-density circuit board of Electricity Functional.
The technical solution of the utility model is as follows: a kind of ceramics high-density circuit board, the oxidation including double-sides belt conductive hole
The oxygen of aluminium ceramic base copper-clad base plate, the upper and lower ends for being provided with two layers and being respectively arranged at the alumina ceramic-base copper-clad base plate
Change aluminium glass-fiber-fabric leaching viscosity resin glue layer and conductive layer, the aluminium oxide glass-fiber-fabric leaching viscosity resin glue layer is arranged in the conduction
It is described to divide between two conductive layers and the alumina ceramic-base copper-clad base plate up and down between layer and alumina ceramic-base copper-clad base plate
Not She You one be used for turning circuit through-hole, the through-hole through the aluminium oxide glass-fiber-fabric leaching viscosity resin glue layer and with it is described
Conductive hole on alumina ceramic-base copper-clad base plate corresponds to each other connection, and conductive material is equipped in the through-hole, conductive hole, described
The radiating groove with external opening, the heat dissipation are offered between alumina ceramic-base copper-clad base plate and two conductive layers up and down
Cooling stand is equipped in slot, the opening of the radiating groove is equipped with radiator, and the radiator is fixed on institute by heat-dissipating cover plate
It states on cooling stand.
In the above-mentioned technical solutions, the aluminium oxide glass-fiber-fabric leaching viscosity resin glue layer is the glass-fiber-fabric added with aluminium oxide
Soak viscous antistatic resin glue layer.
In the above-mentioned technical solutions, the radiating groove is located at the middle part of the alumina ceramic-base copper-clad base plate.
In the above-mentioned technical solutions, the conductive layer is layers of copper.
In the above-mentioned technical solutions, the conductive hole of the alumina ceramic-base copper-clad base plate upper and lower ends is located at described
The two sides of alumina ceramic-base copper-clad base plate.
In the above-mentioned technical solutions, the power input of the radiator and the wiring board is electrically connected.
Compared with the existing technology, the utility model has the beneficial effects that: 1, using alumina ceramic-base copper-clad base plate make
For the circuit board substrate, there is good electrical insulation performance, high thermal conductivity characteristic, excellent solderability and high adhesive strength；2,
One layer of aluminium oxide glass-fiber-fabric is set between conductive layer and alumina ceramic-base copper-clad base plate and soaks viscosity resin glue layer, is conducive to increase
Strong viscosity, and there is anti-static function；3, alumina ceramic-base copper-clad base plate is the two-sided design with conductive hole, each conduction
Layer is corresponding with conductive hole equipped with a through-hole, relative to the design of the conductive layer two through hole on existing market, is conducive to maximum
Change and improves usable floor area utilization rate；4, by being provided between the middle part and conductive layer of alumina ceramic-base copper-clad base plate by dissipating
Heat channel, cooling stand, heat-dissipating cover plate, radiator structure composed by radiator so that the heat in the middle part of wiring board can enter it is scattered
Rapid cooling is carried out in heat channel and by radiator, and the other parts of wiring board then pass through alumina ceramic-base copper-clad base plate and dissipate
Heat, excellent in heat dissipation effect.
Detailed description of the invention
It, below will be to embodiment or the prior art in order to illustrate more clearly of the technical scheme in the embodiment of the utility model
Attached drawing needed in description is briefly described, it should be apparent that, the accompanying drawings in the following description is only that this is practical new
Some embodiments of type for those of ordinary skill in the art without creative efforts, can be with root
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is a kind of structural schematic diagram of ceramic high-density circuit board of the utility model.
Specific embodiment
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation
The present invention will be further described in detail for example.It should be appreciated that specific embodiment described herein is only used to explain
The utility model is not used to limit the utility model.
In order to illustrate technical solution described in the utility model, the following is a description of specific embodiments.
Embodiment
Referring to Fig. 1, the present embodiment provides a kind of ceramic high-density circuit board, the aluminium oxide including double-sides belt conductive hole 11
The aluminium oxide of ceramic base copper-clad base plate 1, the upper and lower ends for being provided with two layers and being respectively arranged at alumina ceramic-base copper-clad base plate 1
Glass-fiber-fabric soaks viscosity resin glue layer 2 and conductive layer 3, and the conductive hole 11 of 1 upper and lower ends of alumina ceramic-base copper-clad base plate distinguishes position
In the two sides of alumina ceramic-base copper-clad base plate 1, the present embodiment is used as the wiring board base using alumina ceramic-base copper-clad base plate 1
Plate has good electrical insulation performance, high thermal conductivity characteristic, excellent solderability and high adhesive strength.
Aluminium oxide glass-fiber-fabric leaching viscosity resin glue layer 2 setting conductive layer 3 and alumina ceramic-base copper-clad base plate 1 it
Between, wherein it is that the glass-fiber-fabric added with aluminium oxide soaks viscous antistatic resin glue that the aluminium oxide glass-fiber-fabric, which soaks viscosity resin glue layer 2,
Layer.Be conducive to enhancing viscosity, and there is anti-static function.
The conductive layer 3 is layers of copper, is respectively equipped with one between upper and lower two conductive layer 3 and alumina ceramic-base copper-clad base plate 1
For the through-hole 31 of turning circuit, through-hole 31 is covered through aluminium oxide glass-fiber-fabric leaching viscosity resin glue layer 2 and with alumina ceramic-base
Conductive hole 11 on copper base 1 corresponds to each other connection, conductive material 4 is equipped in through-hole 31, conductive hole 11, relative to existing market
On conductive layer two through hole design, be conducive to maximize improve usable floor area utilization rate.
It offers between the middle part of the alumina ceramic-base copper-clad base plate 1 and upper and lower two conductive layer 3 with external opening
Radiating groove 51, cooling stand 52 is equipped in radiating groove 51, the opening of radiating groove 51 is equipped with radiator 53, and radiator 53 passes through
Heat-dissipating cover plate 54 is fixed on cooling stand 52, and the power input of the radiator 53 and the wiring board is electrically connected.So that
Heat in the middle part of wiring board can enter in radiating groove 51 and carry out rapid cooling by radiator 53, and other portions of wiring board
Divide and is then radiated by alumina ceramic-base copper-clad base plate 1, excellent in heat dissipation effect.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this
Made any modifications, equivalent replacements, and improvements etc., should be included in the utility model within the spirit and principle of utility model
Protection scope within.
Claims (6)
1. a kind of ceramics high-density circuit board, it is characterised in that: alumina ceramic-base copper-clad base plate including double-sides belt conductive hole,
It is provided with two layers and is respectively arranged at the viscous tree of aluminium oxide glass-fiber-fabric leaching of the upper and lower ends of the alumina ceramic-base copper-clad base plate
Rouge glue layer and conductive layer, the aluminium oxide glass-fiber-fabric leaching viscosity resin glue layer are arranged in the conductive layer and alumina ceramic-base
It is described to be respectively equipped with one between two conductive layers and the alumina ceramic-base copper-clad base plate up and down for being connected between copper-clad base plate
The through-hole of circuit, the through-hole through aluminium oxide glass-fiber-fabric leaching viscosity resin glue layer and cover copper with the alumina ceramic-base
Conductive hole on substrate corresponds to each other connection, is equipped with conductive material in the through-hole, conductive hole, the alumina ceramic-base covers copper
The radiating groove with external opening is offered between substrate and two conductive layers up and down, and heat dissipation branch is equipped in the radiating groove
The opening of frame, the radiating groove is equipped with radiator, and the radiator is fixed on the cooling stand by heat-dissipating cover plate.
2. a kind of ceramic high-density circuit board according to claim 1, it is characterised in that: the aluminium oxide glass-fiber-fabric leaching is viscous
Resin glue liquid layer is that the glass-fiber-fabric added with aluminium oxide soaks viscous antistatic resin glue layer.
3. a kind of ceramic high-density circuit board according to claim 1, it is characterised in that: the radiating groove is located at the oxygen
Change the middle part of aluminium ceramic base copper-clad base plate.
4. a kind of ceramic high-density circuit board according to claim 1, it is characterised in that: the conductive layer is layers of copper.
5. a kind of ceramic high-density circuit board according to claim 1, it is characterised in that: the alumina ceramic-base covers copper
The conductive hole of substrate upper and lower ends is located at the two sides of the alumina ceramic-base copper-clad base plate.
6. a kind of ceramic high-density circuit board according to claim 1, it is characterised in that: the radiator and the wiring board
Power input be electrically connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821439301.4U CN209234099U (en) | 2018-09-04 | 2018-09-04 | A kind of ceramics high-density circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821439301.4U CN209234099U (en) | 2018-09-04 | 2018-09-04 | A kind of ceramics high-density circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209234099U true CN209234099U (en) | 2019-08-09 |
Family
ID=67498403
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821439301.4U Active CN209234099U (en) | 2018-09-04 | 2018-09-04 | A kind of ceramics high-density circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209234099U (en) |
-
2018
- 2018-09-04 CN CN201821439301.4U patent/CN209234099U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN209563090U (en) | Terminal device | |
| CN208401601U (en) | Wireless charger | |
| CN206564724U (en) | A kind of cooling circuit board, circuit board assemblies and electronic equipment | |
| CN209234099U (en) | A kind of ceramics high-density circuit board | |
| CN108093567A (en) | A kind of thickness copper method for manufacturing printed circuit board | |
| CN104934386A (en) | Packaging structure and optical module | |
| CN208317104U (en) | The two-sided PCB circuit board radiator structure of multi-layered high-density | |
| CN107734838B (en) | PCB capable of fast radiating | |
| CN211240293U (en) | Aluminum base material force calculation board | |
| CN207692149U (en) | A kind of multi-layer PCB board with conductive structure | |
| CN208781834U (en) | Heat radiation structure | |
| CN207305059U (en) | A kind of PCB circuit board of high efficiency and heat radiation multilayer | |
| CN207869491U (en) | Insulate tension aluminum substrate radiator structure | |
| CN207283915U (en) | A kind of wiring board of perfect heat-dissipating | |
| CN206629368U (en) | A kind of heat abstractor, combination unit and carrier arrangement | |
| CN206432253U (en) | Semiconductor devices | |
| CN205755047U (en) | The pcb board that a kind of thermal diffusivity is strong | |
| CN108135075A (en) | A kind of high heat conduction printed circuit board | |
| CN209419989U (en) | A kind of heat-radiating substrate | |
| CN205356936U (en) | Box heat radiation structure and emergency command case | |
| CN204733462U (en) | A kind of circuit board based on ceramic material | |
| CN107949156A (en) | A kind of double-sided wiring board | |
| CN210075681U (en) | Copper-clad aluminum substrate with double copper layers and high-efficiency heat dissipation function | |
| CN208572540U (en) | A kind of low thermal resistance can bending aluminum substrate | |
| CN217546418U (en) | Hybrid integrated ceramic substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |